CN102943966B - Light emitting diode disposed on heat dissipating device - Google Patents
Light emitting diode disposed on heat dissipating device Download PDFInfo
- Publication number
- CN102943966B CN102943966B CN201210439858.9A CN201210439858A CN102943966B CN 102943966 B CN102943966 B CN 102943966B CN 201210439858 A CN201210439858 A CN 201210439858A CN 102943966 B CN102943966 B CN 102943966B
- Authority
- CN
- China
- Prior art keywords
- led
- radiator
- area
- abaculus
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a light emitting diode disposed on a heat dissipating device. The heat dissipating device is provided with a front surface having an opening. The device comprises a carrier, at least one LED tube core, and a heat conducting embedded block provided with a first area and a second area. The first area is coupled with the carrier thermally, and a second area is provided with a column protruding outward. The column is operably accommodated in the opening in the heat dissipating device, and the LED device can be fixedly disposed on the heat dissipating device, therefore the second area is coupled with the front surface of the heat dissipating device. The invention also discloses other embodiments, wherein the LED device can be installed by bonding the heat conducting material (196),the elastic locking plate, or welding or inserting hooks.
Description
The divisional application that the application is the applying date is on December 11st, 2008, application number is 200880120919.7, denomination of invention is the patent application of " for being installed to the light emitting diode of radiator ".
Background of invention
1. technical field
Present invention relates in general to light emitting diode (LED), and relate more particularly to LED to be installed to radiator.
2. description of Related Art
Light emitting diode (LED) is usually considered to electronic unit and thus usually uses various solder technology to be installed to printed circuit board (PCB) (PCB), and described solder technology is such as the reflow soldering of such as surface mounted package.
The progress of LED technology has caused improving optical efficiency with lower manufacturing cost, and the LED of higher-wattage can be used for general lighting application now, such as family and commercial lighting.The demand of simple, the low cost for LED being installed to solution is set up in such application.Welding may not be for illuminating industry a kind of suitable installation and/or connect solution, illuminating industry depends on connection and the mounting technique of relative low technical traditionally.Solder technology is introduced such industry and may represent obstruction for broadly adopting LED illumination parts.
LED is also compacter significantly than the traditional lighting device of such as incandescent lamp bulb and fluorescent lamp bulb and so on, this problem bringing heat to remove, because LED has than conventional bulb less can be used for the surface area of convection heat transfer' heat-transfer by convection to surrounding air.
When installing LED, needing the heat that LED produces to be delivered to can the main body of surrounding enviroment heat radiation towards periphery, thus LED is maintained safe operating temperature.
Mounting technique for conventional lighting sources (such as incandescent lamp bulb, fluorescent tube etc.) is not suitable for using together with LED component usually, because the heat transfer demands that conventional lighting sources is usually not identical with LED.Most of mounting techniques for conventional lighting sources can not be used for installing compact LED source (such as, high-capacity LED may be 1mm × 1mm or less).
Therefore, there are the needs of the method and apparatus for installing LED.
Summary of the invention
According to one aspect of the present invention, provide a kind of light emitting diode (LED) equipment for being installed to radiator, radiator has wherein with the front surface of opening.This equipment comprises carrier (sub-mount), is installed at least one LED die on this carrier and has the heat conduction abaculus in the first and second regions.First area is thermally coupled to carrier and second area has from its post (post) outwardly.This post to be operationally configured to be received within the opening in radiator and LED device is fixed to radiator, makes second area be thermally coupled to the front surface of radiator.
Described post can comprise threaded portion, and it can operate to engage LED device is fixed to radiator with the threaded portion of the opening in radiator.
Described heat conduction abaculus can operationally be configured to receive spanner in order to apply moment of torsion so that LED device is fixed to radiator.
Radiator can comprise the pedestal wherein with opening, and can comprise and to extend from pedestal and there is the cylindrical wall of the openend away from pedestal, this cylindrical wall is closed LED device at least in part and can be operated to be guided the light produced by LED die by described openend.
Described post can comprise threaded portion, and this threaded portion is given prominence to from its rear surface when being received within the opening in radiator and is operationally configured to receive nut in order to LED device is fixed to radiator.
Described post can comprise distal portions, this distal portions is given prominence to from radiator rear face when being received within described opening, this distal portions is operationally configured to receive elastic collet, in order to engage the rear surface of radiator to advance the front surface thermal coupling of second area and radiator.
Described equipment can comprise setting Heat Conduction Material on the second region, and this Heat Conduction Material can operate with the interface formed when LED device is installed on radiator between second area and radiator front surface, thus reduces thermal resistance therebetween.Described equipment can also comprise the elastic collet on the distal portions being arranged on described post, this elastic collet has at least one part, this at least one portion being operable ground is configured to compress described post with flushing while being received within the opening in radiator, Heat Conduction Material is enough submissive arrives to the front surface of radiator to enough degree to allow LED device to be pressed down, with the rear surface allowing at least one part described in elastic collet to engage radiator, thus advance second area and front surface thermal coupling.
Described abaculus can comprise at least one passage for receiving at least one conductor, and described conductor is used for for induced current at least one LED die described.
At least one passage described can be extended by described post to be conducive to the wiring of at least one conductor described to radiator rear face.
Described equipment can comprise setting Heat Conduction Material on the second region, and this Heat Conduction Material can operate with the interface formed when LED device can be installed on radiator between second area and radiator, thus reduces thermal resistance therebetween.
Described equipment can comprise at least one terminal be electrically connected with at least one LED die described, and this terminal can operate to receive and be fixed for supply operating current to the electric conductor of at least one LED die described.
