CN102943966A - Light emitting diode disposed on heat dissipating device - Google Patents

Light emitting diode disposed on heat dissipating device Download PDF

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Publication number
CN102943966A
CN102943966A CN2012104398589A CN201210439858A CN102943966A CN 102943966 A CN102943966 A CN 102943966A CN 2012104398589 A CN2012104398589 A CN 2012104398589A CN 201210439858 A CN201210439858 A CN 201210439858A CN 102943966 A CN102943966 A CN 102943966A
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CN
China
Prior art keywords
led
radiator
area
equipment
abaculus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2012104398589A
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Chinese (zh)
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CN102943966B (en
Inventor
L.张
F.M.斯特兰卡
F.J.沃尔
J.克梅特克
J.W.韦坎普
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Koninklijke Philips NV
Lumileds LLC
Original Assignee
Koninklijke Philips Electronics NV
Philips Lumileds Lighing Co LLC
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Publication date
Priority claimed from US11/956,270 external-priority patent/US7625104B2/en
Priority claimed from US11/956,870 external-priority patent/US8335600B2/en
Application filed by Koninklijke Philips Electronics NV, Philips Lumileds Lighing Co LLC filed Critical Koninklijke Philips Electronics NV
Publication of CN102943966A publication Critical patent/CN102943966A/en
Application granted granted Critical
Publication of CN102943966B publication Critical patent/CN102943966B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

The invention discloses a light emitting diode disposed on a heat dissipating device. The heat dissipating device is provided with a front surface having an opening. The device comprises a carrier, at least one LED tube core, and a heat conducting embedded block provided with a first area and a second area. The first area is coupled with the carrier thermally, and a second area is provided with a column protruding outward. The column is operably accommodated in the opening in the heat dissipating device, and the LED device can be fixedly disposed on the heat dissipating device, therefore the second area is coupled with the front surface of the heat dissipating device. The invention also discloses other embodiments, wherein the LED device can be installed by bonding the heat conducting material (196),the elastic locking plate, or welding or inserting hooks.

Description

For being installed to the light emitting diode of radiator
The application is to be dividing an application of December 11, application number in 2008 are 200880120919.7, denomination of invention is " for being installed to the light emitting diode of radiator " patent application the applying date.
Background of invention
1. technical field
Present invention relates in general to light emitting diode (LED), and relate more particularly to LED is installed to radiator.
2. description of Related Art
Light emitting diode (LED) usually be considered to electronic unit and thereby usually use various solder technology to be installed to printed circuit board (PCB) (PCB), described solder technology is such as being for example reflow soldering of surface mounted package.
The progress of LED technology has caused improving optical efficiency with lower manufacturing cost, and the LED of higher-wattage can be used for general lighting application, for example family and commercial lighting now.Such application is set up for simple, the low-cost demand that solution is installed for LED.Welding may not be that illuminating industry depends on connection and the mounting technique of relative low technical traditionally for a kind of suitable installation of illuminating industry and/or connection solution.Solder technology is introduced to such industry may be represented for the obstruction that adopts more widely the LED illuminace component.
LED is also compacter significantly than the traditional lighting device such as incandescent lamp bulb and fluorescent lamp bulb, and the problem that this brings heat to remove, because LED has the less surface area that convection heat transfer' heat-transfer by convection arrives surrounding air that can be used for than conventional bulb.
When LED is installed, the heat that LED need to be produced is delivered to the main body of surrounding enviroment heat radiation towards periphery, thereby LED is maintained to safe operating temperature.
For example, mounting technique for conventional light source (incandescent lamp bulb, fluorescent tube etc.) is not suitable for using together with the LED device usually, because conventional light source does not have the hot delivery request identical with LED usually.Most of mounting techniques for conventional light source can not for example, for installing compact LED source (, high-capacity LED may be 1mm * 1mm or less).
Therefore, there are the needs of the method and apparatus for LED is installed.
Summary of the invention
According to one aspect of the present invention, a kind of light emitting diode (LED) equipment for being installed to radiator is provided, radiator has wherein the front surface with opening.The heat conduction abaculus that this equipment comprises carrier (sub-mount), is installed at least one the LED tube core on this carrier and has the first and second zones.First area is thermally coupled to carrier and second area has from its outside outstanding post (post).This post operationally is configured to be received within the opening in radiator and by LED equipment and is fixed to radiator, makes second area be thermally coupled to the front surface of radiator.
Described post can comprise threaded portion, and its threaded portion that can operate with the opening with in radiator engages in order to LED equipment is fixed to radiator.
Described heat conduction abaculus can operationally be configured to receive spanner in order to apply moment of torsion so that LED equipment is fixed to radiator.
Radiator can comprise the pedestal that wherein has opening, and can comprise from the pedestal extension and there is the cylindrical wall away from the openend of pedestal, this cylindrical wall seals at least in part LED equipment and can operate the light to be produced by the LED tube core by described openend guiding.
Described post can comprise threaded portion, gives prominence to from its rear surface in the time of in the opening of this threaded portion in being received within radiator and operationally is configured to receive nut in order to LED equipment is fixed to radiator.
