CN102962970B - Injection moulding machine - Google Patents
Injection moulding machine Download PDFInfo
- Publication number
- CN102962970B CN102962970B CN201210229322.4A CN201210229322A CN102962970B CN 102962970 B CN102962970 B CN 102962970B CN 201210229322 A CN201210229322 A CN 201210229322A CN 102962970 B CN102962970 B CN 102962970B
- Authority
- CN
- China
- Prior art keywords
- temperature
- section
- controlled area
- controlled
- band heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/74—Heating or cooling of the injection unit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/78—Measuring, controlling or regulating of temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76655—Location of control
- B29C2945/76658—Injection unit
- B29C2945/76682—Injection unit injection piston cylinder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76929—Controlling method
- B29C2945/76939—Using stored or historical data sets
Abstract
The invention provides an injection moulding machine which can control temperature of a heating target component more flexibly. The injection moulding machine comprises a heating cylinder (1) which is divided into a plurality of temperature control sections (Z1, Z2, Z3, Z4) for temperature control, a band type heater (30) for heating the predetermined temperature control section Z1 in the plurality of temperature control sections (Z1, Z2, Z3, Z4), and a temperature control part (20) used for controlling the temperature of a part (Z1.5) except for the predetermined temperature control section Z1 to be the predetermined temperature with the band type heater (30).
Description
Technical field
The present invention relates to a kind of injection (mo(u)lding) machine with heating target parts.
Background technology
Conventionally, there is known the device (such as referenced patent document 1) of the temperature of cartridge heater in control injection (mo(u)lding) machine.
This device is according to from the temperature data of temperature sensor being installed on multiple temperature-controlled area section in cartridge heater respectively, and limit performs the closed-loop control controlled based on PID, the band heater that limit FEEDBACK CONTROL is corresponding with multiple temperature-controlled area section respectively.
Patent document 1: Japanese Unexamined Patent Publication 2006-137119 publication
But the device recorded in patent document 1 utilizes and specified temp controls band heater corresponding to section and control with the combination that this specified temp controls temperature sensor corresponding to section the temperature that this specified temp controls section.That is, the device recorded in patent document 1 independently controls multiple temperature-controlled area sections temperature separately.Therefore, exist adjustment that specified temp controls the temperature of section only according to and this specified temp control band heater corresponding to section and temperature sensor with closed carrying out the restricted problem of temperature controlled response.
Summary of the invention
In view of the above problems, the object of the present invention is to provide a kind of injection (mo(u)lding) machine that can control the temperature of heating target parts more neatly.
To achieve these goals, the injection (mo(u)lding) machine involved by embodiments of the invention, is characterized in that, has: heating cylinder, is split into multiple temperature-controlled area section and carries out temperature control; Heating part, heats the predetermined temperature-controlled area section in described multiple temperature-controlled area section; And temperature control part, by described heating part, the temperature at the position except described predetermined temperature-controlled area section is controlled as predetermined temperature.
Invention effect:
According to above-mentioned component, the present invention can provide a kind of injection (mo(u)lding) machine that can control the temperature of heating target parts more neatly.
Accompanying drawing explanation
Fig. 1 is the synoptic diagram of the structure example of the temperature control system represented on the injection (mo(u)lding) machine that is equipped on involved by embodiments of the invention.
Fig. 2 represents by the temperature control part in the temperature control system of Fig. 1 by the figure of an example of the Temperature Distribution of the heating cylinder of control temperature.
Fig. 3 is the flow chart of the flow process representing the first temperature control treatment.
Fig. 4 represents by the temperature control part in the temperature control system of Fig. 1 by the figure of other examples of the Temperature Distribution of the heating cylinder of control temperature.
Fig. 5 is the flow chart of the flow process representing the second temperature control treatment.
In figure: 1-heating cylinder, 2-control part, 3-band heater, 4-temperature sensor, 10-water-cooled cylinder portion, 11-first cylindrical portion, 12-second cylindrical portion, 13-spray nozzle part, 20-temperature control part, 30-the 1st section band heater, 31-the 2nd section band heater, 32-the 3rd section band heater, 33-the 4th section band heater, 40-the 1st zone temperatures sensor, 41-the 1.5th zone temperatures sensor, 42-the 2nd zone temperatures sensor, 43-the 3rd zone temperatures sensor, 44-the 4th zone temperatures sensor, 100-temperature control system, Z1-the 1st section, Z2-the 2nd section, Z3-the 3rd section, Z4-the 4th section.
Detailed description of the invention
Below, with reference to accompanying drawing, embodiments of the invention are described.
[embodiment 1]
Fig. 1 is the synoptic diagram of the structure example of the temperature control system 100 represented on the injection (mo(u)lding) machine that is equipped on involved by embodiments of the invention.In the present embodiment, temperature control system 100 limit is by measuring the temperature of the heating cylinder 1 as heating target parts as the temperature sensor 4 of temperature detecting part, limit is by controlling the temperature of heating cylinder 1 as the band heater 3 of heating part.