According to another aspect of the present invention, provide a kind of light emitting diode (LED) equipment for being installed to radiator.This equipment comprises carrier, is installed at least one LED die on carrier and has the heat conduction abaculus in the first and second regions.First area is thermally coupled to carrier.This equipment also comprises the Heat Conduction Material be arranged on the second area of abaculus, and this Heat Conduction Material has outer surface, and this outer surface has adhesion properties LED device is fixed to radiator, makes second area be thermally coupled to the front surface of radiator.
Described Heat Conduction Material can comprise: thermal conductive material layer, and it has inner surface and outer surface; Arrange the first tack coat on an internal surface, this first tack coat can operate that thermal conductive material layer is attached to second area; And the second tack coat be positioned on outer surface.
Described abaculus can operationally be configured to be received within radiator in corresponding recess, and this recess can operate and be beneficial to LED device to aim at radiator.
Described equipment can comprise setting removable diaphragm on the outer surface, and this diaphragm is operationally configured to be removed before LED device is fixed to radiator.
Described equipment can comprise at least one terminal be electrically connected with at least one LED die described, and this terminal can operate to receive and be fixed for supply operating current to the electric conductor of at least one LED die described.
According to another aspect of the present invention, provide a kind of light emitting diode (LED) equipment for being installed to radiator, it has the elastic collet pair being attached to radiator front surface, and each elastic collet has free end.This equipment comprises carrier, is installed at least one LED die on carrier and has the heat conduction abaculus in the first and second regions.First area is thermally coupled to carrier.This equipment also comprises the first and second grooves on the opposite side of the upper surface being placed in LED device, first and second grooves can operate the corresponding free end receiving elastic collet, the second area of abaculus is pushed into when LED device is installed on radiator and is coupled with radiator heat.
Described equipment can be included in the electrical insulator formed at least partially of abaculus around, and the first and second grooves can be formed in this electrical insulator.
Described equipment can comprise the updip ramp portion of each of leading in the first and second grooves, and this ramp portion is oriented to receives the corresponding free end of elastic collet and can operate to guide these free ends to engage with the first and second corresponding grooves.
The second area of described abaculus can operationally be configured to be received within the recess of formation in radiator front surface, and this recess can operate LED device to be navigated on radiator.
Described equipment can comprise setting Heat Conduction Material on the second region, and this Heat Conduction Material can operate with the interface formed when LED device can be installed on radiator between second area and radiator, reduces thermal resistance therebetween thus.
Described equipment can comprise at least one terminal be electrically connected with at least one LED die described, and this terminal can operate to receive and be fixed for supply operating current to the electric conductor of at least one LED die described.
According to another aspect of the present invention, provide a kind of light emitting diode (LED) equipment for being installed to radiator front surface, radiator has at least one opening formed through it.This equipment comprise there is upper surface and lower surface carrier, be installed at least one LED die on the upper surface of carrier and be attached to the conductor belt of upper surface of carrier, the contiguous LED die of described conductor belt and being connected to supply operating current to it with LED electrical gas.Conductor belt has at least one connector part dangled from the upper surface of carrier downwards.This equipment is included in the molded around at least partially of connector part and the electrical insulator that has contact with of the insertion with contiguous connector part, insert to have contact with and to be operationally configured to be received within described opening and to engage the rear surface of radiator LED device is fixed to radiator, make the lower surface of carrier be thermally coupled to the front surface of radiator.
Connector part can be included in the v shape otch of its far-end, this v shape otch can operate to receive electric current to supply conductor and the insulating barrier of replacing on (displace) electric current supply conductor so as to set up with for for induced current to the electrical contact of the connector of LED die.
Described equipment can comprise the Heat Conduction Material be arranged on carrier lower surface, and this Heat Conduction Material can operate with the interface formed when LED device can be installed on radiator between lower surface and radiator, thus reduces thermal resistance therebetween.
According to another aspect of the present invention, provide a kind of light emitting diode (LED) equipment for being installed to radiator, LED device.This equipment comprises carrier, is installed at least one LED die on carrier and has the metal insert in the first and second regions, first area is thermally coupled to carrier and second area has from its metallic stud (stud) outwardly, this stud is operationally configured to that welding current is transmitted to radiator from abaculus and is welded to radiator to cause LED device, makes second area be thermally coupled to radiator.
Described equipment can comprise at least one terminal be electrically connected with at least one LED die described, and this terminal can operate to receive and be fixed for supply operating current to the electric conductor of at least one LED die described.
According to another aspect of the present invention, provide a kind of for light emitting diode (LED) equipment being installed to the technique of metal heat sink, this LED device comprises carrier, is installed at least one LED die on carrier and has the metal insert in the first and second regions, first area is thermally coupled to carrier, described method.This technique comprises causes the second area of abaculus to be oriented to contiguous radiator, and the capacitor-coupled of charging is set up welding current in order to abaculus is welded to radiator to abaculus between the second area and radiator of abaculus.
Cause the second area of abaculus to be oriented to contiguous radiator can comprise and be received in chuck by LED device, this chuck is operationally configured to the surface engaging radiator, makes the second area of abaculus to be separated relative to radiator and to locate.
Cause the second area of abaculus to be oriented to contiguous radiator can comprise and be received in chuck by LED device, this chuck is operationally configured to the surface engaging radiator, makes the second area of abaculus engage radiator.
Cause the second area of abaculus to be oriented to contiguous radiator and can comprise the second area stud joint radiator outwardly caused from abaculus, this stud can operate that welding current is transmitted to radiator from abaculus, melt the second area of stud and abaculus at least partially thus, to make abaculus be soldered to radiator.
