CN102975132A - Multi grinding wheel for OLED substrate and method for grinding OLED substrate using the multi grinding wheel - Google Patents
Multi grinding wheel for OLED substrate and method for grinding OLED substrate using the multi grinding wheel Download PDFInfo
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- CN102975132A CN102975132A CN2012103229348A CN201210322934A CN102975132A CN 102975132 A CN102975132 A CN 102975132A CN 2012103229348 A CN2012103229348 A CN 2012103229348A CN 201210322934 A CN201210322934 A CN 201210322934A CN 102975132 A CN102975132 A CN 102975132A
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- 239000000758 substrate Substances 0.000 title claims abstract description 75
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000002245 particle Substances 0.000 claims abstract description 74
- 239000011230 binding agent Substances 0.000 claims abstract description 56
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 35
- 239000010432 diamond Substances 0.000 claims abstract description 35
- 239000005416 organic matter Substances 0.000 claims description 32
- 238000005498 polishing Methods 0.000 claims description 26
- 239000011521 glass Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 13
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 13
- 235000019580 granularity Nutrition 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000005011 phenolic resin Substances 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 229920002635 polyurethane Polymers 0.000 claims description 7
- 239000004814 polyurethane Substances 0.000 claims description 7
- 239000004925 Acrylic resin Substances 0.000 claims description 6
- 229920000178 Acrylic resin Polymers 0.000 claims description 6
- 229920001225 polyester resin Polymers 0.000 claims description 6
- 239000004645 polyester resin Substances 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920005596 polymer binder Polymers 0.000 claims description 3
- 239000002491 polymer binding agent Substances 0.000 claims description 3
- 150000002894 organic compounds Chemical class 0.000 abstract 1
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229920001568 phenolic resin Polymers 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 229920005749 polyurethane resin Polymers 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910007610 Zn—Sn Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
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- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A multi-grinding wheel for an OLED(Organic Light Emitting Diode) substrate with high grinding quality and a method for grinding an OLED substrate using the multi-grinding wheel are provided to maintain grindability and minimize chipping in grinding by employing an elastic binder and controlling the grain size and shape of diamond particles of a grinding tip. A multi-grinding wheel for an OLED substrate with high grinding quality comprises a core member(210), wheel bodies(220,220a,220b), and grinding tips(225). The core member has a hollow portion to which a rotary shaft is coupled. The wheel bodies are separated in the axial direction of the rotary shaft and coupled to the exterior of the core member. The grinding tips are formed on the exterior of the respective wheel bodies. In the grinding tips, an elastic binder fixes grinding particles including diamond particles so as to reduce the chip scattered when grinding an edge of an organic compound laminated surface of an OLED substrate.
Description
Technical field
The present invention relates to the Organic Light Emitting Diode substrate grinding manufacturing technology of Grinding wheel (grinding wheel), more specifically, relating to break (chipping) that produce in the time of can making when the edge of grinding Organic Light Emitting Diode substrate the edge at grinding organic matter layer pressure surface especially minimizes and can make and disperse to the minimized Multi-function grinding wheel of organic chip and the method for grinding that utilizes the Organic Light Emitting Diode substrate of this Multi-function grinding wheel.
Background technology
At present, most of display is all take liquid crystal display (Liquid Crystal Display) as the basis.
With regard to the glass for liquid crystal display panel, be to come panel machining with the edge (edge) that external diameter is about the Multi-function grinding wheel grinding face glass of 130mm at present.
On the other hand, recently over against much studying at Organic Light Emitting Diode more outstanding than liquid crystal display aspect definition, slimming, the lightweight (Organic Light Emitting Diode).
Organic Light Emitting Diode is also identical with liquid crystal display, after cutting (cutting) Organic Light Emitting Diode is with substrate, also needs Organic Light Emitting Diode is implemented the edge grinding with substrate, to remove the crackle that produced, to improve fracture strength etc.
