CN102912390A - Ag-Cu-Sn alloy solution - Google Patents
Ag-Cu-Sn alloy solution Download PDFInfo
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- CN102912390A CN102912390A CN2012104217051A CN201210421705A CN102912390A CN 102912390 A CN102912390 A CN 102912390A CN 2012104217051 A CN2012104217051 A CN 2012104217051A CN 201210421705 A CN201210421705 A CN 201210421705A CN 102912390 A CN102912390 A CN 102912390A
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- silver
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- acid
- plating bath
- alloy plating
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Abstract
The invention discloses an Ag-Cu-Sn alloy solution which is characterized by comprising the following materials according to volume ratio: 50-250 g/L of organic silver salt, 50-300 g/L of organic tin salt, 50-200 g/L of organic copper salt, 20-200 g/L of organic acid, 50-100 g/L of brightener, 10-30 g/L of catalyst and 30-100 g/L of complexing agent; and water is replenished to 1000 L. The Ag-Cu-Sn alloy solution has the advantages that the formula is reasonable, and a bright and neat coating can be simply and quickly produced.
Description
Technical field
The present invention relates to a kind of silver-bearing copper Sn Alloy Plating Bath.
Background technology
In plating, the hazardous property of the metallic element that contains in the plated film is regarded as problem, even for very early widely used nickel plating, also expect to have the plated film that can substitute.Substitutes the candidate of plated film as nickel, can list silver-bearing copper tin alloy plating, but as plating bath, silver-bearing copper Sn Alloy Plating Bath prescription of the prior art is unreasonable, the preparation difficulty, can not obtain quickly light, smooth, do not produce the capital.
Therefore, be badly in need of a kind of improved technology and solve existing this problem in the prior art.
Summary of the invention
The purpose of this invention is to provide a kind of silver-bearing copper Sn Alloy Plating Bath.
The technical solution used in the present invention is:
A kind of silver-bearing copper Sn Alloy Plating Bath is characterized in that: each volume of material ratio of this silver-bearing copper Sn Alloy Plating Bath is:
Organic silver salts 50-250g/L;
Organic tin salt 50-300 g/L;
Organic copper salt 50-200 g/L;
Organic acid 20-200 g/L;
Brightening agent 50-100g/L;
Catalyzer 10-30g/L;
Complexing agent 30-100g/L;
Water complements to 1000L.
In described organic acid methylsulfonic acid, ethyl sulfonic acid,-sulfinic acid, the thionothiolic acid one or both.
Described brightening agent is imidazoles, formic acid or Sodium Benzoate.
Described catalyzer is Cerium II Chloride or yttrium oxide.
Described complexing agent is thiocarbamide or aminocarboxylate.。
Advantage of the present invention is: prescription rationally, easy, quickly obtain bright, smooth, do not produce coating.
Embodiment
Following embodiment only is used for explanation the present invention, but can not limit protection scope of the present invention.
Embodiment 1
A kind of silver-bearing copper Sn Alloy Plating Bath, each volume of material ratio of this silver-bearing copper Sn Alloy Plating Bath is:
Organic silver salts 200g/L;
Organic tin salt 300 g/L;
Organic copper salt 100 g/L;
Organic acid 150 g/L;
Brightening agent 50g/L;
Catalyzer 20g/L;
Complexing agent 30g/L;
Water complements to 1000L.
Described have in the thionothiolic acid.
Described brightening agent is Sodium Benzoate.
Described catalyzer is yttrium oxide.
Described complexing agent is thiocarbamide.
Embodiment 2
A kind of silver-bearing copper Sn Alloy Plating Bath, each volume of material ratio of this silver-bearing copper Sn Alloy Plating Bath is:
Organic silver salts 150g/L;
Organic tin salt 250 g/L;
Organic copper salt 200 g/L;
Organic acid 100 g/L;
Brightening agent 60g/L;
Catalyzer 20g/L;
Complexing agent 30g/L;
Water complements to 1000L.
The mixing acid of described organic acid ethyl sulfonic acid and thionothiolic acid.
Described brightening agent is formic acid.
Described catalyzer is yttrium oxide.
Described complexing agent is thiocarbamide.
Embodiment 3
A kind of silver-bearing copper Sn Alloy Plating Bath, each volume of material ratio of this silver-bearing copper Sn Alloy Plating Bath is:
Organic silver salts 250g/L;
Organic tin salt 100 g/L;
Organic copper salt 150 g/L;
Organic acid 150 g/L;
Brightening agent 80g/L;
Catalyzer 20g/L;
Complexing agent 80g/L;
Water complements to 1000L.
The mixing acid of described organic acid-sulfinic acid and thionothiolic acid.
Described brightening agent is Sodium Benzoate.
Described catalyzer is yttrium oxide.
Described complexing agent is aminocarboxylate.
Prescription rationally, easy, quickly obtain bright, smooth, do not produce coating.
