CN102994993A - Tinning liquid - Google Patents
Tinning liquid Download PDFInfo
- Publication number
- CN102994993A CN102994993A CN2012104201848A CN201210420184A CN102994993A CN 102994993 A CN102994993 A CN 102994993A CN 2012104201848 A CN2012104201848 A CN 2012104201848A CN 201210420184 A CN201210420184 A CN 201210420184A CN 102994993 A CN102994993 A CN 102994993A
- Authority
- CN
- China
- Prior art keywords
- acid
- tin
- plating electrolyte
- tin plating
- electrolyte according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses tinning liquid which is characterized by comprising the following components: 100-400g/L of organic mixed acid, 50-150g/L of organic tin salt, 10-50g/L of silver salt, 30-100g/L of complexing agent, 5-30g/L of brightener, 50-100g/L of antioxidant, 10-30g/L of catalyst, 20-50g/L of emulsifying agent and the balance of water. The tinning liquid has the advantages of reasonable formulation, and a bright and flat tin coating without tin whisker can be obtained simply, conveniently and quickly.
Description
Technical field
The present invention relates to the electroplating surfaces with tin technical field, relate in particular to a kind of tin plating electrolyte.
Background technology
Tin coating is a kind of good weldability and has the coating of certain anti-corrosion capability, is widely used in electronic wire, printed-wiring board (PWB).Tin coating can adopt the method preparation of plating, immersion plating and electroless plating.Immersion tin is easy and simple to handle, and cost is low, but thickness of coating is limited, generally only has 0.5 μ m, and plating bath is easily poisoned, and can't satisfy industrial requirements.Eleetrotinplate can't the deep hole processing part, blind bored member; The Electroless tin coating even thickness, solution dispersibility is good, and production efficiency is high, easily-controlled operation, coating surface is bright and clean smooth, compact crystallization, porosity is low, and bonding force is better than immersion tin and eleetrotinplate, is a kind of desirable Small electronic component and the electroless plating technology of electronic wire.But because the hydrogen-evolution overpotential of tin is high, catalytic activity is low, if adopt separately the reductive agents such as formaldehyde, inferior sodium phosphate, hydroborate, all can not realize the continuously self-catalyzed deposition of tin, can't obtain thicker coating.
Therefore, be badly in need of a kind of improved technology and solve existing this problem in the prior art.
Summary of the invention
The purpose of this invention is to provide a kind of tin plating electrolyte.
The technical solution used in the present invention is:
A kind of tin plating electrolyte is characterized in that: this tin plating electrolyte consists of the following composition:
Organic mixing acid 100g/L-400g/L;
Organic tin salt 50g/L-150g/L;
Organic silver salts 10g/L-50g/L;
Complexing agent 30g/L-100g/L;
Brightening agent 5g/L-30g/L;
Oxidation inhibitor 50g/L--100g/L;
Catalyzer 10g/L-30g/L;
Emulsifying agent 20g/L-50g/L;
Water surplus.
Described organic mixing acid is in methylsulfonic acid, ethyl sulfonic acid,-sulfinic acid, the thionothiolic acid two kinds or multiple.
Described organic tin salt is tin methane sulfonate,-sulfinic acid tin or ethyl sulfonic acid.
Described organic silver salts is methylsulfonic acid silver, ethyl sulfonic acid is silver-colored or-sulfinic acid is silver-colored.
Described complexing agent is thiocarbamide, methylguanidine or aminocarboxylate.
Described brightening agent is imidazoles, formic acid or Sodium Benzoate.
Described oxidation inhibitor is this diphenol, pentanoic, Ursol D or phosphorous acid ester.
Described catalyzer is Cerium II Chloride or yttrium oxide.
Described emulsifying agent is alkylphenol polyoxyethylene, chlorination hexadecyl trimethylamine or phosphoric acid salt.
Advantage of the present invention is: prescription rationally, and is easy, obtain bright, smooth, as not produce tin palpus tin coating quickly.
Embodiment
Following embodiment only is used for explanation the present invention, but can not limit protection scope of the present invention.
Embodiment 1
A kind of tin plating electrolyte, this tin plating electrolyte consists of the following composition:
Organic mixing acid 200g/L;
Organic tin salt 100g/L;
Organic silver salts 20g/L;
Complexing agent 40g/L;
Brightening agent 10g/L;
Oxidation inhibitor 50g/L;
Catalyzer 10g/L;
Emulsifying agent 20g/L;
Water 550 g/L.