With regard to base-board of liquid crystal display, because the two sides is glass, so the chip that disperses behind the grinding edge (chip) can easily be removed in the cleaning process after grinding.But, with regard to Organic Light Emitting Diode with regard to the substrate, because a lamination has organic matter, so the chip that disperses during the top edge of grinding substrate is embedded in the organic matter layer pressure surface of Organic Light Emitting Diode and can't easily removes.Like this, the chip that is embedded in the organic matter layer pressure surface can become the bad reason of Organic Light Emitting Diode.
At present, be used for the Grinding wheel at the edge of grinding Organic Light Emitting Diode substrate, major part all has the form that phenolic resin is fixed the polishing particles such as diamond particles, carborundum as binding agent (binder).
As background technology related to the present invention, the Ginding process of the flat-panel monitor put down in writing in Korea S's publication communique 10-2011-0054589 number (on 05 25th, 2011 open) can be proposed.
Summary of the invention
The object of the invention is to, provide to make breaking of when the edge of the organic matter layer pressure surface of grinding Organic Light Emitting Diode substrate, producing minimize and can prevent the Multi-function grinding wheel that chip disperses to organic matter layer.
Another object of the present invention is to, provide and can be respectively adopt the grinding machine head with distinct characteristics to improve the method for grinding of the Organic Light Emitting Diode substrate of grinding quality to the edge of the glass surface of Organic Light Emitting Diode substrate and the edge of organic matter layer pressure surface.
Organic Light Emitting Diode substrate for the embodiments of the invention that achieve the above object is taken turns (multi grinding wheel) with Multi-function grinding, be used for the edge of above-mentioned organic matter layer pressure surface that grinding has the Organic Light Emitting Diode substrate of glass surface and organic matter layer pressure surface, it is characterized in that, comprise central module, it is formed with mesopore, with fastening rotating shaft, a plurality of wheel bodies, combine with the outer peripheral face of above-mentioned central module in the axial spaced-apart mode along above-mentioned rotating shaft, and a plurality of grinding machine heads, be formed at above-mentioned a plurality of wheel bodies outer peripheral face separately; Above-mentioned grinding machine head has the form that is fixedly comprised the polishing particles of diamond particles by elastic binder, can reduce the chip that disperses when the edge of the organic matter layer pressure surface of the above-mentioned Organic Light Emitting Diode substrate of grinding.
At this moment, above-mentioned elastic binder can be formed by the resin of selecting from polyurethanes resin, polyester resin and acrylic resin.
And preferably, above-mentioned diamond particles has the granularity of 800～1200 orders (mesh).
And preferably, above-mentioned diamond particles is spheroidal particle.
Method for grinding for the Organic Light Emitting Diode substrate of the embodiments of the invention that reach above-mentioned another purpose, it is characterized in that, utilize the first Multi-function grinding to take turns grinding to have the edge of above-mentioned glass surface of the Organic Light Emitting Diode substrate of glass surface and organic matter layer pressure surface, wherein, the first Multi-function grinding wheel comprises by the fixing a plurality of grinding machine heads of the form of polishing particles of the first binding agent; Utilize the second Multi-function grinding to take turns the edge of the above-mentioned organic matter layer pressure surface of the above-mentioned Organic Light Emitting Diode substrate of grinding, wherein, the second Multi-function grinding wheel comprises a plurality of grinding machine heads of form that fixedly comprised the polishing particles of diamond particles by elasticity the second binding agent higher than above-mentioned the first binding agent.
At this moment, the first binding agent that is contained in above-mentioned the first Multi-function grinding wheel can be formed by the resin of selecting from phenol resin and polyimide based resin; The second binding agent that is contained in above-mentioned the second Multi-function grinding wheel can be formed by the resin of selecting from polyurethanes resin, polyester resin and acrylic resin.
Organic Light Emitting Diode substrate of the present invention is taken turns with Multi-function grinding, by grinding machine head being adopted the elastic binder as polyurethane, can reduce breaking of producing when the edge of the organic matter layer pressure surface of grinding Organic Light Emitting Diode substrate.
And Organic Light Emitting Diode substrate of the present invention is taken turns with Multi-function grinding, passes through granularity and the shape of the diamond particles of adjusting grinding machine head when adopting binding agent, and breaking of producing in the time of can also making grinding when keeping grindability minimizes.
