CN102958294A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
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- CN102958294A CN102958294A CN2011102538797A CN201110253879A CN102958294A CN 102958294 A CN102958294 A CN 102958294A CN 2011102538797 A CN2011102538797 A CN 2011102538797A CN 201110253879 A CN201110253879 A CN 201110253879A CN 102958294 A CN102958294 A CN 102958294A
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Abstract
The invention discloses a circuit board and a manufacturing method of the circuit board. The manufacturing method of the circuit board comprises the steps of forming an external insulating layer on a substrate, and forming a pre-gelatinized layer and a metal layer on the external insulating layer, wherein the pre-gelatinized layer is located between the metal layer and the external insulating layer, the metal layer is provided with a contact surface touching the pre-gelatinized layer, and the average roughness of 10 points of the contact surface is 1-4 microns; and then, forming at least one pore in the metal layer; forming a conductive layer covering the metal layer and all surfaces of the pore; forming a metal column in the pore after forming the conductive layer; forming a metal pattern layer touching and locally covering the conductive layer above the metal layer; and removing part of the metal layer and part of the conductive layer exposed by the metal pattern layer to form an external circuit layer. The invention further provides a circuit board manufactured by the method.
Description
Technical field
The present invention relates to a kind of wiring board and manufacture method thereof, particularly relate to a kind of wiring board and manufacture method thereof with pre-glue-line (primer).
Background technology
Wiring board now, particularly high density intraconnections plate (High Density Interconnection Board, HDI Board) are towards the trend development of graph thinning.Therefore, the live width how research of the manufacturer of many wiring boards dwindles wiring board is to increase line density.Yet; when the live width of wiring board is dwindled; the outer-layer circuit layer can weaken usually with peel strength (peeling strength) between the outer insulation that it is connected; cause the outer-layer circuit layer easily to break away from from outer insulation, thereby reduce the reliability (reliability) of wiring board.
Summary of the invention
The invention provides a kind of manufacture method of wiring board, it increases peel strength between outer-layer circuit layer and the outer insulation with pre-glue-line.
The present invention provides a kind of wiring board in addition, and it has above-mentioned pre-glue-line, and is made by above-mentioned manufacture method.
The object of the invention to solve the technical problems realizes by the following technical solutions.The manufacture method of a kind of wiring board that proposes according to the present invention.In the manufacture method of this wiring board, form an outer insulation at a substrate, wherein substrate has two planes respect to one another, and outer insulation is formed on wherein on the plane.Form pre-glue-line and a metal level at outer insulation, wherein pre-glue-line position is between metal level and outer insulation, and metal level has a contact-making surface that contacts pre-glue-line.10 mean roughness of contact-making surface are between 1 micron to 4 microns.Then, form at least one hole at metal level, its Hole is to run through at least metal level, pre-glue-line and outer insulation and form.Then, forming a conductive layer, the wherein all surface of conductive layer covering metal layer and hole on the metal level and in hole.After forming conductive layer, in hole, form a metal column, wherein metal column connection metal layer.Then, above metal level, form a metal pattern layer, wherein metal pattern layer contact and the local conductive layer that covers.Afterwards, remove the partially conductive layer that metal pattern layer exposes and remove not by the part metals layer that metal pattern layer covered, to form an outer-layer circuit layer.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The manufacture method of aforesaid wiring board, the method that wherein forms metal level comprises pressing one tinsel.
The manufacture method of aforesaid wiring board, the method that wherein forms metal pattern layer comprise, at first, form a local mask pattern layer that exposes conductive layer at conductive layer.Then,, as shade conductive layer is electroplated with the mask pattern layer.
The manufacture method of aforesaid wiring board, the method that wherein forms hole comprises laser drill, plasma etching or machine drilling.
The manufacture method of aforesaid wiring board, the method that wherein forms outer insulation comprises that pressing one semi-solid preparation film is on substrate.
The manufacture method of aforesaid wiring board, wherein said substrate has at least one line layer, and metal column connection line layer.