Described post can comprise distal portions, this distal portions is outstanding from the radiator rear surface in being received within described opening the time, this distal portions operationally is configured to receive elastic collet, in order to the rear surface that engages radiator to advance the front surface thermal coupling of second area and radiator.
Described equipment can comprise the Heat Conduction Material be arranged on second area, and this Heat Conduction Material can operate to form the interface between second area and radiator front surface when LED equipment is installed on radiator, thereby reduces thermal resistance therebetween.Described equipment can also comprise the elastic collet on the distal portions that is arranged on described post, this elastic collet has at least one part, this at least one part compresses described post with flushing when operationally being configured in the opening in being received within radiator, Heat Conduction Material enough submissive the so that front surface that allows LED equipment to be pressed down to arrive to radiator to enough degree, engage the rear surface of radiator with described at least one part that allows elastic collet, thereby advance second area and front surface thermal coupling.
Described abaculus can comprise for receiving at least one passage of at least one conductor, and described conductor is for giving described at least one LED tube core for induced current.
Described at least one passage can extend in order to be conducive to the wiring of described at least one conductor to the radiator rear surface by described post.
Described equipment can comprise the Heat Conduction Material be arranged on second area, and this Heat Conduction Material can operate and form the interface between second area and radiator when can be installed on radiator at LED equipment, thereby reduces thermal resistance therebetween.
Described equipment can comprise at least one terminal with described at least one LED tube core electrical connection, and this terminal can operate to receive and be fixed for supplying the electric conductor of operating current to described at least one LED tube core.
According to another aspect of the present invention, provide a kind of light emitting diode (LED) equipment for being installed to radiator.The heat conduction abaculus that this equipment comprises carrier, is installed at least one the LED tube core on carrier and has the first and second zones.First area is thermally coupled to carrier.This equipment also comprises the Heat Conduction Material on the second area that is arranged on abaculus, and this Heat Conduction Material has outer surface, and this outer surface has adhesion properties in order to LED equipment is fixed to radiator, makes second area be thermally coupled to the front surface of radiator.
Described Heat Conduction Material can comprise: thermal conductive material layer, and it has inner surface and outer surface; Be arranged on the first tack coat on inner surface, this first tack coat can operate that thermal conductive material layer is attached to second area; And be positioned at the second tack coat on outer surface.
Described abaculus can operationally be configured to be received within radiator in corresponding recess, and this recess can operate and be beneficial to LED equipment is aimed at radiator.
Described equipment can comprise setting removable diaphragm on the outer surface, and this diaphragm operationally is configured to be removed before LED equipment is fixed to radiator.
Described equipment can comprise at least one terminal with described at least one LED tube core electrical connection, and this terminal can operate to receive and be fixed for supplying the electric conductor of operating current to described at least one LED tube core.
According to another aspect of the present invention, a kind of light emitting diode (LED) equipment for being installed to radiator is provided, it has the elastic collet pair that is attached to the radiator front surface, and each elastic collet has free end.The heat conduction abaculus that this equipment comprises carrier, is installed at least one the LED tube core on carrier and has the first and second zones.First area is thermally coupled to carrier.This equipment also comprises the first and second grooves on the opposite side of the upper surface that is placed in LED equipment, the first and second grooves can operate to receive the corresponding free end of elastic collet, make the second area of abaculus be pushed into when LED equipment is installed on radiator with radiator heat and are coupled.
Described equipment can be included in the electrical insulator formed around at least a portion of abaculus, and the first and second grooves can form in this electrical insulator.
Described equipment can comprise each the updip ramp portion of leading in the first and second grooves, and this ramp portion is oriented to the corresponding free end of receiving elastic collet and can operates to guide these free ends to engage with corresponding the first and second grooves.
The second area of described abaculus can operationally be configured to be received within the recess formed in the radiator front surface, and this recess can operate that LED equipment is navigated on radiator.
Described equipment can comprise the Heat Conduction Material be arranged on second area, and this Heat Conduction Material can operate and form the interface between second area and radiator when can be installed on radiator at LED equipment, reduces thus thermal resistance therebetween.
Described equipment can comprise at least one terminal with described at least one LED tube core electrical connection, and this terminal can operate to receive and be fixed for supplying the electric conductor of operating current to described at least one LED tube core.
According to another aspect of the present invention, a kind of light emitting diode (LED) equipment for being installed to the radiator front surface is provided, radiator has at least one opening through its formation.At least one LED tube core on the upper surface that this equipment comprises carrier with upper surface and lower surface, be installed to carrier and the conductor belt that is attached to the upper surface of carrier, the contiguous LED tube core of described conductor belt and with the LED electrical connection to its supply operating current.Conductor belt has at least one connector part dangled from the upper surface of carrier downwards.This equipment is included at least a portion molded about of connector part and has the electrical insulator that the insertion of contiguous connector part is had contact with, insertion have contact with operationally be configured to be received within described opening and the rear surface that engages radiator in order to LED equipment is fixed to radiator, make the lower surface of carrier be thermally coupled to the front surface of radiator.
Connector part can be included in the v shape otch of its far-end, this v shape otch can operate to receive the insulating barrier on electric current supply conductor and displacement (displace) electric current supply conductor in case set up with for the electrical contact to the connector of LED tube core for induced current.