Heating cylinder 1 is can to rotate and the mode that can move axially holds the parts of screw rod (not shown).Heating cylinder 1 mainly comprises water-cooled cylinder portion 10, first cylindrical portion 11, second cylindrical portion 12 and spray nozzle part 13.In addition, water-cooled cylinder portion 10, first cylindrical portion 11, second cylindrical portion 12 and spray nozzle part 13 are formed by metal, can exchange heat.The resin that hopper (not shown) through being installed on water-cooled cylinder portion 10 supplies, is melted/plasticising in heating cylinder 1, by the direction feed of screw rod to spray nozzle part 13.
Temperature control system 100 mainly comprises control part 2, band heater 3 and temperature sensor 4.
Control part 2 is the function important document of the action of control temperature control system 100, such as, for possessing CPU(Central Processing Unit), RAM(Random Access Memory) and ROM(ReadOnly Memory) etc. computer.Specifically, control part 2 limit reads the program corresponding with temperature control part 20 from ROM and is deployed in RAM, while make CPU perform the process corresponding with temperature control part 20.
Band heater 3 is the examples to the heating part that heating cylinder 1 heats.In the present embodiment, band heater 3 comprise the first cylindrical portion 11 of heating cylinder 1 is heated 2 band heaters 30,31,1 band heater 32 that the second cylindrical portion 12 is heated and 1 band heater 33 that spray nozzle part 13 is heated.In addition, the first cylindrical portion 11 of heating cylinder 1 have by being configured at temperature-controlled area section i.e. the 1st section Z1 that band heater 30 near water-cooled cylinder 10 heats, temperature-controlled area section i.e. the 2nd section Z2 that heated by the band heater 31 be configured near the second cylindrical portion 12 and section Z1.5 be configured between the 1st section Z1 and the 2nd section Z2.Further, the second cylindrical portion 12 of heating cylinder 1 forms temperature-controlled area section i.e. the 3rd section Z3 heated by band heater 32.Further, the spray nozzle part 13 of heating cylinder 1 forms temperature-controlled area section i.e. the 4th section Z4 heated by band heater 33.Below, the section becoming heating target is coordinated band heater 30 ~ 33 to be called the 1st section band heater 30, the 2nd section band heater 31, the 3rd section band heater 32 and the 4th section band heater 33.
Further, the control signal action that band heater 3 exports according to control part 2, such as, according to the PWM(Pulse Width Modulation that control part 2 exports) signal switching opening and closing.
Like this, heating cylinder 1 is split into multiple temperature-controlled area section Z1, Z2, Z3, Z4 and by control temperature.
Temperature sensor 4 is an example of the temperature detecting part of the temperature detecting heating cylinder 1, such as, comprise thermocouple.In the present embodiment, temperature sensor 4 comprises the 4th zone temperatures sensor 44 of the temperature of the 1st zone temperatures sensor 40 of the temperature of detection the 1st section Z1, the 1.5th zone temperatures sensor 41 of the temperature of detector segments Z1.5, the 2nd zone temperatures sensor 42 detecting the temperature of the 2nd section Z2, the 3rd zone temperatures sensor 43 detecting the temperature of the 3rd section Z3 and detection the 4th section Z4.Further, temperature sensor 4 pairs of control parts 2 are with predetermined period output detections value repeatedly.
The temperature control part 20 of control part 2 temperature of heating cylinder 1 is controlled for the function important document of predetermined design temperature, such as, to carry out PWM control according to the detected value of temperature sensor 4 to band heater 3.
Fig. 2 represents by the temperature control part 20 in temperature control system 100 by the figure of an example of the Temperature Distribution of the heating cylinder 1 of control temperature, and the chart of the relation represented from the distance of datum mark and temperature is shown in the below of the synoptic diagram of heating cylinder 1.In addition, the datum mark of this chart is the central point of water-cooled cylinder 10, and the direction of this distance from datum mark towards spray nozzle part 13 (left of figure) increases.
The detected value of temperature control part 20 such as persistent surveillance the 2nd zone temperatures sensor 42, when this detected value is lower than design temperature T1, opens the 2nd section band heater 31, when this detected value exceedes design temperature T1, closes the 2nd section band heater 31.Its result, the temperature of the 2nd section Z2 is controlled as design temperature T1 by the 2nd section band heater 31 by temperature control part 20.So, the method for the temperature being controlled this temperature-controlled area section by the band heater corresponding with temperature-controlled area section is called " the first temperature-controlled process ".At this moment, temperature control part 20 can be larger by the difference of design temperature T1 and the current detected value (< T1) of the 2nd zone temperatures sensor 42, and the dutycycle of all the more large pwm signal to the 2nd section band heater 31 increases specific temperature rise.The temperature of the 3rd section Z3 and the 4th section Z4 is controlled for also identical during design temperature T1.In addition, design temperature T1 is such as being supplied to the fusing point of the resin of heating cylinder 1.