The object of the invention to solve the technical problems also realizes by the following technical solutions.According to a kind of wiring board that the present invention proposes, it comprises a substrate, at least one outer insulation, at least one pre-glue-line, at least one outer-layer circuit layer and at least one metal column.Outer insulation is configured on the substrate, and pre-glue-line is configured on the outer insulation.The outer-layer circuit layer is local to cover pre-glue-line, and comprises a metal pattern layer, one first patterned layer and one second patterned layer, and wherein the first patterned layer position is between the second patterned layer and metal pattern layer, and the second patterned layer has the contact-making surface of the pre-glue-line of a contact.10 mean roughness of contact-making surface are between 1 micron to 4 microns, and the peel strength between outer-layer circuit layer and the pre-glue-line is greater than 9.8 newton/square centimeters.Metal column is configured in the outer insulation, and connects the outer-layer circuit layer.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid wiring board, the live width of wherein said outer-layer circuit layer is between 15 microns to 30 microns.
Aforesaid wiring board, the thickness of wherein said pre-glue-line is between 1 micron to 10 microns.
Aforesaid wiring board, the thickness of wherein said metal pattern layer is more than or equal to the thickness of the second patterned layer, and the thickness of the second patterned layer is greater than the thickness of the first patterned layer.
Aforesaid wiring board, wherein said substrate are an internal layer circuit substrate, and comprise at least one inner insulation layer and at least one line layer.Line layer is configured on the inner insulation layer, and wherein outer insulation covers line layer, and line layer connection metal post.
By technique scheme, above-mentioned pre-glue-line can increase the peel strength between outer-layer circuit layer and the outer insulation, the chance that breaks away from from outer insulation to reduce the outer-layer circuit layer, thereby the reliability of increase wiring board.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above and other purpose of the present invention, feature and advantage can be become apparent, below especially exemplified by embodiment, and the cooperation accompanying drawing, be described in detail as follows.
Description of drawings
Figure 1A to Fig. 1 H is the section schematic flow sheet of manufacture method of the wiring board of one embodiment of the invention.
Fig. 2 is the local enlarged diagram of regional A among Fig. 1 H.
Fig. 3 is the schematic top plan view of the wiring board among Fig. 1 H.
100: wiring board 110: substrate
112,114: plane 116: line layer
116t: cabling 116p: connection pad
118: inner insulation layer 119: conductive pole
120: outer insulation 130: pre-glue-line
140: metal level 142: contact-making surface
170: metal pattern layer 180: the mask pattern layer
190: outer-layer circuit layer H1: hole
L1: live width S1: hole wall
T1, T2, T3: thickness
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with drawings and Examples, wiring board and its embodiment of manufacture method, structure, method, step, feature and effect thereof to foundation the present invention proposes are described in detail as follows.
Relevant aforementioned and other technology contents of the present invention, Characteristic can be known to present in the following detailed description that cooperates with reference to graphic embodiment.By the explanation of embodiment, should be to reach technological means and the effect that predetermined purpose takes to obtain one more deeply and concrete understanding to the present invention, yet appended graphic only be for reference to and explanation, the present invention is limited.
Figure 1A to Fig. 1 H is the section schematic flow sheet of manufacture method of the wiring board of one embodiment of the invention.See also shown in Figure 1A and Figure 1B, in the manufacture method of the wiring board of the present embodiment, at first, form two layers of outer insulation 120 at a substrate 110.Specifically, substrate 110 has two planes 112 respect to one another, 114, and each layer outer insulation 120 is formed on plane 112 and 114 wherein on the one.Therefore, after forming these outer insulations 120, substrate 110 meeting positions are between these outer insulations 120, and these outer insulations 120 all are configured on the substrate 110.
These outer insulations 120 are formed by two semi-solid preparation films (prepreg), and the method that forms these outer insulations 120 can be that these semi-solid preparation films of pressing are on substrate 110.Therefore, outer insulation 120 can be a kind of resin bed (resin layer) that contains glass fibre (glass fiber).In addition, in the process of pressing semi-solid preparation film, these semi-curing glue sector-meetings hide respectively plane 112 and 114 fully, so these outer insulations 120 can be distinguished comprehensive ground overlay planes 112 and 114.
In the present embodiment, substrate 110 can comprise four sandwich circuit layers 116 and three layers of inner insulation layer 118, wherein each sandwich circuit layer 116 is configured in wherein on one deck inner insulation layer 118, so the substrate shown in the present embodiment 110 can be considered in fact a kind of wiring board with four sandwich circuits.After forming these outer insulations 120, these outer insulations 120 can comprehensive ground covered substrate 110 outermost two sandwich circuit layers 116.
The method of formation substrate 110 has multiple, and for example substrate 110 can utilize Layer increasing method (build-up) to form.In addition, these line layers 116 can be to utilize addition process (Additive Process, AP), semi-additive process (Semi-Additive Process, SAP) or subtractive process (Subtractive Process, SP) to form.Above Layer increasing method, addition process, semi-additive process and subtractive process are all now common wiring board manufacture method, even the therefore manufacture method of unspecified substrate 110, those of skill in the art still know how to adopt said method to form substrate 110.
