CN102275022A - Connecting method of C/C composite material and copper or copper alloy - Google Patents
Connecting method of C/C composite material and copper or copper alloy Download PDFInfo
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- CN102275022A CN102275022A CN2011101910547A CN201110191054A CN102275022A CN 102275022 A CN102275022 A CN 102275022A CN 2011101910547 A CN2011101910547 A CN 2011101910547A CN 201110191054 A CN201110191054 A CN 201110191054A CN 102275022 A CN102275022 A CN 102275022A
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Abstract
The invention relates to a connection method of a C/C composite material and copper or copper alloy, belong to the field of heterogeneous material connection and solving the problems of complex preparation method of an active coating, overhigh heat treatment temperature, low joint strength, and the like in the prior art. According to the method, active elements Ti and Si undergo a physicochemical reaction on the surface of the CC composite material to form a laminated transitional reaction layer, therefore the wettability of brazing filler metal is improved, stronger interface combination is formed, and tight connection between the C/C composite material and the copper or copper alloy is realized. According to the invention, the connection between the C/C composite material and the copper or copper alloy is realized by adopting the active Cu-Si brazing filler metal, a transitional interface of CC/(TiC+SiC+Ti5Si3)/copper or copper alloy is formed through the physiochemical reaction of active elements Ti and Si on the interface, therefore the combination strength is high; and a welding joint after welding is of a pure copper structure which is beneficial to retarding the thermal stress of a joint through plastic deformation. The invention has the main technical effects that: compared with an active casting method, the connecting method disclosed by the invention has the advantages that: the prepared joint has high strength and excellent thermal shock stability, and the active element Ti and Si are introduced with a simple method.
Description
Technical field
The present invention relates to the method for attachment of a kind of C/C composite and copper or copper alloy, belong to the dissimilar materials connection area.
Background technology
Carbon fiber reinforced carbon matrix composite (C/C) has low-density, low-expansion coefficient, high heat conductance, anti-ablation, anti-thermal shock and thermal fatigue resistance and excellent high-temperature mechanical property, is applied in the ITER nuclear fusion test plant in the face of plasma first wall material.The first wall material require bears high heat load and ion bombardment, and the C/C composite need connect to form cooling system with heat sink CuCrZr alloy.Therefore, C/C composite and CuCrZr jointing require to have high strength, high heat conductance and high thermal shock stability.Yet, there is significant physical chemistry attribute difference between the two, metallurgical compatibility is poor, and traditional melting connects very difficulty.Soldering is one of the most effective dissimilar materials method of attachment, but bigger thermal expansion coefficient difference (the Δ α ≈ 16 * 10 of both existence
-6/ k), the cooling procedure center tap produces bigger residual stress with the severe exacerbation joint performance.Therefore, select for use the fine copper of high heat conduction, low yield strength to alleviate the joint thermal stress usually as the intermediate layer.Its key technology that is connected of C/C composite and CuCrZr alloy is being connected of C/C composite and copper intermediate layer.The money base active solder can be realized pottery and being connected of alloy, but silver can become cadmium under neutron irradiation, so silver-containing solder can not be applied to nuclear fusion device as facing the plasma parts.