Further, the detected value of temperature control part 20 persistent surveillance the 1.5th zone temperatures sensor 41, when this detected value is lower than design temperature T1, opens the 1st section band heater 30, when this detected value exceedes design temperature T1, closes the 1st section band heater 30.Its result, the temperature of section Z1.5 is controlled as design temperature T1 by the 1st section band heater 30 by temperature control part 20.So, the method being controlled the temperature of section by directly not corresponding with temperature-controlled area section band heater control temperature is called " the second temperature-controlled process ".Now, when the temperature of section Z1.5 reaches design temperature T1, the temperature of the 1st section Z1 is usually less than design temperature T1.This is because the 1st section Z1 is adjacent with the water-cooled cylinder portion 10 comparing low temperature, and temperature not easily rises compared with section Z1.5.But the temperature of the 1st section Z1 when the temperature of section Z1.5 reaches design temperature T1 is also sometimes higher than design temperature T1.In addition, " reaching design temperature " refers to, the detected value comprising temperature sensor 4 stops the state of the scheduled time in the temperature range of predetermined amplitude comprising design temperature.
Afterwards, 1st zone temperatures sensor 40 is reached the temperature of the moment detection of design temperature T1 as the design temperature T2 of the 1st section Z1 by temperature control part 20 in the temperature of section Z1.5, add Hot device 30 control the temperature of the 1st section Z1 for design temperature T2 by the 1st section belt.So, after execution second temperature-controlled process, utilize the design temperature of new settings in the second temperature-controlled process, the method being controlled the temperature of this temperature-controlled area section by the band heater corresponding with temperature-controlled area section is called " the 3rd temperature-controlled process ".In addition, the temperature that when temperature that the design temperature T2 of the 1st section Z1 may not be section Z1.5 reaches design temperature T1, the 1st zone temperatures sensor 40 detects itself, but this temperature is multiplied by the temperature that pre-determined factor etc. derives indirectly according to this temperature.
Why temperature control part 20 adopts the 3rd temperature-controlled process, is can by the temperature of the 1st section Z1 being controlled as the temperature of section Z1.5 controls as design temperature T1 this point by design temperature T2 because consider.And, because when temperature control part 20 does not switch to the 3rd temperature-controlled process and continues employing the second temperature-controlled process, the heating delays of the 1st section Z1 when likely causing the temperature of the 1st section Z1 sharply to decline because of the cooling in the resin that supplies from hopper or water-cooled cylinder portion 10 and greatly upset the equalized temperature of heating cylinder 1.
Temperature Distribution (solid line) when the figure of Fig. 2 indicates the Temperature Distribution (dotted line) when adopting the first temperature-controlled process to all temperature-controlled area sections of the 1st section Z1 ~ the 4th section Z4 and adopts the second temperature-controlled process to section Z1.5 and adopt the 3rd temperature-controlled process to the 1st section Z1.
As shown with a dotted line in fig. 2, when adopting the first temperature-controlled process to all temperature-controlled area sections of the 1st section Z1 ~ the 4th section Z4,1st section Z1, the 2nd section Z2, the 3rd section Z3 and the 4th section Z4 are controlled as design temperature T1, but the temperature that there is not the section Z1.5 of corresponding band heater is not become the temperature exceeding design temperature T1 by controlling.
On the other hand, as shown in the solid line of Fig. 2, when adopting the second temperature-controlled process to section Z1.5 and to the 1st section Z1 employing the 3rd temperature-controlled process, the 1st section Z1 is controlled as design temperature T2, and the section Z1.5 that there is not corresponding band heater is controlled as design temperature T1.In addition, identical with the situation shown in the dotted line of Fig. 2, the 2nd section Z2, the 3rd section Z3 and the 4th section Z4 are controlled as design temperature T1.
So, temperature control system 100 can be avoided being between the 1st section Z1 and the 2nd section Z2 and to there is not the non-control state (being such as the state of overshoot) of temperature in the section Z1.5 of corresponding band heater.
Then, the flow process with reference to figure 3 pairs of temperature control parts 20, the temperature of heating cylinder 1 being controlled to the process (hereinafter referred to as " the first temperature control treatment ") of desired state is described.In addition, Fig. 3 is the flow chart of the flow process representing the first temperature control treatment.Temperature control part 20 such as performs this first temperature control treatment according to the operation input of the operating personnel through the input parts such as contact panel (not shown).
First, temperature control part 20 starts to control (the second temperature-controlled process) (step S1) based on the temperature of the section Z1.5 of the 1st section band heater 30.