Should be noted that, although the substrate 110 shown in Figure 1A to Fig. 1 H comprises four sandwich circuit layers 116 and three layers of inner insulation layer 118, but because substrate 110 can be in fact one-sided circuit board or double-sided wiring board, so substrate 110 can only comprise one deck line layer 116 and one deck inner insulation layer 118.In addition, in other are implemented, substrate 110 also can be the sheet material with any line layer, for example metal core core (metal core board) or resin core layer (blank core), so the line layer 116 in graphic and inner insulation layer 118 the two quantity and the kind of substrate 110 only for illustrating, and non-limiting the present invention.
But, in other embodiments, each root conductive pole 119 is solid metal column not necessarily, for example one of them hollow metal post that can be filled up by inner insulation layer 118 or outer insulation 120 of these conductive poles 119.When all conductive poles 119 are all the hollow metal post, these conductive poles 119 can stagger each other (stagger).When some of them conductive pole 119 is all the hollow metal post, and other conductive poles 119 are when being all solid metal column, and these solid metal columns not only can stagger each other, and can stagger with these hollow metal posts.
Form two layers of pre-glue-line 130 and two layers of metal level 140 at these outer insulations 120.After these pre-glue-lines 130 and these metal levels 140 form, the pre-glue-line 130 of each layer can be configured in wherein on one deck outer insulation 120, and the position is layer of metal layer 140 and wherein between one deck outer insulation 120 therein, and wherein pre-glue-line 130 contacts with metal level 140.
Pre-glue-line 130 and metal level 140 are respectively formed at relative two sides of substrate 110.That is to say, wherein the pre-glue-line of one deck 130 and layer of metal layer 140 wherein all are formed on the top on plane 112, and the pre-glue-line 130 of another layer and another layer metal level 140 all are formed on the below on plane 114.Therefore, after forming these pre-glue-lines 130 and these metal levels 140, substrate 110 can the position between these pre-glue-lines 130, and substrate 110 and pre-glue-line 130 are all between these metal levels 140, as shown in Figure 1B.
Each metal level 140 has the contact-making surface 142 of the pre-glue-line 130 of a contact, and 10 mean roughness of each face contact-making surface 142 (ten-point mean roughness, Rz) are between 1 micron (micrometer, μ m) is to 4 microns.Wherein, the definition of 10 mean roughness Rz and method for measurement can be with reference to the described surface roughnesses of the JIS B0601 of version Japanese Industrial Standards (Surface Roughness) in 1994.Metal level 140 can be tinsel, it for example is Copper Foil, and the method that forms each layer metal level 140 can be the pressing tinsel, and wherein the thickness of this tinsel can be between 3 microns to 5 microns, so the thickness of each layer metal level 140 also can be between 3 microns to 5 microns.
The thickness of the pre-glue-line 130 of each layer can be between 1 micron to 10 microns, and the composition of pre-glue-line 130 can contain resin.Before the pressing tinsel, pre-glue-line 130 can be to be coated with (coating) glue material on contact-making surface 142, thus pre-glue-line 130 metal level accompanying with it 140 the two can be combined into a kind of tinsel that has scribbled the glue material.
Utilize the pre-glue-line 130 that has been attached on the metal level 140, tinsel can be pressed together on the substrate 110, thereby forms metal level 140 and pre-glue-line 130 at substrate 110.Hence one can see that, and in the present embodiment, the two can be formed on metal level 140 and pre-glue-line 130 on the substrate 110 simultaneously.
See also shown in Fig. 1 C, then, form at least one hole H1 at each layer metal level 140, wherein each hole H1 runs through at least metal level 140, pre-glue-line 130 and outer insulation 120 and forms.The method that forms these holes H1 has multiple, for example laser drill (laser drilling), plasma etching (plasma etching) or machine drilling (mechanical drilling).
In the present embodiment, each hole H1 only runs through metal level 140, pre-glue-line 130 and outer insulation 120 and forms, so these holes H1 can expose substrate 110 outermost line layers 116 in the part, and each hole H1 exposes one of them connection pad 116p.But, in other embodiments, the part of hole H1 also can be to remove part substrate 110 and form.