At present, C/C composite and the copper method of attachment reported mainly contain: the reactive metal casting of Austrian Plansee SE technique center exploitation, adopt laser roughening to handle to the C/C surface in advance, then by CVD or PVD deposition techniques one deck active element Ti [F.Rainer, et al.Patent EP 0663670.1995] or Ti+Si[B Schedler, et al.Physica Scripta, 2007, T128:200-203], the fine copper extruding is cast in the C/C surface realize that C/C is connected with the tight of Cu being higher than under copper melting temperature (1100 ℃), the vacuum condition.Strength of joint 53.7～the 73.4MPa of this method preparation, but the active coating preparation method is too complicated and equipment is had relatively high expectations.Italy announces that a C/C process for modifying surface is used for the [F.Rainer that is connected of C/C and fine copper, et al, patent EP 0663670,1995], group vib Cr, Mo, W element powders are coated in the C/C surface and heat-treat, generate carbide lamella by solid-state reaction, then fine copper cast in C/C surface after the modification and form being connected of C/C and Cu, adopt then electron beam welding or etc. static pressure connection Cu and CuCrZr.This technology prepares strength of joint 33MPa, but C/C surface modification heat treatment temperature too high (＞1300 ℃), and cost is higher, complex process.Adopt the CuGeNi solder brazing to connect C/C and Cu [M.Salvo, et al.Journal ofNuclear materials.2008,374:69-74], strength of joint 34MPa, but the C/C surface needs to have above-mentioned shortcoming equally through the modification of chromium high-temperature heat treatment.Adopt the TiCuNi amorphous brazing filler metal to connect C/C and Cu[P.Appendino, et al.Fusion Engineering and Design, 2003,66-68:225-229], strength of joint is 24MPa only.Tan Mo wait by force the people adopt active casting connect C/C composite and copper [Tan Moqiang, etc. weld journal, 2006,27 (6): 61-66].People such as Xie Fengchun adopt TiZrCuNi solder brazing graphite and copper [Xie Fengchun, Deng. welding journal, 2008,29:73-76], compound can not effectively be alleviated the joint thermal stress between the hard brittle metal that weld seam generates, and strength of joint is low and far can not satisfy the requirement of thermal fatigue property.
In sum, mainly there is following problem in the C/C composite with the copper method of attachment at present: 1. adopting active casting is that the CC/Cu strength of joint that active element prepares is compared higher with Ti+Si, but CVD or PVD method complex process are adopted in the active coating preparation, equipment is had relatively high expectations, and production cost is higher; 2. the CC/Cu strength of joint for preparing after adopting the group vib metallic element to the C/C surface modification is lower, heat treatment temperature too high (＞1300 ℃), and complex process, production cost is higher; 3. adopt the titanium based solder soldering to connect C/C and copper, strength of joint is low, and the fragile metal compound that weld seam generates can't be alleviated joint stress and poor heat conductivity, and thermal shock resistance is poor.At present the domestic C/C composite is connected with copper rarely have report, be badly in need of the exploitation preparation and have the interconnection technique of high strength, high thermal shock stability C/C composite and copper alloy.
Summary of the invention
The present invention is directed to the shortcoming of present C/C composite and copper or copper alloy interconnection technique, the method of attachment of a kind of C/C composite and copper or copper alloy is proposed, adopt copper-based active soldering connection method, problem such as solve the active coating preparation method complexity that exists in the prior art, heat treatment temperature is too high, strength of joint is low.
Technical scheme of the present invention is:
The present invention forms the transient response layer by active element at the physical-chemical reaction of C/C composite material surface, improves the wetability of solder and forms stronger interface combination, realizes that the C/C composite is connected with the tight of copper or copper alloy.Wherein:
(1) C/C composite: adopt in advance laser technology or other micro-processing technology to the C-base composte material face of weld texturing of punching handle, form the bellmouth that the evenly distributed degree of depth is 300～1000 μ m on the surface, the diameter on bellmouth surface is 100～1000 μ m.
(2) titanium processing: after machining, adopt and brush TiH
2Powder method, magnetron sputtering method, PVD or CVD method are carried out the titanium processing to the C/C surface, titanium layer thickness 0.5～50 μ m.
(3) Cu-Si solder: the composition of Cu-Si alloy is: Cu:90～99wt%; Si:1～10wt%, user mode is thin slice or powder, and sheet thickness is 100～500 μ m, and powder size is 50～200 μ m.
(4) welded metal: being welded metal is the strong copper alloys of heat such as anaerobic fine copper, CuCr, CuCrZr or CuCrZrNb.
(5) C/C composite, Cu-Si solder and copper or copper alloy intermediate layer are assembled by " C/C-solder-copper or copper alloy " sandwich structure, place in the vacuum brazing furnace, be warming up to above 20～50 ℃ of welding temperatures of solder fusing point, insulation 5～30min finishes soldering.
Among the present invention,, form CC (TiC+SiC+Ti by active element Ti and Si physical-chemical reaction at the interface
5Si
3)/Cu or CC/ (TiC+SiC+Ti
5Si
3The transition interface of)/Cu alloy.
Among the present invention, the composition of CuCr copper alloy is as follows: by weight percentage, and Cr:0.3-1.2; All the other are Cu.
