CN102945030A - Method for effectively controlling out-of-control production cycle in wafer production process - Google Patents

Method for effectively controlling out-of-control production cycle in wafer production process Download PDF

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Publication number
CN102945030A
CN102945030A CN2012104352072A CN201210435207A CN102945030A CN 102945030 A CN102945030 A CN 102945030A CN 2012104352072 A CN2012104352072 A CN 2012104352072A CN 201210435207 A CN201210435207 A CN 201210435207A CN 102945030 A CN102945030 A CN 102945030A
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lot
control
production cycle
production process
urgent
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CN102945030B (en
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严丽辉
赵伟
柯陈宾
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Shanghai Huali Microelectronics Corp
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Shanghai Huali Microelectronics Corp
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

The invention relates to the field of semiconductor manufacturing, in particular to a method for effectively controlling an out-of-control production cycle in a wafer production process. The method comprises the following steps: all lots, which have been delivered to a site by using an urgency coefficient, are re-endowed with priority levels; and each lot is sequentially subject to the process technology of the site according to the re-endowed priority levels. According to the invention, the out-of-control production cycle in product production process is effectively controlled on the basis of improving the productivity efficiency, and accordingly, on-time delivery rate of the product is enhanced.

Description

Production cycle method out of control in a kind of effective control wafer production process
Technical field
The present invention relates to field of semiconductor manufacture, relate in particular to production cycle method out of control in a kind of effective control wafer production process.
Background technology
At present, after factory realized scale of mass production, the production cycle of its product all was by manual control, namely when there is problem the punctual delivery time of certain lot of discovery, can only change by manual type the right of priority of this lot, so that this lot can punctual delivery; But owing to being manual control, and all be to lag behind just the priority of lot to be regulated and control when the time of delivery of lot, be easy to because regulation and control are improper or it is pressed for time, need to pay at double manpower and the punctual delivery of production capacity ability, even the production cycle of some lot out of controlly just can't catch up with the time of delivery at all, thereby have a strong impact on the punctual delivery rate.
Fig. 1 is in the background technology of the present invention because the production cycle is out of controlly caused dysgenic schematic diagram; As shown in Figure 1, after the client consigns to factory with a large amount of orders, because product is many and complicated on the line, artificial regulatory is improper easily to cause the out of control of production cycle, and then affect the punctual delivery rate of product, finally cause the reduction of customer satisfaction and lose order, so that factory suffers huge loss; Priority such as a certain lot is 4, but owing to being delayed (hold) two days in certain website process (process) problem, is not noted after recovering process (release), will certainly affect the punctual delivery rate of this lot.
Fig. 2 is the normal distribution that adopts manually operated life cycle of the product in the background technology of the present invention, and the longitudinal axis represents the lot quantitative proportion, and transverse axis represents the production cycle (unit is sky/mask layer); As shown in Figure 2, the curve among the square frame a represents production cycle hypervelocity part, can cause the waste of production capacity, and the curve among the square frame b represents that then the production cycle is relatively poor, i.e. production cycle part out of control, and exceptional value out of control can affect the punctual delivery rate of product greatly; So, want the waste of the out of control and production capacity in production control cycle, the curve among square frame a and the b be thought the center section convergence.
Summary of the invention
Problem for above-mentioned existence, the present invention has disclosed production cycle method (A effective Fab cycle time control method) out of control in a kind of effective control wafer production process, mainly be the critical ratio by automatic setting and each lot that upgrades in time, the priority of each lot on the auto-control website.
The objective of the invention is to be achieved through the following technical solutions:
Production cycle method out of control in a kind of effective control wafer production process of the present invention, wherein,
On a website, all lot of Delivered are carried out group divide;
Confirm the delivery date of each lot;
Calculate the urgent coefficient of each lot;
