CN102903727A - Electronic device with electrostatic discharge protection - Google Patents
Electronic device with electrostatic discharge protection Download PDFInfo
- Publication number
- CN102903727A CN102903727A CN2011103078254A CN201110307825A CN102903727A CN 102903727 A CN102903727 A CN 102903727A CN 2011103078254 A CN2011103078254 A CN 2011103078254A CN 201110307825 A CN201110307825 A CN 201110307825A CN 102903727 A CN102903727 A CN 102903727A
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- Prior art keywords
- discharge
- jag
- lead frame
- esd
- electronic installation
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- 238000009434 installation Methods 0.000 claims description 61
- 230000003068 static effect Effects 0.000 claims description 34
- 239000011469 building brick Substances 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000012212 insulator Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002457 bidirectional effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
An electronic device with electrostatic discharge protection comprises a first lead frame having at least a first discharge protrusion; a second lead frame having at least one second discharge protrusion; the electronic component is arranged on the first lead frame, and two ends of the electronic component are respectively and electrically connected with the first lead frame and the second lead frame; the first and second discharge protrusions are oppositely arranged and separated by a predetermined distance; when the electrostatic discharge event occurs on the first or the second lead frame, the electrostatic discharge is performed through the first and the second discharge protruding ends.
Description
Technical field
The present invention relates to a kind of electronic installation with electrostatic discharge (ESD) protection, relate in particular to a kind of point discharge principle of utilizing to reach the electronic installation of electrostatic discharge (ESD) protection.
Background technology
Electrostatic charge moves to another surface by a surface, and this phenomenon is static discharge (Electrostatic Discharge), also can be referred to as ESD.In integrated circuit and electronic building brick, the electric current that static discharge phenomenon produces may be to semiconductor junction, metal parts to cause damage with gate structure.Traditional electrostatic discharge protective equipment 10 as shown in Figure 1; wherein shielded light-emitting diode d1 is in parallel with a zener diode (Zener Diode) p1; the wherein negative electrode of zener diode p1 and voltage source V dd coupling, anode then is coupled with a voltage source V ss.When producing a static discharge phenomenon in voltage source V dd place, its voltage will greater than the junction breakdown voltage (junction breakdown voltage) of zener diode p1, make zener diode p1 conducting, and electrostatic charge is imported voltage source V ss.
Yet tradition need to be carried out extra fabrication steps with zener diode in the integrated circuit manufacture process stage as electrostatic discharge protective equipment, and increases cost burden, still has the suitable space of improving.
Summary of the invention
In view of this, the present invention proposes a kind of electronic installation of tool electrostatic discharge (ESD) protection, comprises the first lead frame, has at least one the first discharge jag; The second lead frame has at least one the second discharge jag; And electronic building brick, being arranged on the first lead frame, the two ends of electronic building brick are electrically connected respectively first and second lead frame; First and second discharge jag is the subtend setting and separates a both set a distance; When electrostatic discharge event comes across first or carry out static discharge by first and second discharge jag during the second lead frame.
The present invention proposes a kind of electronic installation of tool electrostatic discharge (ESD) protection in addition, comprises the first lead frame, and this first lead frame has at least the first discharge jag; The second lead frame has at least the second discharge jag, and the second lead frame is electrically connected to a reference potential node; And electronic building brick, be electrically connected the first lead frame; First and second discharge jag is the subtend setting and separates a both set a distance; When coming across the first lead frame, electrostatic discharge event carries out static discharge by first and second discharge jag.
The present invention also proposes a kind of electronic installation of tool electrostatic discharge (ESD) protection, comprises the first lead frame, has at least one the first discharge jag; The second lead frame has at least one the second discharge jag; The earth lead frame has at least one the 3rd discharge jag and at least one the 4th discharge jag; Electronic building brick is arranged on the earth lead frame, and the two ends of this electronic building brick are electrically connected respectively first and second lead frame; The first and the 3rd discharge jag is the subtend setting and separates the first both set a distance; The second and the 4th discharge jag is the subtend setting and separates the second both set a distance; When electrostatic discharge event comes across first or during the second lead frame, carry out static discharge or carry out static discharge by the second and the 4th discharge jag by the first and the 3rd discharge jag.
Description of drawings
Fig. 1 is traditional electrostatic discharge protective equipment schematic diagram;
Fig. 2 A is the plane graph with electronic installation 20 of electrostatic discharge (ESD) protection;
Fig. 2 B is that the electronic installation with electrostatic discharge (ESD) protection 20 of Fig. 2 A is along the profile in AA ' cross section;
Fig. 2 C is the equivalent circuit diagram with electronic installation 20 of electrostatic discharge (ESD) protection;
Fig. 2 D shows the plane graph of the electronic installation 21 with electrostatic discharge (ESD) protection;
Fig. 2 E shows the plane graph of the electronic installation 22 with electrostatic discharge (ESD) protection;
Fig. 2 F shows the plane graph of the electronic installation 23 with electrostatic discharge (ESD) protection;
Fig. 2 G shows that the electronic installation 20 ' with electrostatic discharge (ESD) protection is through the profile after encapsulating;
Fig. 3 A is the plane graph with electronic installation 30 of electrostatic discharge (ESD) protection;
Fig. 3 B is that the electronic installation with electrostatic discharge (ESD) protection 30 of Fig. 3 A is along the profile in AA ' cross section;
Fig. 3 C is the equivalent circuit diagram with electronic installation 30 of electrostatic discharge (ESD) protection;
Fig. 3 D shows that the electronic installation 31 with electrostatic discharge (ESD) protection is through the profile after encapsulating;
Fig. 4 A is the plane graph with electronic installation 40 of electrostatic discharge (ESD) protection;
Fig. 4 B is the equivalent circuit diagram with electronic installation 40 of electrostatic discharge (ESD) protection.