Specifically, the detected value of temperature control part 20 persistent surveillance the 1.5th zone temperatures sensor 41, when this detected value is lower than design temperature T1, opens the 1st section band heater 30, when this detected value exceedes design temperature T1, close the 1st section band heater 30.
Further, temperature control part 20 starts to control (the first temperature-controlled process) based on the temperature of the 2nd section Z2 of the 2nd section band heater 31, control (the first temperature-controlled process) and control (the first temperature-controlled process) based on the temperature of the 4th section Z4 of the 4th section band heater 33 based on the temperature of the 3rd section Z3 of the 3rd section band heater 32 equally.
Afterwards, temperature control part 20 monitors whether the temperature of section Z1.5 reaches design temperature T1(step S2).In addition, such as after the temperature of section Z1.5 becomes design temperature T1 after a predetermined time time, be judged as that the temperature of section Z1.5 has reached design temperature T1.This be temperature stabilization in order to confirm section Z1.5 become design temperature T1, although and be to prevent the temperature of section Z1.5 from just becoming design temperature T1 instantaneously, the second temperature-controlled process being switched to the 3rd temperature-controlled process.In addition, design temperature T1 can be the temperature range with predetermined amplitude.
When being judged as that the temperature of section Z1.5 not yet reaches design temperature T1 (step S2's is no), temperature control part 20 continues to monitor whether the temperature of section Z1.5 reaches design temperature T1.
On the other hand, when being judged as that the temperature of section Z1.5 reaches design temperature T1 (step S2 is), the current temperature of the 1st section Z1 i.e. current detected value of the 1st zone temperatures sensor 40 is set to the design temperature T2(step S3 of the 1st section Z1 by temperature control part 20).
Afterwards, temperature control part 20 starts to control (the 3rd temperature-controlled process) (step S4) based on the temperature of the 1st section Z1 of the 1st section band heater 30.
Specifically, the detected value of temperature control part 20 persistent surveillance the 1st zone temperatures sensor 40, when this detected value is lower than design temperature T2, opens the 1st section band heater 30, when this detected value exceedes design temperature T2, close the 1st section band heater 30.
According to above structure, temperature control system 100 utilizes the 1st section band heater 30 corresponding with the 1st section Z1 to control the temperature of the section Z1.5 that there is not corresponding band heater.Its result, the temperature that there is not the section of corresponding band heater can control as desired temperature by temperature control system 100, and can control the temperature of the heating cylinder 1 as heating target parts more neatly.
Further, temperature control system 100 utilizes the 1st section band heater 30 to control the temperature of section Z1.5 for after design temperature T1, and the temperature of the 1st section Z1 when the temperature of section Z1.5 being reached design temperature T1 is set to design temperature T2.And temperature control system 100 utilizes the 1st section band heater 30 temperature of the 1st corresponding section Z1 to be controlled to be design temperature T2.Its result, the temperature of the 1st section Z1 can be controlled as design temperature T2 by the 1st section band heater 30 on limit by temperature control system 100, while control the temperature of section Z1.5 for design temperature T1.
Further, temperature control system 100 can also utilize the 1st section band heater 30 to control the temperature of the 1st section Z1 for after design temperature T2, again utilizes the 1st section band heater 30 temperature of section Z1.5 to be controlled to be design temperature T1.At this moment, temperature control system 100 carries out the temperature control of section Z1.5 and the temperature control of the 1st section Z1 successively repeatedly.Its result, the temperature of the 1st section Z1 can be controlled as design temperature T2 by the 1st section band heater 30 by temperature control system 100, and controls the temperature of section Z1.5 for design temperature T1.
Further, temperature control system 100 controls the temperature in the region between this predetermined temperature-controlled area section and the temperature-controlled area section be adjacent with the heating part of heating predetermined temperature-controlled area section.That is, temperature control system 100 controls the temperature of region between the 1st section Z1 and the 2nd section Z2 and section Z1.5 with the 1st section band heater 30 of heating the 1st section Z1.But the present invention is not limited thereto.Such as, temperature control system 100 can control the temperature in the region between other temperature-controlled area sections with the heating part of heating predetermined temperature-controlled area section.
Then, with reference to figure 4, the temperature control treatment (hereinafter referred to as " the second temperature control treatment ") based on temperature control part 20 is described.
Fig. 4 represents by the temperature control part 20 in temperature control system 100 by the figure of another example of the Temperature Distribution of the heating cylinder 1 of control temperature, corresponding with Fig. 2.Fig. 4 illustrates the chart represented from the relation between the Distance geometry temperature of datum mark in the below of the synoptic diagram of heating cylinder 1.In addition, identical with the situation of Fig. 2, the datum mark of this chart is the central point of water-cooled cylinder 10, and the direction of this distance from datum mark towards spray nozzle part 13 (left of figure) increases.