Among the present invention, the composition of CuCrZr copper alloy is as follows: by weight percentage, Cr:0.25-0.65, Zr:0.08-0.20, all the other are Cu.
Among the present invention, the composition of CuCrZrNb copper alloy is as follows: by weight percentage, and Cr:0.15-0.40; Zr:0.10-0.25; Nb:0.08-0.25; Ce:0.02-0.16; All the other are Cu.
Beneficial effect of the present invention:
The present invention adopts active Cu-Si solder to realize being connected of C/C composite and copper or copper alloy, at the physical-chemical reaction at interface, forms CC/ (TiC+SiC+Ti by active element Ti and Si
5Si
3The transition interface of)/copper or copper alloy, the bond strength height; The postwelding weld seam is the fine copper tissue, helps slowing down the joint thermal stress by plastic deformation.Major technique effect of the present invention is: compares with active casting, and the strength of joint height of the present invention's preparation, the thermal shock resistance excellence, active element Ti and Si introducing method are simple.
Description of drawings
Fig. 1 is the C/C composite and the oxygen-free copper joint assembling schematic diagram of preparation among the embodiment 1.Among the figure, 1, the anaerobic fine copper; 2, Cu-3.5Si solder; 3, laser hole; 4, C/C composite.
Fig. 2 is the C/C composite and the oxygen-free copper joint weld interface sem photograph of embodiment 1 preparation.
Fig. 3 is C/C and a Cu-3.5Si solder interface microstructure sem photograph in the C/C composite of embodiment 1 preparation and the oxygen-free copper joint.
Fig. 4 is the C/C composite and oxygen-free copper joint median surface conversion zone thing XRD figure spectrum mutually of embodiment 1 preparation.
The specific embodiment
The present invention forms stratiform transient response layer by active element at the physical-chemical reaction of C/C composite material surface, improves the wetability of solder and forms stronger interface combination, realizes that the C/C composite is connected with the tight of copper.Wherein:
1.C/C composite is cut into 15mm * 10mm * 5mm, adopt laser technology to face of weld the texturing of punching handle.After machining, use TiH
2Powder (powder size is＜20 μ m) brushing C/C surface forms uniform TiH
2Coating, coating layer thickness are 40 μ m.Cu-3.5Si solder foil thickness 200 μ m are processed into 15mm * 10mm * 5mm with the anaerobic fine copper.
2. become sandwich to place in the soldering oven with the anaerobic fine copper by " C/C-solder-copper " assembled in sequence C/C composite, Cu-3.5Si solder, when vacuum reaches 2 * 10
-3Pa～5 * 10
-3During Pa, be warming up to 1050～1070 ℃ welding temperature, insulation 5～20min finishes soldering.
As shown in Figure 1, have laser hole 3 on the C/C composite 4, laser hole 3 is to form bellmouth evenly distributed, the degree of depth 300～1000 μ m on C/C composite 4 surfaces, the diameter on bellmouth surface is 300 μ m, and anaerobic fine copper 1, Cu-3.5Si solder 2 and C/C composite 4 form sandwich in order.
As shown in Figure 2, from C/C composite and oxygen-free copper joint weld interface sem photograph as can be seen, the wetability of the C/C composite material surface of Cu-3.5Si solder after texturing is better, and solder is filled better in the laser roughening hole, defectives such as interface flawless, hole.Among the figure, Braze is a solder, and Copper is the oxygen-free copper joint.
As shown in Figure 3, C/C and Cu-3.5Si solder interface microstructure sem photograph are as can be seen from C/C composite and oxygen-free copper joint, solder and C/C composite and oxygen-free copper all form combines closely, and the interface is intact to be fallen into, and the interface forms the significant reaction layer.Among the figure, Braze is a solder, and Reaction layer is an interfacial reaction layer.
As shown in Figure 4, compose as can be seen with oxygen-free copper joint median surface conversion zone thing XRD figure mutually from the C/C composite, XRD analysis shows that the conversion zone thing is TiC, SiC and Ti mutually
5Si
3
Among the embodiment 1, experimental result data is as follows:
The CC/CuCrZr connector is carried out performance test, and the room temperature shear strength reaches 75MPa, 450 ℃ of thermal shock tests (shrend) through 30 thermal cycles after joint interface remain intact, do not find Interface Crack and peel off obscission.
Difference from Example 1 is,
1.C/C composite is cut into 15mm * 10mm * 5mm, adopt laser technology to face of weld the texturing of punching handle.After machining, adopt magnetron sputtering method that the titanium processing is carried out on the C/C surface, the C/C surface forms uniform Ti coating, and thickness is 10 μ m.Cu-3.5Si solder foil thickness 200 μ m cut into 16mm * 11mm * 7mm size with the CuCrZr alloy, in the CuCrZr alloy, by weight percentage, and Cr:0.25-0.65, Zr:0.08-0.20, all the other are Cu.
2. become sandwich to place in the soldering oven with the CuCrZr alloy by " C/C-solder-copper alloy " assembled in sequence C/C composite Cu-3.5Si solder, when vacuum reaches 2 * 10
-3Pa～5 * 10
-3During Pa, be warming up to 1050～1070 ℃ welding temperature, insulation 5～20min finishes soldering.After soldering was finished, with greater than the cooling velocity fast cooling to 475 of 1 ℃/s ℃, insulation 3h carried out Ageing Treatment, and after insulation finished, joint cooled to room temperature with the furnace.
Among the embodiment 2, experimental result data is as follows:
The CC/CuCrZr connector is carried out performance test, and the room temperature shear strength is up to 55MPa, 450 ℃ of thermal shock tests (shrend) through 30 thermal cycles after joint interface remain intact, do not find Interface Crack and peel off obscission.
Difference from Example 1 is,
On C/C composite and oxygen-free copper joint (CC/Cu joint, Cu thickness 2mm) basis that embodiment 1 obtains, adopt diffusion welding (DW) to connect CC/Cu joint and CuCrZr alloy, obtain the CC/Cu/CuCrZr connector.
The technological parameter that diffusion welding (DW) connects is as follows:
Diffusion welding (DW) connects 600～800 ℃ of temperature, connects pressure 5～10MPa, connect hours 10～60min, vacuum 2 * 10
-3Pa.
The CC/Cu/CuCrZr connector is carried out performance test, and the room temperature shear strength is up to 79MPa, 450 ℃ of thermal shock tests (shrend) through 50 thermal cycles after joint interface remain intact, do not find Interface Crack and peel off obscission, thermal shock resistance excellence.
Claims (3)
1. the method for attachment of a C/C composite and copper or copper alloy, it is characterized in that: form the transient response layer at the physical-chemical reaction of C/C composite material surface by active element Ti and Si, improve the wetability of solder and form stronger interface combination, realize that the C/C composite is connected with the tight of copper or copper alloy.
2. according to the method for attachment of the described C/C composite of claim 1 and copper or copper alloy, it is characterized in that,, form CC/ (TiC+SiC+Ti by active element Ti and Si physical-chemical reaction at the interface
5Si
3The transition interface of)/copper or copper alloy.
3. according to the method for attachment of the described C/C composite of claim 1 and copper or copper alloy, it is characterized in that, comprise the steps:
(1) C/C composite: adopt in advance laser technology or other micro-processing technology to the C-base composte material face of weld texturing of punching handle, form the bellmouth that the evenly distributed degree of depth is 300～1000 μ m on the surface, the diameter on bellmouth surface is 100～1000 μ m;
(2) titanium processing: after machining, adopt and brush TiH
2Powder method, magnetron sputtering method, PVD method or CVD method are carried out the titanium processing to the C/C surface, titanium layer thickness 0.5～50 μ m;
(3) Cu-Si solder: the composition of Cu-Si alloy is Cu:90～99wt%; Si:1～10wt%, user mode is thin slice or powder, and sheet thickness is 100～500 μ m, and powder size is 50～200 μ m;
(4) welded metal: being welded metal is anaerobic fine copper, CuCr, CuCrZr or the strong copper alloy of CuCrZrNb heat;
(5) C/C composite, Cu-Si solder and copper or copper alloy intermediate layer are assembled by " C/C-solder-copper or copper alloy " sandwich structure, place in the vacuum brazing furnace, be warming up to above 20～50 ℃ of welding temperatures of solder fusing point, insulation 5～30min finishes soldering.
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103223537A (en) * | 2013-04-09 | 2013-07-31 | 武汉工程大学 | Method for connecting high-strength graphite with copper alloy |
| CN103990880A (en) * | 2014-06-06 | 2014-08-20 | 哈尔滨工业大学 | Non-metallic material and metal material brazing method capable of forming interpenetrating network structure brazing seams |
| CN104117748A (en) * | 2014-08-19 | 2014-10-29 | 郑州机械研究所 | High-voltage power transmission and transformation contact and welding method thereof |
| CN104708161A (en) * | 2015-02-12 | 2015-06-17 | 武汉工程大学 | Welding method for graphite/copper connector and composite solder of graphite/copper connector |
| CN105108343A (en) * | 2015-09-22 | 2015-12-02 | 武汉金顿激光科技有限公司 | Weld joint surface treatment process |
| CN105174991A (en) * | 2015-09-25 | 2015-12-23 | 浙江工业大学 | New method of using laser cladding technology for ceramic and metal connection |
| CN106695043A (en) * | 2016-12-22 | 2017-05-24 | 核工业西南物理研究院 | Carbon base material and copper brazing connection method |
| CN108857069A (en) * | 2018-08-14 | 2018-11-23 | 常熟理工学院 | A kind of method of carbon fibre composite and copper alloy welding |
| CN109175659A (en) * | 2018-10-31 | 2019-01-11 | 天津重型装备工程研究有限公司 | A kind of metal composite products combination interface localization method |
| CN111408805A (en) * | 2020-03-05 | 2020-07-14 | 西安陕鼓动力股份有限公司 | Manufacturing process method of impeller in same furnace for brazing and performance heat treatment |
| CN111989179A (en) * | 2018-04-20 | 2020-11-24 | 普兰西股份有限公司 | Composite body and method for producing composite body |
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| CN103223537B (en) * | 2013-04-09 | 2015-03-11 | 武汉工程大学 | Method for connecting high-strength graphite with copper alloy |
| CN103223537A (en) * | 2013-04-09 | 2013-07-31 | 武汉工程大学 | Method for connecting high-strength graphite with copper alloy |
| CN103990880B (en) * | 2014-06-06 | 2015-12-02 | 哈尔滨工业大学 | The nonmetallic materials of inierpeneirating network structure brazed seam and the method for welding of metal material can be formed |
| CN103990880A (en) * | 2014-06-06 | 2014-08-20 | 哈尔滨工业大学 | Non-metallic material and metal material brazing method capable of forming interpenetrating network structure brazing seams |
| CN104117748A (en) * | 2014-08-19 | 2014-10-29 | 郑州机械研究所 | High-voltage power transmission and transformation contact and welding method thereof |
| CN104708161A (en) * | 2015-02-12 | 2015-06-17 | 武汉工程大学 | Welding method for graphite/copper connector and composite solder of graphite/copper connector |
| CN105108343A (en) * | 2015-09-22 | 2015-12-02 | 武汉金顿激光科技有限公司 | Weld joint surface treatment process |
| CN105174991A (en) * | 2015-09-25 | 2015-12-23 | 浙江工业大学 | New method of using laser cladding technology for ceramic and metal connection |
| CN106695043A (en) * | 2016-12-22 | 2017-05-24 | 核工业西南物理研究院 | Carbon base material and copper brazing connection method |
| CN111989179A (en) * | 2018-04-20 | 2020-11-24 | 普兰西股份有限公司 | Composite body and method for producing composite body |
| CN108857069A (en) * | 2018-08-14 | 2018-11-23 | 常熟理工学院 | A kind of method of carbon fibre composite and copper alloy welding |
| CN109175659A (en) * | 2018-10-31 | 2019-01-11 | 天津重型装备工程研究有限公司 | A kind of metal composite products combination interface localization method |
| CN109175659B (en) * | 2018-10-31 | 2020-09-25 | 天津重型装备工程研究有限公司 | Method for positioning bonding interface of metal composite product |
| CN111408805A (en) * | 2020-03-05 | 2020-07-14 | 西安陕鼓动力股份有限公司 | Manufacturing process method of impeller in same furnace for brazing and performance heat treatment |
| CN111408805B (en) * | 2020-03-05 | 2021-09-17 | 西安陕鼓动力股份有限公司 | Manufacturing process method of impeller in same furnace for brazing and performance heat treatment |
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