Described equipment can comprise the Heat Conduction Material be arranged on the carrier lower surface, and this Heat Conduction Material can operate and form the interface between lower surface and radiator when can be installed on radiator at LED equipment, thereby reduces thermal resistance therebetween.
According to another aspect of the present invention, provide a kind of light emitting diode (LED) equipment for being installed to radiator, LED equipment.The metal abaculus that this equipment comprises carrier, is installed at least one the LED tube core on carrier and has the first and second zones, first area is thermally coupled to carrier and second area has from its outside outstanding metallic stud (stud), this double-screw bolt operationally is configured to welding current is transmitted to radiator to cause LED equipment to be welded to radiator from abaculus, makes second area be thermally coupled to radiator.
Described equipment can comprise at least one terminal with described at least one LED tube core electrical connection, and this terminal can operate to receive and be fixed for supplying the electric conductor of operating current to described at least one LED tube core.
According to another aspect of the present invention, provide a kind of for light emitting diode (LED) equipment being installed to the technique of metal heat sink, the metal abaculus that this LED equipment comprises carrier, is installed at least one the LED tube core on carrier and has the first and second zones, first area is thermally coupled to carrier, described method.This technique comprises that the second area that causes abaculus is oriented to contiguous radiator, thereby and the capacitor-coupled of charging is set up to welding current in order to abaculus is welded to radiator to abaculus between the second area of abaculus and radiator.
Cause the second area of abaculus to be oriented to contiguous radiator and can comprise LED equipment is received in chuck, this chuck operationally is configured to engage the surface of radiator, makes the second area of abaculus to be separated and to locate with respect to radiator.
Cause the second area of abaculus to be oriented to contiguous radiator and can comprise LED equipment is received in chuck, this chuck operationally is configured to engage the surface of radiator, makes the second area of abaculus engage radiator.
Cause the second area of abaculus be oriented to contiguous radiator can comprise cause from the second area of abaculus outwards outstanding double-screw bolt engage radiator, this double-screw bolt can operate that welding current is transmitted to radiator from abaculus, melt thus at least a portion of the second area of double-screw bolt and abaculus, in order to make abaculus be soldered to radiator.
Cause the second area of abaculus be oriented to contiguous radiator can comprise make from the second area of abaculus outwards outstanding double-screw bolt and radiator separate, this double-screw bolt can operate that welding current is transmitted to radiator from abaculus, melt thus at least a portion of the second area of double-screw bolt and abaculus, in order to cause abaculus to be soldered to radiator.
The capacitor-coupled of charging can be comprised to abaculus: LED equipment is received in chuck, and this chuck has the conduction portion for the electrical contact abaculus; And the conduction portion that the capacitor-coupled of charging is arrived to chuck.
When the description for specific embodiment of the present invention of looking back below in conjunction with accompanying drawing, other side of the present invention and feature will become clear for those of ordinary skills.
The accompanying drawing explanation
In the accompanying drawing of the explanation embodiment of the present invention,
Fig. 1 is the perspective view according to the LED equipment of first embodiment of the invention;
Another perspective view that Fig. 2 is LED equipment shown in Fig. 1;
Fig. 3 is the sectional view of the LED equipment that is installed to the Fig. 1 on radiator along line 3-3 intercepting;
Fig. 4 is the sectional view according to the LED equipment of second embodiment of the invention;
Fig. 5 is the sectional view according to the LED equipment of third embodiment of the invention;
Fig. 6 is the sectional view according to the LED equipment of fourth embodiment of the invention;
Fig. 7 is another sectional view of LED equipment shown in the Fig. 6 intercepted on the direction of the sectional view quadrature with Fig. 6;
The plane that Fig. 8 is the LED equipment shown in Fig. 6 and Fig. 7;
Fig. 9 is the perspective view according to the LED equipment of fifth embodiment of the invention;
The sectional view that Figure 10 is LED equipment shown in Fig. 9;
Figure 11 is the sectional view according to the LED equipment of sixth embodiment of the invention;
Figure 12 is the sectional view according to the LED equipment of seventh embodiment of the invention;
Figure 13 is the perspective view according to the LED equipment of eighth embodiment of the invention;
The sectional view that Figure 14 is LED equipment shown in the Figure 13 be installed on radiator;
Figure 15 is the perspective view according to the LED equipment of ninth embodiment of the invention;
The perspective view that Figure 16 is the second area of LED equipment shown in Figure 15; And
Figure 17-19 are welded to LED shown in Figure 15 and Figure 16 for explanation a series of sectional views of the technique of radiator.
The specific embodiment
In Fig. 1 and Fig. 2 with the 100 LED equipment that substantially show according to first embodiment of the invention.With reference to Fig. 1, LED 100 comprises carrier (sub-mount) 102 and is installed at least one the LED tube core 104 on this carrier.Carrier 102 can comprise for example pottery or silicon materials.LED 100 also comprises the heat conduction abaculus 106 with first and second zones 108 and 110.First area 108 is thermally coupled to carrier 102.Abaculus 106 also comprises from the outside outstanding post 112 of second area 110.Usually, post 112 operationally is configured to be received within the opening of radiator (not shown in figure 1) so that LED equipment is fixed to radiator, causes described second area to be thermally coupled to radiator simultaneously.Radiator can be that for example LED 100 will be installed to its metal or alloy plate or fixture.Post 112 and abaculus 106 can together with form for example single main body of Heat Conduction Material (for example aluminium or copper).
