CN102958292B - Manufacturing method of multi-layer circuit board - Google Patents
Manufacturing method of multi-layer circuit board Download PDFInfo
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- CN102958292B CN102958292B CN201110245535.1A CN201110245535A CN102958292B CN 102958292 B CN102958292 B CN 102958292B CN 201110245535 A CN201110245535 A CN 201110245535A CN 102958292 B CN102958292 B CN 102958292B
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- edges
- circuit board
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- boards groove
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides and a kind ofly use vacuum taphole but resin can not be caused to infiltrate the manufacturing method of multi-layer circuit board of edges of boards grooves.Comprise the following steps: step 1 makes via on multilayer circuit board; Step 2 makes circuit board outer graphics; Step 3 vacuum taphole; Step 4 milling edges of boards groove; Step 5 makes layers of copper at the edges of boards groove cell wall milled out.Owing to making edges of boards groove again after consent of the present invention, therefore fundamentally stopped in vacuum taphole process, resin infiltrates the phenomenon of edges of boards groove.
Description
Technical field
The present invention relates to a kind of manufacture method of circuit board, particularly relate to a kind of manufacture method of the multilayer circuit board having sidewall metallization to design.
Background technology
Sidewall metallization wiring board refers to the wiring board of the sidewall metallization of edges of boards groove, so that electronic devices and components and this metallized edges of boards groove sidewall conducting.
Its existing Making programme is as shown in Figure 1:
S101 bores via, and milling edges of boards groove → S102 makes layers of copper → S103 pad pasting, exposure, development → S104 vacuum taphole → move back film in via and edges of boards groove.
When the via on wiring board needs the mode consent adopting vacuum taphole, and when devising sidewall metallization, electroplate making layers of copper after conventional disposable boring and groove milling, then there is great drawback in the processing method of consent, when adopting selectivity vacuum taphole, in vacuum taphole equipment, conventional various dry films 24 are all to seal edges of boards groove, and can cause in vacuum taphole process, dry film 24 breaks, resin 25 infiltrates edges of boards groove, causes the defect having resin in groove.
Especially high thickness to diameter ratio, the i.e. ratio of height to diameter of the via multi-layer sheet that is greater than 8: 1, more need the technique adopting vacuum taphole.And when the length dimension of edges of boards groove is at more than 10mm, dry film cannot seal the space of edges of boards groove especially, more easily there is the situation that edges of boards groove infiltrates resin.
Summary of the invention
The object of the invention is to: provide a kind of and use vacuum taphole but resin can not be caused to infiltrate the manufacturing method of multi-layer circuit board of edges of boards groove.
To achieve the above object of the invention, the invention provides manufacturing method of multi-layer circuit board, comprise the following steps:
Step 1 makes via on multilayer circuit board;
Step 2 makes circuit board outer graphics;
Step 3 vacuum taphole;
Step 4 milling edges of boards groove;
Step 5 makes layers of copper at the edges of boards groove sidewall milled out.
Wherein, described step 2 comprises:
Step 2.1 pastes light-sensitive surface;
Step 2.2 exposes the light-sensitive surface sticked;
Unexposed light-sensitive surface develops by step 2.3;
After described step 3, carry out before step 4:
Step 3.1 takes off except light-sensitive surface.
Wherein, carry out after step 5:
Step 6: the edges of boards groove part in the outer part of milling dividing circuit plate, thus leave the metallized edges of boards groove of partial sidewall.
Wherein, the ratio of height to diameter of described via is greater than 8: 1.
Wherein, the length of described edges of boards groove is greater than 10mm.
Owing to making edges of boards groove again after consent of the present invention, therefore fundamentally stopped in vacuum taphole process, resin infiltrates the phenomenon of edges of boards groove.
Accompanying drawing explanation
Fig. 1 is the flowage structure figure of manufacturing method of multi-layer circuit board in background technology of the present invention;
Fig. 2 is the flowage structure figure of the manufacturing method of multi-layer circuit board of the specific embodiment of the invention;
Fig. 3 is part A partial enlarged drawing in Fig. 2;
Fig. 4 is part B partial enlarged drawing in Fig. 2;
Fig. 5 is C part partial enlarged drawing in Fig. 2;
Fig. 6 is D part partial enlarged drawing in Fig. 2;
Fig. 7 is E part partial enlarged drawing in Fig. 2.
Label declaration:
20. via 21,22,23. layers of copper 24. dry film 25. resin 30. edges of boards grooves
Embodiment
By describing technology contents of the present invention, structural feature in detail, realized object and effect, accompanying drawing is coordinated to be explained in detail below in conjunction with execution mode.
Refer to Fig. 1 and Fig. 2, the invention provides a kind of manufacturing method of multi-layer circuit board, comprise the following steps:
Step S201 bores via on multilayer circuit board, and there is layers of copper 21 on multi-layer sheet surface;
Step S202 electroplates, in via 20 inside and layers of copper 22 on multi-layer sheet plated surface;
Step S203 pastes light-sensitive surface on multi-layer sheet surface, exposes, is developed by unexposed light-sensitive surface, to make circuit board outer graphics to the light-sensitive surface sticked;
Step S204 vacuum taphole, resin 25 beyond the Great Wall in via 20, then takes off dry film 24;
Step S205 mills out edges of boards groove 30;
Step S206 sinks copper and thicken plating, makes layers of copper 23 at the edges of boards groove cell wall that milling out.
In a preferred embodiment, after step 206, carry out step 207: the edges of boards groove part in the outer part of milling dividing circuit plate, thus realize edges of boards groove sidewall metallization.
In a preferred embodiment, the ratio of height to diameter of via 20 is greater than 8: 1.Because ratio of height to diameter be greater than 8: 1 via conventional screen consent difficulty high, need use vacuum taphole could meet consent quality requirements.
In a further advantageous embodiment, the length of described edges of boards groove 30 is greater than 10mm.Because the edges of boards groove being greater than 10mm is more difficult to dry film sealing (dry film is easily damaged when vacuumizing).
Owing to making edges of boards groove again after consent of the present invention, therefore fundamentally stopped in vacuum taphole process, resin infiltrates the phenomenon of edges of boards groove.Therefore the finished product rate of the present embodiment production is high.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (3)
1. a manufacturing method of multi-layer circuit board, is characterized in that, comprises the following steps:
Step 1 makes via on multilayer circuit board;
Step 2 makes circuit board outer graphics, specifically comprises the steps, step 2.1 pastes light-sensitive surface; Step 2.2 exposes the light-sensitive surface sticked; Unexposed light-sensitive surface develops by step 2.3;
Step 3 vacuum taphole, resin beyond the Great Wall in via, then takes off dry film, and takes off except light-sensitive surface;
Step 4 milling edges of boards groove;
Step 5 makes layers of copper at the edges of boards groove cell wall milled out;
Step 6: the edges of boards groove part in the outer part of milling dividing circuit plate, thus leave the metallized edges of boards groove of partial sidewall.
2. manufacturing method of multi-layer circuit board according to claim 1, is characterized in that, the ratio of height to diameter of described via is greater than 8:1.
3. manufacturing method of multi-layer circuit board according to claim 1, is characterized in that, the length of described edges of boards groove is greater than 10mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110245535.1A CN102958292B (en) | 2011-08-25 | 2011-08-25 | Manufacturing method of multi-layer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110245535.1A CN102958292B (en) | 2011-08-25 | 2011-08-25 | Manufacturing method of multi-layer circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102958292A CN102958292A (en) | 2013-03-06 |
| CN102958292B true CN102958292B (en) | 2015-10-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201110245535.1A Active CN102958292B (en) | 2011-08-25 | 2011-08-25 | Manufacturing method of multi-layer circuit board |
Country Status (1)
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| CN (1) | CN102958292B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107529289B (en) * | 2017-08-17 | 2019-11-05 | 奥士康科技股份有限公司 | A kind of design method of the half metallization non-metallic slot of half |
| CN111479389A (en) * | 2020-04-09 | 2020-07-31 | 江苏普诺威电子股份有限公司 | Processing method of through groove of circuit board |
| CN113518515B (en) * | 2021-03-15 | 2023-09-08 | 江西宇睿电子科技有限公司 | Method for manufacturing broken joint metalized edge and circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1722939A (en) * | 2004-07-14 | 2006-01-18 | 燿华电子股份有限公司 | Manufacturing method of modular circuit board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3154350B2 (en) * | 1991-10-24 | 2001-04-09 | ソニー株式会社 | Printed wiring board and its manufacturing method |
| CN101662893A (en) * | 2009-09-04 | 2010-03-03 | 东莞美维电路有限公司 | Manufacturing method for printed wiring board with dense disk holes |
| CN101795535A (en) * | 2010-01-12 | 2010-08-04 | 熊淑萍 | Plughole machine for optional ink plughole and easy grinding |
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2011
- 2011-08-25 CN CN201110245535.1A patent/CN102958292B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1722939A (en) * | 2004-07-14 | 2006-01-18 | 燿华电子股份有限公司 | Manufacturing method of modular circuit board |
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| CN102958292A (en) | 2013-03-06 |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |