CN102275022A - Connecting method of C/C composite material and copper or copper alloy - Google Patents
Connecting method of C/C composite material and copper or copper alloy Download PDFInfo
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- CN102275022A CN102275022A CN2011101910547A CN201110191054A CN102275022A CN 102275022 A CN102275022 A CN 102275022A CN 2011101910547 A CN2011101910547 A CN 2011101910547A CN 201110191054 A CN201110191054 A CN 201110191054A CN 102275022 A CN102275022 A CN 102275022A
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- 239000010949 copper Substances 0.000 title claims abstract description 72
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 55
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 239000002131 composite material Substances 0.000 title claims abstract description 51
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 30
- 229910000679 solder Inorganic materials 0.000 claims abstract description 30
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 16
- 238000006243 chemical reaction Methods 0.000 claims abstract description 14
- 238000003466 welding Methods 0.000 claims abstract description 10
- 229910017758 Cu-Si Inorganic materials 0.000 claims abstract description 8
- 229910017931 Cu—Si Inorganic materials 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 8
- 230000007704 transition Effects 0.000 claims abstract description 5
- 239000010936 titanium Substances 0.000 claims description 22
- 238000005476 soldering Methods 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 238000005516 engineering process Methods 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 238000003754 machining Methods 0.000 claims description 4
- 238000005240 physical vapour deposition Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 238000010792 warming Methods 0.000 claims description 4
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 230000001052 transient effect Effects 0.000 claims description 3
- 238000005229 chemical vapour deposition Methods 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 abstract description 11
- 230000035939 shock Effects 0.000 abstract description 10
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 238000005266 casting Methods 0.000 abstract description 4
- 230000008646 thermal stress Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 9
- 239000011651 chromium Substances 0.000 description 6
- 238000001816 cooling Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052774 Proactinium Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000446313 Lamella Species 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- -1 by weight percentage Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000005713 exacerbation Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010406 interfacial reaction Methods 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005058 metal casting Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 238000010671 solid-state reaction Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
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- Other Surface Treatments For Metallic Materials (AREA)
Abstract
本发明涉及一种C/C复合材料与铜或铜合金的连接方法，属于异质材料连接领域，解决现有技术中存在的活性涂层制备方法复杂、热处理温度过高、接头强度低等问题。通过活性元素Ti和Si在C/C复合材料表面的物理化学反应形成层状过渡反应层，提高钎料的润湿性并形成较强的界面结合，实现C/C复合材料与铜或铜合金的紧密连接。本发明采用活性Cu-Si钎料实现了C/C复合材料与铜或铜合金的连接，通过活性元素Ti和Si在界面的物理化学反应，形成CC/(TiC+SiC+Ti5Si3)/铜或铜合金的过渡界面，结合强度高；焊后焊缝为纯铜组织，有利于通过塑性变形减缓接头热应力。本发明的主要技术效果在于：与活性铸造法相比，本发明制备的接头强度高，抗热震性能优异，活性元素Ti与Si引入方法简单。The invention relates to a connection method between C/C composite material and copper or copper alloy, which belongs to the field of connection of heterogeneous materials and solves the problems in the prior art such as complicated preparation method of active coating, high heat treatment temperature and low joint strength. . Through the physical and chemical reaction of the active elements Ti and Si on the surface of the C/C composite material, a layered transition reaction layer is formed, which improves the wettability of the solder and forms a strong interface bond, and realizes the connection between the C/C composite material and copper or copper alloy. of tight connection. The invention adopts active Cu-Si solder to realize the connection of C/C composite material and copper or copper alloy, and forms CC/(TiC+SiC+Ti 5 Si 3 ) through the physical and chemical reaction of active elements Ti and Si at the interface / Copper or copper alloy transition interface, high bonding strength; after welding, the weld seam is pure copper structure, which is conducive to slowing down the thermal stress of the joint through plastic deformation. The main technical effects of the invention are: compared with the active casting method, the joint prepared by the invention has high strength, excellent thermal shock resistance, and simple introduction method of active elements Ti and Si.
Description
Technical field
The present invention relates to the method for attachment of a kind of C/C composite and copper or copper alloy, belong to the dissimilar materials connection area.
Background technology
Carbon fiber reinforced carbon matrix composite (C/C) has low-density, low-expansion coefficient, high heat conductance, anti-ablation, anti-thermal shock and thermal fatigue resistance and excellent high-temperature mechanical property, is applied in the ITER nuclear fusion test plant in the face of plasma first wall material.The first wall material require bears high heat load and ion bombardment, and the C/C composite need connect to form cooling system with heat sink CuCrZr alloy.Therefore, C/C composite and CuCrZr jointing require to have high strength, high heat conductance and high thermal shock stability.Yet, there is significant physical chemistry attribute difference between the two, metallurgical compatibility is poor, and traditional melting connects very difficulty.Soldering is one of the most effective dissimilar materials method of attachment, but bigger thermal expansion coefficient difference (the Δ α ≈ 16 * 10 of both existence
-6/ k), the cooling procedure center tap produces bigger residual stress with the severe exacerbation joint performance.Therefore, select for use the fine copper of high heat conduction, low yield strength to alleviate the joint thermal stress usually as the intermediate layer.Its key technology that is connected of C/C composite and CuCrZr alloy is being connected of C/C composite and copper intermediate layer.The money base active solder can be realized pottery and being connected of alloy, but silver can become cadmium under neutron irradiation, so silver-containing solder can not be applied to nuclear fusion device as facing the plasma parts.
At present, C/C composite and the copper method of attachment reported mainly contain: the reactive metal casting of Austrian Plansee SE technique center exploitation, adopt laser roughening to handle to the C/C surface in advance, then by CVD or PVD deposition techniques one deck active element Ti [F.Rainer, et al.Patent EP 0663670.1995] or Ti+Si[B Schedler, et al.Physica Scripta, 2007, T128:200-203], the fine copper extruding is cast in the C/C surface realize that C/C is connected with the tight of Cu being higher than under copper melting temperature (1100 ℃), the vacuum condition.Strength of joint 53.7～the 73.4MPa of this method preparation, but the active coating preparation method is too complicated and equipment is had relatively high expectations.Italy announces that a C/C process for modifying surface is used for the [F.Rainer that is connected of C/C and fine copper, et al, patent EP 0663670,1995], group vib Cr, Mo, W element powders are coated in the C/C surface and heat-treat, generate carbide lamella by solid-state reaction, then fine copper cast in C/C surface after the modification and form being connected of C/C and Cu, adopt then electron beam welding or etc. static pressure connection Cu and CuCrZr.This technology prepares strength of joint 33MPa, but C/C surface modification heat treatment temperature too high (＞1300 ℃), and cost is higher, complex process.Adopt the CuGeNi solder brazing to connect C/C and Cu [M.Salvo, et al.Journal ofNuclear materials.2008,374:69-74], strength of joint 34MPa, but the C/C surface needs to have above-mentioned shortcoming equally through the modification of chromium high-temperature heat treatment.Adopt the TiCuNi amorphous brazing filler metal to connect C/C and Cu[P.Appendino, et al.Fusion Engineering and Design, 2003,66-68:225-229], strength of joint is 24MPa only.Tan Mo wait by force the people adopt active casting connect C/C composite and copper [Tan Moqiang, etc. weld journal, 2006,27 (6): 61-66].People such as Xie Fengchun adopt TiZrCuNi solder brazing graphite and copper [Xie Fengchun, Deng. welding journal, 2008,29:73-76], compound can not effectively be alleviated the joint thermal stress between the hard brittle metal that weld seam generates, and strength of joint is low and far can not satisfy the requirement of thermal fatigue property.
In sum, mainly there is following problem in the C/C composite with the copper method of attachment at present: 1. adopting active casting is that the CC/Cu strength of joint that active element prepares is compared higher with Ti+Si, but CVD or PVD method complex process are adopted in the active coating preparation, equipment is had relatively high expectations, and production cost is higher; 2. the CC/Cu strength of joint for preparing after adopting the group vib metallic element to the C/C surface modification is lower, heat treatment temperature too high (＞1300 ℃), and complex process, production cost is higher; 3. adopt the titanium based solder soldering to connect C/C and copper, strength of joint is low, and the fragile metal compound that weld seam generates can't be alleviated joint stress and poor heat conductivity, and thermal shock resistance is poor.At present the domestic C/C composite is connected with copper rarely have report, be badly in need of the exploitation preparation and have the interconnection technique of high strength, high thermal shock stability C/C composite and copper alloy.
Summary of the invention
The present invention is directed to the shortcoming of present C/C composite and copper or copper alloy interconnection technique, the method of attachment of a kind of C/C composite and copper or copper alloy is proposed, adopt copper-based active soldering connection method, problem such as solve the active coating preparation method complexity that exists in the prior art, heat treatment temperature is too high, strength of joint is low.
Technical scheme of the present invention is:
The present invention forms the transient response layer by active element at the physical-chemical reaction of C/C composite material surface, improves the wetability of solder and forms stronger interface combination, realizes that the C/C composite is connected with the tight of copper or copper alloy.Wherein:
(1) C/C composite: adopt in advance laser technology or other micro-processing technology to the C-base composte material face of weld texturing of punching handle, form the bellmouth that the evenly distributed degree of depth is 300～1000 μ m on the surface, the diameter on bellmouth surface is 100～1000 μ m.
(2) titanium processing: after machining, adopt and brush TiH
2Powder method, magnetron sputtering method, PVD or CVD method are carried out the titanium processing to the C/C surface, titanium layer thickness 0.5～50 μ m.
(3) Cu-Si solder: the composition of Cu-Si alloy is: Cu:90～99wt%; Si:1～10wt%, user mode is thin slice or powder, and sheet thickness is 100～500 μ m, and powder size is 50～200 μ m.
(4) welded metal: being welded metal is the strong copper alloys of heat such as anaerobic fine copper, CuCr, CuCrZr or CuCrZrNb.
(5) C/C composite, Cu-Si solder and copper or copper alloy intermediate layer are assembled by " C/C-solder-copper or copper alloy " sandwich structure, place in the vacuum brazing furnace, be warming up to above 20～50 ℃ of welding temperatures of solder fusing point, insulation 5～30min finishes soldering.
Among the present invention,, form CC (TiC+SiC+Ti by active element Ti and Si physical-chemical reaction at the interface
5Si
3)/Cu or CC/ (TiC+SiC+Ti
5Si
3The transition interface of)/Cu alloy.
Among the present invention, the composition of CuCr copper alloy is as follows: by weight percentage, and Cr:0.3-1.2; All the other are Cu.
Among the present invention, the composition of CuCrZr copper alloy is as follows: by weight percentage, Cr:0.25-0.65, Zr:0.08-0.20, all the other are Cu.
Among the present invention, the composition of CuCrZrNb copper alloy is as follows: by weight percentage, and Cr:0.15-0.40; Zr:0.10-0.25; Nb:0.08-0.25; Ce:0.02-0.16; All the other are Cu.
Beneficial effect of the present invention:
The present invention adopts active Cu-Si solder to realize being connected of C/C composite and copper or copper alloy, at the physical-chemical reaction at interface, forms CC/ (TiC+SiC+Ti by active element Ti and Si
5Si
3The transition interface of)/copper or copper alloy, the bond strength height; The postwelding weld seam is the fine copper tissue, helps slowing down the joint thermal stress by plastic deformation.Major technique effect of the present invention is: compares with active casting, and the strength of joint height of the present invention's preparation, the thermal shock resistance excellence, active element Ti and Si introducing method are simple.
Description of drawings
Fig. 1 is the C/C composite and the oxygen-free copper joint assembling schematic diagram of preparation among the embodiment 1.Among the figure, 1, the anaerobic fine copper; 2, Cu-3.5Si solder; 3, laser hole; 4, C/C composite.
Fig. 2 is the C/C composite and the oxygen-free copper joint weld interface sem photograph of embodiment 1 preparation.
Fig. 3 is C/C and a Cu-3.5Si solder interface microstructure sem photograph in the C/C composite of embodiment 1 preparation and the oxygen-free copper joint.
Fig. 4 is the C/C composite and oxygen-free copper joint median surface conversion zone thing XRD figure spectrum mutually of embodiment 1 preparation.
The specific embodiment
The present invention forms stratiform transient response layer by active element at the physical-chemical reaction of C/C composite material surface, improves the wetability of solder and forms stronger interface combination, realizes that the C/C composite is connected with the tight of copper.Wherein:
1.C/C composite is cut into 15mm * 10mm * 5mm, adopt laser technology to face of weld the texturing of punching handle.After machining, use TiH
2Powder (powder size is＜20 μ m) brushing C/C surface forms uniform TiH
2Coating, coating layer thickness are 40 μ m.Cu-3.5Si solder foil thickness 200 μ m are processed into 15mm * 10mm * 5mm with the anaerobic fine copper.
2. become sandwich to place in the soldering oven with the anaerobic fine copper by " C/C-solder-copper " assembled in sequence C/C composite, Cu-3.5Si solder, when vacuum reaches 2 * 10
-3Pa～5 * 10
-3During Pa, be warming up to 1050～1070 ℃ welding temperature, insulation 5～20min finishes soldering.
As shown in Figure 1, have laser hole 3 on the C/C composite 4, laser hole 3 is to form bellmouth evenly distributed, the degree of depth 300～1000 μ m on C/C composite 4 surfaces, the diameter on bellmouth surface is 300 μ m, and anaerobic fine copper 1, Cu-3.5Si solder 2 and C/C composite 4 form sandwich in order.
As shown in Figure 2, from C/C composite and oxygen-free copper joint weld interface sem photograph as can be seen, the wetability of the C/C composite material surface of Cu-3.5Si solder after texturing is better, and solder is filled better in the laser roughening hole, defectives such as interface flawless, hole.Among the figure, Braze is a solder, and Copper is the oxygen-free copper joint.
As shown in Figure 3, C/C and Cu-3.5Si solder interface microstructure sem photograph are as can be seen from C/C composite and oxygen-free copper joint, solder and C/C composite and oxygen-free copper all form combines closely, and the interface is intact to be fallen into, and the interface forms the significant reaction layer.Among the figure, Braze is a solder, and Reaction layer is an interfacial reaction layer.
As shown in Figure 4, compose as can be seen with oxygen-free copper joint median surface conversion zone thing XRD figure mutually from the C/C composite, XRD analysis shows that the conversion zone thing is TiC, SiC and Ti mutually
5Si
3
Among the embodiment 1, experimental result data is as follows:
The CC/CuCrZr connector is carried out performance test, and the room temperature shear strength reaches 75MPa, 450 ℃ of thermal shock tests (shrend) through 30 thermal cycles after joint interface remain intact, do not find Interface Crack and peel off obscission.
Difference from Example 1 is,
1.C/C composite is cut into 15mm * 10mm * 5mm, adopt laser technology to face of weld the texturing of punching handle.After machining, adopt magnetron sputtering method that the titanium processing is carried out on the C/C surface, the C/C surface forms uniform Ti coating, and thickness is 10 μ m.Cu-3.5Si solder foil thickness 200 μ m cut into 16mm * 11mm * 7mm size with the CuCrZr alloy, in the CuCrZr alloy, by weight percentage, and Cr:0.25-0.65, Zr:0.08-0.20, all the other are Cu.
2. become sandwich to place in the soldering oven with the CuCrZr alloy by " C/C-solder-copper alloy " assembled in sequence C/C composite Cu-3.5Si solder, when vacuum reaches 2 * 10
-3Pa～5 * 10
-3During Pa, be warming up to 1050～1070 ℃ welding temperature, insulation 5～20min finishes soldering.After soldering was finished, with greater than the cooling velocity fast cooling to 475 of 1 ℃/s ℃, insulation 3h carried out Ageing Treatment, and after insulation finished, joint cooled to room temperature with the furnace.
Among the embodiment 2, experimental result data is as follows:
The CC/CuCrZr connector is carried out performance test, and the room temperature shear strength is up to 55MPa, 450 ℃ of thermal shock tests (shrend) through 30 thermal cycles after joint interface remain intact, do not find Interface Crack and peel off obscission.
Difference from Example 1 is,
On C/C composite and oxygen-free copper joint (CC/Cu joint, Cu thickness 2mm) basis that embodiment 1 obtains, adopt diffusion welding (DW) to connect CC/Cu joint and CuCrZr alloy, obtain the CC/Cu/CuCrZr connector.
The technological parameter that diffusion welding (DW) connects is as follows:
Diffusion welding (DW) connects 600～800 ℃ of temperature, connects pressure 5～10MPa, connect hours 10～60min, vacuum 2 * 10
-3Pa.
The CC/Cu/CuCrZr connector is carried out performance test, and the room temperature shear strength is up to 79MPa, 450 ℃ of thermal shock tests (shrend) through 50 thermal cycles after joint interface remain intact, do not find Interface Crack and peel off obscission, thermal shock resistance excellence.
Claims (3)
1. the method for attachment of a C/C composite and copper or copper alloy, it is characterized in that: form the transient response layer at the physical-chemical reaction of C/C composite material surface by active element Ti and Si, improve the wetability of solder and form stronger interface combination, realize that the C/C composite is connected with the tight of copper or copper alloy.
2. according to the method for attachment of the described C/C composite of claim 1 and copper or copper alloy, it is characterized in that,, form CC/ (TiC+SiC+Ti by active element Ti and Si physical-chemical reaction at the interface
5Si
3The transition interface of)/copper or copper alloy.
3. according to the method for attachment of the described C/C composite of claim 1 and copper or copper alloy, it is characterized in that, comprise the steps:
(1) C/C composite: adopt in advance laser technology or other micro-processing technology to the C-base composte material face of weld texturing of punching handle, form the bellmouth that the evenly distributed degree of depth is 300～1000 μ m on the surface, the diameter on bellmouth surface is 100～1000 μ m;
(2) titanium processing: after machining, adopt and brush TiH
2Powder method, magnetron sputtering method, PVD method or CVD method are carried out the titanium processing to the C/C surface, titanium layer thickness 0.5～50 μ m;
(3) Cu-Si solder: the composition of Cu-Si alloy is Cu:90～99wt%; Si:1～10wt%, user mode is thin slice or powder, and sheet thickness is 100～500 μ m, and powder size is 50～200 μ m;
(4) welded metal: being welded metal is anaerobic fine copper, CuCr, CuCrZr or the strong copper alloy of CuCrZrNb heat;
(5) C/C composite, Cu-Si solder and copper or copper alloy intermediate layer are assembled by " C/C-solder-copper or copper alloy " sandwich structure, place in the vacuum brazing furnace, be warming up to above 20～50 ℃ of welding temperatures of solder fusing point, insulation 5～30min finishes soldering.
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| CN103223537A (en) * | 2013-04-09 | 2013-07-31 | 武汉工程大学 | Method for connecting high-strength graphite with copper alloy |
| CN103990880A (en) * | 2014-06-06 | 2014-08-20 | 哈尔滨工业大学 | Non-metallic material and metal material brazing method capable of forming interpenetrating network structure brazing seams |
| CN104117748A (en) * | 2014-08-19 | 2014-10-29 | 郑州机械研究所 | High-voltage power transmission and transformation contact and welding method thereof |
| CN104708161A (en) * | 2015-02-12 | 2015-06-17 | 武汉工程大学 | Welding method for graphite/copper connector and composite solder of graphite/copper connector |
| CN105108343A (en) * | 2015-09-22 | 2015-12-02 | 武汉金顿激光科技有限公司 | Weld joint surface treatment process |
| CN105174991A (en) * | 2015-09-25 | 2015-12-23 | 浙江工业大学 | New method of using laser cladding technology for ceramic and metal connection |
| CN106695043A (en) * | 2016-12-22 | 2017-05-24 | 核工业西南物理研究院 | Carbon base material and copper brazing connection method |
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| CN111989179A (en) * | 2018-04-20 | 2020-11-24 | 普兰西股份有限公司 | Composite body and method for producing composite body |
| CN115781096A (en) * | 2022-11-17 | 2023-03-14 | 河南科技大学 | Flaky composite brazing filler metal for connecting C/C or C/SiC composite material and metal, preparation method and brazing process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05163078A (en) * | 1991-12-18 | 1993-06-29 | Nippon Steel Corp | Joint form made up of ceramic and metal |
| CN101143397A (en) * | 2007-11-06 | 2008-03-19 | 北京有色金属研究总院 | C/C and C/SiC composite material and metal connecting method |
| CN101499601A (en) * | 2009-03-04 | 2009-08-05 | 安固集团有限公司 | Method for welding carbon board and copper substrate in commutator |
-
2011
- 2011-07-08 CN CN 201110191054 patent/CN102275022B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05163078A (en) * | 1991-12-18 | 1993-06-29 | Nippon Steel Corp | Joint form made up of ceramic and metal |
| CN101143397A (en) * | 2007-11-06 | 2008-03-19 | 北京有色金属研究总院 | C/C and C/SiC composite material and metal connecting method |
| CN101499601A (en) * | 2009-03-04 | 2009-08-05 | 安固集团有限公司 | Method for welding carbon board and copper substrate in commutator |
Non-Patent Citations (1)
| Title |
|---|
| 陈俊华等: "碳/碳复合材料焊接技术研究进展", 《热加工工艺》 * |
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| CN103223537B (en) * | 2013-04-09 | 2015-03-11 | 武汉工程大学 | Method for connecting high-strength graphite with copper alloy |
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| CN111408805A (en) * | 2020-03-05 | 2020-07-14 | 西安陕鼓动力股份有限公司 | Manufacturing process method of impeller in same furnace for brazing and performance heat treatment |
| CN111408805B (en) * | 2020-03-05 | 2021-09-17 | 西安陕鼓动力股份有限公司 | Manufacturing process method of impeller in same furnace for brazing and performance heat treatment |
| CN115781096A (en) * | 2022-11-17 | 2023-03-14 | 河南科技大学 | Flaky composite brazing filler metal for connecting C/C or C/SiC composite material and metal, preparation method and brazing process |
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