CN102916113A - 荧光粉组成及使用该荧光粉组成的白色发光装置 - Google Patents
荧光粉组成及使用该荧光粉组成的白色发光装置 Download PDFInfo
- Publication number
- CN102916113A CN102916113A CN2011102188613A CN201110218861A CN102916113A CN 102916113 A CN102916113 A CN 102916113A CN 2011102188613 A CN2011102188613 A CN 2011102188613A CN 201110218861 A CN201110218861 A CN 201110218861A CN 102916113 A CN102916113 A CN 102916113A
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- fluorescent material
- white light
- nitrogen compound
- emitting device
- light emitting
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- 239000000843 powder Substances 0.000 title claims abstract description 57
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- 229910017464 nitrogen compound Inorganic materials 0.000 claims abstract description 56
- 150000002830 nitrogen compounds Chemical class 0.000 claims abstract description 31
- -1 calcium aluminum silicon nitrogen Chemical compound 0.000 claims abstract description 14
- RWLIDFDVLWSKTE-UHFFFAOYSA-N [Si].[N].[La] Chemical compound [Si].[N].[La] RWLIDFDVLWSKTE-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 11
- 239000001301 oxygen Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 106
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 12
- 229910052791 calcium Inorganic materials 0.000 claims description 12
- 239000011575 calcium Substances 0.000 claims description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 10
- 150000004767 nitrides Chemical class 0.000 claims description 8
- 238000001228 spectrum Methods 0.000 description 10
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000002223 garnet Substances 0.000 description 5
- 229910052727 yttrium Inorganic materials 0.000 description 5
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910003564 SiAlON Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 2
- 229910052693 Europium Inorganic materials 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- TVGGZXXPVMJCCL-UHFFFAOYSA-N [Si].[La] Chemical compound [Si].[La] TVGGZXXPVMJCCL-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/59—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing silicon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/64—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing aluminium
- C09K11/646—Silicates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
Abstract
Description
Claims (21)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610316702.XA CN105932141A (zh) | 2011-08-02 | 2011-08-02 | 荧光粉组成及使用该荧光粉组成的白色发光装置 |
CN201110218861.3A CN102916113B (zh) | 2011-08-02 | 2011-08-02 | 荧光粉组成及使用该荧光粉组成的白色发光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110218861.3A CN102916113B (zh) | 2011-08-02 | 2011-08-02 | 荧光粉组成及使用该荧光粉组成的白色发光装置 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610316871.3A Division CN105762257A (zh) | 2011-08-02 | 2011-08-02 | 荧光粉组成及使用该荧光粉组成的白色发光装置 |
CN201610316702.XA Division CN105932141A (zh) | 2011-08-02 | 2011-08-02 | 荧光粉组成及使用该荧光粉组成的白色发光装置 |
Publications (2)
Publication Number | Publication Date |
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CN102916113A true CN102916113A (zh) | 2013-02-06 |
CN102916113B CN102916113B (zh) | 2016-06-15 |
Family
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Application Number | Title | Priority Date | Filing Date |
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CN201610316702.XA Pending CN105932141A (zh) | 2011-08-02 | 2011-08-02 | 荧光粉组成及使用该荧光粉组成的白色发光装置 |
CN201110218861.3A Expired - Fee Related CN102916113B (zh) | 2011-08-02 | 2011-08-02 | 荧光粉组成及使用该荧光粉组成的白色发光装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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CN201610316702.XA Pending CN105932141A (zh) | 2011-08-02 | 2011-08-02 | 荧光粉组成及使用该荧光粉组成的白色发光装置 |
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CN (2) | CN105932141A (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103980891A (zh) * | 2013-02-07 | 2014-08-13 | 亿光电子工业股份有限公司 | 荧光粉组成及发光二极管元件 |
CN105892145A (zh) * | 2016-04-05 | 2016-08-24 | 武汉华星光电技术有限公司 | 一种显示器及其显示模组 |
CN107557007A (zh) * | 2016-06-30 | 2018-01-09 | 有研稀土新材料股份有限公司 | 镥氮基荧光粉及具有其的发光器件 |
CN109285937A (zh) * | 2018-08-16 | 2019-01-29 | 佛山市国星光电股份有限公司 | Led白光器件及其制备方法、led背光模组 |
CN115513358A (zh) * | 2022-11-21 | 2022-12-23 | 四川世纪和光科技发展有限公司 | 荧光组合物、荧光膜和光源 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060208262A1 (en) * | 2005-03-18 | 2006-09-21 | Fujikura Ltd., Independent Administrative Institution | Light emitting device and illumination apparatus |
US20070164308A1 (en) * | 2002-11-29 | 2007-07-19 | Toyoda Gosei Co., Ltd. | Light emitting apparatus and light emitting method |
CN101785120A (zh) * | 2007-08-30 | 2010-07-21 | 日亚化学工业株式会社 | 发光装置 |
US20110031874A1 (en) * | 2008-01-21 | 2011-02-10 | Nichia Corporation | Light emitting apparatus |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070252513A1 (en) * | 2004-07-05 | 2007-11-01 | Koninklijke Philips Electronics, N.V. | Illumination System Comprising a Radiation Source and a Fluorescent Material |
EP2074668B1 (en) * | 2006-10-10 | 2018-02-28 | Tridonic Jennersdorf GmbH | Phosphor-converted light emitting diode |
-
2011
- 2011-08-02 CN CN201610316702.XA patent/CN105932141A/zh active Pending
- 2011-08-02 CN CN201110218861.3A patent/CN102916113B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070164308A1 (en) * | 2002-11-29 | 2007-07-19 | Toyoda Gosei Co., Ltd. | Light emitting apparatus and light emitting method |
US20060208262A1 (en) * | 2005-03-18 | 2006-09-21 | Fujikura Ltd., Independent Administrative Institution | Light emitting device and illumination apparatus |
CN101785120A (zh) * | 2007-08-30 | 2010-07-21 | 日亚化学工业株式会社 | 发光装置 |
US20110031874A1 (en) * | 2008-01-21 | 2011-02-10 | Nichia Corporation | Light emitting apparatus |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103980891A (zh) * | 2013-02-07 | 2014-08-13 | 亿光电子工业股份有限公司 | 荧光粉组成及发光二极管元件 |
CN105892145A (zh) * | 2016-04-05 | 2016-08-24 | 武汉华星光电技术有限公司 | 一种显示器及其显示模组 |
CN105892145B (zh) * | 2016-04-05 | 2020-07-03 | 武汉华星光电技术有限公司 | 一种显示器及其显示模组 |
CN111883632A (zh) * | 2016-04-05 | 2020-11-03 | 武汉华星光电技术有限公司 | 一种显示器及其显示模组 |
CN111883632B (zh) * | 2016-04-05 | 2022-06-10 | 武汉华星光电技术有限公司 | 一种显示器及其显示模组 |
CN107557007A (zh) * | 2016-06-30 | 2018-01-09 | 有研稀土新材料股份有限公司 | 镥氮基荧光粉及具有其的发光器件 |
CN109285937A (zh) * | 2018-08-16 | 2019-01-29 | 佛山市国星光电股份有限公司 | Led白光器件及其制备方法、led背光模组 |
WO2020034391A1 (zh) * | 2018-08-16 | 2020-02-20 | 佛山市国星光电股份有限公司 | Led白光器件及其制备方法、led背光模组 |
US11757069B2 (en) | 2018-08-16 | 2023-09-12 | Foshan Nationstar Optoelectronics Co., Ltd | LED white light device, preparation method thereof, and LED backlight module |
CN115513358A (zh) * | 2022-11-21 | 2022-12-23 | 四川世纪和光科技发展有限公司 | 荧光组合物、荧光膜和光源 |
CN115513358B (zh) * | 2022-11-21 | 2023-06-23 | 四川世纪和光科技发展有限公司 | 荧光组合物、荧光膜和光源 |
Also Published As
Publication number | Publication date |
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CN102916113B (zh) | 2016-06-15 |
CN105932141A (zh) | 2016-09-07 |
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