Cause the second area of abaculus to be oriented to contiguous radiator can comprise and make to separate from the second area of abaculus stud outwardly and radiator, this stud can operate that welding current is transmitted to radiator from abaculus, melt the second area of stud and abaculus at least partially thus, to cause abaculus to be soldered to radiator.
The capacitor-coupled of charging can be comprised to abaculus: LED device be received in chuck, this chuck has the conduction portion for electrical contact abaculus; And by the conduction portion of the capacitor-coupled of charging to chuck.
When looking back the description for specific embodiment of the present invention below in conjunction with accompanying drawing, other side of the present invention and feature will become clear for those of ordinary skill in the art.
Accompanying drawing explanation
In the accompanying drawing that the embodiment of the present invention is described,
Fig. 1 is the perspective view of the LED device according to first embodiment of the invention;
Another perspective view that Fig. 2 is LED device shown in Fig. 1;
Fig. 3 is the sectional view being installed to the LED device of the Fig. 1 on radiator intercepted along line 3-3;
Fig. 4 is the sectional view of the LED device according to second embodiment of the invention;
Fig. 5 is the sectional view of the LED device according to third embodiment of the invention;
Fig. 6 is the sectional view of the LED device according to fourth embodiment of the invention;
Fig. 7 is another sectional view of LED device shown in Fig. 6 of intercepting on the direction orthogonal with the sectional view of Fig. 6;
Fig. 8 is the plane of the LED device shown in Fig. 6 and Fig. 7;
Fig. 9 is the perspective view of the LED device according to fifth embodiment of the invention;
Figure 10 is the sectional view of LED device shown in Fig. 9;
Figure 11 is the sectional view of the LED device according to sixth embodiment of the invention;
Figure 12 is the sectional view of the LED device according to seventh embodiment of the invention;
Figure 13 is the perspective view of the LED device according to eighth embodiment of the invention;
Figure 14 is for being installed to the sectional view of LED device shown in the Figure 13 on radiator;
Figure 15 is the perspective view of the LED device according to ninth embodiment of the invention;
Figure 16 is the perspective view of the second area of LED device shown in Figure 15; And
LED shown in Figure 15 and Figure 16 is welded to a series of sectional views of the technique of radiator by Figure 17-19 for illustrating.
Detailed description of the invention
LED device according to first embodiment of the invention is generally shows in fig. 1 and 2 with 100.With reference at least one LED die 104 that Fig. 1, LED 100 comprises carrier (sub-mount) 102 and be installed on this carrier.Carrier 102 can comprise such as pottery or silicon materials.LED 100 also comprises the heat conduction abaculus 106 with the first and second regions 108 and 110.First area 108 is thermally coupled to carrier 102.Abaculus 106 also comprises from second area 110 post 112 outwardly.Usually, the opening that post 112 is operationally configured to be received within radiator (not shown in figure 1) is interior so that LED device is fixed to radiator, causes described second area to be thermally coupled to radiator simultaneously.Radiator can be that such as LED 100 will be installed to its metal or alloy plate or fixture.Post 112 and abaculus 106 can together be formed as the single main body of such as Heat Conduction Material (such as aluminium or copper).
In the embodiment shown in Fig. 1 and Fig. 2, LED 100 also comprises molded body 114 and for being coupled and/or guiding the lens 116 of the light produced by LED die 102.Molded body 114 is surrounded abaculus 106 and is provided for the installing component of lens 116.
Carrier 102 also comprises the one or more carrier electrode (not shown) being electrically coupled to LED die 104.LED 100 also comprises the first terminal 118 for receiving electric current to supply conductor.The first terminal 118 can be receive and the press-fit terminal of fixing such as lead wire of conductor.The first terminal 118 be electrically coupled to the first pad (pad) 120 and LED 100 also comprise for the first pad 120 be connected between carrier 102 operating current to be supplied to the first connector 121 of the first electrode on carrier.
In an illustrated embodiment, LED 100 also comprises the second pad 122, second wire bond connector 124 and the second terminal (illustrating with 154 in Fig. 3) in order to operating current to be supplied to the second electrode on carrier.In other embodiments, LED die 104 can be coupled to abaculus 106 and abaculus can serve as the second electric current supply terminal for LED 100.
LED needs electric current to carry out work, and this electric current is supplied by the conductor of the positive and negative terminal being connected to LED or LED usually.Alternatively, some LED can be configured to make each terminal can be used as plus end or negative terminal interchangeably on electrically, and this is typical for regular alternating current illuminace component.
In one embodiment, lens 116 comprise the optically transparent material of such as Silica hydrogel, and it has outer surface 117 and extends between carrier 102 and the outer surface 117 of lens.Alternatively, lens 116 can comprise the rigid lens material of closed carrier 102, and optional filler material occupies the hole between the outer surface 117 of lens 116 and carrier 102.
With reference to Fig. 3, in one embodiment, LED 100 is installed to be had on the metal heat sink 140 of front surface 144, has cylinder opening 142 in this metal heat sink 140.In this embodiment, opening 142 extends between the front surface 144 and rear surface 145 of this plate, and size is determined to be receiving post 112.
Post 112 comprises distal portions 148, and this distal portions 148 is given prominence to by opening 142 when LED 100 is installed on described plate.When installing LED 100, elastic collet 150 is placed on the distal portions 148 of post 112.Elastic collet 150 have at least one part 152(Fig. 3 two parts 152 have been shown), the rear surface 145 that this at least one part 152 can operate to engage radiator is to advance front surface 144 thermal coupling of second area 110 and radiator 140.