In the embodiment shown in Fig. 1 and Fig. 2, LED 100 also comprises molded body 114 and the lens 116 of the light that produced by LED tube core 102 for coupling and/or guiding.Molded body 114 is surrounded abaculus 106 and is provided for the installing component of lens 116.
Carrier 102 also comprises the one or more carrier electrode (not shown) that are electrically coupled to LED tube core 104.LED 100 also comprises for receiving the first terminal 118 of electric current supply conductor.The first terminal 118 can be to receive and the fixing for example press-fit terminal of lead wire of conductor.The first terminal 118 is electrically coupled to the first pad (pad) 120 and LED 100 and also comprises for being connected in order to operating current is supplied to the first connector 121 of the first electrode on carrier between the first pad 120 and carrier 102.
In an illustrated embodiment, LED 100 also comprises that the second pad 122, the second wire bond connector 124 and the second terminal (illustrating with 154 in Fig. 3) are in order to be supplied to operating current at the second electrode on carrier.In other embodiments, LED tube core 104 can be coupled to abaculus 106 and abaculus and can serve as the second electric current supply terminal for LED 100.
LED needs electric current to carry out work, and this electric current conductor of the positive and negative terminal by being connected to LED or LED encapsulation is usually supplied.Replacedly, some LED can be configured to make each terminal can be used as interchangeably plus end or negative terminal on electric, and this is typical for routine exchanges illuminace component.
In one embodiment, lens 116 comprise for example optically transparent material of silicon gel, and it has outer surface 117 and extends between the outer surface 117 of carrier 102 and lens.Replacedly, lens 116 can comprise the rigidity lens material that seals carrier 102, and optional filler material occupies the outer surface 117 of lens 116 and the hole between carrier 102.
With reference to Fig. 3, in one embodiment, LED 100 is installed on the metal heat sink 140 with front surface 144, in this metal heat sink 140, has cylinder opening 142.In this embodiment, opening 142 extends between the front surface 144 of this plate and rear surface 145, and size is determined to be and receives post 112.
Post 112 comprises distal portions 148, and this distal portions 148 is outstanding by opening 142 when LED 100 is installed on described plate.When LED 100 is installed, elastic collet 150 is placed on the distal portions 148 of post 112.Elastic collet 150 have at least one part 152(Fig. 3 two parts 152 have been shown), the rear surface 145 that this at least one part 152 can operate to engage radiator is to advance front surface 144 thermal couplings of second area 110 and radiator 140.
The LED 100 installed also has the Heat Conduction Material 146 between the second area 110 of the front surface 144 that is arranged on radiator 140 and abaculus 106.Suitable Heat Conduction Material comprises for example heat conduction adhesive tape, phase-change material, heat-conducting elastomer pad and graphite cake.Micropore hole and/or gap between the second area 110 of this Heat Conduction Material filling front surface 144 and abaculus 106, described micropore hole and/or gap occur and cause the thermal resistance between abaculus 106 and radiator 140 to increase due to nonideal surface finish.
Replacedly, elastic collet 150 can integrally be attached to the distal portions 148 of post 112, and part 152 can for example, manufacture to allow elastic collet to compress post 112 by fully thin material (beryllium copper band) with partly flushing, and post inserts by the opening 142 in radiator 140 simultaneously.In this embodiment, Heat Conduction Material 146 should be fully submissive, and smooth and easy by opening 142 and outwards be bound to as directed position to allow elastic collet part 152, LED presses against the front surface 144 of radiator for 100 times simultaneously.The example of suitable compressible Heat Conduction Material is the ultra-soft thermally-conductive interface pad 5502S that can obtain from Tokyo Sumiitomo 3M Limited Tape and Adhesive Division.
Advantageously, once install, can be by the first electric current supply conductor 158 being inserted to the first terminal 118 and the second electric current supply conductor 156 being inserted to the electrical connection that the second terminal 154 easily is formed into LED 100.As top described in conjunction with Fig. 1 and Fig. 2, the first and second terminals 118 and 154 are connected to carrier 102 in order to operating current is supplied to LED tube core 104.
Advantageously, post 112 and corresponding opening 142 are conducive to, with radiator mechanical registeration ground, LED 100 is installed to radiator 140 without instrument.In order to obtain best hot property, the size of elastic collet 150 and post should minimize in order to increase the heat transfer area between abaculus 106 and radiator 140.
In interchangeable embodiment, can have with the recess (not shown) of abaculus 106 substantially corresponding shapes and be beneficial to aiming between radiator and LED 100 in the interior formation of radiator 140.There are lens when LED 100 can operate to couple light into, in the optical profile system (not shown) of reflector and/or scattering surface the time, desired may be that LED is accurately aimed at respect to this optical profile system.By being provided for receiving and the recess of the abaculus 106 of location LED 100 can contribute to such aligning.