The temperature of the 3rd section Z3 is controlled as design temperature T1 by the 3rd section band heater 32 according to the first temperature-controlled process by temperature control part 20, and is controlled the temperature of the 4th section Z4 for design temperature T1 by the 4th section band heater 33.
As shown in the single dotted broken line of Fig. 4, controlled by above temperature, the Temperature Distribution of heating cylinder 1 becomes design temperature T1 respectively in the 3rd section Z3 and the 4th section Z4.
But, such as such as because circulation increases or the quantity delivered of resin increases under state more than the supply heat of the 4th section band heater 33 of the demand heat of heating cylinder 1, the temperature that the 4th section Z4 may occur cannot reach the situation of design temperature T1.
Therefore, when the temperature of the 4th section Z4 keeps the scheduled time and the time of stagnation lower than the temperature of threshold temperature T3, temperature control part 20 starts to control (the second temperature-controlled process) based on the temperature of the 4th section Z4 of the 3rd section band heater 32 corresponding with the 3rd section Z3 being adjacent to the 4th section Z4.This is to control the temperature of the 4th section Z4 for design temperature T1.In addition, threshold temperature T3 is for judging that the 4th section band heater 33 has N/R temperature, such as, be the temperature than design temperature T1 only low predetermined temperature.
Specifically, the detected value of temperature control part 20 persistent surveillance the 4th zone temperatures sensor 44, when this detected value is lower than design temperature T1, open the 3rd section band heater 32, by the 3rd section band heater 32, the temperature of the 4th section Z4 is controlled as design temperature T1 thus.At this moment, the difference that temperature control part 20 can pass through the current detected value (< T1) of design temperature T1 and the 4th zone temperatures sensor 44 is larger, and the dutycycle of all the more large pwm signal to the 3rd section band heater 32 increases specific temperature rise.Further, the detected value of temperature control part 20 persistent surveillance the 3rd zone temperatures sensor 43, when this detected value reaches threshold temperature T4(> T1) time, the 3rd section band heater 32 can be closed.Although this being to prevent the temperature of the 3rd section Z3 from having reached design temperature T1, continuing to open the 3rd section band heater 32 further to make the temperature of the 4th section Z4 rise, finally causing the excessive temperature of the 3rd section Z3 to exceed design temperature T1.
The chart of Fig. 4 is except illustrating above-mentioned desirable Temperature Distribution (single dotted broken line), also illustrate when occurring abnormal in the 4th section band heater 33, the Temperature Distribution (dotted line) when first temperature-controlled process adopting to the 4th section Z4 when controlling the temperature of the 4th section Z4 by the 4th section band heater 33.In addition, the figure of Fig. 4 indicates the Temperature Distribution (solid line) when adopting the second temperature-controlled process when being controlled the temperature of the 4th section Z4 by the 3rd section band heater 32 to the 4th section Z4.
As indicated with broken lines in fig. 4, when the 4th section band heater 33 fully cannot heat the 4th section Z4, when continuing employing the first temperature-controlled process to the 4th section Z4, the temperature of the 4th section Z4 can not reach design temperature T1 and pass with the temperature lower than threshold temperature T3.
On the other hand, as shown in the solid line of Fig. 4, when the 4th section band heater 33 fully cannot heat the 4th section Z4, when adopting the second temperature-controlled process to the 4th section Z4, the temperature of the 3rd section Z3 can be made lower than threshold temperature T4(> T1), and the temperature of the 4th section Z4 can be controlled as design temperature T1.
So, temperature control system 100 can avoid exception etc. because of corresponding band heater and the non-control state of temperature in the temperature-controlled area section produced.
Then, with reference to figure 5, the flow process of the second temperature control treatment is described.In addition, Fig. 5 is the flow chart of the flow process representing the second temperature control treatment.Such as when the temperature i.e. detected value of the 4th zone temperatures sensor 44 of the 4th section Z4 is lower than the threshold temperature T3 scheduled time, temperature control part 20 performs this second temperature control treatment.
First, temperature control part 20 starts to control (the second temperature-controlled process) (step S11) based on the temperature of the 4th section Z4 of the 3rd section band heater 32.
Specifically, the detected value of temperature control part 20 persistent surveillance the 4th zone temperatures sensor 44, when this detected value is lower than design temperature T1, opens the 3rd section band heater 32.
Afterwards, temperature control part 20 monitors whether the temperature of the 4th section Z4 reaches design temperature T1(step S12).In addition, such as after the temperature of the 4th section Z4 becomes design temperature T1 after a predetermined time time, be judged as that the temperature of the 4th section Z4 reaches design temperature T1.This be temperature stabilization in order to confirm the 4th section Z4 become design temperature T1.In addition, design temperature T1 can be the temperature range with predetermined amplitude.
When being judged as that the temperature of the 4th section Z4 not yet reaches design temperature T1 (step S12's is no), whether the temperature that temperature control part 20 continues supervision the 4th section Z4 reaches design temperature T1.