Described organic mixing acid is methylsulfonic acid and thionothiolic acid.
Described organic tin salt is ethyl sulfonic acid.
Described organic silver salts is methylsulfonic acid silver.
Described complexing agent is thiocarbamide.
Described brightening agent is Sodium Benzoate.
Described oxidation inhibitor is Ursol D.
Described catalyzer is Cerium II Chloride.
Described emulsifying agent is alkylphenol polyoxyethylene.
Embodiment 2
A kind of tin plating electrolyte, this tin plating electrolyte consists of the following composition:
Organic mixing acid 350g/L;
Organic tin salt 50g/L;
Organic silver salts 30g/L;
Complexing agent 30g/L;
Brightening agent 5g/L;
Oxidation inhibitor 50g/L;
Catalyzer 20g/L;
Emulsifying agent 30g/L;
Water 445 g/L.
Described organic mixing acid is-sulfinic acid and thionothiolic acid.
Described organic tin salt is tin methane sulfonate.
Described organic silver salts is-sulfinic acid silver.
Described complexing agent is aminocarboxylate.
Described brightening agent is imidazoles.
Described oxidation inhibitor is phosphoric acid ester.
Described catalyzer is yttrium oxide.
Described emulsifying agent is the chlorination hexadecyl trimethylamine.
Embodiment 3
A kind of tin plating electrolyte, this tin plating electrolyte consists of the following composition:
Organic mixing acid 150g/L;
Organic tin salt 120g/L;
Organic silver salts 40g/L;
Complexing agent 80g/L;
Brightening agent 20g/L;
Oxidation inhibitor 80g/L;
Catalyzer 30g/L;
Emulsifying agent 40g/L;
Water 440 g/L.
Described organic mixing acid is methylsulfonic acid and thionothiolic acid.
Described organic tin salt is-sulfinic acid tin.
Described organic silver salts is ethyl sulfonic acid silver.
Described complexing agent is methylguanidine.
Described brightening agent is Sodium Benzoate.
Described oxidation inhibitor is pentanoic.
Described catalyzer is yttrium oxide.
Described emulsifying agent is the chlorination hexadecyl trimethylamine.
Prescription rationally, and is easy, obtain bright, smooth, as not produce tin palpus tin coating quickly.
Claims (9)
1. tin plating electrolyte, it is characterized in that: this tin plating electrolyte consists of the following composition:
Organic mixing acid 100g/L-400g/L;
Organic tin salt 50g/L-150g/L;
Organic silver salts 10g/L-50g/L;
Complexing agent 30g/L-100g/L;
Brightening agent 5g/L-30g/L;
Oxidation inhibitor 50g/L--100g/L;
Catalyzer 10g/L-30g/L;
Emulsifying agent 20g/L-50g/L;
Water surplus.
2. a kind of tin plating electrolyte according to claim 1 is characterized in that: described organic mixing acid is in methylsulfonic acid, ethyl sulfonic acid,-sulfinic acid, the thionothiolic acid two kinds or multiple.
3. a kind of tin plating electrolyte according to claim 1, it is characterized in that: described organic tin salt is tin methane sulfonate,-sulfinic acid tin or ethyl sulfonic acid.
4. a kind of tin plating electrolyte according to claim 1 is characterized in that: described organic silver salts is methylsulfonic acid silver, ethyl sulfonic acid is silver-colored or-sulfinic acid is silver-colored.
5. a kind of tin plating electrolyte according to claim 1, it is characterized in that: described complexing agent is thiocarbamide, methylguanidine or aminocarboxylate.
6. a kind of tin plating electrolyte according to claim 1, it is characterized in that: described brightening agent is imidazoles, formic acid or Sodium Benzoate.
7. a kind of tin plating electrolyte according to claim 1 is characterized in that: described oxidation inhibitor is this diphenol, pentanoic, Ursol D or phosphorous acid ester.
8. a kind of tin plating electrolyte according to claim 1, it is characterized in that: described catalyzer is Cerium II Chloride or yttrium oxide.