The LED 100 installed also has the Heat Conduction Material 146 be arranged between the front surface 144 of radiator 140 and the second area 110 of abaculus 106.Suitable Heat Conduction Material comprises such as heat conduction adhesive tape, phase-change material, heat-conducting elastomer pad and graphite cake.Micro-v oid between this Heat Conduction Material filling front surface 144 and the second area 110 of abaculus 106 and/or gap, described Micro-v oid and/or gap occur due to nonideal surface finish and cause the thermal resistance between abaculus 106 and radiator 140 to increase.
Alternatively, elastic collet 150 integrally can be attached to the distal portions 148 of post 112, and part 152 can be manufactured by fully thin material (such as beryllium copper band) to allow spring clip portion to compress post 112 with flushing, and post is inserted by the opening 142 in radiator 140 simultaneously.In this embodiment, Heat Conduction Material 146 should be fully submissive, and to allow, spring clip portion 152 is smooth and easy is outwards bound to as directed position by opening 142, and LED presses against the front surface 144 of radiator for 100 times simultaneously.The example of suitable compressible Heat Conduction Material is the ultra-soft thermally-conductive interface pad 5502S that can obtain from Tokyo Sumiitomo 3M Limited Tape and Adhesive Division.
Advantageously, once install, can by the first electric current supply conductor 158 being inserted the first terminal 118 and the second electric current supply conductor 156 being inserted the electrical connection that the second terminal 154 is easily formed into LED 100.Described by composition graphs 1 above and Fig. 2, the first and second terminals 118 and 154 are connected to carrier 102 in order to operating current is supplied to LED die 104.
Advantageously, post 112 and corresponding opening 142 be conducive to radiator mechanical registeration LED 100 is installed to radiator 140 without instrument.In order to obtain best hot property, the size of elastic collet 150 and post should minimize to increase the heat transfer area between abaculus 106 and radiator 140.
In alternative embodiments, the aligning that the recess (not shown) with the shape substantially corresponding to abaculus 106 is beneficial between radiator and LED 100 can be formed in radiator 140.When LED 100 can operate in the optical distribution system (not shown) coupling light into and have lens, reflector and/or scattering surface, desired may be accurately aimed at relative to this optical distribution system by LED.Such aligning can be contributed to by the recess being provided for the abaculus 106 received and locate LED 100.
With reference to Fig. 4, in alternative embodiments, LED 160 comprises the post 162 with threaded portion 164.LED 160 is similar to the LED 100 shown in Fig. 1 and Fig. 2 substantially and comprises abaculus 106, first area 108 and second area 110.LED 160 be installed to there is corresponding threaded openings 168 metal heat sink 166 on.Threaded openings 168 can extend to the rear surface 172 of radiator 166 from the front surface 170 of radiator 166 by radiator 166.Alternatively, threaded openings 168 can be the blind hole in radiator 166.
The LED 160 installed also has the Heat Conduction Material 174 be arranged between the front surface 170 of radiator 166 and the second area 110 of abaculus 106.It is interior and fastened to cause Heat Conduction Material to conform to the second area 110 of abaculus with front surface 170 substantially that LED 160 is screwed into threaded openings 168, provides good thermal coupling therebetween thus.By the thermal coupling selecting the minimum diameter of post 162 to be improved, this post 162 still operationally provides sufficient bed knife, thus makes to maximize with the size of the second area of radiator 166 thermal coupling.The thickness of radiator 166 can be selected to allow to join in threaded openings 168, in order to reliably LED 160 is fixed to radiator (such as, doubling the diameter of post) by sufficient for the threaded portion 164 of post 162 length.Substantially, when LED 160 is to be enough to cause the moment of torsion of Heat Conduction Material optimum compacting to be fixed to radiator 166, the thermal resistance between first area 110 and radiator 166 is also minimized.
In alternative embodiments, molded body 114 can be shaped for engaging by the instrument of such as spanner, thus contributes to the heat trnasfer of moment of torsion for optimum LED 160 being fastened to expectation.
With reference to 5, in another embodiment, LED 190 comprises the Heat Conduction Material 192 of the second area 110 being attached to abaculus 106.LED 190 is similar with the LED 100 shown in Fig. 1 and 2 substantially, and exception part is on second area 110, do not have outstanding post in this embodiment.Heat Conduction Material 192 comprises the outer surface 194 with adhesion properties.
LED 190 can be supplied with the Heat Conduction Material of the second area 110 being attached to abaculus 106, and the outer surface 194 of Heat Conduction Material is protected by removable diaphragm.When installing LED 190, this diaphragm is removed and LED 190 aims at radiator 196 and is pressed into and contacts with the first surface 198 of radiator.In this embodiment, radiator 198 comprises the recess 199 with the shape corresponding with the second area 110 of LED 190.Recess 199 is received the second area 110 it with Heat Conduction Material 192 and is conducive to LED to aim at radiator 196.
Usually, Heat Conduction Material comprises thermal conductive material layer (not shown), and the first and second tack coats are on the inner surface and outer surface of thermal conductive material layer.Suitable heat conduction adhesive tape can obtain from the 3M electronic adhesives of St. Paul, MN and Special Products portion.This 3M heat conduction adhesive tape has ceramic fillers and pressure sensitive adhesive surface, these bonding surfaces is provided with the removable diaphragm of silicone treated polyester.For 3M band, can by by about 5-50psi(pound/square inch) pressure maintain about 2-5 and realize good bonding second.