The priority of again giving above-mentioned each lot according to described urgent coefficient;
Successively each lot is carried out the making technology of this website according to priority.
Production cycle method out of control in above-mentioned effective control wafer production process wherein, carries out removing urgent batch lot and unusual lot when described group is divided, and urgent batch lot carries out the making technology of this website prior to the lot that is set with priority.
Production cycle method out of control in above-mentioned effective control wafer production process, wherein, described unusual lot comprises buffer memory batch lot, the lot of cut is arranged and deliberately slow down the lot of progress.
Production cycle method out of control in above-mentioned effective control wafer production process wherein, adopts formula D=D the delivery date of described each lot 1+ Z+N determines, D is the delivery date of lot, D 1Be rolling off the production line the date of lot, Z is the production cycle that lot promises to undertake, N is the buffer memory fate.
Production cycle method out of control in above-mentioned effective control wafer production process wherein, adopts formula C=(D-D 2)/(S-X) calculated the urgent coefficient of each lot, and C is the urgent coefficient of lot, and D is the delivery date of lot, D 2Be current date, S is that the processing procedure master station of lot counts, and X is that lot has finished the website number.
Production cycle method out of control in above-mentioned effective control wafer production process, wherein, the priority-level number of lot and the urgent coefficient of this lot are inversely proportional to.
Production cycle method out of control in above-mentioned effective control wafer production process, wherein, at regular intervals after, repeat above-mentioned steps with the priority of each lot of redefining this website and sending to.
Production cycle method out of control in above-mentioned effective control wafer production process wherein, every 12 hours, repeats to redefine the priority of each lot that this website sends to once.
Production cycle method out of control in above-mentioned effective control wafer production process, wherein, can give above-mentioned lot according to described urgent coefficient is urgent batch.
Production cycle method out of control in above-mentioned effective control wafer production process wherein, when giving above-mentioned lot and be urgent batch according to described urgent coefficient, is less than or equal to the value of current date delivery date.
Production cycle method out of control in above-mentioned effective control wafer production process is by realize again giving and upgrading of each lot priority on each website such as automatons such as computing machines, with the purpose that realizes the life cycle of the product Automatic Optimal is processed.
In sum, production cycle method out of control in a kind of effective control wafer production process of the present invention, again give priority to Delivered to all lot of a certain website by adopting urgent coefficient, and successively each lot is carried out the making technology of this website according to this priority of again giving, on the basis of improving production capacity efficient, effectively the control life cycle of the product is out of control, and then the punctual delivery rate of improving product.
Description of drawings
Fig. 1 is in the background technology of the present invention because the production cycle is out of controlly caused dysgenic schematic diagram;
Fig. 2 is the normal distribution that adopts manually operated life cycle of the product in the background technology of the present invention, and the longitudinal axis represents the lot quantitative proportion, and transverse axis represents the production cycle (unit is sky/mask layer);
Fig. 3 is the schematic flow sheet that the present invention effectively controls the method out of control of production cycle in the wafer production process;
Fig. 4 is the form that the present invention effectively controls the optimization priority in the method out of control of production cycle in the wafer production process;
Fig. 5 effectively controls production cycle normal distribution after the method control out of control of production cycle in the wafer production process through the present invention, and the longitudinal axis represents the lot quantitative proportion, and transverse axis represents the production cycle (unit is sky/mask layer).
Embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is further described:
As shown in Figure 3-4, production cycle method out of control in a kind of effective control wafer production process of the present invention is applicable to each process that semiconductor crystal wafer is produced:
At first, on a technique website, carry out group to the product (lot) of all batches of this website and divide sending to, such as the lot that removes urgent batch (Bullet/Hot) having promised to undertake the client and unusual lot, and the lot that sends worker's right of priority prior to being set with priority of this lot of urgent batch; Wherein, unusual lot comprises such as buffer memory batch (Future Bank) lot, the lot of cut (Scrap) is arranged and deliberately slow down lot of progress (Slow Down) etc.