With reference to Fig. 4, in interchangeable embodiment, LED 160 comprises the post 162 with threaded portion 164.LED 160 is similar to substantially the LED 100 shown in Fig. 1 and Fig. 2 and comprises abaculus 106, first area 108 and second area 110.LED 160 is installed on the metal heat sink 166 with corresponding threaded openings 168.Threaded openings 168 can extend to by radiator 166 rear surface 172 of radiator 166 from the front surface 170 of radiator 166.Replacedly, threaded openings 168 can be the blind hole in radiator 166.
The LED 160 installed also has the Heat Conduction Material 174 between the second area 110 of the front surface 170 that is arranged on radiator 166 and abaculus 106.LED 160 is screwed in threaded openings 168 also fastened to cause Heat Conduction Material to conform to the second area 110 of front surface 170 and abaculus substantially, and good thermal coupling therebetween is provided thus.The thermal coupling that can be improved by the minimum diameter of selecting post 162, this post 162 still operationally provides sufficient bed knife, thereby makes to maximize with the size of the second area of radiator 166 thermal couplings.The thickness of radiator 166 can be selected to allow the sufficient length of the threaded portion of post 162 164 is joined in threaded openings 168, for example, in order to reliably LED 160 is fixed to radiator (, doubling the diameter of post).Substantially, when LED 160 is fixed to radiator 166 with the moment of torsion that is enough to cause the Heat Conduction Material optimum to be suppressed, the thermal resistance between first area 110 and radiator 166 also is minimized.
In interchangeable embodiment, molded body 114 can be shaped by the instrument of for example spanner for engaging, thereby contributes to LED 160 is fastened to the moment of torsion of expectation with the heat transmission for optimum.
With reference to 5, in another embodiment, LED 190 comprises the Heat Conduction Material 192 of the second area 110 that is attached to abaculus 106.LED 190 is similar with the LED 100 shown in Fig. 1 and 2 substantially, and the exception part for not having in this embodiment outstanding post on second area 110.Heat Conduction Material 192 comprises the outer surface 194 with adhesion properties.
LED 190 can be supplied with the Heat Conduction Material of the second area 110 that has been attached to abaculus 106, and the outer surface 194 of Heat Conduction Material is protected by removable diaphragm.When LED 190 is installed, this diaphragm be removed and LED 190 with radiator 196 alignings and be pressed into the first surface 198 of radiator and contact.In this embodiment, radiator 198 comprises the recess 199 with shape corresponding with the second area 110 of LED 190.Recess 199 is received on it to have the second area 110 of Heat Conduction Material 192 and be conducive to LED is aimed at radiator 196.
Usually, Heat Conduction Material comprises the thermal conductive material layer (not shown), and the first and second tack coats are on the inner surface and outer surface of thermal conductive material layer.Suitable heat conduction adhesive tape can obtain from 3M electronic adhesives and the Special Products section in Sao Paulo, the Minnesota State.This 3M heat conduction adhesive tape has ceramic filler and presser sensor bonding surface, is provided with the removable diaphragm of silicone treated polyester on these bonding surfaces.For 3M band, can be by by about 5-50psi(pounds/square inch) pressure maintain about 2-5 and realize good bonding second.
Advantageously, the LED 190 shown in Fig. 5 is conducive to the quick improvement of many existing LED products, for unique specific (special) requirements of radiator 196, is to provide the reasonable clean flat surfaces for combination.LED 190 can be firmly bonded to radiator 196 and consider hardening time without the situation when for example using heat-conduction epoxy resin.Described combination can be permanent or semipermanent, and this depends on for Heat Conduction Material 192 being attached to the adhesive of second area 110 and radiator 196.When using the 3M band, can help remove LED 190 to peel off band by heating, if wish LED is attached to radiator 196 again, must replace described band so.
With reference to Fig. 6, in another embodiment, LED 200 comprises molded body 206, and this molded body 206 has the first protuberance 202 and second protuberance 204 of the opposite side of the upper surface 208 that is positioned at this main body.The first and second protuberances 202 and 204 can moldedly become the part of main body 206.Replacedly, these protuberances can form the part of abaculus 106.LED 200 also comprises for receiving the terminal 207 and 209 of electric current supply conductor.Terminal 207 and 209 can be the press-fit terminal as top receiving described in conjunction with Figure 1 and fixed conductor lead-in wire.
LED 200 is installed on radiator 212, and it has the first elastic collet 214 and the second elastic collet 216 that is attached to radiator. Elastic collet 214 and 216 can be welded to radiator 212 in attachment point 218 and 220 places respectively.In the embodiment shown in fig. 6, elastic collet 214 and 216 is the sheet spring, and can be by for example beryllium copper or stainless steel manufacture.In other embodiments, elastic collet 214 and 216 can form the part of radiator 212.
With reference to Fig. 7, each protuberance 202 and 204 comprises groove 210, and this groove is for receiving the corresponding elastic collet 214 cause LED 200 to be pressed into to contact with radiator 212 and 216 free end.In an illustrated embodiment, radiator 212 comprises the sunk area 222 for receiving LED 200.This sunk area 222 has the shape and size corresponding with abaculus 106 and is provided for LED 200 is navigated to the alignment guidance device on radiator 212.This sunk area also holds Heat Conduction Material 224.
In the embodiment shown in Fig. 6 and Fig. 7, each in protuberance 202 and 204 comprises corresponding updip ramp portion 226 and 228.With reference to Fig. 8, ramp portion 226 and 228 is oriented in the position 230 shown in dotted outline and receives the corresponding free end of elastic collet 214 and 216.So LED 200 reverses with along corresponding ramp portion 226 and 228 these free ends of guiding on the direction shown in arrow 234 and 236, the corresponding free end that makes elastic collet 214 and 216 in position 232 with corresponding groove 210 interlocks.In the time of in being received within corresponding groove 210, elastic collet 214 and 216 free end apply downward pressure and prevent that LED 200 is further rotated, thereby LED is fixed to radiator 212.
In other embodiments, protuberance 202 and 204 and slope 226 and 228 can omit, and groove 210 can directly form in the upper surface of abaculus 106 or main body 206.
Therefore LED 200 is installed to LED on radiator 212 securely, replaces if necessary LED, is conducive to remove easily and replace simultaneously.Advantageously, remove easily and replace by being conducive to, LED 200 can be by this area relatively unskilled and unbred personnel replace, thereby the whole fixture of having avoided replacing carrying LED.
With reference to Fig. 9, in another embodiment, LED 240 comprises for the heat conduction abaculus 242 of one or more LED tube cores 244 is installed.In this embodiment, show four LED tube cores 244 that are arranged on the heat conduction carrier 246 that is attached to abaculus 242.Carrier 246 can comprise for example silicon or ceramic material.Carrier 246 also comprises the pad (not shown) that is connected to LED tube core 244 for electric current being supplied to conductor.
Abaculus 242 comprises mounting portion 248 and the post 250 for carrier 246 is installed.Post 250 comprises threaded portion 252 at the far-end of post.In the embodiment shown in fig. 9, LED 240 comprises the nut 254 on the threaded portion 252 that is received within post 250.Abaculus 242 is for example formed by the Heat Conduction Material such as aluminium, steel or copper.
In the embodiment shown in fig. 9, abaculus 242 comprises the steel bolt with copper face coat.Advantageously, this steel bolt is more strong and usually have a lower cost than copper or aluminium abaculus.Steel also have than copper or aluminium (be respectively 17 and 23ppm(PPM)/℃) lower thermal coefficient of expansion (approximately 11ppm/ ℃).Usually there is low thermal coefficient of expansion (silicon has the thermal coefficient of expansion of about 3.2ppm/ ℃) for the material that LED tube core 244 is installed.Therefore steel provides lower coefficient of expansion mismatch between abaculus 242 and tube core 244, thereby reduces the stress on the LED 240 caused due to variations in temperature.
LED 240 also comprises the first and second passages 256 and 258 that extend by the mounting portion 248 of abaculus 242 and post.Passage 256 and 258 can operate to receive for the respective conductors 260 and 262 to LED tube core 244 for induced current.Conductor 260 and 262 comprises corresponding crooked end 264 and 266, its welding or combination of ultrasound to the pad on LED tube core 244 in order to be provided to the electrical connection of tube core by carrier 246.Therein in the embodiment of abaculus 242 conduction, conductor 260 and 262 should with the first and second passages 256 and 258 electrical isolation.
With reference to Figure 10, LED 240 is illustrated as being installed to radiator 270.Radiator 270 comprises the opening 272 for receiving post 250.Heat Conduction Material 249 is arranged between the mounting portion 248 of the front surface 274 of radiator 270 and abaculus 242.LED 240 is by engaging and clamp nut 254 is fixed to radiator 270, thereby causes the mounting portion 248 of abaculus 242 to be pushed into front surface 274 thermal couplings with radiator 270. Conductor 260 and 262 extends through the end of the threaded portion 252 of post 250, and is conducive to for operating current being supplied to the connection of the current source of LED 240.
In the embodiment shown in fig. 10, radiator 270 has cylindrical tank shape main body, and it also serves as for collecting and guide reflective optical system and/or the photoconduction of the light produced by LED tube core 244. Conductor 260 and 262 can be connected on the room ceiling for hanging the illuminating equipment (not shown) of LED equipment.In other embodiments, radiator 270 can or have the radiator of cooling fin for for example plate.
With reference to Figure 11, it illustrates the radiator 302 that LED 300 is installed to replaceability.LED 300 is similar to the LED 240 shown in Fig. 9 substantially, and LED 300 has the post 304 of part of being threaded 306, but has cylinder body 308.Radiator 302 comprise cylinder recess 312 and for the threaded portion 306 of receiving post 304 so that the threaded openings 314 of fixed L ED 300.Heat Conduction Material 318 is arranged between the surface 320 of main body 308 and recess 312.
Advantageously, thus LED 300 can be screwed into threaded openings 314 and fastening to cause the thermal coupling between Heat Conduction Material 318 pressurized providers 308 and radiator 302.
With reference to Figure 12, in another embodiment, LED 340 comprises the cylinder body 342 for one or more LED tube cores 344 are installed.LED 340 comprises the conductor 346 and 348 as the top LED of being connected to tube core 344 described in conjunction with Figure 9.
LED 340 is installed to the radiator 350 had for the feed-through openings 354 of conductor 346 and 348.Radiator 350 also comprises connector block 356, and this connector block is fixed to radiator and comprises for receiving the connection socket 358 and 360 of corresponding conductor 346 and 348. Socket 358 and 360 is connected respectively to electric current supply conductor 362 and 364 in order to supply induced current to LED 340.
