CN102931153A - Radiator for microgroove column group - Google Patents
Radiator for microgroove column group Download PDFInfo
- Publication number
- CN102931153A CN102931153A CN2012104432772A CN201210443277A CN102931153A CN 102931153 A CN102931153 A CN 102931153A CN 2012104432772 A CN2012104432772 A CN 2012104432772A CN 201210443277 A CN201210443277 A CN 201210443277A CN 102931153 A CN102931153 A CN 102931153A
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- China
- Prior art keywords
- microflute
- radiator
- microgroove
- post
- working medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a radiator for a microgroove column group. The radiator comprises a working medium liquid, working medium steam, microgroove columns, a seal cavity and a ribbed radiator. A plurality of the microgroove columns and the working medium liquid are arranged at the bottom of the seal cavity, the ribbed radiator is arranged on the upper portion of the seal cavity, and the working medium steam is arranged below the ribbed radiator. The steam and liquid phase-transition temperature of the working medium steam corresponding to the pressure in the seal cavity is in a range of minus 20 DEG C to 200 DEG C. Microgrooves are arranged on the surfaces of the microgroove columns, widths of the microgrooves are in a range of 0.01mm to 1 mm, and depths of the microgrooves are in a range of 0.01mm to 1 mm. The working medium liquid surface is lower than the microgroove columns. The radiator for the microgroove column group can solve the cooling problem of heating objects with large heat flux in a small contact area.
Description
Technical field
The present invention relates to radiator, relate in particular to a kind of microflute post group radiator.
Background technology
Along with the development of semi-conductor industry, the integrated level of circuit is more and more higher, and the density of heat flow rate of electronic device also increases.Such as CPU, the electronic devices such as great power LED just need in limited area, need to carry out the cooling of large density of heat flow rate.Conventional solid radiator need to be transmitted to by the heat of the conductors such as copper, aluminium in will this limited area has more large-area spreader surface, and the use solid is grown the heat conduction of distance and will be brought larger thermal resistance.The present invention utilizes microflute post group to promote evaporation and the boiling of worker quality liquid, so that local large hot-fluid is diffused into rapidly wider space, has avoided the long thermal resistance of bringing apart from solid conductive heat.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of microflute post group radiator for the cooling problem of the thermal objects of larger density of heat flow rate in solving than small area of contact is provided.
Microflute post group radiator comprises worker quality liquid, working substance steam, microflute post, seal chamber and fin radiator; The seal chamber bottom is provided with many microflute posts, worker quality liquid, and seal chamber top is provided with fin radiator, and the fin radiator below is provided with working substance steam.
The liquid-gas phase transition temperature of the corresponding working substance steam of pressure in the described seal chamber is-20 ℃～200 ℃.Described microflute post, the surface be provided with microflute, the width of microflute is 0.01mm～1mm, the degree of depth 0.01mm of microflute～1mm.Described worker quality liquid liquid level is lower than the height of microflute post.
The present invention efficiently solves the cooling problem than the thermal objects of larger density of heat flow rate in the small area of contact.
Description of drawings
Fig. 1 (a) is microflute post group radiator structural representation;
Fig. 1 (b) is B-B cutaway view among Fig. 1 (a);
Fig. 1 (c) is A-A cutaway view among Fig. 1 (a).
Among the figure, worker quality liquid 1, working substance steam 2, microflute post 3, seal chamber 4 and fin radiator 5.
Embodiment
As shown in Figure 1, microflute post group radiator comprises worker quality liquid 1, working substance steam 2, microflute post 3, seal chamber 4 and fin radiator 5; Seal chamber 4 bottoms are provided with many microflute posts 3, worker quality liquid 1, and seal chamber 4 tops are provided with fin radiator 5, and fin radiator 5 belows are provided with working substance steam 2.
The liquid-gas phase transition temperature of the corresponding working substance steam 2 of pressure in the described seal chamber 4 is-20 ℃～200 ℃.Worker quality liquid and working substance steam can be the same material, also can be the mixture of many kinds of substance.
Described microflute post 3, the surface be provided with microflute, the width of microflute is 0.01mm～1mm, the degree of depth 0.01mm of microflute～1mm.The cross sectional shape of microflute post can be the various ways such as circular, square, cross, rice font.
Heater of the present invention is connected at a face that has worker quality liquid to exist with microflute post group radiator.The heat of heater is transmitted to worker quality liquid and microflute post group by the cavity wall.Worker quality liquid is heated evaporation or boiling occurs, and forms working substance steam.Microflute post group utilizes the surface tension of liquid that worker quality liquid is drawn high the post surface, promotes the evaporation of worker quality liquid.Working substance steam is taken heat to one side that cavity has fin, and fin discharges heat to air, again is condensed into liquid so that working substance steam obtains cooling off, and gets back to heating surface.Efficiently solve the cooling problem than the thermal objects of larger density of heat flow rate in the small area of contact.
Claims (4)
1. a microflute post group radiator is characterized in that comprising worker quality liquid (1), working substance steam (2), microflute post (3), seal chamber (4) and fin radiator (5); Seal chamber (4) bottom is provided with many microflute posts (3), worker quality liquid (1), and seal chamber (4) top is provided with fin radiator (5), and fin radiator (5) below is provided with working substance steam (2).
2. a kind of microflute post group radiator according to claim 1 is characterized in that the liquid-gas phase transition temperature of the corresponding working substance steam of pressure (2) in the described seal chamber (4) is-20 ℃～200 ℃.
3. a kind of microflute post group radiator according to claim 1 is characterized in that described microflute post (3), the surface be provided with microflute, the width of microflute is 0.01mm～1mm, the degree of depth 0.01mm of microflute～1mm.
4. a kind of microflute post group radiator according to claim 1 is characterized in that described worker quality liquid (1) liquid level is lower than the height of microflute post (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210443277.2A CN102931153B (en) | 2012-11-08 | 2012-11-08 | A kind of radiator for microgroove column group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210443277.2A CN102931153B (en) | 2012-11-08 | 2012-11-08 | A kind of radiator for microgroove column group |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102931153A true CN102931153A (en) | 2013-02-13 |
| CN102931153B CN102931153B (en) | 2015-11-04 |
Family
ID=47645923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210443277.2A Expired - Fee Related CN102931153B (en) | 2012-11-08 | 2012-11-08 | A kind of radiator for microgroove column group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102931153B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103824825A (en) * | 2014-02-13 | 2014-05-28 | 中国科学院工程热物理研究所 | Microchannel phase-change heat transfer device |
| CN108133914A (en) * | 2017-12-20 | 2018-06-08 | 深圳先进技术研究院 | Radiator and its application method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003332549A (en) * | 2002-05-17 | 2003-11-21 | Fuji Photo Film Co Ltd | Mounting structure and imaging device |
| CN101614499A (en) * | 2008-06-27 | 2009-12-30 | 超众科技股份有限公司 | Temperature-uniforming plate and preparation method thereof |
| CN202149467U (en) * | 2011-08-02 | 2012-02-22 | 苏州迅康纳米科技有限公司 | Microgroove circulation radiator |
| CN202977399U (en) * | 2012-11-08 | 2013-06-05 | 浙江大学 | Microgroove column group heat sink |
-
2012
- 2012-11-08 CN CN201210443277.2A patent/CN102931153B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003332549A (en) * | 2002-05-17 | 2003-11-21 | Fuji Photo Film Co Ltd | Mounting structure and imaging device |
| CN101614499A (en) * | 2008-06-27 | 2009-12-30 | 超众科技股份有限公司 | Temperature-uniforming plate and preparation method thereof |
| CN202149467U (en) * | 2011-08-02 | 2012-02-22 | 苏州迅康纳米科技有限公司 | Microgroove circulation radiator |
| CN202977399U (en) * | 2012-11-08 | 2013-06-05 | 浙江大学 | Microgroove column group heat sink |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103824825A (en) * | 2014-02-13 | 2014-05-28 | 中国科学院工程热物理研究所 | Microchannel phase-change heat transfer device |
| CN103824825B (en) * | 2014-02-13 | 2017-01-04 | 中国科学院工程热物理研究所 | Micro-channel phase change heat exchange device |
| CN108133914A (en) * | 2017-12-20 | 2018-06-08 | 深圳先进技术研究院 | Radiator and its application method |
| CN108133914B (en) * | 2017-12-20 | 2019-12-13 | 深圳先进技术研究院 | heat dissipation device and use method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102931153B (en) | 2015-11-04 |
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151104 Termination date: 20161108 |
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| CF01 | Termination of patent right due to non-payment of annual fee |