CN102922815B - Water-cooled flat plate layered CuCrZr/OFHC-Cu/CVD-W plasma-facing part and manufacturing method thereof - Google Patents
Water-cooled flat plate layered CuCrZr/OFHC-Cu/CVD-W plasma-facing part and manufacturing method thereof Download PDFInfo
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- CN102922815B CN102922815B CN201210260306.1A CN201210260306A CN102922815B CN 102922815 B CN102922815 B CN 102922815B CN 201210260306 A CN201210260306 A CN 201210260306A CN 102922815 B CN102922815 B CN 102922815B
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Abstract
The invention discloses a water-cooled flat plate layered CuCrZr/OFHC-Cu/CVD-W plasma-facing part and a manufacturing method thereof. The part has a three-layer structure comprising a heat sink, an adaptation layer, and a plasma-facing material sequentially arranged from bottom to top. The heat sink adopts a precipitation-hardened CuCrZr alloy material. The adaptation layer adopts a low-oxygen high-purity soft copper material OFHC-Cu with a thickness of 1-3mm. The plasma-facing material adopts a chemical vapor deposition tungsten coating CVD-W with a thickness of 1-4mm. The surface of the OFHC-Cu is subjected to a pre-texturing treatment, such that bonding strength is improved. Through holes as cooling water channels are provided in the heat sink. The cooling water channels contain circulating water. The invention provides a low-cost, high-cooling-effect and high-reliability PFC scheme which can be used in a plasma-facing area in a fusion device with relatively low heat load (wherein a steady-state heat flux is lower than 5MW/m<2>) during normal operation.
Description
Technical field
The present invention relates to fusion facility flux of plasma parts (Plasma-facing component, PFC) field, be specifically related to a kind of water cooling dull and stereotyped stratiform CuCrZr/OFHC-Cu/CVD-W flux of plasma parts.
Background technology
Tungsten material has the good characteristic such as high-melting-point, high sputtering threshold value, high heat conductance, low-vapor pressure, low hydrogen isotope delay, is therefore a kind of important facing plasma material.Thermic load lower (stable state hot-fluid < 5 MW/m when fusion facility long pulse is normally run
2) region, slab design is a kind of feasible and candidate scheme of low cost.In order to reach the object of high efficiency and heat radiation, PFC is necessary for active cooling-type.This can by passing into circulating cooling liquid to realize in tabular is heat sink with the high-strength highly-conductive of tungsten part good combination hot copper base (the high strength CuCrZr alloy as age-hardening).The selection of cooling scheme need according to the thermal-Hydraulics Design of PFC.In addition, in order to make overall structure have good mechanical stability, copper alloy heat sink well should be connected with passive high duty metal structural material.
But, a key issue in layer structure active cooling PFC be copper heat sink/mismatch problems of tungsten material interface.Tungsten material thermal expansion coefficient is lower (is about 4.5 × 10 under room temperature
-6/ K), and copper alloy thermal coefficient of expansion is higher (is about 16.6 × 10 under room temperature
-6/ K), and due to the higher not easily plastic deformation of copper alloy intensity, so in parts military service process, great thermal stress will be produced, may cause copper heat sink/tungsten material interface cracking or tungsten material surface cracking, reduce the service reliability of PFC.
Two schemes is had to can be used for solving the problem at present: copper/tungsten functionally gradient transition zone and soft and tough intermediate buffer layer (being generally low oxygen content fine copper OFHC-Cu).Although copper/tungsten functionally gradient transition zone is at present by method (as big current impedance sintering or thermal spraying) preparation comparatively cleverly, because different melting points between tungsten copper is too large, copper/tungsten functionally graded layer that extensive preparation defect is less is still very difficult.From component integration angle, comparatively functionally graded layer is advantageously for anaerobic pure copper material.
The interconnection technique that OFHC-Cu sheet material (thickness is about 1-3 mm) is heat sink with tabular CuCrZr has the multiple connection schemes such as soldering, explosive welding (EW) and high temperature insostatic pressing (HIP).But it should be noted that and precipitated phase solid solution in CuCrZr material should be avoided to cause intensity significantly to decline in connection procedure.So, in whole connection procedure, it will be a key factor that temperature controls.In addition, after welding, oxygen-free copper surface should smoothly be connected with tungsten to facilitate.
For tungsten region, coating is a good scheme, has very strong competitiveness in cost.Up to now, more research is carried out to this both at home and abroad, as methods such as air/vacuum plasma spray, ionic liquid (fused salt) plating and chemical vapor deposition (CVD)s.Often porosity is too high for the tungsten coating prepared of plasma spray process, and spray gun is by road scanning spraying, and speed is slower.And although tungsten coating density prepared by Molten Salt Electroplating method is very high, because its preparation temperature is very high, cause the significantly reduction of CuCrZr alloy strength.Although it should be noted that the intensity of CuCrZr material can be recovered by follow-up solid-solution and aging heat treatment technique, quenching stress may cause the damage of parts, and aging technique adds the cost of PFC.Chemical vapour deposition (CVD) utilizes following chemical reaction
Deposit under about 500-600 DEG C, the significantly decline of the CuCrZr strength of materials can not be caused.Current industrial CVD-W coating deposition rate can reach 0.8 mm/h, and density can reach 99.6%, and efficiency is high, and processing characteristics comparatively sintered tungsten excellence.Therefore, CVD is the very competitive tungsten coating technique of one, can be used for the preparation of PFC parts.
But because solid solubility mutual between tungsten and copper is extremely low, rely on enhanced primary treatment merely, then adhesion is very low, in order to improve bond strength, need to introduce mechanical bond.Surface roughness can be improved on OFHC-Cu surface by the method such as sandblasting or laser roughening, and CVD process Atom can be deposited among surperficial very low power, forms good mechanical snap.
Tungsten material plasticity is very poor, and the crackle produced to prevent somewhere is expanded in monoblock tungsten, and considers the damage effect reducing electromagnetic force, and need to introduce notching construction, namely utilizing the fluting of network that large stretch of tungsten region is separated becomes several fritters.For CVD scheme, fluting should carry out in advance before deposited coatings, was conducive to like this avoiding due to the damage of tungsten coating follow-up fluting processing introducing to coating.
Summary of the invention:
In order to solve facing plasma material and the larger problem of heat sink material mispairing, the present invention proposes and a kind ofly be heat sink material with CuCrZr alloy, be facing plasma material with chemical vapour deposition (CVD) tungsten (CVD-W), take low oxygen content high purity copper (OFHC-Cu) as water cooling flat board stratiform CuCrZr/OFHC-Cu/CVD-W flux of plasma parts of the two adaptation layer and preparation method thereof.
For achieving the above object, the present invention adopts following technical scheme:
Water cooling dull and stereotyped stratiform CuCrZr/OFHC-Cu/CVD-W flux of plasma parts, it is characterized in that: include three-decker, described three-decker is followed successively by heat sink from bottom to top, adaptation layer, facing plasma material, the CuCrZr alloy material of described heat sink employing precipitation-hardening, described adaptation layer adopts thickness to be 1-3 mm low oxygen content high-purity soft copper material OFHC-Cu, described facing plasma material employing thickness is the chemical vapour deposition (CVD) tungsten coating CVD-W of 1-4 mm, described heat sink in have through hole as cooling-water duct, recirculated water is connected with in cooling-water duct.
Described heat sink in the termination of cooling-water duct be welded with the joint of CuCrZr alloy material.
The welding manner of the joint of described heat sink and cooling-water duct can adopt copper silver soldering, solid-state diffusion is welded.
Described adaptation layer is connected with heat sink zero defect, and connected mode can adopt hot isostatic press welding, lamination hot rolling, explosive welding.
The upper surface of described adaptation layer laterally, longitudinally has multiple arc groove and forms network.
The preparation method of water cooling dull and stereotyped stratiform CuCrZr/OFHC-Cu/CVD-W flux of plasma parts, is characterized in that, comprise following content:
(1), the high-quality CuCrZr alloy of selecting thickness to be 20mm is heat sink material, room temperature tensile intensity > 280 MPa, room-temperature yield strength > 175 MPa;
(2), to CuCrZr heat sink sheet material electroplating surface thickness be the fine copper of 1-3 mm, plating solution batching is copper-bath and the 60 g/L sulfuric acid mixture liquids of 200 g/L, and electroplating temperature is 15-35 DEG C, and current density controls at 2-5 A/dm
2, adopt swap cathode and plating solution is uninterruptedly stirred and plating solution supplement;
(3), to the CuCrZr/OFHC-Cu composite board after welding carry out machining, comprising: according to thermal-Hydraulics Design at the heat sink middle Drilling operation cooling-water duct of CuCrZr; According to PFC general assembly design, working joint on CuCrZr is heat sink in advance; Cut away remainder in OFHC-Cu make its thickness be 1.5 mm then according to the tungsten coating fluting design of scheme and layout in PFC, at OFHC-Cu Surface Machining groove, sandblasting or laser roughening process are carried out to whole surface in advance;
(4), the CuCrZr/OFHC-Cu composite wood of above-mentioned machining is carried out to the CVD of tungsten coating, depositing temperature should control below 550 DEG C, in addition, should block cooling-water duct port in deposition process to avoid tungsten in cooling-water duct inside deposition, the thickness of CVD-W coating is 3 mm;
(5), the parts after CVD and joint and cooling system are assembled.
The present invention in order to slowly-releasing in PFC is on active service tungsten coating and heat sink between the thermal stress that produces, introducing soft and tough OFHC-Cu(thickness is between 1-3 mm) be middle adaptation layer.The introducing technology of adaptation layer comprises the schemes such as heat iso-hydrostatic diffusion welding, explosive welding (EW) and laminated rolling.In addition, consider that electromagnetic force damage effect and the overall preparation section of PFC may be expanded and reduce to crackle on a large scale in tungsten coating, adopt in advance be connected to heat sink on adaptation layer surface form grid according to the groove of design machining transition, and then chemical vapour deposition (CVD) tungsten coating CVD-W.
Advantage of the present invention is:
The present invention adopts circulating water design, and the PFC heat dissipation ability that the present invention is proposed is strong.
The present invention adopts soft and tough OFHC-Cu to be middle adaptation layer, significantly can reduce the thermal stress produced during PFC is on active service.
The present invention carries out the design of grid fluting to tungsten coating region, effectively can reduce the probability that in coating, the expansion of crackle large scale and electromagnetic force are destroyed.
In sum, the present invention proposes the PFC scheme that a kind of low cost, high cooling efficiency and reliability are strong, can be applicable to the flux of plasma region that thermic load in fusion facility is relatively low.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is adaptation layer upper surface grooved section schematic diagram.
Detailed description of the invention
As shown in Figure 1, 2, water cooling dull and stereotyped stratiform CuCrZr/OFHC-Cu/CVD-W flux of plasma parts, include three-decker, three-decker is followed successively by heat sink 4, adaptation layer 2, facing plasma material 1 from bottom to top, the CuCrZr alloy material of heat sink 4 employing precipitation-hardenings, adaptation layer 2 adopts thickness to be 1-3 mm low oxygen content high-purity soft copper material OFHC-Cu, facing plasma material 1 adopts thickness to be the chemical vapour deposition (CVD) tungsten coating CVD-W of 1-4 mm, have through hole in heat sink 4 as cooling-water duct 3, in cooling-water duct 3, be connected with recirculated water.
Exemplifying embodiment 1:
1, high strength (room temperature tensile intensity > 280 MPa is selected, room-temperature yield strength > 175 MPa) thickness be the CuCrZr alloy of 20 mm be heat sink material, the OFHC-Cu sheet material that thickness is about 2 mm is middle adaptation layer.
2, to adaptation layer and CuCrZr heat sink employing vacuum canning soldering and sealing (air pressure < 0.1 Pa), then about 530 DEG C, carry out the welding of high temperature insostatic pressing (HIP) solid-state diffusion in the ar gas environment of air pressure > 100 MPa, weld interval is 1 h.In addition, the mechanical property caused due to high-temperature soldering in order to avoid CuCrZr is heat sink reduces, and needs control temperature to be no more than 550 DEG C in welding process.
3, machining is carried out to the CuCrZr/OFHC-Cu composite wood after welding, comprising: remove surperficial jacket; According to thermal-Hydraulics Design at the heat sink middle Drilling operation cooling-water duct of CuCrZr and utilize copper silver soldering technology connect warter connection; According to PFC general assembly design, process support joint on CuCrZr is heat sink in advance; According to the tungsten coating fluting design (as shown in Figure 2) of scheme and layout in PFC, (for square net, single grid area is 1-9 cm
2), be linked to be network and integral surface texturing at OFHC-Cu Surface Machining groove 5 in advance.
4, the CuCrZr/OFHC-Cu composite wood of above-mentioned machining is carried out to the CVD of tungsten coating, depositing temperature should control below 550 DEG C.In addition, in deposition process should shutoff cooling-water duct to avoid tungsten in cooling-water duct inside deposition.The thickness of CVD-W coating is 3 mm.
5, the parts after CVD and joint and cooling system are assembled.
Exemplifying embodiment 2:
1, selecting thickness to be the high-quality CuCrZr alloy of 20 mm is heat sink material (room temperature tensile intensity > 280 MPa, room-temperature yield strength > 175 MPa).
2, to CuCrZr heat sink sheet material electroplating surface thickness be the fine copper of 1-3 mm, plating solution batching is copper-bath and the 60 g/L sulfuric acid mixture liquids of 200 g/L, and electroplating temperature is 15-35 DEG C, and current density controls at 2-5 A/dm
2, adopt swap cathode and plating solution is uninterruptedly stirred and plating solution supplement.
3, machining is carried out to the CuCrZr/OFHC-Cu composite board after welding, comprising: according to thermal-Hydraulics Design at the heat sink middle Drilling operation cooling-water duct of CuCrZr; According to PFC general assembly design, working joint on CuCrZr is heat sink in advance; Cutting away remainder in OFHC-Cu makes its thickness be that then (for square net, single grid area is 1-9 cm to 1.5 mm according to the tungsten coating fluting design (as shown in Figure 2) of scheme and layout in PFC
2), in advance at OFHC-Cu Surface Machining groove 5 also integral surface frosting treatment.
4, the CuCrZr/OFHC-Cu composite wood of above-mentioned machining is carried out to the CVD of tungsten coating, depositing temperature should control below 550 DEG C.In addition, cooling-water duct port should be blocked in deposition process to avoid tungsten in cooling-water duct inside deposition.The thickness of CVD-W coating is 3 mm.
5, the parts after CVD and joint and cooling system are assembled.
Claims (6)
1. water cooling dull and stereotyped stratiform CuCrZr/OFHC-Cu/CVD-W flux of plasma parts, it is characterized in that: include three-decker, described three-decker is followed successively by heat sink from bottom to top, adaptation layer, facing plasma material, the CuCrZr alloy material of described heat sink employing precipitation-hardening, described adaptation layer adopts thickness to be 1-3 mm low oxygen content high-purity soft copper material OFHC-Cu, described facing plasma material employing thickness is the chemical vapour deposition (CVD) tungsten coating CVD-W of 1-4 mm, described heat sink in have through hole as cooling-water duct, recirculated water is connected with in cooling-water duct.
2. water cooling according to claim 1 dull and stereotyped stratiform CuCrZr/OFHC-Cu/CVD-W flux of plasma parts, is characterized in that: described heat sink in the termination of cooling-water duct be welded with the joint of CuCrZr alloy material.
3. water cooling according to claim 1 and 2 dull and stereotyped stratiform CuCrZr/OFHC-Cu/CVD-W flux of plasma parts, is characterized in that: the welding manner of the joint of described heat sink and cooling-water duct can adopt copper silver soldering, solid-state diffusion is welded.
4. water cooling according to claim 1 dull and stereotyped stratiform CuCrZr/OFHC-Cu/CVD-W flux of plasma parts, it is characterized in that: described adaptation layer is connected with heat sink zero defect, connected mode can adopt hot isostatic press welding, lamination hot rolling, explosive welding.
5. water cooling according to claim 1 dull and stereotyped stratiform CuCrZr/OFHC-Cu/CVD-W flux of plasma parts, is characterized in that: the upper surface of described adaptation layer laterally, longitudinally has multiple arc groove and forms network.
6. the preparation method of water cooling dull and stereotyped stratiform CuCrZr/OFHC-Cu/CVD-W flux of plasma parts, is characterized in that, comprise following content:
(1), the high-quality CuCrZr alloy of selecting thickness to be 20mm is heat sink material, room temperature tensile intensity > 280 MPa, room-temperature yield strength > 175 MPa;
(2), to CuCrZr heat sink sheet material electroplating surface thickness be the fine copper of 1-3 mm, plating solution batching is copper-bath and the 60 g/L sulfuric acid mixture liquids of 200 g/L, and electroplating temperature is 15-35 DEG C, and current density controls at 2-5 A/dm
2, adopt swap cathode and plating solution is uninterruptedly stirred and plating solution supplement;
(3), to the CuCrZr/OFHC-Cu composite board after welding carry out machining, comprising: according to thermal-Hydraulics Design at the heat sink middle Drilling operation cooling-water duct of CuCrZr; According to PFC general assembly design, working joint on CuCrZr is heat sink in advance; Cut away remainder in OFHC-Cu make its thickness be 1.5 mm then according to the tungsten coating fluting design of scheme and layout in PFC, at OFHC-Cu Surface Machining groove, sandblasting or laser roughening process are carried out to whole surface in advance;
(4), the CuCrZr/OFHC-Cu composite wood of above-mentioned machining is carried out to the CVD of tungsten coating, depositing temperature should control below 550 DEG C, in addition, should block cooling-water duct port in deposition process to avoid tungsten in cooling-water duct inside deposition, the thickness of CVD-W coating is 3 mm;
(5), the parts after CVD and joint and cooling system are assembled.
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| CN201210260306.1A CN102922815B (en) | 2012-07-26 | 2012-07-26 | Water-cooled flat plate layered CuCrZr/OFHC-Cu/CVD-W plasma-facing part and manufacturing method thereof |
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|---|---|---|---|---|
| CN103406658B (en) * | 2013-06-17 | 2016-01-20 | 北京科技大学 | A kind of large scale tungsten copper flux of plasma parts preparation method |
| CN103774112B (en) * | 2013-11-15 | 2016-03-02 | 厦门虹鹭钨钼工业有限公司 | A kind of tungsten coating copper alloy parts and preparation method thereof |
| CN104607878B (en) * | 2015-01-07 | 2017-07-04 | 安泰科技股份有限公司 | The preparation method of W/Cu/CuCrZr composite components |
| JP6332108B2 (en) * | 2015-03-30 | 2018-05-30 | 三菱マテリアル株式会社 | Manufacturing method of power module substrate with heat sink |
| CN110306137B (en) * | 2019-06-28 | 2021-05-04 | 南京理工大学 | Preparation method of layered copper-chromium-zirconium-pure copper composite plate |
| CN110773955A (en) * | 2019-10-18 | 2020-02-11 | 合肥聚能电物理高技术开发有限公司 | Connecting process suitable for fusion reactor cladding containing complex water-cooling runner parts |
| CN115026139A (en) * | 2022-08-10 | 2022-09-09 | 太原科技大学 | Method for preparing nickel-magnesium composite board by rolling |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1538462A (en) * | 2003-04-02 | 2004-10-20 | �����ɷ� | Lameller component of fusion reactor |
| CN1787115A (en) * | 2005-10-27 | 2006-06-14 | 中国科学院等离子体物理研究所 | First wall part coated with thick wolfram coat or copper alloy heat sink and mfg. method thereof |
-
2012
- 2012-07-26 CN CN201210260306.1A patent/CN102922815B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1538462A (en) * | 2003-04-02 | 2004-10-20 | �����ɷ� | Lameller component of fusion reactor |
| CN1787115A (en) * | 2005-10-27 | 2006-06-14 | 中国科学院等离子体物理研究所 | First wall part coated with thick wolfram coat or copper alloy heat sink and mfg. method thereof |
Non-Patent Citations (3)
| Title |
|---|
| W与CuCrZr焊接应力的有限元分析及剪切强度的研究;张庆玲等;《材料导报》;20120625;第133-136页 * |
| 面向等离子体W_Cu功能梯度涂层的热应力模拟;冯云彪等;《材料导报》;20100825;第84-87页 * |
| 面向等离子体高热负荷部件中的关键性连接技术;谭模强;《焊接学报》;20060625;第61-63、66页 * |
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