Socket 358 and 360 be similar to substantially use on printed circuit-board assembly for removedly electronic unit being connected to the socket of circuit board, and be used to provide the connection of conductor 346 and 348, and LED 340 be fixed to radiator simultaneously.The power that socket 358 and 360 is configured to provide enough to be Heat Conduction Material 366 is compressed between the front surface 352 of main body 342 and radiator 350 at least in part, thereby guarantees the good thermo-contact between LED 340 and radiator.
With reference to Figure 13, in another embodiment, LED 380 comprises the LED tube core 382 on the first surface 385 that is installed to carrier 384.LED 380 also comprises the first and second elongate conductor bands 386 and 388 that are attached to first surface 385.In one embodiment, carrier 384 comprises the metallized ceramic with the connection pad (not shown) for conductor belt 386 and 388 being welded to appropriate location.These connect pad can also be with 382 electrical connections of LED tube core in order to supply operating current to it.
Each in conductor belt has respectively the connector part 390 and 392 dangled downwards.In an illustrated embodiment, connector part 390 and 392 bends with the first surface 385 from carrier 384 to downward-extension.
With reference to Figure 14, LED 380 is sealed in plasticity main body 396, and this plasticity main body is surrounded carrier 384(except the rear surface 398 of LED tube core 382 and carrier).Main body 396 also comprises that being molded into the interior insertion of main body has contact with (insertion snap) 402.
LED 380 is installed to the radiator 404 of the connector part 390 that has and dangle and 392 corresponding openings downwards, and its opening 410 and 412 is illustrated.When LED 380 is installed, insert and have contact with 402 and be received within opening 410 and 412, and main body 396 pressed downwards, have contact with 402 and engage with the rear surface 408 of radiator 404 until insert.Heat Conduction Material 414 is arranged between the front surface 406 of the rear surface 398 of carrier 384 and radiator 404, and under these conditions, the rear surface of carrier be thermally coupled to radiator and fixing in position.Heat Conduction Material 414 can be submissive material, for example pad as hot as top 3M ultra-soft described in conjunction with Figure 5.
In the embodiment shown in Figure 13 and Figure 14, each in the connector part 390 and 392 dangled downwards has to receive respectively " V " shape otch 416 and 418 of insulated electric conductor 420 and 422.In this embodiment, otch 416 and 418 also has and is removed to allow the circular portion 417 and 419 of the end of connector part at the plane inner bending of conductor part.Each in insulated electric conductor comprises conductive core 424 and insulating barrier 426, and in the time of in insulated electric conductor 420 and 422 stressed entering " V " shape otch 416 and 418, corresponding lancing with by by insulation displacement to the conductive core electrical contact, engaging described conductor.Plasticity main body 396 prevents supplied current electrical short circuit by going between with radiator 404 insulation.
As discussed in conjunction with embodiment as shown in Fig. 1 and Fig. 2, can in any above-described alternative embodiment, provide optical element.For example, with reference to Figure 14, this optical element can comprise the lens (not shown), and it was molded on carrier in advance before attached conduction band 386 and 388.
With reference to Figure 15 and Figure 16, in another embodiment, LED 450 comprises at least one or a plurality of LED tube core 454 on carrier 452 and carrier.LED 450 also comprises the metal abaculus 456 with first and second zones 458 and 460.First area 458 is thermally coupled to carrier 452.Abaculus 456 also comprises the metallic stud outstanding from second area 460 462.
In this embodiment, LED 450 comprises for coupling and/or guides the lens 464 by the light of LED tube core 454 generations.Lens 464 are installed in molded body 468, and LED tube core 454 is surrounded and protected to molded body 468 together with lens.LED 450 also comprises for supplying the terminal 470 of operating current to LED tube core 454 and 472 and corresponding connector 474 and 476.In this embodiment, connector 474 and 476 is for for example top in conjunction with Figure 13 and the described insulation displacement style connector of Figure 14.In other embodiments, can provide the press-fit terminal the terminal 118 in Fig. 1.
Below in conjunction with Figure 17 to Figure 19, the technique for LED 450 is installed is described.With reference to Figure 17, LED 450 is received within the chuck 490 of soldering appliance (not shown).Soldering appliance can be the part of capacitor discharge stud welding system, and described system is for example the Nelson that can obtain from the Nelson Stud Welding of Ohio Illyria ?cD Lite I system.This Nelson system comprises for 66000 μ F capacitors being charged to the power subsystem of the voltage in the 50V-220V scope.Soldering appliance is configured to receive various chuck annexes, and described chuck annex is for receiving workpiece to be welded.Soldering appliance comprises the cable for being coupled to capacitor and comprises for activating capacitor and discharge into the switch of workpiece by chuck.
In this embodiment, chuck 490 comprises the outer sleeve 492 of the insulated part 494 had for engaging radiator 496.Chuck 490 also comprises for keeping LED 450 and for welding current is transmitted to the retainer 498 of metal abaculus 456 from the capacitor of charging.Retainer 498 is received within sleeve 492 and can moves with respect to sleeve on arrow 500 indicated directions.Chuck 490 also comprises for advance the spring 502 of LED 450 towards radiator 496.Usually, capacitive discharge stud welding system is conducive to regulate the propulsive force provided by spring 502 to realize desired welding characteristic.
Before welding, LED 450 is positioned such that connector 474 and 476 engages corresponding conductor 504 and 506.Chuck 490 then be placed on LED 450 and LED when initial by chuck 490 location, make the contiguous but electrical contact radiator 496 not of double-screw bolt 462.In other embodiments, LED 450 can be loaded in chuck 490 and in then in remaining on chuck and locate with respect to radiator.
Power supply also is activated in order to charge the capacitor to desired voltage.When capacitor is recharged and LED 450 during in desired position, the soldering appliance switch is activated by the user, and this makes capacitor pass through retainer 498 electric discharges.
The initial current flow is concentrated by double-screw bolt 462, and it remains on earth potential usually at double-screw bolt and radiator 496() between set up electric arc.Concentrated current flow causes by the high current density of double-screw bolt 362, causes double-screw bolt to be heated rapidly to the degree that wherein double-screw bolt melts at least in part and/or vaporizes, thereby allows second area 460 to be moved into more close radiator 496.Along with second area 460 is moved into more close radiator 496, a plurality of electric arc 510 is set up between second area and radiator.Electric arc 510 causes the local melting of abaculus 456 in second area 460 and radiator 496, and this reaches while contacting with radiator and securely LED 450 is welded to radiator at second area subsequently.
With reference to Figure 19, when molten metal is cooling and curing subsequently, good thermo-contact has been guaranteed in the abaculus 456 of resulting LED 450 and the welding between radiator 496.
Advantageously, capacitive discharge stud welding system in very short time frame by double-screw bolt 362 coupling large electric current (for example 4 milliseconds in 9000A).Resulting to double-screw bolt 462 with the heating of second area 460 on every side is very fast and heat radiation thereby minimize, thus make for any infringement of abaculus 456 and/or radiator 496 or the localization of fading.
Referring again to Figure 17, in interchangeable embodiment (being called hand capacity electric discharge stud welding), double-screw bolt 462 can be oriented to and radiator 496 electrical contacts.Subsequently, when activator switch, welding current is directly coupled to radiator 496 by double-screw bolt 462.Start the embodiment of electric discharge when wherein between double-screw bolt 462 and radiator 496, having gap, hand capacity electric discharge stud welding causes the weld interval of a little more growing.
Advantageously, double-screw bolt 462 initializes the welding current of desired position (being the center of second area 460).Yet in other embodiments, double-screw bolt 462 can omit.Under these circumstances, initial welding current is set up electric arc between second area 460 and radiator 496, and may need the more careful aligning of LED 450 with respect to radiator, in order to guarantee that resulting welding is enough even.
Advantageously, the LED of embodiment as described herein provides attached to radiator that does not use scolder, and the good thermal coupling between LED and radiator is provided simultaneously, makes heat can effectively pass to radiator.Some embodiment described herein are conducive to the attached without instrument of radiator, and other embodiment can with common handheld tool or other easily instrument install.
Although described and illustrated specific embodiment of the present invention, such embodiment is appreciated that the present invention rather than restriction the present invention as explained according to claims only is described.

Claims (5)

1. light emitting diode (LED) equipment for being installed to radiator (196), this LED equipment comprises:
Carrier (102);
Be installed at least one the LED tube core (104) on described carrier; And
Have the heat conduction abaculus (106) of first area (108) and second area (110), described first area is thermally coupled to described carrier; And
Be arranged on the Heat Conduction Material (192) on the described second area of described abaculus, described Heat Conduction Material has outer surface (196), this outer surface (196) has adhesion properties in order to this LED equipment is fixed to this radiator, makes described second area be thermally coupled to the front surface (198) of this radiator.
2. the equipment of claim 1, wherein said Heat Conduction Material (192) comprising:
Thermal conductive material layer, have inner surface and outer surface;
Be arranged on the first tack coat on described inner surface, described the first tack coat can operate that described thermal conductive material layer is attached to described second area; And
Be positioned at the second tack coat on described outer surface.
3. the equipment of claim 2, wherein said abaculus (106) operationally is configured to be received within the respective recess (199) in radiator (196), and described recess can operate and be beneficial to this LED equipment is aimed at this radiator.
4. the equipment of claim 2, also comprise the removable diaphragm be arranged on described outer surface, and described diaphragm operationally is configured to be removed before this LED equipment is fixed to radiator (196).
5. the equipment of claim 1, also comprise and at least one terminal (118) of described at least one LED tube core (104) electrical connection, and described terminal can operate to receive and be fixed for supplying the electric conductor of operating current to described at least one LED tube core.
CN201210439858.9A 2007-12-13 2008-12-11 Light emitting diode disposed on heat dissipating device Active CN102943966B (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US11/956,870 2007-12-13
US11/956,270 US7625104B2 (en) 2007-12-13 2007-12-13 Light emitting diode for mounting to a heat sink
US11/956,270 2007-12-13
US11/956270 2007-12-13
US11/956870 2007-12-13
US11/956,870 US8335600B2 (en) 2007-12-14 2007-12-14 Regenerative integrated actuation system and associated method

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