Advantageously, the LED 190 shown in Fig. 5 is conducive to the quick improvement of many existing LED product, and the unique particular/special requirement for radiator 196 is to provide the rationally clean flat surfaces for combining.LED 190 can be firmly bonded to radiator 196 and without the need to as such as use heat-conduction epoxy resin time situation consider hardening time.Described combination can be permanent or semipermanent, and this depends on the adhesive for Heat Conduction Material 192 being attached to second area 110 and radiator 196.When using 3M band, can help remove LED 190 with release band by heating, if wish LED to be again attached to radiator 196, so must replace described band.
With reference to Fig. 6, in another embodiment, LED 200 comprises molded body 206, and this molded body 206 has the first protuberance 202 and the second protuberance 204 of the opposite side of the upper surface 208 being positioned at this main body.First and second protuberances 202 and 204 can be molded the part becoming main body 206.Alternatively, these protuberances can be formed as a part for abaculus 106.LED 200 also comprises the terminal 207 and 209 for receiving electric current to supply conductor.Terminal 207 and 209 can be the press-fit terminal as receiving described in conjunction with Figure 1 above and fixed conductor lead-in wire.
LED 200 is installed on radiator 212, and it has the first elastic collet 214 and the second elastic collet 216 being attached to radiator.Elastic collet 214 and 216 can be welded to radiator 212 at attachment point 218 and 220 place respectively.In the embodiment shown in fig. 6, elastic collet 214 and 216 is sheet spring, and can by such as beryllium copper or stainless steel manufacture.In other embodiments, elastic collet 214 and 216 can be formed as a part for radiator 212.
With reference to Fig. 7, each protuberance 202 and 204 comprises groove 210, and this groove is for receiving the free end of the corresponding elastic collet 214 and 216 causing LED 200 to be pressed into contact with radiator 212.In an illustrated embodiment, radiator 212 comprises the sunk area 222 for receiving LED 200.This sunk area 222 has the shape and size corresponding with abaculus 106 and is provided for the alignment guidance device that navigated to by LED 200 on radiator 212.This sunk area also holds Heat Conduction Material 224.
In the embodiment shown in Fig. 6 and Fig. 7, each in protuberance 202 and 204 comprises corresponding updip ramp portion 226 and 228.With reference to Fig. 8, the corresponding free end of elastic collet 214 and 216 is received in ramp portion 226 and 228 position 230 be oriented to shown in dotted outline.So LED 200 reverses to guide these free ends along corresponding ramp portion 226 and 228 on the direction shown in arrow 234 and 236, the corresponding free end of elastic collet 214 and 216 is engaged with corresponding groove 210 in position 232.When being received within corresponding groove 210, the free end of elastic collet 214 and 216 applies downward pressure and prevents LED 200 from further rotating, thus LED is fixed to radiator 212.
In other embodiments, protuberance 202 and 204 and slope 226 and 228 can be omitted, and groove 210 can directly be formed in the upper surface of abaculus 106 or main body 206.
Therefore LED is installed on radiator 212 by LED 200 securely, replaces LED if necessary simultaneously, is conducive to removing easily and replacing.Advantageously, by being conducive to removing easily and replacing, LED 200 relatively unskilled and unbred personnel can be replaced by this area, thus avoids the whole fixture of replacing carrying LED.
With reference to Fig. 9, in another embodiment, LED 240 comprises the heat conduction abaculus 242 for installing one or more LED die 244.In this embodiment, four LED die 244 being arranged on and being attached on the heat conduction carrier 246 of abaculus 242 are shown.Carrier 246 can comprise such as silicon or ceramic material.Carrier 246 also comprises the pad (not shown) being connected to LED die 244 for electric current being supplied conductor.
Abaculus 242 comprises mounting portion 248 for installing carrier 246 and post 250.Post 250 comprises threaded portion 252 at the far-end of post.In the embodiment shown in fig. 9, LED 240 comprises the nut 254 be received within the threaded portion 252 of post 250.Abaculus 242 is such as formed by the Heat Conduction Material of such as aluminium, steel or copper.
In the embodiment shown in fig. 9, abaculus 242 comprises the steel bolt with copper face coat.Advantageously, this steel bolt than copper or aluminium abaculus more strong and there is lower cost usually.Steel also have than copper or aluminium (be respectively 17 and 23ppm(PPM)/DEG C) lower thermal coefficient of expansion (about 11ppm/ DEG C).Material for installing LED die 244 has low thermal coefficient of expansion (silicon has the thermal coefficient of expansion of about 3.2ppm/ DEG C) usually.Therefore steel provides lower expansion coefficient mismatch between abaculus 242 and tube core 244, thus reduces the stress on the LED 240 that causes due to variations in temperature.
LED 240 also comprises the first and second passages 256 and 258 extended by mounting portion 248 and the post of abaculus 242.Passage 256 and 258 can operate to receive for supplying induced current to the respective conductors 260 and 262 of LED die 244.Conductor 260 and 262 comprises corresponding crooked end 264 and 266, its welding or combination of ultrasound to the pad in LED die 244 in order to be provided to the electrical connection of tube core by carrier 246.Wherein abaculus 242 conduct electricity embodiment in, conductor 260 and 262 should with the first and second passage 256 and 258 electrical isolation.
Be illustrated as being installed to radiator 270 with reference to Figure 10, LED 240.Radiator 270 comprises the opening 272 for receiving post 250.Heat Conduction Material 249 is arranged between the front surface 274 of radiator 270 and the mounting portion 248 of abaculus 242.LED 240, by engaging and clamp nut 254 and be fixed to radiator 270, thus causes the mounting portion 248 of abaculus 242 to be pushed into front surface 274 thermal coupling with radiator 270.Conductor 260 and 262 extends through the end of the threaded portion 252 of post 250, and is conducive to the connection of the current source for operating current being supplied to LED 240.