9. a kind of tin plating electrolyte according to claim 1, it is characterized in that: described emulsifying agent is alkylphenol polyoxyethylene, chlorination hexadecyl trimethylamine or phosphoric acid salt.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012104201848A CN102994993A (en) | 2012-10-29 | 2012-10-29 | Tinning liquid |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012104201848A CN102994993A (en) | 2012-10-29 | 2012-10-29 | Tinning liquid |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102994993A true CN102994993A (en) | 2013-03-27 |
Family
ID=47924086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2012104201848A Pending CN102994993A (en) | 2012-10-29 | 2012-10-29 | Tinning liquid |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102994993A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107365986A (en) * | 2017-07-11 | 2017-11-21 | 东莞市富默克化工有限公司 | A kind of tin plating technique of chemical tin inorganic agent and application the chemical tin inorganic agent |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101403112A (en) * | 2008-10-28 | 2009-04-08 | 昆山成利焊锡制造有限公司 | Chemical tin plating liquor for copper and copper alloy |
CN101705482A (en) * | 2009-11-19 | 2010-05-12 | 广州电器科学研究院 | Alkyl sulfonic acid chemical tinning solution and chemical tinning solution based tinning process |
CN102660724A (en) * | 2012-05-17 | 2012-09-12 | 合肥工业大学 | Rare-earth plating aid for hot dip tinning and preparation method thereof |
-
2012
- 2012-10-29 CN CN2012104201848A patent/CN102994993A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101403112A (en) * | 2008-10-28 | 2009-04-08 | 昆山成利焊锡制造有限公司 | Chemical tin plating liquor for copper and copper alloy |
CN101705482A (en) * | 2009-11-19 | 2010-05-12 | 广州电器科学研究院 | Alkyl sulfonic acid chemical tinning solution and chemical tinning solution based tinning process |
CN102660724A (en) * | 2012-05-17 | 2012-09-12 | 合肥工业大学 | Rare-earth plating aid for hot dip tinning and preparation method thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107365986A (en) * | 2017-07-11 | 2017-11-21 | 东莞市富默克化工有限公司 | A kind of tin plating technique of chemical tin inorganic agent and application the chemical tin inorganic agent |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102080241B (en) | Low-concentration weakly alkaline cyanide-free copper plating and bath solution preparing method | |
CN102051607B (en) | Electroless copper plating solution | |
CN101403112B (en) | Chemical tin plating liquor for copper and copper alloy | |
CN101760768A (en) | Electroplating solution for cyanide-free silver plating and cyanide-free silver plating method | |
CN101314861A (en) | Plating process for low-nickel non-cyanogen alkalescent zinc-nickel alloy | |
CN103469261A (en) | Cyanide-free silver plating solution additive | |
CN110029374A (en) | A kind of cyanide-free alkaline copper plating electroplate liquid and electroplating technology | |
US20160230287A1 (en) | Reductive electroless gold plating solution, and electroless gold plating method using the plating solution | |
CN104789999B (en) | A kind of ironware Direct Electroplating acid copper solution | |
CN110158066B (en) | Environment-friendly solution capable of inhibiting tetravalent tin generation rate | |
CN102994993A (en) | Tinning liquid | |
CN104141120A (en) | Cuprous chemical copper plating solution | |
MX339242B (en) | Process for electroless deposition of metals using highly alkaline plating bath. | |
CN102994994A (en) | Lead-free electroless tin plating solution | |
CN101187020A (en) | Surface chemical plating Ni-P process using nickel sulfate as main salt | |
CN105369305A (en) | A copper-nickel alloy electroplating solution and an electroplating method thereof | |
CN105112899A (en) | Alkaline nickel-tungsten-phosphorus-alloy chemical plating brightening agent and chemical plating method using brightening agent | |
CN100362141C (en) | Propanetriol non-cyanide bright copper plating liquid | |
CN105002529A (en) | Bismuth-plating electroplating liquid and pulse plating method for bismuth thin film | |
CN104120466A (en) | Weak acid chloride electroplating solution used for neodymium iron boron electroplating of zinc-iron alloy and preparation method | |
CN103173819A (en) | Tinning stabilization additive | |
JP6621169B2 (en) | Manufacturing method of plated products | |
CN103806050A (en) | Cyanide-free copper electroplating method for reducing porosity of copper plating layer | |
CN103668195A (en) | Three-element zinc-tin-nickel soaking iron electroplating technique of aluminum alloy plate | |
CN103184487A (en) | Copper electroplating solution |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130327 |