For example, hole H1 runs through substrate 110, all metal levels 140, all pre-glue-lines 130 and all outer insulations 120 and forms.In addition, hole H1 runs through layer of metal layer 140, the pre-glue-line 130 of one deck, one deck outer insulation 120, at least one sandwich circuit layer 116 and one deck inner insulation layer 118 at least, but does not run through substrate 110 and form.So these holes H1 in graphic is only for illustrating, and non-limiting the present invention.
See also shown in Fig. 1 D, then, forming a conductive layer 150, the wherein all surface of these conductive layer 150 covering metal layers 140 and hole H1 on each layer metal level 140 and in each hole H1.That is to say hole wall S1 and the bottom of conductive layer 150 meeting comprehensive ground coverage hole H1.In the present embodiment, the bottom of hole H1 can be the surface of the connection pad 116p that exposes of hole H1, and conductive layer 150 can contact connection pad 116p and outer insulations 120.The method that forms these conductive layers 150 has multiple, for example electroless-plating (electroless plating) or sputter (sputtering).
See also shown in Fig. 1 E and Fig. 1 F, after forming conductive layer 150, in each hole H1, form a metal column 160, and above each layer metal level 140, form a metal pattern layer 170.These metal columns 160 are configured in these outer insulations 120, and each root metal column 160 connects wherein layer of metal layer 140 and wherein one deck line layer 116, wherein the connection pad 116p of metal column 160 connection line layers 116.These metal pattern layer 170 contact respectively and local these conductive layers 150 that cover, shown in Fig. 1 F.
The method of formation metal pattern layer 170 has multiple, and in the present embodiment, the method that forms metal pattern layer 170 is as follows.
Please consult first shown in Fig. 1 E, at first, form a local mask pattern layer 180 that exposes conductive layer 150 at each layer conductive layer 150.Mask pattern layer 180 is formed by the photosensitive material (light-sensitive material) behind overexposure (exposure) and develop (developed), and wherein this photosensitive material for example is dry film photoresistance (dry film photoresist) or wet film photoresistance (wet film photoresist).
When mask pattern layer 180 is when being formed by the dry film photoresistance, the method that forms mask pattern layer 180 can be first applying a slice dry film photoresistance on each layer conductive layer 150.Afterwards, sequentially these dry film photoresistances are exposed and development, thereby form mask pattern layer 180.When mask pattern layer 180 is when being formed by the wet film photoresistance, the method that forms mask pattern layer 180 can be first at each layer conductive layer 150 coating one deck wet film photoresistances.Afterwards, sequentially these wet film photoresistances are carried out prebake conditions, exposure and development, to form mask pattern layer 180.
No matter mask pattern layer 180 is formed by dry film photoresistance or wet film photoresistance, the formation method of above mask pattern layer 180 is all the conventional means in the existing line board fabrication method, be how to form even without describing above mask pattern layer 180 in detail, those of skill in the art can know that still mask pattern layer 180 is how to form from dry film photoresistance or wet film photoresistance.
Please consult again shown in Fig. 1 F, afterwards,, as shade these conductive layers 150 are electroplated with mask pattern layer 180.Because these conductive layers 150 cover all surface of these metal levels 140 and these holes H1, therefore when these conductive layers 150 are electroplated, can be in these holes H1 and on the conductive layer 150 that mask pattern layer 180 exposes plated metal.So, formed these metal columns 160 and these metal pattern layer 170.Hence one can see that, and the two can begin metal column 160 and metal pattern layer 170 to form simultaneously.
See also shown in Fig. 1 F to Fig. 1 H, after forming metal column 160 and metal pattern layer 170, remove mask pattern layer 180, so that conductive layer 150 is exposed out, shown in Fig. 1 G.Afterwards, remove the partially conductive layer 150 that metal pattern layer 170 exposes and remove the part metals layer 140 that is not covered by metal pattern layer 170, to expose the pre-glue-line 130 (shown in Fig. 1 H) that is not covered by metal pattern layer 170, thereby form two layers of outer-layer circuit layer 190, the method that wherein removes part metals layer 140 and partially conductive layer 150 can comprise etching.So far, a kind of wiring board 100 that comprises substrate 110, two layers of outer insulation 120, two layers of outer-layer circuit layer 190, two layers of pre-glue-line 130 and many metal columns 160 has basically been made and has been finished.