Secondly, according to the date D that rolls off the production line of lot 1, the production cycle Z that promises to undertake and buffer memory (Bank) the fate N of this lot, and utilize formula D=D 1+ Z+N, come to determine every this website each lot this moment delivery date D exact date.
Then, according to determine delivery date D value, utilize formula C=(D-D 2)/(S-X) calculated the urgent coefficient (Critical Ratio) of each lot, and C is the urgent coefficient of lot, and D is the delivery date of lot, D 2Be current date, S is that the processing procedure master station of lot counts (the total Stage number of technique), and X is that lot has finished website number (having finished the Stage number), and S is more than or equal to X.
Afterwards, according to the critical ratio of each lot all lot are re-started priority assignment, because critical ratio is inversely proportional to priority, namely critical ratio is less, illustrates that the delivery urgency of this lot is higher, and it sends worker's priority level also just higher.
At last, according to the priority-level of each lot, this website carries out making technology to each lot successively.
Preferably, at set intervals after, repeat the assignment of priority for all lot that arrive this website, as can carrying out the renewal of a lot priority level every 12 hours, and the priority after more upgrading is sent worker's order to the lot of this website.
As shown in Figure 4, Lot ID is the lot of A000001, and its delivery date, D was on October 1st, 2011, and the value of residue website number (S-X) is 59, the current date D of setting 2Be on October 15th, 2011, then the critical ratio C=14/59=0.2372881 of this lot keeps the 2 significant digits valid data, and after rounding up, the value C of the critical ratio of this lot is 0.24.Repeating above-mentioned is the step that the critical ratio of the lot of A000001 calculates for Lot ID, draws the critical ratio of all lot of this website this moment: Lot ID be the critical ratio of the lot of A000002 is 0.56, Lot ID is the lot of A000002 critical ratio is 0.33, Lot ID is the lot of A000002 critical ratio is 1.15, Lot ID is the lot of A000002 critical ratio be 0.41 and Lot ID be that the critical ratio of the lot of A000002 is 0.81; The priority that is the lot of A000001 according to the urgent parameter identification Lot ID of each above-mentioned lot is 1, and the priority of the corresponding critical ratios of all the other lot is followed successively by 4,2,6,3 and 5 equally; At last, send worker order according to what the priority of each lot was carried out this website.
As shown in Figure 5, after adopting the present invention effectively to control the method out of control of production cycle in the wafer production process, so that the production cycle of product reasonably optimized, so that lower small-scale production cycle of production capacity and have a strong impact on the product quantity ratio of the large production cycle of punctual delivery rate and greatly reduce, thereby when improving production capacity efficient, promoted the punctual delivery rate of product.
Further, because the overlong time of delay may cause passed through futures the delivery date of lot, cause the value of D at delivery date to be less than or equal to current date D 2Value, at this moment, then set this lot and be urgent batch to carry out technique prior to the lot that also is less than all delivery dates at present, with the punctual delivery rate of maximum improving product.
Each above-mentioned processing step, be based on as on the basis of the automatic control equipments such as computing machine to again the giving and upgrade of each lot priority on each website, with the purpose that realizes the life cycle of the product Automatic Optimal is processed.
In sum, owing to having adopted technique scheme, the embodiment of the invention proposes production cycle method out of control in a kind of effective control wafer production process, again give priority to Delivered to all lot of a certain website by adopting urgent coefficient, and successively each lot is carried out the making technology of this website according to this priority of again giving, on the basis of improving production capacity efficient, effectively control the out of control of life cycle of the product, and then the punctual delivery rate of improving product.
By explanation and accompanying drawing, provided the exemplary embodiments of the ad hoc structure of embodiment, based on the present invention's spirit, also can do other conversion.Although foregoing invention has proposed existing preferred embodiment, yet these contents are not as limitation.
For a person skilled in the art, read above-mentioned explanation after, various changes and modifications undoubtedly will be apparent.Therefore, appending claims should be regarded whole variations and the correction of containing true intention of the present invention and scope as.Any and all scope of equal value and contents all should be thought still to belong in the intent of the present invention and the scope in claims scope.

