CN102956517A - Method for testing transmission fatigue of wafer - Google Patents
Method for testing transmission fatigue of wafer Download PDFInfo
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- CN102956517A CN102956517A CN2011102411457A CN201110241145A CN102956517A CN 102956517 A CN102956517 A CN 102956517A CN 2011102411457 A CN2011102411457 A CN 2011102411457A CN 201110241145 A CN201110241145 A CN 201110241145A CN 102956517 A CN102956517 A CN 102956517A
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- fatigue strength
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- wafer transmission
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Abstract
The invention discloses a method for testing transmission fatigue of a wafer. The method includes (1), starting transmission of the wafer; (2), monitoring and acquiring states of various moving components in real time; (3), detecting whether faults occur or not; (4), recording faulted components, types of the faulted components and the frequency of the faults; (5), completing transmission of the wafer; (6), repeating transmission by N times; (7), drawing a visual chart according to the acquired and recorded faults; (8), comparing performance parameters of the various components, finding out abnormal performance parameters and monitoring the abnormal performance parameters in a focused manner to find out problems; (9), finding out corresponding solutions according to the different problems; and (10), completing the fatigue test. The method has the advantages that state trends of the various components during long-term movement can be comprehensively reflected, are visible, are easy to understand and bring convenience for statistics, unstable factors can be found out quickly, and the solutions for the problems can be found out pertinently according to classifications of types of the problems.
Description
Technical field
The present invention relates to a kind of semiconductor device manufacturing test system, relate in particular to a kind of method of ion implantor wafer transmission fatigue strength test.
Background technology
Ion implantor is a kind of by guiding Impurity injection semiconductor wafer, thereby change the equipment of the conductivity of wafer, wherein the stability of wafer transmission system directly concerns the production efficiency of equipment and the benefit of enterprise, therefore most important once the effective wafer transmission fatigue strength method of testing of cover, in " marathon " formula flow fatigue strength test in early stage, only have as much as possible all problems is all come out, could give the client equipment of a stability and safety.
In view of the importance of wafer transmission fatigue strength test, how developing the comprehensive wafer transmission fatigue strength of cover system test macro is ion implantor stability test urgent problem.
Summary of the invention
The present invention be directed in the prior art wafer transmission fatigue strength and test that system is not comprehensive, affect stabilization of equipment performance, may cause heavy losses to the client, and the system of a cover wafer transmission fatigue strength test of developing.
The present invention is achieved through the following technical solutions: introduce a condition monitoring system, the state of each moving component is all gathered or manual record automatically, wherein the speed of motor, acceleration, error etc. can gather automatically, and the temperature of motor, fault type, the number of stoppages and trouble unit etc. may need manually to go to measure and record, with Data classification arrangement and the statistics that gathers and record, whether fluctuation ratio is larger for detection data wherein, the emphasis that fluctuates large detects, and makes tendency chart or other diagrammatic forms.If those parts have larger failure problems, can be from 3 aspects, order is generally software, hardware and structure and 3 aspects of other fault.
The present invention has following remarkable advantage:
1. systematic comparison is comprehensive, has contained all parameters that need to test.
2. genealogical classification is more complete, and all classification of system of parts all in the wafer transmission process, the data parameters of testing under each classification is not quite similar.
3. the flow of long-time " marathon " formula can all come out all contingent failure problems substantially, uses other faults of generation to drop to minimum consigning to the client.
Description of drawings
Fig. 1 is a wafer transmission fatigue strength test flow chart.
Embodiment
Below in conjunction with accompanying drawing 1 and specific embodiment the present invention is further introduced, but not as a limitation of the invention.
For the test of wafer transmission fatigue strength, with above-described fatigue strength method of testing: according in the accompanying drawing 1, the method must be carried out the wafer transmission more than 4000 every day, the status data (2) of all parts mainly comprises: the fault in the temperature of transmission time, each motor of time period and error, the transmission, transferring wafer quantity and number of tiles in the record transmission course.Make statistics according to record data, be drawn as audio-visual picture sheet form (7), convenient understandable.
1) draw the chart of transmission time and each motor temperature, whether have large fluctuation, whether exceed the temperature of its calibration range that dispatches from the factory if detecting motor temperature, if find this situation, should contact with manufacturer as early as possible, coordinates to deal with problems; Draw the chart of transmission time and each motor error, detect each motor error whether larger fluctuation is arranged, if suitable that whether parameter of motor arranges under checking first arranged, reexamine motor and hardware or structure problem whether occur, not all right words go to seek advice from manufacturer again.