On the other hand, when being judged as that the temperature of the 4th section Z4 reaches design temperature T1 (step S12 is), the current temperature of the 3rd section Z3 i.e. current detected value of the 3rd zone temperatures sensor 43 is set to the design temperature T5(< T4 of the 3rd section Z3 by temperature control part 20) (step S13).In addition, the design temperature T5 of the 3rd section Z3 may not be temperature that the 3rd zone temperatures sensor 43 detects when the temperature of the 4th section Z4 reaches design temperature T1 itself, but this temperature is multiplied by the temperature that pre-determined factor etc. derives indirectly according to this temperature.
Afterwards, temperature control part 20 starts to control (the 3rd temperature-controlled process) (step S14) based on the temperature of the 3rd section Z3 of the 3rd section band heater 32.
Specifically, temperature control part 20 continues the detected value of supervision the 3rd zone temperatures sensor 43, when this detected value is lower than design temperature T5, opens the 3rd section band heater 32, when this detected value exceedes design temperature T5, close the 3rd section band heater 32.
Why temperature control part 20 adopts the 3rd temperature-controlled process, is can by the temperature of the 3rd section Z3 being controlled as the temperature of the 4th section Z4 controls as design temperature T1 this point by design temperature T5 because consider.But temperature control part 20 after the temperature of the 4th section Z4 reaches design temperature T1, can not adopt the 3rd temperature-controlled process and continues employing second temperature-controlled process yet.Directly be subject to the impact of the temperature change of the die device (not shown) that spray nozzle part 13 contacts due to the 4th section Z4, therefore temperature is easier to change compared with the 3rd section Z3.This is because, when continuing employing the second temperature-controlled process in this condition, promptly can control comparing the temperature being easy to the 4th section Z4 changed as design temperature T1.In addition, when continuing employing the second temperature-controlled process, although the temperature of the 3rd section Z3 can not get controlling, can prevent the excessive temperature of the 3rd section Z3 from rising by closing the 3rd section band heater 32 when the temperature of the 3rd section Z3 reaches threshold temperature T4.
According to above structure, temperature control system 100 utilizes the 3rd section band heater 32 corresponding with the 3rd section Z3 to control the temperature that the 4th abnormal section Z4 occurs in corresponding band heater.Its result, the temperature that abnormal section occurs in corresponding band heater can control as desired temperature by temperature control system 100, and can control the temperature of the heating cylinder 1 as heating target parts more neatly.
Further, temperature control system 100 utilizes the 3rd section band heater 32 to control the temperature of the 4th section Z4 for after design temperature T1, and the temperature of the 3rd section Z3 when the temperature of the 4th section Z4 being reached design temperature T1 is set to design temperature T5.And temperature control system 100 utilizes the 3rd section band heater 32 temperature of the 3rd corresponding section Z3 to be controlled to be design temperature T5.Its result, the temperature of the 3rd section Z3 can be controlled as design temperature T5 by the 3rd section band heater 32 on limit by temperature control system 100, while control the temperature of the 4th section Z4 for design temperature T1.
Further, temperature control system 100 can utilize the 3rd section band heater 32 to control the temperature of the 3rd section Z3 for after design temperature T5, again utilizes the 3rd section band heater 32 temperature of the 4th section Z4 to be controlled to be design temperature T1.At this moment, temperature control system 100 carries out the temperature control of the 4th section Z4 and the temperature control of the 3rd section Z3 successively repeatedly.Its result, the temperature of the 3rd section Z3 can be controlled as design temperature T5 by the 3rd section band heater 32 by temperature control system 100, and controls the temperature of the 4th section Z4 for design temperature T1.
Further, temperature control system 100 heating part of heating predetermined temperature-controlled area section controls the temperature being adjacent to the temperature-controlled area section of this predetermined temperature-controlled area section.That is, temperature control system 100 the 3rd section band heater 32 of heating the 3rd section Z3 controls the temperature being adjacent to the 4th section Z4 of the 3rd section Z3.But the present invention is not limited thereto.Such as, temperature control system 100 is temperature that heating part by heating predetermined temperature-controlled area section controls other temperature-controlled area sections, and other temperature-controlled area sections are not limited to the temperature-controlled area section adjoined.
Further, temperature control system 100 also can simultaneously executed in parallel first temperature control treatment and the second temperature control treatment.
Above, the preferred embodiments of the present invention have been described in detail, but the invention is not restricted to the embodiments described, without departing from the scope of the present invention, various distortion and replacement can be carried out to the above embodiments.
Such as, in the above-described embodiments, temperature control system 100 adopts band heater as the heating part of heating each section of heating cylinder 1, but heating part is not limited thereto.Such as, temperature control system 100 also can adopt configuration around each section to make the heater of the pipeline of heating fluid loop.At this moment, temperature control part 20 adjustment adds the temperature of hot fluid or flow velocity to control the temperature of each section.
Claims (8)
1. an injection (mo(u)lding) machine, is characterized in that, has:
Heating cylinder, is split into multiple temperature-controlled area section and carries out temperature control;
Heating part, heats the predetermined temperature-controlled area section in described multiple temperature-controlled area section; And
Temperature control part, controls to be predetermined temperature by the temperature at the position except described predetermined temperature-controlled area section with described heating part.
2. injection (mo(u)lding) machine as claimed in claim 1, is characterized in that,
The detected value of the temperature detecting part of described temperature control part set by the position except described predetermined temperature-controlled area section, is controlled the temperature at the position except described predetermined temperature-controlled area section as predetermined temperature by described heating part.
3. injection (mo(u)lding) machine as claimed in claim 1 or 2, is characterized in that,
Position except described predetermined temperature-controlled area section is the region between described multiple temperature-controlled area section.
4. injection (mo(u)lding) machine as claimed in claim 1 or 2, is characterized in that,
Position except described predetermined temperature-controlled area section is other temperature-controlled area sections.
5. injection (mo(u)lding) machine as claimed in claim 1 or 2, is characterized in that,
Position except described predetermined temperature-controlled area section is the temperature-controlled area section that the temperature-controlled area section predetermined with this adjoins.
6. injection (mo(u)lding) machine as claimed in claim 1 or 2, is characterized in that,
The temperature at the position except described predetermined temperature-controlled area section controls as after predetermined temperature by described temperature control part, controls the temperature of described predetermined temperature-controlled area section with described heating part.
7. injection (mo(u)lding) machine as claimed in claim 6, is characterized in that,
Described temperature control part, to control the temperature at the position except described predetermined temperature-controlled area section for the temperature of described predetermined temperature-controlled area section during predetermined temperature is as the design temperature of this predetermined temperature-controlled area section with described heating part, controls the temperature of this predetermined temperature-controlled area section.
8. injection (mo(u)lding) machine as claimed in claim 7, is characterized in that,
The temperature of described predetermined temperature-controlled area section controls, for after described design temperature, to control the temperature at the position except described predetermined temperature-controlled area section by the described heating part of described temperature control part.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011190061A JP5736278B2 (en) | 2011-08-31 | 2011-08-31 | Injection molding machine |
| JP190061/2011 | 2011-08-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102962970A CN102962970A (en) | 2013-03-13 |
| CN102962970B true CN102962970B (en) | 2015-05-27 |
Family
ID=47793548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210229322.4A Active CN102962970B (en) | 2011-08-31 | 2012-07-03 | Injection moulding machine |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5736278B2 (en) |
| KR (1) | KR101407203B1 (en) |
| CN (1) | CN102962970B (en) |
| TW (1) | TWI530382B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6009385B2 (en) * | 2013-03-26 | 2016-10-19 | 住友重機械工業株式会社 | Injection molding machine |
| JP5650807B2 (en) * | 2013-06-13 | 2015-01-07 | ファナック株式会社 | Temperature monitoring device for injection molding machine |
| JP6919588B2 (en) * | 2018-01-31 | 2021-08-18 | オムロン株式会社 | Temperature control device, temperature control method, and temperature control program |
| KR101970694B1 (en) * | 2018-10-08 | 2019-08-13 | (주)한국이엔이 | Injection molding machine |
| CN110027165A (en) * | 2019-03-04 | 2019-07-19 | 北京汽车集团有限公司 | The manufacturing device and manufacturing method of thermoplastic composite moulding |
| JP2023148494A (en) | 2022-03-30 | 2023-10-13 | 住友重機械工業株式会社 | Injection molding machine controller, injection molding machine, and injection molding machine control method |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1060812A (en) * | 1990-10-18 | 1992-05-06 | 日精树脂工业株式会社 | The temperature-controlled process of injection moulding forming machine |
| US5456870A (en) * | 1994-05-20 | 1995-10-10 | Van Dorn Demag Corporation | Barrel temperature state controller for injection molding machine |
| JP2006137119A (en) * | 2004-11-15 | 2006-06-01 | Meiki Co Ltd | Temperature control method and object to be controlled |
| JP3790609B2 (en) * | 1997-06-04 | 2006-06-28 | 株式会社日本製鋼所 | Temperature control method and temperature control device for injection molding machine |