Claims (10)

1. effectively control production cycle method out of control in the wafer production process for one kind, it is characterized in that,
On a website, all lot of Delivered are carried out group divide;
Confirm the delivery date of each lot;
Calculate the urgent coefficient of each lot;
The priority of again giving above-mentioned each lot according to described urgent coefficient;
Successively each lot is carried out the making technology of this website according to priority.
2. production cycle method out of control in effective control wafer production process according to claim 1, it is characterized in that, carry out removing urgent batch lot and unusual lot when described group is divided, urgent batch lot carries out the making technology of this website prior to the lot that is set with priority.
3. production cycle method out of control in effective control wafer production process according to claim 2 is characterized in that, described unusual lot comprises buffer memory batch lot, the lot of cut is arranged and deliberately slow down the lot of progress.
4. production cycle method out of control in effective control wafer production process according to claim 1 is characterized in that, adopts formula D=D the delivery date of described each lot 1+ Z+N determines, D is the delivery date of lot, D 1Be rolling off the production line the date of lot, Z is the production cycle that lot promises to undertake, N is the buffer memory fate.
5. production cycle method out of control in effective control wafer production process according to claim 1 is characterized in that, adopts formula C=(D-D 2)/(S-X) calculated the urgent coefficient of each lot, and C is the urgent coefficient of lot, and D is the delivery date of lot, D 2Be current date, S is that the processing procedure master station of lot counts, and X is that lot has finished the website number.
6. production cycle method out of control in effective control wafer production process according to claim 1 is characterized in that, the priority-level number of lot and the urgent coefficient of this lot are inversely proportional to.
7. production cycle method out of control in the described effective control wafer production process of any one is characterized in that according to claim 1-6, at regular intervals after, repeat above-mentioned steps with the priority of each lot of redefining this website and sending to.
8. production cycle method out of control in effective control wafer production process according to claim 7 is characterized in that, every 12 hours, repeats to redefine the priority of each lot that this website sends to once.
9. production cycle method out of control in effective control wafer production process according to claim 7 is characterized in that, can give above-mentioned lot according to described urgent coefficient is urgent batch.
10. production cycle method out of control in effective control wafer production process according to claim 8 is characterized in that, when giving above-mentioned lot and be urgent batch according to described urgent coefficient, is less than or equal to the current date value delivery date.
CN201210435207.2A 2012-11-02 2012-11-02 Method for effectively controlling out-of-control production cycle in wafer production process Active CN102945030B (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103440545A (en) * 2013-08-02 2013-12-11 上海华力微电子有限公司 System and method for management of product batch grades
CN106896787A (en) * 2015-12-18 2017-06-27 中芯国际集成电路制造(上海)有限公司 Batch priority adjusting apparatus and the method for adjustment of product
CN111784035A (en) * 2020-06-24 2020-10-16 上海华力集成电路制造有限公司 Flow production line workload prediction method based on delivery date

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WO2007120115A1 (en) * 2006-04-17 2007-10-25 Chartered Semiconductor Manufacturing Limited Automated manufacturing systems and methods
CN101206728A (en) * 2006-12-18 2008-06-25 中芯国际集成电路制造(上海)有限公司 Work management system and method for manufacturing semiconductor
CN101872714A (en) * 2009-04-24 2010-10-27 中芯国际集成电路制造(上海)有限公司 On-line detection method and system for wafer
CN101996359A (en) * 2009-08-26 2011-03-30 中芯国际集成电路制造(上海)有限公司 Dispatching method of semiconductor manufacturing process

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
US20060074503A1 (en) * 2004-10-05 2006-04-06 Purdy Matthew A Method and system for dynamically adjusting metrology sampling based upon available metrology capacity
WO2007120115A1 (en) * 2006-04-17 2007-10-25 Chartered Semiconductor Manufacturing Limited Automated manufacturing systems and methods
CN101206728A (en) * 2006-12-18 2008-06-25 中芯国际集成电路制造(上海)有限公司 Work management system and method for manufacturing semiconductor
CN101872714A (en) * 2009-04-24 2010-10-27 中芯国际集成电路制造(上海)有限公司 On-line detection method and system for wafer
CN101996359A (en) * 2009-08-26 2011-03-30 中芯国际集成电路制造(上海)有限公司 Dispatching method of semiconductor manufacturing process

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103440545A (en) * 2013-08-02 2013-12-11 上海华力微电子有限公司 System and method for management of product batch grades
CN103440545B (en) * 2013-08-02 2016-05-25 上海华力微电子有限公司 Product batches hierarchical management system and method
CN106896787A (en) * 2015-12-18 2017-06-27 中芯国际集成电路制造(上海)有限公司 Batch priority adjusting apparatus and the method for adjustment of product
CN111784035A (en) * 2020-06-24 2020-10-16 上海华力集成电路制造有限公司 Flow production line workload prediction method based on delivery date

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