And, the method for grinding of Organic Light Emitting Diode substrate of the present invention, breaking that the organic matter layer pressure surface produces, and can improve the grinding quality of Organic Light Emitting Diode substrate when adopting respectively different binding agent to suppress grinding by the edge to the edge of glass surface and organic matter layer pressure surface.
Description of drawings
Fig. 1 represents that the Organic Light Emitting Diode substrate of embodiments of the invention takes turns with Multi-function grinding.
Fig. 2 represents that the Organic Light Emitting Diode substrate of another embodiment of the present invention takes turns with Multi-function grinding.
Fig. 3 to Fig. 8 represents the example applicable to the grinding machine head of the method for grinding of Organic Light Emitting Diode substrate of the present invention.
The explanation of Reference numeral
110: central module
120: the wheel body
125: grinding machine head
The specific embodiment
The embodiment that describes in detail referring to accompanying drawing can allow advantages and features of the invention and realize that the method for these advantages and feature is clearer and more definite.But, the present invention is not limited to following the disclosed embodiments, can implement with mutually different variety of way, present embodiment only is used for making disclosure of the present invention more complete, help the general technical staff of the technical field of the invention intactly to understand category of the present invention, the present invention defines according to the scope of claims.In specification full text, identical Reference numeral represents identical structural detail.
Referring to accompanying drawing to Organic Light Emitting Diode substrate of the present invention with Multi-function grinding wheel and utilize the method for grinding of the Organic Light Emitting Diode substrate of this Multi-function grinding wheel to be elaborated.
Multi-function grinding of the present invention wheel is used as the Grinding wheel (grinding wheel) at edge that grinding has the Organic Light Emitting Diode substrate of glass surface and organic matter layer pressure surface.
The Organic Light Emitting Diode substrate has four edges at glass surface, at the organic matter layer pressure surface four edges is arranged.And, the edge on the summit of four summits that connect glass surfaces and organic matter layer pressure surface is arranged.
Multi-function grinding wheel of the present invention is used for a plurality of edges of grinding Organic Light Emitting Diode substrate.
As mentioned above, when the edge of the organic matter layer pressure surface of grinding Organic Light Emitting Diode substrate, there is the problem of breaking.To this, the present invention in advance material, polishing particles etc. of the binding agent by regulating grinding machine head 125 described later solves debatable splintering problem when the edge of the organic matter layer pressure surface of grinding Organic Light Emitting Diode substrate.
Fig. 1 represents that the Organic Light Emitting Diode substrate of embodiments of the invention takes turns with Multi-function grinding.
With reference to Fig. 1, shown Multi-function grinding wheel comprises central module 110, wheel body 120 and grinding machine head 125.
Be formed with mesopore with fastening rotating shaft in the inside of central module 110.Rotating shaft can be connected with driver elements such as motors.
A plurality of wheel bodies 120 combine with the outer peripheral face of central module 110 in the axial spaced-apart mode along rotating shaft.This a plurality of wheel body 120 can have integral structure, also can have separation-type structure.And central module 110 also can have with a plurality of wheel bodies 120 and is respectively one-piece type structure.
Grinding machine head 125 is formed at a plurality of wheel bodies outer peripheral face separately.
At this moment, grinding machine head 125 has the form that is fixedly comprised the polishing particles of diamond particles by elastic binder.
In the present invention, grinding machine head 125 utilizes elastic binder.This is in order to reduce breaking of producing when the edge of the organic matter layer pressure surface of grinding Organic Light Emitting Diode substrate.The elastic binder that is applicable to this grinding machine head 125 representatively can utilize the binding agent that is formed by polyurethane resin, can utilize the binding agent that is formed by polyester resin and acrylic resin etc. in addition.
Usually, the binding agent that is applicable to grinding machine head utilizes phenolic resins or polyimide resin mostly.These resins are mainly used in wheel and are cut the large situation of the contacted area of material because having high rigidity and adhesion, grind such as plane lapping or cylinder.
But as the grinding machine head that binding agent adopts, although hardness is very high, there is elasticity in these resins hardly.Grinding is cut material in addition and is together dropped to finish by binding agent, the polishing particles of grinding machine head.But in the situation that adopts the resin glue that hardness is high, elasticity is low, although grinding force is very outstanding, being cut the broken of material or break can be a lot.
In contrast, in the situation of using the grinding machine head that adopts the elastic binder as polyurethane resin, because Grinding wheel can be absorbed in the impact that produces when quilt that grinding enbrittles is cut material as the Organic Light Emitting Diode substrate, so can guarantee to be cut the stability of material.
Thus, come at the Grinding wheel that utilization comprises the grinding machine head that adopts elastic binder in the situation at edge of organic matter layer pressure surface of grinding Organic Light Emitting Diode substrate, can reduce by stable grinding the Organic Light Emitting Diode substrate crushing, reduce the amount of the chip produce or the reduction distance of dispersing, and the grinding heat that produces can reduce grinding the time.
And in the present invention, as the polishing particles utilization that is contained in grinding machine head 125 is diamond particles.At this moment, the preferred diamond particles with 800～1200 purpose granularities of utilizing, the size of the chip that produces during with the minimizing grinding.In the thick situation, exist the size of chip to become large problem at granularity less than 800 orders of diamond particles.On the contrary, surpass 1200 orders and in the too small situation, grindability might descend greatly in the granularity of diamond particles.
And preferably, the diamond particles utilization has the particle of ball shape, the chip that produces when can reduce grinding, and clean easily the chip that produces.
On the other hand, cerium oxide (CeO
2) can together be contained in polishing particles with diamond particles.Because cerium oxide can be realized the physics grinding, and can realize chemical grinding by the chemical action with water, so can provide remarkable grindability for glass grinding.
Therefore, together be contained in the situation of polishing particles at cerium oxide and diamond particles, have when can realize the physics grinding by means of diamond particles and cerium oxide, realize the advantage of chemical grinding by means of cerium oxide and water.
State in the use in the situation of Multi-function grinding wheel, by being adopted, grinding machine head as polyurethane, has flexible binding agent, and granularity and the shape of adjusting diamond particles, can make at grinding Organic Light Emitting Diode substrate, especially debatable splintering problem minimizes when the edge of the organic matter layer pressure surface of grinding Organic Light Emitting Diode substrate.
Next, will take turns the method for grinding Organic Light Emitting Diode substrate to describe to utilizing above-mentioned Multi-function grinding.
The present invention considers the two sides of Organic Light Emitting Diode substrate, and namely glass surface is different with the physical property of organic matter layer pressure surface, utilizes mutually different Multi-function grinding wheel when the edge of each face of grinding.Can carry out simultaneously to the grinding at the edge of glass surface with to the grinding at the edge of organic matter layer pressure surface.
That is, in the situation at the edge of the glass surface of grinding Organic Light Emitting Diode substrate, utilize comprise by the first binding agent fixedly the first Multi-function grinding of a plurality of grinding machine heads of the form of polishing particles take turns.On the other hand, in the situation at the edge of the organic matter layer pressure surface of grinding Organic Light Emitting Diode substrate, utilize to comprise second Multi-function grinding of a plurality of grinding machine heads of form that fixedly comprises the polishing particles of diamond particles by the second binding agent and take turns.
At this moment, the elasticity of the second binding agent is higher than the elasticity of the first binding agent, can use aforesaid elastic binder.
The first binding agent that is contained in the grinding machine head of the first Multi-function grinding wheel can be formed by the phenol resin of the binding agent that is often used as grinding machine head, polyimide based resin etc.Even this is also can remove by cleaning easily because the glass surface of Organic Light Emitting Diode produces chip when grinding.
And the polishing particles that is contained in the grinding machine head of the first Multi-function grinding wheel can utilize diamond particles, cerium oxide particles, iron oxide particles, carborundum particle etc. to be used as the various polishing particles of grinding agent.
The second binding agent that is contained in the grinding machine head of the second Multi-function grinding wheel utilizes the elasticity binding agent higher than the first binding agent.This binding agent can utilize the binding agent that is formed by polyurethanes resin, polyester resin, acrylic resin etc.
And preferably, the diamond particles that is contained in the grinding machine head of the second Multi-function grinding wheel has 800～1200 purpose granularities, the effect of the size of the chip that produces when reducing grinding accessing.
And preferably, the diamond particles that is contained in the second Multi-function grinding wheel is the particle with ball shape, can reducing the generation of chip, and can clean easily the chip that produces.
And the polishing particles that is contained in the grinding machine head of the second Multi-function grinding wheel also can comprise cerium oxide.In this case, have and to realize the physics grinding by means of diamond particles and cerium oxide, can also realize by means of the chemical action of cerium oxide and water the advantage of chemical grinding.
Although Multi-function grinding shown in Figure 1 wheel is comprising 5 Grinding wheels that are combined with respectively grinding machine head, is not limited to this.
Fig. 2 represents that the Organic Light Emitting Diode substrate of another embodiment of the present invention takes turns with Multi-function grinding, and this Multi-function grinding wheel comprises central module 210, wheel body 220 and grinding machine head 225.
Fig. 2 represents that wheel body 220 is 6 embodiment.Because each element is identical with the explanation among Fig. 1, therefore with description is omitted.
At this moment, just be positioned at the wheel body 220a of both sides of the edge take the length direction of central module 210 as benchmark and be positioned at regard to the wheel body 220b of center side the physical property that can regulate its shape, size and grinding machine head.
For example, be located in the wheel body 220a at the edge of central module 210, the face of grinding machine head can be with respect to the surface tilt of wheel body about about 45 °.In this case, the wheel body 220a that is positioned at the edge of central module 210 can be used as the so-called corner cut (corner cut) at 4 sharp edges that grinding is connected with the summit of the summit of glass surface of OLED substrate and organic matter layer pressure surface.
For this reason, corner cut can adopt the high metal adhesive of hardness or adopt the hybrid adhesive that is mixed by metal adhesive and high polymer binder with the grinding machine head of wheel body 220a.
As the example of hybrid adhesive, what can propose is the binding agent that soft metal binding agent and the outstanding mixed with resin of heat endurance as the engineering polyimide resin of Zn-Sn series that fusing point is lower forms.Using in the situation of hybrid adhesive, reducing the size of chip with the situation phase specific energy that only adopts metal adhesive, also can reduce the amount of the chip that disperses, therefore can realize stable corner cut.
Fig. 3 to Fig. 8 represents the example applicable to the grinding machine head of the method for grinding of Organic Light Emitting Diode substrate of the present invention.
With regard to grinding machine head shown in Figure 3, utilized phenolic resin adhesive as binding agent, utilized diamond particles, carborundum, the iron oxide that is coated with nickel as polishing particles.
With regard to grinding machine head shown in Figure 3, can show remarkable grindability and free-cutting during the edge of the glass surface of grinding Organic Light Emitting Diode substrate, the size of the chip that produces during grinding is below the 50 μ m.
With regard to grinding machine head shown in Figure 4, utilized the hybrid adhesive that is mixed by tin (Sn) powder and polyimide resin as binding agent, utilized diamond particles as polishing particles.
With regard to grinding machine head shown in Figure 4, can show remarkable grindability and life characteristic, the size of the chip that produces during grinding is below the 80 μ m.Therefore, grinding machine head shown in Figure 4 is used for the purposes such as corner cut of Organic Light Emitting Diode substrate applicable to the Grinding wheel 220a at the edge that is positioned at the multi-functional resins wheel shown in Figure 2.
With regard to grinding machine head shown in Figure 5, utilized zinc (Zn) powder as the soft metal as binding agent, utilized diamond particles as polishing particles.
With regard to grinding machine head shown in Figure 5, can show remarkable grindability, especially life characteristic is outstanding.Therefore, the grinding machine head shown in Figure 5 also grinding machine head with shown in Figure 4 is the same, can be used for the purposes such as corner cut of Organic Light Emitting Diode substrate.
On the other hand, the size of the chip that when reducing grinding, produces, guarantee the aspects such as stability of grinding, more outstanding than metal adhesive by the hybrid adhesive that soft metal binding agent and polyimide resin are composited, and aspect the life-span of wheel, the simple metal binding agent is more outstanding than hybrid adhesive.And hybrid adhesive is more outstanding than general high polymer binder aspect the life-span of wheel.
