CN102970816A - 制作于印刷电路板上的球栅阵列 - Google Patents
制作于印刷电路板上的球栅阵列 Download PDFInfo
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- CN102970816A CN102970816A CN2011102662116A CN201110266211A CN102970816A CN 102970816 A CN102970816 A CN 102970816A CN 2011102662116 A CN2011102662116 A CN 2011102662116A CN 201110266211 A CN201110266211 A CN 201110266211A CN 102970816 A CN102970816 A CN 102970816A
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- tin ball
- tin
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
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Claims (16)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201110266211.6A CN102970816B (zh) | 2011-09-01 | 2011-09-01 | 制作于印刷电路板上的球栅阵列 |
Applications Claiming Priority (1)
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CN201110266211.6A CN102970816B (zh) | 2011-09-01 | 2011-09-01 | 制作于印刷电路板上的球栅阵列 |
Publications (2)
Publication Number | Publication Date |
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CN102970816A true CN102970816A (zh) | 2013-03-13 |
CN102970816B CN102970816B (zh) | 2015-09-09 |
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CN201110266211.6A Active CN102970816B (zh) | 2011-09-01 | 2011-09-01 | 制作于印刷电路板上的球栅阵列 |
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CN (1) | CN102970816B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112490219A (zh) * | 2020-11-27 | 2021-03-12 | 海宁利伊电子科技有限公司 | 一种抗辐射泄露的共形屏蔽sip封装结构 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5832598A (en) * | 1995-03-02 | 1998-11-10 | Circuit Components Incorporated | Method of making microwave circuit package |
US6198635B1 (en) * | 1999-05-18 | 2001-03-06 | Vsli Technology, Inc. | Interconnect layout pattern for integrated circuit packages and the like |
CN1738038A (zh) * | 2005-08-10 | 2006-02-22 | 威盛电子股份有限公司 | 球栅阵列封装结构与其基板 |
JP2006165003A (ja) * | 2004-12-02 | 2006-06-22 | Matsushita Electric Ind Co Ltd | プリント基板およびプリント基板の設計方法、icパッケージの接続端子設計方法、icパッケージの接続方法 |
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2011
- 2011-09-01 CN CN201110266211.6A patent/CN102970816B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5832598A (en) * | 1995-03-02 | 1998-11-10 | Circuit Components Incorporated | Method of making microwave circuit package |
US6198635B1 (en) * | 1999-05-18 | 2001-03-06 | Vsli Technology, Inc. | Interconnect layout pattern for integrated circuit packages and the like |
JP2006165003A (ja) * | 2004-12-02 | 2006-06-22 | Matsushita Electric Ind Co Ltd | プリント基板およびプリント基板の設計方法、icパッケージの接続端子設計方法、icパッケージの接続方法 |
CN1738038A (zh) * | 2005-08-10 | 2006-02-22 | 威盛电子股份有限公司 | 球栅阵列封装结构与其基板 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112490219A (zh) * | 2020-11-27 | 2021-03-12 | 海宁利伊电子科技有限公司 | 一种抗辐射泄露的共形屏蔽sip封装结构 |
CN112490219B (zh) * | 2020-11-27 | 2022-05-03 | 海宁利伊电子科技有限公司 | 一种抗辐射泄露的共形屏蔽sip封装结构 |
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Publication number | Publication date |
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CN102970816B (zh) | 2015-09-09 |
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Effective date of registration: 20201026 Address after: No. 1, Xingzhu Road, Hsinchu Science Park, Taiwan, China Patentee after: MEDIATEK Inc. Address before: 405, 4th floor, 1st District, Shenzhen Bay science and technology ecological park, Aohai street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Mstar Semiconductor,Inc. Patentee before: MEDIATEK Inc. Effective date of registration: 20201026 Address after: 405, 4th floor, 1st District, Shenzhen Bay science and technology ecological park, Aohai street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Mstar Semiconductor,Inc. Patentee after: MEDIATEK Inc. Address before: 518057, Guangdong, Shenzhen hi tech Zone, South District, science and technology, South ten road, Shenzhen Institute of Aerospace Science and technology innovation, C block, building 4 Patentee before: Mstar Semiconductor,Inc. Patentee before: MSTAR SEMICONDUCTOR Inc. |
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TR01 | Transfer of patent right |