See also shown in Fig. 1 H, each layer outer-layer circuit layer 190 part cover the wherein pre-glue-line 130 of one deck, and are trilamellar membrane, and wherein each layer outer-layer circuit layer 190 comprises a metal pattern layer 170, one first patterned layer 152 and one second patterned layer 144.The first patterned layer 152 is formed by conductive layer 150, and the second patterned layer 144 is formed by metal level 140, so each layer the second patterned layer 144 has the contact-making surface 142 of the pre-glue-line 130 of contact.In same layer outer-layer circuit layer 190,152 of the first patterned layer are between the second patterned layer 144 and metal pattern layer 170.
These pre-glue-lines 130 can increase the peel strength between outer-layer circuit layer 190 and the outer insulation 120, so that have very large adhesion between outer-layer circuit layer 190 and the pre-glue-line 130, for example the peel strength between outer-layer circuit layer 190 and the pre-glue-line 130 can be greater than 9.8 newton/square centimeters.So, utilize these pre-glue-lines 130, can reduce the chance that outer-layer circuit layer 190 breaks away from from outer insulation 120, thereby increase the reliability of wiring board 100.
Fig. 2 is the local enlarged diagram of regional A among Fig. 1 H.See also Fig. 1 H and shown in Figure 2, in same layer outer-layer circuit layer 190, metal pattern layer 170, the first patterned layer 152 and one second patterned layer, 144 threes' thickness is not identical completely.Specifically, the thickness T 1 of metal pattern layer 170 can be more than or equal to the thickness T 2 of the second patterned layer 144, and the thickness T 2 of the second patterned layer 144 can be greater than the thickness T 3 of the first patterned layer 152.So in outer-layer circuit layer 190, the thickness T 3 of the first patterned layer 152 is the thinnest.
Fig. 3 is the schematic top plan view of the wiring board among Fig. 1 H, and wherein Fig. 1 H is that line I-I section from Fig. 3 is drawn.See also Fig. 1 H and shown in Figure 3, because pre-glue-line 130 can increase the peel strength between outer-layer circuit layer 190 and the outer insulation 120, therefore the live width L1 of outer-layer circuit layer 190 is dwindled, to satisfy the development trend of present graph thinning, and in the present embodiment, the live width L1 of outer-layer circuit layer 190 can be between 15 microns to 30 microns.
Should be noted that, a kind of wiring board 100 and manufacture method thereof that comprises two layers of outer insulation 120, two layers of pre-glue-line 130, two layers of outer-layer circuit layer 190 and many metal columns 160 although above Figure 1A to Fig. 1 H is disclosed, but in other embodiments, wiring board 100 also can only comprise simple layer outer insulation 120, the pre-glue-line 130 of simple layer, simple layer outer-layer circuit layer 190 and single metal column 160, and outer insulation 120, pre-glue-line 130 and outer-layer circuit layer 190 all are formed on the same side of substrate 110.
In other words, according to other embodiment, in the manufacture method of wiring board 100, can only form simple layer outer insulation 120, the pre-glue-line 130 of simple layer, simple layer metal level 140, simple layer conductive layer 150, single metal column 160, simple layer metal pattern layer 170, simple layer mask pattern layer 180 and simple layer outer-layer circuit layer 190.
Hence one can see that, the quantity of the quantity of the quantity of the quantity of the quantity of the disclosed outer insulation 120 of Figure 1A to Fig. 1 H, pre-glue-line 130, the quantity of metal level 140, conductive layer 150, the quantity of metal column 160, metal pattern layer 170, the quantity of mask pattern layer 180 and outer-layer circuit layer 190 is all and illustrates, and non-limiting the present invention.
The above, only be embodiments of the invention, be not that the present invention is done any pro forma restriction, although the present invention discloses as above with embodiment, yet be not to limit the present invention, any those skilled in the art, within not breaking away from the technical solution of the present invention scope, when the method that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, any simple modification that foundation technical spirit of the present invention is done above embodiment, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (10)
1. the manufacture method of a wiring board is characterized in that it may further comprise the steps:
Form an outer insulation at a substrate, wherein this substrate has two planes respect to one another, and this outer insulation is formed on wherein on the plane;
Form pre-glue-line and a metal level at this outer insulation, wherein this pre-glue-line position is between this metal level and this outer insulation, and this metal level has the contact-making surface of this pre-glue-line of contact, and 10 mean roughness of this contact-making surface are between 1 micron to 4 microns;
Form at least one hole at this metal level, wherein this hole is to run through at least this metal level, this pre-glue-line and this outer insulation and form;
Forming a conductive layer on this metal level and in this hole, wherein this conductive layer covers all surface of this metal level and this hole;
After forming this conductive layer, in this hole, form a metal column, wherein this metal column connects this metal level;
Above this metal level, form a metal pattern layer, wherein this metal pattern layer contact and local this conductive layer that covers; And
Remove this conductive layer of part that this metal pattern layer exposes and remove not by this metal level of part that this metal pattern layer covered, to form an outer-layer circuit layer.
2. the manufacture method of wiring board according to claim 1 is characterized in that the method that wherein forms this metal level comprises pressing one tinsel.
3. the manufacture method of wiring board according to claim 1 is characterized in that the method that wherein forms this metal pattern layer comprises:
Form a local mask pattern layer that exposes this conductive layer at this conductive layer; And
, as shade this conductive layer is electroplated with this mask pattern layer.
4. wiring board according to claim 1 and manufacture method thereof is characterized in that the method that wherein forms this hole comprises laser drill, plasma etching or machine drilling.
5. wiring board according to claim 1 and manufacture method thereof it is characterized in that wherein said substrate has at least one line layer, and this metal column connect this line layer.
6. wiring board is characterized in that it comprises:
One substrate;
At least one outer insulation is configured on this substrate;
At least one pre-glue-line is configured on this outer insulation;
At least one outer-layer circuit layer, local this pre-glue-line that covers, and comprise a metal pattern layer, one first patterned layer and one second patterned layer, wherein this first patterned layer position is between this second patterned layer and this metal pattern layer, and this second patterned layer has the contact-making surface of this pre-glue-line of contact, 10 mean roughness of this contact-making surface are between 1 micron to 4 microns, and the peel strength between this outer-layer circuit layer and this pre-glue-line is greater than 9.8 newton/square centimeters; And
At least one metal column is configured in this outer insulation, and connects this outer-layer circuit layer.
7. wiring board according to claim 6 is characterized in that the live width of wherein said outer-layer circuit layer is between 15 microns to 30 microns.
8. wiring board according to claim 6 is characterized in that the thickness of wherein said pre-glue-line is between 1 micron to 10 microns.
9. 1 described wiring board according to claim 6 it is characterized in that the thickness of wherein said metal pattern layer more than or equal to the thickness of this second patterned layer, and the thickness of this second patterned layer is greater than the thickness of this first patterned layer.
10. wiring board according to claim 6 is characterized in that wherein said substrate is an internal layer circuit substrate, and comprises:
At least one inner insulation layer; And
At least one line layer is configured on this inner insulation layer, and wherein this outer insulation covers this line layer, and this line layer connects this metal column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102538797A CN102958294A (en) | 2011-08-26 | 2011-08-26 | Circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102538797A CN102958294A (en) | 2011-08-26 | 2011-08-26 | Circuit board and manufacturing method thereof |
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| CN102958294A true CN102958294A (en) | 2013-03-06 |
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| CN2011102538797A Pending CN102958294A (en) | 2011-08-26 | 2011-08-26 | Circuit board and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110035625A (en) * | 2019-03-07 | 2019-07-19 | 武汉迈斯卡德微电子科技有限公司 | A kind of production method that signal measures medium soft board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030188886A1 (en) * | 2002-04-09 | 2003-10-09 | International Business Machines Corporation | Printed wiring board with conformally plated circuit traces |
| US20050106370A1 (en) * | 2003-11-14 | 2005-05-19 | Kenji Takai | Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
| US20100282499A1 (en) * | 2006-05-25 | 2010-11-11 | Fujikura Ltd. | Printed wiring board, method for forming the printed wiring board, and board interconnection structure |
-
2011
- 2011-08-26 CN CN2011102538797A patent/CN102958294A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030188886A1 (en) * | 2002-04-09 | 2003-10-09 | International Business Machines Corporation | Printed wiring board with conformally plated circuit traces |
| US20050106370A1 (en) * | 2003-11-14 | 2005-05-19 | Kenji Takai | Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
| US20100282499A1 (en) * | 2006-05-25 | 2010-11-11 | Fujikura Ltd. | Printed wiring board, method for forming the printed wiring board, and board interconnection structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110035625A (en) * | 2019-03-07 | 2019-07-19 | 武汉迈斯卡德微电子科技有限公司 | A kind of production method that signal measures medium soft board |
| CN110035625B (en) * | 2019-03-07 | 2021-07-06 | 武汉迈斯卡德微电子科技有限公司 | Method for manufacturing signal measurement medium soft board |
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Application publication date: 20130306 |