| CN1835836A (en) * | 2003-08-27 | 2006-09-20 | 住友重机械工业株式会社 | Injection molding machine, and temperature control method for injection molding machine |
| JP4055104B2 (en) * | 2000-11-22 | 2008-03-05 | 株式会社ニイガタマシンテクノ | Nozzle temperature control method and nozzle temperature control apparatus for injection molding machine |
| CN101394984A (en) * | 2006-03-13 | 2009-03-25 | 住友重机械工业株式会社 | Injection molding machine |
| CN101722636A (en) * | 2008-10-23 | 2010-06-09 | 鸿富锦精密工业（深圳）有限公司 | Ejection molding machine |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59137022U (en) * | 1983-03-02 | 1984-09-12 | 東芝機械株式会社 | heating cylinder heating device |
| JPH0255114A (en) * | 1988-08-18 | 1990-02-23 | Nissei Plastics Ind Co | Heating apparatus of injection molding machine |
| JPH07110511B2 (en) * | 1989-05-30 | 1995-11-29 | 東洋機械金属株式会社 | Heating cylinder temperature control method and apparatus for injection molding machine |
| JPH09216261A (en) * | 1996-02-13 | 1997-08-19 | Toyo Mach & Metal Co Ltd | In-line screw type injection molding machine |
-
2011
- 2011-08-31 JP JP2011190061A patent/JP5736278B2/en active Active
-
2012
- 2012-07-03 CN CN201210229322.4A patent/CN102962970B/en active Active
- 2012-07-26 TW TW101126967A patent/TWI530382B/en not_active IP Right Cessation
- 2012-08-27 KR KR1020120093515A patent/KR101407203B1/en active IP Right Grant
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1060812A (en) * | 1990-10-18 | 1992-05-06 | 日精树脂工业株式会社 | The temperature-controlled process of injection moulding forming machine |
| US5456870A (en) * | 1994-05-20 | 1995-10-10 | Van Dorn Demag Corporation | Barrel temperature state controller for injection molding machine |
| JP3790609B2 (en) * | 1997-06-04 | 2006-06-28 | 株式会社日本製鋼所 | Temperature control method and temperature control device for injection molding machine |
| JP4055104B2 (en) * | 2000-11-22 | 2008-03-05 | 株式会社ニイガタマシンテクノ | Nozzle temperature control method and nozzle temperature control apparatus for injection molding machine |
| CN1835836A (en) * | 2003-08-27 | 2006-09-20 | 住友重机械工业株式会社 | Injection molding machine, and temperature control method for injection molding machine |
| JP2006137119A (en) * | 2004-11-15 | 2006-06-01 | Meiki Co Ltd | Temperature control method and object to be controlled |
| CN101394984A (en) * | 2006-03-13 | 2009-03-25 | 住友重机械工业株式会社 | Injection molding machine |
| CN101722636A (en) * | 2008-10-23 | 2010-06-09 | 鸿富锦精密工业（深圳）有限公司 | Ejection molding machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102962970A (en) | 2013-03-13 |
| KR20130024799A (en) | 2013-03-08 |
| TW201313442A (en) | 2013-04-01 |
| JP2013052510A (en) | 2013-03-21 |
| TWI530382B (en) | 2016-04-21 |
| KR101407203B1 (en) | 2014-06-12 |
| JP5736278B2 (en) | 2015-06-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102962970B (en) | Injection moulding machine | |
| KR101711500B1 (en) | Control device for an injection molding machine | |
| EP2054185B1 (en) | Thermal management of extruder of molding system | |
| CN106951012B (en) | A kind of temprature control method of oven | |
| JP7260434B2 (en) | Temperature control device for injection molding machine with abnormality detection function | |
| CZ20022696A3 (en) | Method for controlling extruder temperature with perpetual temperature zeroing | |
| US20230229180A1 (en) | Control method and control system for high-precision rapid temperature trajectory tracking | |
| US8196630B2 (en) | Thermally-controlled friction bonding of workpiece layers | |
| JP2019533588A (en) | Method and apparatus for producing molded parts using semi-finished products | |
| JP5189577B2 (en) | Temperature control method for injection molding machine | |
| EP2212754B1 (en) | A method of operating a temperature management device | |
| CN106211393B (en) | Heating power control method and device of electromagnetic heating system | |
| KR100462338B1 (en) | A method of adjusting a heat-displacing t-die | |
| JP3785352B2 (en) | Hot press temperature control method | |
| EP1967038B1 (en) | Improved hot wire control apparatus and method | |
| EP2572854B1 (en) | Injection molding machine | |
| US20040074894A1 (en) | Variable flow thermostat and method for variably controlling engine temperature | |
| CN111034352B (en) | Heating device and abnormality detection method for heating device | |
| CN111571951A (en) | Temperature control system and temperature control method for injection molding machine mold hot runner | |
| JP6206719B2 (en) | Heating barrel temperature control method for injection molding machine | |
| CN101936650B (en) | Method for automatically heating product in drying groove of cleaning machine | |
| WO2003035362A1 (en) | Controlling injection moulding processes | |
| CN116449889A (en) | Detector and temperature control system and method thereof | |
| JP2002059458A (en) | Injection molding machine | |
| Zhang et al. | Over-time alarm for temperature rise in salt-bath furnace and heating time recorder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |