CN102956517B - A kind of method of transmission fatigue of wafer test - Google Patents
A kind of method of transmission fatigue of wafer test Download PDFInfo
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- CN102956517B CN102956517B CN201110241145.7A CN201110241145A CN102956517B CN 102956517 B CN102956517 B CN 102956517B CN 201110241145 A CN201110241145 A CN 201110241145A CN 102956517 B CN102956517 B CN 102956517B
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Abstract
The invention discloses the method for a kind of transmission fatigue of wafer test, comprise: wafer transmission starts (1), real-time monitoring and gather the state (2) of each moving component, whether there is fault (3), record trouble parts, type and number of times (4), wafer transmission completes (5), circle transmission N time (6), according to collection and record trouble, draw chart directly perceived (7), performance parameter with all parts compares, find out abnormal, key monitoring searches problem (8), corresponding solution (9) and this fatigue strength test end (10) is found out according to different problem.It is characterized in that: can than more comprehensively reflecting the state trend of all parts in prolonged exercise, visual and understandable, be convenient to statistics, find out the factors of instability more fast, according to classification of type, find out the way of dealing with problems targetedly.
Description
Technical field
The present invention relates to a kind of semiconductor device manufacturing test system, particularly relate to the method for a kind of ion implantor transmission fatigue of wafer test.
Background technology
Ion implantor is a kind of by guiding impurity to inject semiconductor wafer, thus change the equipment of the conductivity of wafer, wherein the stability of wafer transmission system directly concerns the production efficiency of equipment and the benefit of enterprise, therefore a set of effective transmission fatigue of wafer method of testing is just most important, in " marathon " formula flow fatigue strength test in early stage, only have and as much as possible all problems is all come out, client could be given the equipment of a stability and safety.
In view of the importance of transmission fatigue of wafer test, how developing the comprehensive transmission fatigue of wafer test macro of set of system is ion implantor stability test urgent problem.
Summary of the invention
The present invention be directed to the not system of testing of transmission fatigue of wafer in prior art not comprehensively, to affect stabilization of equipment performance, heavy losses may be caused to client, and the system of a set of transmission fatigue of wafer test of developing.
The present invention is achieved through the following technical solutions: introduce a condition monitoring system, the state of each moving component is gathered or manual record all automatically, wherein the speed, acceleration, error etc. of motor can gather automatically, and the temperature of motor, fault type, the number of stoppages and trouble unit etc. may need manually to go to measure and record, the Data classification gathered and record is arranged and statistics, whether fluctuation ratio is larger for detection data wherein, the emphasis fluctuating large detects, and makes tendency chart or other diagrammatic forms.If those parts have larger failure problems, can start with from 3 aspects, order is generally software, hardware and structure and other fault 3 aspects.
The present invention has following remarkable advantage:
1. systematic comparison is comprehensive, covers all parameters needing test.
2. genealogical classification is more complete, and the classification of parts all in wafer transmission process all system, the data parameters of testing under each classification is not quite similar.
3. the flow of long-time " marathon " formula, substantially all can coming out all contingent failure problems, using other faults of generation to drop to minimum consigning to client.
Accompanying drawing explanation
Fig. 1 is a transmission fatigue of wafer test flow chart.
Embodiment
Below in conjunction with accompanying drawing 1 and specific embodiment, the present invention is further introduced, but not as a limitation of the invention.
In order to transmission fatigue of wafer test, by above-described fatigue strength method of testing: according in accompanying drawing 1, the method must carry out the wafer transmission of more than 4000 every day, the status data (2) of all parts in record transmitting procedure, mainly comprises: fault, transferring wafer quantity and number of tiles in the temperature of transmission time, each motor of time period and error, transmission.Make statistics according to record data, be drawn as audio-visual picture sheet form (7), facilitate understandable.
1) drawing the chart of transmission time and each motor temperature, whether have large fluctuation, whether exceed the temperature of its calibration range that dispatches from the factory, if find this situation, should contact as early as possible, coordinate to deal with problems with manufacturer if detecting motor temperature; Draw the chart of transmission time and each motor error, detect each motor error and whether have larger fluctuation, whether if whether what have the parameter of motor under first checking to arrange is suitable, reexamining motor there is hardware or structure problem, and not all right words go to seek advice from manufacturer again.
2) curve chart of transmission time, transmission fault, number of wafers and number of tiles several is drawn, can this few item number according to signing in individual chart, also can be separated in several chart, emphasis detects the distribution situation of transmission time and transmission fault and transmission fault and number of tiles, therefrom pinpoint the problems, find problem is also dealt with problems.
3) transmission fault generally can be subdivided into software, hardware and structure and other faults in order, because flow process host computer programming, and hardware controls is slave computer bottom, first look for from flow process, efficiency is higher, and structure and the general odds of other fault smaller, so after coming.According to amount detection, draw chart; Also number of tiles separately can be analyzed one by one with these 3 faults, so more easily find the problem.
The specific embodiment of patent of the present invention elaborates the content of patent of the present invention.For persons skilled in the art, to any apparent change that it does under the prerequisite not deviating from patent spirit of the present invention, all form the infringement to patent of the present invention, corresponding legal liabilities will be born.
Claims (2)
1. the method for a transmission fatigue of wafer test, comprise: wafer transmission starts (1), monitor and gather the state (2) of each moving component in real time, whether have fault (3), record trouble parts, type and number of times (4), wafer transmission complete (5), circle transmission N time (6), according to collection and record trouble, draw chart directly perceived (7), compare with the performance parameter of all parts, find out abnormal, key monitoring searches problem (8), find out corresponding solution (9) and this fatigue strength test end (10) according to different problem; It is characterized in that: comprehensively can reflect the state trend of all parts in prolonged exercise, visual and understandable, be convenient to statistics, find out the factors of instability fast, according to classification of type, find out the way of dealing with problems targetedly;
The state of each moving component in motion process (2) is made diagrammatic form, show intuitively, the tendency chart that the temperature that chart comprises motor changes with run duration, the tendency chart that the error of motor changes with run duration, can express easily, facilitate understandable.
2. the method for transmission fatigue of wafer test as claimed in claim 1, is characterized in that: according to the abnormality occurred, promptly can navigate to problem, decrease the time of some middle decision problems, improve the efficiency of test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110241145.7A CN102956517B (en) | 2011-08-22 | 2011-08-22 | A kind of method of transmission fatigue of wafer test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110241145.7A CN102956517B (en) | 2011-08-22 | 2011-08-22 | A kind of method of transmission fatigue of wafer test |
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| Publication Number | Publication Date |
|---|---|
| CN102956517A CN102956517A (en) | 2013-03-06 |
| CN102956517B true CN102956517B (en) | 2016-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110241145.7A Active CN102956517B (en) | 2011-08-22 | 2011-08-22 | A kind of method of transmission fatigue of wafer test |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107246970B (en) * | 2017-05-27 | 2020-02-07 | 北京新能源汽车股份有限公司 | Fault monitoring method of vacuum power assisting system and server |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1767164A (en) * | 2004-10-29 | 2006-05-03 | 力晶半导体股份有限公司 | Wafer testing device and method with automatic reversion function |
| CN1770416A (en) * | 2004-11-02 | 2006-05-10 | 力晶半导体股份有限公司 | Wafer defect management method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020065900A1 (en) * | 2000-10-02 | 2002-05-30 | Applied Materials, Inc. | Method and apparatus for communicating images, data, or other information in a defect source identifier |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1767164A (en) * | 2004-10-29 | 2006-05-03 | 力晶半导体股份有限公司 | Wafer testing device and method with automatic reversion function |
| CN1770416A (en) * | 2004-11-02 | 2006-05-10 | 力晶半导体股份有限公司 | Wafer defect management method |
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| CN102956517A (en) | 2013-03-06 |
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Effective date of registration: 20220616 Address after: 101111 1st floor, building 1, 6 Xingguang 2nd Street, Tongzhou District, Beijing Patentee after: Beijing Scintillation Section Zhongkexin Electronic Equipment Co.,Ltd. Address before: 101111 No. 6, Xingguang Second Street, Tongzhou Park optical electromechanical integration industrial base, Zhongguancun Science Park, Beijing Patentee before: BEIJING ZHONGKEXIN ELECTRONICS EQUIPMENT Co.,Ltd. |