Claims (5)
1. silver-bearing copper Sn Alloy Plating Bath, it is characterized in that: each volume of material ratio of this silver-bearing copper Sn Alloy Plating Bath is:
Organic silver salts 50-250g/L;
Organic tin salt 50-300 g/L;
Organic copper salt 50-200 g/L;
Organic acid 20-200 g/L;
Brightening agent 50-100g/L;
Catalyzer 10-30g/L;
Complexing agent 30-100g/L;
Water complements to 1000L.
2. a kind of silver-bearing copper Sn Alloy Plating Bath according to claim 1 is characterized in that: one or both in described organic acid methylsulfonic acid, ethyl sulfonic acid,-sulfinic acid, the thionothiolic acid.
3. a kind of silver-bearing copper Sn Alloy Plating Bath according to claim 1, it is characterized in that: described brightening agent is imidazoles, formic acid or Sodium Benzoate.
4. a kind of silver-bearing copper Sn Alloy Plating Bath according to claim 1, it is characterized in that: described catalyzer is Cerium II Chloride or yttrium oxide.
5. a kind of silver-bearing copper Sn Alloy Plating Bath according to claim 1, it is characterized in that: described complexing agent is thiocarbamide or aminocarboxylate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104217051A CN102912390A (en) | 2012-10-30 | 2012-10-30 | Ag-Cu-Sn alloy solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104217051A CN102912390A (en) | 2012-10-30 | 2012-10-30 | Ag-Cu-Sn alloy solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102912390A true CN102912390A (en) | 2013-02-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104217051A Pending CN102912390A (en) | 2012-10-30 | 2012-10-30 | Ag-Cu-Sn alloy solution |
Country Status (1)
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| CN (1) | CN102912390A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1844476A (en) * | 2006-03-24 | 2006-10-11 | 哈尔滨工业大学 | Subacidity bath for electroplating Sn-Ag-Cu alloy coating and electroplating method therefor |
| CN101403112A (en) * | 2008-10-28 | 2009-04-08 | 昆山成利焊锡制造有限公司 | Chemical tin plating liquor for copper and copper alloy |
| CN102162113A (en) * | 2011-05-30 | 2011-08-24 | 长春工业大学 | Tin-silver-copper ternary alloy electroplating solution and electroplating method |
| CN102268701A (en) * | 2011-08-02 | 2011-12-07 | 南京大学 | Non-cyanide bright silver electroplating bath and preparation method thereof |
| CN102605392A (en) * | 2012-04-18 | 2012-07-25 | 吉安市荣泰电讯科技有限公司 | Tin plating liquid with rear earth additive |
| CN102605394A (en) * | 2012-03-07 | 2012-07-25 | 深圳市华傲创表面技术有限公司 | Cyanogen-free acidic cupronickel-tin plating solution |
-
2012
- 2012-10-30 CN CN2012104217051A patent/CN102912390A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1844476A (en) * | 2006-03-24 | 2006-10-11 | 哈尔滨工业大学 | Subacidity bath for electroplating Sn-Ag-Cu alloy coating and electroplating method therefor |
| CN101403112A (en) * | 2008-10-28 | 2009-04-08 | 昆山成利焊锡制造有限公司 | Chemical tin plating liquor for copper and copper alloy |
| CN102162113A (en) * | 2011-05-30 | 2011-08-24 | 长春工业大学 | Tin-silver-copper ternary alloy electroplating solution and electroplating method |
| CN102268701A (en) * | 2011-08-02 | 2011-12-07 | 南京大学 | Non-cyanide bright silver electroplating bath and preparation method thereof |
| CN102605394A (en) * | 2012-03-07 | 2012-07-25 | 深圳市华傲创表面技术有限公司 | Cyanogen-free acidic cupronickel-tin plating solution |
| CN102605392A (en) * | 2012-04-18 | 2012-07-25 | 吉安市荣泰电讯科技有限公司 | Tin plating liquid with rear earth additive |
Non-Patent Citations (4)
| Title |
|---|
| 张锦秋等: ""配位剂对弱酸性体系电沉积Sn-Ag-Cu镀层的影响"", 《电镀与涂饰》, vol. 27, no. 8, 31 August 2008 (2008-08-31) * |
| 王亚雄: ""甲基磺酸盐在锡及锡基合金镀层中的应用现状"", 《电镀与涂饰》, vol. 27, no. 2, 28 February 2008 (2008-02-28) * |
| 肖友军: ""稀土催化剂抗酸性镀锡液氧化变质的研究"", 《电镀与涂饰》, vol. 20, no. 4, 31 August 2001 (2001-08-31) * |
| 龙有前等: ""酸性镀锡液不稳定性研究"", 《材料保护》, vol. 36, no. 3, 31 March 2003 (2003-03-31), pages 47 - 48 * |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130206 |