In the embodiment shown in fig. 10, radiator 270 has cylindrical tank shape main body, and it also serves as collecting and guiding reflective optical system and/or the photoconduction of the light produced by LED die 244.Conductor 260 and 262 can be connected on overhead room for hanging the illuminating equipment (not shown) of LED device.In other embodiments, radiator 270 can be such as plate or the radiator with cooling fin.
With reference to Figure 11, it illustrates that LED 300 is installed to the radiator 302 of replaceability.LED 300 is similar to the LED 240, LED 300 shown in Fig. 9 substantially and has the post 304 being threaded part 306, but has cylinder body 308.Radiator 302 comprises cylinder recess 312 and for receiving the threaded portion 306 of post 304 so that the threaded openings 314 of fixed L ED 300.Heat Conduction Material 318 is arranged between the surface 320 of main body 308 and recess 312.
Advantageously, LED 300 can be screwed into threaded openings 314 and fastening to cause Heat Conduction Material 318 pressurized thus thermal coupling between provider 308 and radiator 302.
With reference to Figure 12, in another embodiment, LED 340 comprises the cylinder body 342 for installing one or more LED die 344.LED 340 comprises as the conductor 346 and 348 being connected to LED die 344 described in conjunction with Figure 9 above.
LED 340 is installed to the radiator 350 of the feed-through openings 354 had for conductor 346 and 348.Radiator 350 also comprises connector block 356, and this connector block is fixed to radiator and comprises the connection socket 358 and 360 for receiving corresponding conductor 346 and 348.Socket 358 and 360 is connected respectively to electric current supply conductor 362 and 364 in order to supply induced current to LED 340.
Socket 358 and 360 is similar to the socket for removedly electronic unit being connected to circuit board be used on printed circuit-board assembly substantially, and is used to provide the connection of conductor 346 and 348, and LED 340 is fixed to radiator simultaneously.Socket 358 and 360 is configured to provide enough power with between the front surface 352 at least in part Heat Conduction Material 366 being compressed in main body 342 and radiator 350, thus guarantees the good thermo-contact between LED 340 and radiator.
With reference to Figure 13, in another embodiment, LED 380 comprises the LED die 382 be installed on the first surface 385 of carrier 384.LED 380 also comprises the first and second elongate conductor bands 386 and 388 being attached to first surface 385.In one embodiment, carrier 384 comprises the metallized ceramic of the attachment spacers (not shown) had for conductor belt 386 and 388 being welded to appropriate location.These attachment spacers can also be electrically connected in order to supply operating current to it with LED die 382.
Each in conductor belt has the connector part 390 and 392 dangled respectively downwards.In an illustrated embodiment, connector part 390 and 392 bends with the first surface 385 from carrier 384 to downward-extension.
Be sealed in plasticity main body 396 with reference to Figure 14, LED 380, this plasticity body envelopes carrier 384(is except the rear surface 398 of LED die 382 and carrier).Main body 396 also comprises the insertion be molded in main body and has contact with (insertion snap) 402.
LED 380 is installed to the radiator 404 of opening corresponding to the connector part 390 and 392 that has and dangle downwards, and its opening 410 and 412 is illustrated.When installing LED 380, insertion is had contact with 402 and is received within opening 410 and 412, and main body 396 is pressed downwardly, and engages until insertion has contact with 402 with the rear surface 408 of radiator 404.Heat Conduction Material 414 is arranged between the rear surface 398 of carrier 384 and the front surface 406 of radiator 404, and under these conditions, the rear surface of carrier is thermally coupled to radiator and fixes in position.Heat Conduction Material 414 can be conformable material, such as, pad as 3M ultra-soft described in conjunction with Figure 5 is warm above.
In the embodiment shown in Figure 13 and Figure 14, each in the connector part 390 and 392 dangled downwards has " V " shape otch 416 and 418 receiving insulated electric conductor 420 and 422 respectively.In this embodiment, otch 416 and 418 also has the circular portion 417 and 419 of the plane inner bending being removed to allow the end of connector part at conductor part.Each in insulated electric conductor comprises conductive core 424 and insulating barrier 426, and when insulated electric conductor 420 and 422 is stressed enter in " V " shape otch 416 and 418 time, corresponding lancing is with by engaging described conductor by insulation displacement to conductive core electrical contact.Plasticity main body 396 prevents supplied current electrical short circuit by lead-in wire and radiator 404 being insulated.
As shown in composition graphs 1 and Fig. 2, embodiment is discussed, and can provide optical element in any above-described alternative embodiment.For example, referring to Figure 14, this optical element can comprise lens (not shown), its attachment conduction band 386 and 388 before pre-molded on carrier.
With reference to Figure 15 and Figure 16, in another embodiment, LED 450 comprises at least one or more LED die 454 on carrier 452 and carrier.LED 450 also comprises the metal insert 456 with the first and second regions 458 and 460.First area 458 is thermally coupled to carrier 452.Abaculus 456 also comprises from the outstanding metallic stud 462 of second area 460.
In this embodiment, LED 450 comprises for being coupled and/or guiding the lens 464 of the light produced by LED die 454.Lens 464 are installed in molded body 468, and molded body 468 is surrounded and protected LED die 454 together with lens.LED 450 also comprises for supplying operating current to the terminal 470 and 472 of LED die 454 and corresponding connector 474 and 476.In this embodiment, connector 474 and 476 is for such as above in conjunction with the insulation displacement type connector described by Figure 13 and Figure 14.In other embodiments, the press-fit terminal of the terminal 118 in such as Fig. 1 and so on can be provided.