With regard to grinding machine head shown in Figure 6, utilized phenolic resins as binding agent, utilized diamond particles, carborundum and the iron oxide that is coated with nickel as polishing particles.
With regard to grinding machine head shown in Figure 6, free-cutting is outstanding, during grinding, also can realize stable grinding when maximum feed velocity (feed) is 600mm/s.
With regard to Fig. 7 and grinding machine head shown in Figure 8, utilized polyurethane resin as binding agent, utilized diamond particles and carborundum, cerium oxide as polishing particles.
With regard to the phenolic resins that utilizes shown in Figure 3 as with regard to the grinding machine head of binding agent, the hardness of measuring with Shao Shi D hardometer is 91, and with regard to Fig. 7 and the polyurethane resin that utilizes shown in Figure 8 as with regard to the grinding machine head of binding agent, the hardness of measuring with Shao Shi D hardometer is 58.
More than centered by embodiments of the invention, be illustrated, but on those skilled in the art's level, can carry out various changes or distortion.Can say, as long as these changes and distortion do not depart from the scope of the present invention, just all belong to the present invention.Therefore, interest field of the present invention should be judged according to the scope of appending claims.
Claims (15)
1. an Organic Light Emitting Diode substrate is taken turns with Multi-function grinding, is used for the edge of above-mentioned organic matter layer pressure surface that grinding has the Organic Light Emitting Diode substrate of glass surface and organic matter layer pressure surface, it is characterized in that,
Comprise:
Central module, it is formed with mesopore, with fastening rotating shaft,
A plurality of wheel bodies combine with the outer peripheral face of above-mentioned central module in the axial spaced-apart mode along above-mentioned rotating shaft, and
A plurality of grinding machine heads are formed at above-mentioned a plurality of wheel bodies outer peripheral face separately;
Above-mentioned grinding machine head has the form that is fixedly comprised the polishing particles of diamond particles by elastic binder, can reduce the chip that disperses when the edge of the organic matter layer pressure surface of the above-mentioned Organic Light Emitting Diode substrate of grinding.
2. Organic Light Emitting Diode substrate according to claim 1 is taken turns with Multi-function grinding, it is characterized in that, above-mentioned elastic binder is formed by the resin of selecting from polyurethanes resin, polyester resin and acrylic resin.
3. Organic Light Emitting Diode substrate according to claim 1 is taken turns with Multi-function grinding, it is characterized in that, above-mentioned diamond particles has 800～1200 purpose granularities.
4. Organic Light Emitting Diode substrate according to claim 1 is taken turns with Multi-function grinding, it is characterized in that, above-mentioned diamond particles is spheroidal particle.
5. Organic Light Emitting Diode substrate according to claim 1 is taken turns with Multi-function grinding, it is characterized in that, above-mentioned polishing particles also comprises cerium oxide particles.
6. Organic Light Emitting Diode substrate according to claim 1 is taken turns with Multi-function grinding, it is characterized in that, above-mentioned a plurality of wheel bodies have integral structure.
7. Organic Light Emitting Diode substrate according to claim 1 is taken turns with Multi-function grinding, it is characterized in that, above-mentioned a plurality of wheel bodies have separation-type structure.
8. the method for grinding of an Organic Light Emitting Diode substrate is characterized in that,
Utilize the first Multi-function grinding to take turns grinding to have the edge of above-mentioned glass surface of the Organic Light Emitting Diode substrate of glass surface and organic matter layer pressure surface, wherein, described the first Multi-function grinding wheel comprises by the fixing a plurality of grinding machine heads of the form of polishing particles of the first binding agent;
Utilize the second Multi-function grinding to take turns the edge of the above-mentioned organic matter layer pressure surface of the above-mentioned Organic Light Emitting Diode substrate of grinding, wherein, described the second Multi-function grinding wheel comprises a plurality of grinding machine heads of form that fixedly comprised the polishing particles of diamond particles by elasticity the second binding agent higher than above-mentioned the first binding agent.
9. the method for grinding of Organic Light Emitting Diode substrate according to claim 8 is characterized in that, the first binding agent that is contained in above-mentioned the first Multi-function grinding wheel is formed by the resin of selecting from phenol resin and polyimide based resin.
10. the method for grinding of Organic Light Emitting Diode substrate according to claim 8, it is characterized in that the polishing particles that is contained in above-mentioned the first Multi-function grinding wheel comprises more than one in diamond particles, cerium oxide particles, iron oxide particles and the carborundum particle.
11. the method for grinding of Organic Light Emitting Diode substrate according to claim 8, it is characterized in that the second binding agent that is contained in above-mentioned the second Multi-function grinding wheel is formed by the resin of selecting from polyurethanes resin, polyester resin and acrylic resin.
12. the method for grinding of Organic Light Emitting Diode substrate according to claim 8 is characterized in that, the diamond particles that is contained in above-mentioned the second Multi-function grinding wheel has 800～1200 purpose granularities.
13. the method for grinding of Organic Light Emitting Diode substrate according to claim 8 is characterized in that, the diamond particles that is contained in above-mentioned the second Multi-function grinding wheel is spheroidal particle.
14. the method for grinding of Organic Light Emitting Diode substrate according to claim 8 is characterized in that, the polishing particles that is contained in above-mentioned the second Multi-function grinding wheel also comprises cerium oxide.
15. the method for grinding of Organic Light Emitting Diode substrate according to claim 8 is characterized in that,
Above-mentioned the first Multi-function grinding wheel or above-mentioned the second Multi-function grinding wheel have corner cut wheel body,
Be formed with grinding machine head in above-mentioned corner cut with the outer peripheral face of wheel body, this grinding machine head adopted the hybrid adhesive that is mixed by metal adhesive and high polymer binder.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110089577A KR101103146B1 (en) | 2011-09-05 | 2011-09-05 | Multi grinding wheel for oled substrate and method for grinding oled substrate using the multi grinding wheel |
| KR10-2011-0089577 | 2011-09-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102975132A true CN102975132A (en) | 2013-03-20 |
| CN102975132B CN102975132B (en) | 2015-05-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210322934.8A Active CN102975132B (en) | 2011-09-05 | 2012-09-04 | Multi grinding wheel for OLED substrate and method for grinding OLED substrate using the multi grinding wheel |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101103146B1 (en) |
| CN (1) | CN102975132B (en) |
| TW (1) | TWI541104B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103817571A (en) * | 2012-11-16 | 2014-05-28 | 3M材料技术(合肥)有限公司 | Glass polishing device |
| CN113649891A (en) * | 2021-10-20 | 2021-11-16 | 江苏学霖电缆科技有限公司 | Power cable accessory rubber product grinding device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102608901B1 (en) | 2018-12-24 | 2023-12-01 | 삼성전자주식회사 | Wafer Grinding Wheel |
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| KR20040097063A (en) * | 2004-10-22 | 2004-11-17 | 엠.씨.케이 (주) | Process for preparing foamed polyurethane polishing pad for fine polishing |
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| KR20060034908A (en) * | 2004-10-20 | 2006-04-26 | 주식회사 신안에스엔피 | Method of polishing glass for oled and glass for oled manufactured using the same |
| CN101417405A (en) * | 2007-10-17 | 2009-04-29 | 硅电子股份公司 | Simultaneous double-side grinding of semiconductor wafers |
| KR20090070302A (en) * | 2007-12-27 | 2009-07-01 | 주식회사 실트론 | Wafer edge grinding wheel with replaceable wheel ring |
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| CN103817571A (en) * | 2012-11-16 | 2014-05-28 | 3M材料技术(合肥)有限公司 | Glass polishing device |
| CN113649891A (en) * | 2021-10-20 | 2021-11-16 | 江苏学霖电缆科技有限公司 | Power cable accessory rubber product grinding device |
| CN113649891B (en) * | 2021-10-20 | 2021-12-17 | 江苏学霖电缆科技有限公司 | Power cable accessory rubber product grinding device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102975132B (en) | 2015-05-20 |
| TWI541104B (en) | 2016-07-11 |
| KR101103146B1 (en) | 2012-01-04 |
| TW201311399A (en) | 2013-03-16 |
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