2) draw the curve chart of several of transmission time, transmission fault, number of wafers and number of tiles, can be these several item numbers according to signing in the individual chart, also can be separated in several charts, the distribution situation of emphasis detected transmission time and transmission fault and transmission fault and number of tiles, therefrom pinpoint the problems, find problem is also dealt with problems.
3) can generally be subdivided in order software, hardware and structure and other faults to transmission fault, because flow process host computer programming, and hardware controls is the slave computer bottom, begin to look for from flow process first, efficient is higher, and structure and the general odds of other fault are smaller, so come the back.According to amount detection, draw chart; Also can separately analyze number of tiles one by one with these 3 faults, so more easily find the problem.
The specific embodiment of patent of the present invention elaborates the content of patent of the present invention.For persons skilled in the art, any apparent change of under the prerequisite that does not deviate from patent spirit of the present invention it being done all consists of the infringement to patent patent of the present invention, will bear corresponding legal liabilities.
Claims (3)
1. the method for wafer transmission fatigue strength test, comprise: wafer transmission begins (1), the state (2) of Real Time Monitoring and each moving component of collection, whether fault (3) is arranged, the record trouble parts, type and number of times (4), wafer transmission is finished (5), circle transmission N time (6), according to gathering and record trouble, draw chart directly perceived (7), performance parameter with all parts compares, find out unusual, key monitoring search problem (8), find out corresponding solution (9) and this fatigue strength test end (10) according to different problems.It is characterized in that: can be than more comprehensively reflecting the state trend of all parts in prolonged exercise, visual and understandable, be convenient to statistics, find out more fast the factors of instability, according to classification of type, find out targetedly the way of dealing with problems.
2. the method for wafer transmission fatigue strength as claimed in claim 1 test, it is characterized in that: the state (2) of each moving component in motion process made diagrammatic form, show intuitively, for example the temperature of motor is with the tendency chart of run duration variation, the tendency chart that the error of motor changes with run duration etc., can both express eaily, convenient understandable.
3. the method for wafer transmission fatigue strength test as claimed in claim 1 is characterized in that: can more promptly navigate to the problem of certain aspect according to the abnormality that occurs, reduce the time of some middle decision problems, improve the efficient of test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110241145.7A CN102956517B (en) | 2011-08-22 | 2011-08-22 | A kind of method of transmission fatigue of wafer test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110241145.7A CN102956517B (en) | 2011-08-22 | 2011-08-22 | A kind of method of transmission fatigue of wafer test |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102956517A true CN102956517A (en) | 2013-03-06 |
| CN102956517B CN102956517B (en) | 2016-03-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201110241145.7A Active CN102956517B (en) | 2011-08-22 | 2011-08-22 | A kind of method of transmission fatigue of wafer test |
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| Country | Link |
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| CN (1) | CN102956517B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107246970A (en) * | 2017-05-27 | 2017-10-13 | 北京新能源汽车股份有限公司 | The fault monitoring method and server of a kind of vacuum boost system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020065900A1 (en) * | 2000-10-02 | 2002-05-30 | Applied Materials, Inc. | Method and apparatus for communicating images, data, or other information in a defect source identifier |
| CN1767164A (en) * | 2004-10-29 | 2006-05-03 | 力晶半导体股份有限公司 | Wafer testing device and method with automatic reversion function |
| CN1770416A (en) * | 2004-11-02 | 2006-05-10 | 力晶半导体股份有限公司 | Wafer defect management method |
-
2011
- 2011-08-22 CN CN201110241145.7A patent/CN102956517B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020065900A1 (en) * | 2000-10-02 | 2002-05-30 | Applied Materials, Inc. | Method and apparatus for communicating images, data, or other information in a defect source identifier |
| CN1767164A (en) * | 2004-10-29 | 2006-05-03 | 力晶半导体股份有限公司 | Wafer testing device and method with automatic reversion function |
| CN1770416A (en) * | 2004-11-02 | 2006-05-10 | 力晶半导体股份有限公司 | Wafer defect management method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107246970A (en) * | 2017-05-27 | 2017-10-13 | 北京新能源汽车股份有限公司 | The fault monitoring method and server of a kind of vacuum boost system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102956517B (en) | 2016-03-30 |
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Effective date of registration: 20220616 Address after: 101111 1st floor, building 1, 6 Xingguang 2nd Street, Tongzhou District, Beijing Patentee after: Beijing Scintillation Section Zhongkexin Electronic Equipment Co.,Ltd. Address before: 101111 No. 6, Xingguang Second Street, Tongzhou Park optical electromechanical integration industrial base, Zhongguancun Science Park, Beijing Patentee before: BEIJING ZHONGKEXIN ELECTRONICS EQUIPMENT Co.,Ltd. |
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