Below in conjunction with Figure 17 to Figure 19, the technique for installing LED 450 is described.With reference to Figure 17, LED 450 is received within the chuck 490 of soldering appliance (not shown).Soldering appliance can be a part for capacitor discharge screw welding welding system, and described system is such as the Nelson that can obtain from Ohio Illyria Nelson Stud Welding
?cD Lite I system.This Nelson system comprises the power subsystem for 66000 μ F capacitors being charged to the voltage within the scope of 50V-220V.Soldering appliance is configured to receive various chuck annex, and described chuck annex is for receiving workpiece to be welded.Soldering appliance is comprised the cable for being coupled to capacitor and comprises the switch being discharged into workpiece for activating capacitor by chuck.
In this embodiment, chuck 490 comprises the outer sleeve 492 of the insulated part 494 had for engaging radiator 496.Chuck 490 also comprises for keeping LED 450 and for welding current is transmitted to the retainer 498 of metal insert 456 from the capacitor of charging.Retainer 498 to be received within sleeve 492 and can to move relative to sleeve in arrow 500 indicated direction.Chuck 490 also comprises the spring 502 for advancing LED 450 towards radiator 496.Usually, capacitive discharge stud welding system is conducive to regulating the propulsive force provided by spring 502 to realize desired welding characteristic.
Before welding, LED 450 is positioned such that connector 474 and 476 engages corresponding conductor 504 and 506.Then chuck 490 is placed on LED 450 and LED is initial time located by chuck 490, make stud 462 contiguous but not electrical contact radiator 496.In other embodiments, LED 450 can be loaded in chuck 490 and then to locate relative to radiator while remaining in chuck.
Power supply is also activated to charge the capacitor to desired voltage.When capacitor is charged and LED 450 is in desired position, soldering appliance switch is activated by user, and this makes capacitor be discharged by retainer 498.
Initial current flow is concentrated by stud 462, and it remains on earth potential usually at stud and radiator 496() between set up electric arc.The current flow concentrated results through the high current density of stud 362, the degree causing stud to be heated rapidly to wherein stud to melt at least in part and/or vaporize, thus permission second area 460 is moved into closer to radiator 496.Along with second area 460 is moved into closer to radiator 496, multiple electric arc 510 is set up between second area and radiator.Electric arc 510 causes the local melting of abaculus 456 and radiator 496 in second area 460, and LED 450 is welded to radiator when second area reaches and contacts with radiator subsequently by securely.
With reference to Figure 19, when molten metal cools subsequently and solidifies, the abaculus 456 of the LED 450 obtained ensure that good thermo-contact with welding between radiator 496.
Advantageously, capacitive discharge stud welding system in very short time frame by electric current (in such as 4 milliseconds 9000A) that stud 362 is coupled large.Thus the very fast and heat radiation to the heating of stud 462 and surrounding second area 460 obtained minimizes, thus makes any infringement for abaculus 456 and/or radiator 496 or localization of fading.
Referring again to Figure 17, in interchangeable embodiment (being called hand capacity electric discharge stud welding), stud 462 can be oriented to and radiator 496 electrical contact.Subsequently, when the switch is activated, welding current is directly coupled to radiator 496 by stud 462.Compared to the embodiment of star t-up discharge when wherein there is gap between stud 462 and radiator 496, hand capacity electric discharge stud welding causes the weld interval a little more grown.
Advantageously, stud 462 initializes the welding current of desired position (i.e. the center of second area 460).But in other embodiments, stud 462 can omit.Under these circumstances, initial weld electric current sets up electric arc between second area 460 and radiator 496, and LED 450 may be needed relative to the more careful aligning of radiator, to guarantee that obtained welding is enough even.
Advantageously, the LED of embodiment as described herein provides the attachment to radiator not using solder, provides the good thermal coupling between LED and radiator simultaneously, makes heat effectively can pass to radiator.Some embodiments described herein be conducive to radiator without instrument attachment, and other embodiment can use common handheld tool or other easily instrument install.
Although described and illustrated specific embodiment of the present invention, such embodiment be appreciated that only illustrate the present invention instead of restriction as according to claims the present invention of being explained.
Claims (4)
1., for being installed to light emitting diode (LED) equipment for radiator (196), this LED device comprises:
Carrier (102);
Be installed at least one LED die (104) on described carrier; And
Have the heat conduction abaculus (106) of first area (108) and second area (110), described first area is thermally coupled to described carrier;
Be arranged on the Heat Conduction Material (192) on the described second area of described abaculus, described Heat Conduction Material has outer surface (196), this outer surface (196) has adhesion properties in order to this LED device is fixed to this radiator, makes described second area be thermally coupled to the front surface (198) of this radiator; And
Be arranged on the removable diaphragm on described outer surface, described diaphragm is operationally configured to be removed before this LED device being fixed to radiator (196).
2. the equipment of claim 1, wherein said Heat Conduction Material (192) comprising:
Thermal conductive material layer, has inner surface and outer surface;
Arrange the first tack coat on the internal surface, described first tack coat can operate that described thermal conductive material layer is attached to described second area; And
Be positioned at the second tack coat on described outer surface.
3. the equipment of claim 2, wherein said abaculus (106) is operationally configured to be received within the respective recess (199) in radiator (196), and described recess can operate and be beneficial to this LED device to aim at this radiator.
4. the equipment of claim 1, also comprises at least one terminal (118) be electrically connected with described at least one LED die (104), and described terminal can operate to receive and be fixed for supply operating current to the electric conductor of at least one LED die described.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/956,870 | 2007-12-13 | ||
| US11/956,270 | 2007-12-13 | ||
| US11/956270 | 2007-12-13 | ||
| US11/956870 | 2007-12-13 | ||
| US11/956,270 US7625104B2 (en) | 2007-12-13 | 2007-12-13 | Light emitting diode for mounting to a heat sink |
| US11/956,870 US8335600B2 (en) | 2007-12-14 | 2007-12-14 | Regenerative integrated actuation system and associated method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801209197A Division CN101896760B (en) | 2007-12-13 | 2008-12-11 | Light emitting diode for mounting to a heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102943966A CN102943966A (en) | 2013-02-27 |
| CN102943966B true CN102943966B (en) | 2015-02-11 |
Family
ID=44303195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210439858.9A Active CN102943966B (en) | 2007-12-13 | 2008-12-11 | Light emitting diode disposed on heat dissipating device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2011519148A (en) |
| CN (1) | CN102943966B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2829088Y (en) * | 2005-06-02 | 2006-10-18 | 上海环达计算机科技有限公司 | Radiation module |
| CN1893122A (en) * | 2005-07-07 | 2007-01-10 | 南京汉德森科技股份有限公司 | Led Lighting light-source based on metal aluminium-base material |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000333190A (en) * | 1999-05-19 | 2000-11-30 | Sony Corp | Color plane display device and heat liberation device of driver circuit-in color plane display device |
| JP2002223007A (en) * | 2000-11-22 | 2002-08-09 | Matsushita Electric Ind Co Ltd | Light source unit and semiconductor light emitting illumination device using the same |
| JP4701565B2 (en) * | 2001-09-05 | 2011-06-15 | パナソニック株式会社 | Light source unit mounting structure |
| KR100991829B1 (en) * | 2001-12-29 | 2010-11-04 | 항조우 후양 신잉 띠앤즈 리미티드 | A LED and LED lamp |
| US7093958B2 (en) * | 2002-04-09 | 2006-08-22 | Osram Sylvania Inc. | LED light source assembly |
| US6715900B2 (en) * | 2002-05-17 | 2004-04-06 | A L Lightech, Inc. | Light source arrangement |
| US7285802B2 (en) * | 2004-12-21 | 2007-10-23 | 3M Innovative Properties Company | Illumination assembly and method of making same |
| US7296916B2 (en) * | 2004-12-21 | 2007-11-20 | 3M Innovative Properties Company | Illumination assembly and method of making same |
| US20090279300A1 (en) * | 2006-05-31 | 2009-11-12 | Denki Kagaku Kogyo Kabushiki Kaisha | Led light source unit |
-
2008
- 2008-12-11 CN CN201210439858.9A patent/CN102943966B/en active Active
- 2008-12-11 JP JP2010537584A patent/JP2011519148A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2829088Y (en) * | 2005-06-02 | 2006-10-18 | 上海环达计算机科技有限公司 | Radiation module |
| CN1893122A (en) * | 2005-07-07 | 2007-01-10 | 南京汉德森科技股份有限公司 | Led Lighting light-source based on metal aluminium-base material |
Non-Patent Citations (2)
| Title |
|---|
| JP特开2000-333190A 2000.11.30 * |
| JP特开2002-223007A 2002.08.09 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011519148A (en) | 2011-06-30 |
| CN102943966A (en) | 2013-02-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101896760B (en) | Light emitting diode for mounting to a heat sink | |
| RU2464671C2 (en) | Solderless inbuilt connector of light diode assembly and heat sink for light diode | |
| EP2527729B1 (en) | Illumination apparatus | |
| TWI537539B (en) | A connector for connecting a component to a heat sink | |
| KR101398701B1 (en) | Led device, manufacturing method thereof, and light-emitting device | |
| TWI567334B (en) | Lighting device | |
| US7145179B2 (en) | Magnetic attachment method for LED light engines | |
| US8536768B2 (en) | System for heat conduction between two connectable members | |
| US20100271834A1 (en) | Led lighting system | |
| CN107112401B (en) | The lighting device improved with the efficiency for being mounted directly LED on a heat sink | |
| TW201232855A (en) | LED light source utilizing magnetic attachment | |
| CN107342510A (en) | Electric coupler component | |
| CN101802481A (en) | Lamp | |
| US8430533B1 (en) | Devices and methods for replacing LED light sources for LED-based luminaires | |
| TW201041426A (en) | LED lamp and manufacturing method thereof | |
| CN102943966B (en) | Light emitting diode disposed on heat dissipating device | |
| GB2492761A (en) | Lighting assembly circuit board attached to a heat sink | |
| CN202719423U (en) | LED (light-emitting diode) light source module | |
| CN210462950U (en) | Heat dissipation power drive assembly and lamp | |
| CN213421000U (en) | Aluminum profile center pillar connecting rod for lamp | |
| TW201243225A (en) | Light-emitting device with spring-loaded LED-holder | |
| TW584761B (en) | Plane lighting device | |
| CN102751269A (en) | Light-emitting diode module encapsulation structure | |
| CN201038544Y (en) | Semiconductor lighting lamp coupling device | |
| CN102563399A (en) | LED (light-emitting diode) lamp and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Eindhoven, Netherlands Co-patentee after: LUMILEDS LLC Patentee after: KONINKLIJKE PHILIPS N.V. Address before: Eindhoven, Netherlands Co-patentee before: Philips Ramildes Lighting Equipment Co.,Ltd. Patentee before: KONINKLIJKE PHILIPS ELECTRONICS N.V. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200831 Address after: Holland Schiphol Patentee after: KONINKLIJKE PHILIPS NV Address before: Eindhoven, Netherlands Co-patentee before: LUMILEDS LLC Patentee before: KONINKLIJKE PHILIPS N.V. |
|
| TR01 | Transfer of patent right |