Reference numeral:
10,20,21,22,23,24,30,31,40: the electronic installation with electrostatic discharge (ESD) protection;
AA ': cross section
D1: electronic installation;
GND: reference potential node;
M1: the first lead frame;
M2: the second lead frame;
M3: privates frame;
P1, p2, p3, p4: electric discharge device;
R1, R2, R3: space;
S1, S1 ', S2, S2 ', S3, S4, S5, S6: discharge jag;
Vdd: voltage source;
Vss: voltage source;
W1, W2: wire.
Embodiment
Fig. 2 A is the plane graph that has the electronic installation 20 of electrostatic discharge (ESD) protection in one embodiment of the invention, and Fig. 2 B is that the electronic installation with electrostatic discharge (ESD) protection 20 of Fig. 2 A is along the profile in AA ' cross section.In this embodiment, electronic installation 20 for example is light-emitting diode component, but is not to be defined in this.Electronic installation 20 comprises one first lead frame M1, one second lead frame M2, is formed at respectively on the substrate (not being shown in accompanying drawing).The first lead frame M1 and the second lead frame M2 can be formed by copper, silver or aluminium, and wherein when side circuit moved, the first lead frame M1 can be biased to a voltage source V ss, and the second lead frame M2 can be biased to a voltage source V dd.The first lead frame M1 also comprises discharge jag S1, and the second lead frame M2 also comprises discharge jag S2, and the shape of discharge jag S1 and S2 can be coniform, pyramidal or has the geometry of small curvature radius.The tip of discharge jag S1 and S2 toward each other, to form a discharge assembly p1.Electronic building brick d1 structure is loaded on the first lead frame M1, and forms electric connection with the first lead frame M1 and the second lead frame M2 respectively by wire W1 and W2.
Fig. 2 C is the equivalent circuit diagram with electronic installation 20 of electrostatic discharge (ESD) protection, and wherein discharge assembly p1 is in parallel with the electronic building brick d1 of wish protection.The principle of discharge assembly p1 is for utilizing point discharge (point discharging), when the voltage difference between two discharge jag S1 and the S2 reached the starting resistor of discharge assembly p1, the medium between discharge jag S1 and the S2 was ionized and electrically conducts.Distance between discharge jag S1 and the S2 is longer, and the starting resistor of discharge assembly p1 is higher; Distance between discharge jag S1 and the S2 is shorter, and the starting resistor of discharge assembly p1 is lower.In part embodiment, the distance between discharge jag S1 and the S2 is between 1 μ m to 200 μ m.And when static discharge phenomenon produces, generation one is greater than the voltage difference of the starting resistor of discharge assembly p1 between the first lead frame M1 or the second lead frame M2, discharge jag S1 and S2 conducting of this moment, static discharge current discharges by discharge assembly p1, and reaches the effect that prevents that electronic building brick d1 from being destroyed by static discharge current.
The plane graph that has the electronic installation 21 of electrostatic discharge (ESD) protection among Fig. 2 D display part embodiment, wherein discharge jag S1 and S2 can lay respectively at any position of the first lead frame M1 or the second lead frame M2 sidewall, to form discharge assembly p1; Fig. 2 E shows the plane graph that has the electronic installation 22 of electrostatic discharge (ESD) protection among the other parts embodiment; the electronic installation 22 that wherein has an electrostatic discharge (ESD) protection can have a plurality of discharge jag S1, S1 ' and a plurality of discharge jag S2, S2 ' toward each other, to form discharge assembly p1.
Fig. 2 F shows the plane graph that has the electronic installation 23 of electrostatic discharge (ESD) protection among the other parts embodiment, and wherein the first lead frame M1 has discharge jag S1, and privates frame M3 is connected with a reference potential node GND, and has discharge jag S2.Discharge jag S1 and S2 toward each other, to form discharge assembly p1; When static discharge phenomenon results from the first lead frame M1, produce a voltage difference greater than discharge assembly p1 starting resistor between the first lead frame M1 and the privates frame M3, discharge jag S1 and S2 conducting of this moment, static discharge current is disposed to reference potential node GND by discharge assembly p1, and reaches the effect that prevents that electronic building brick d1 from being destroyed by static discharge current.
Fig. 2 G shows through having the profile of the electronic installation 24 of electrostatic discharge (ESD) protection after the encapsulation, wherein encapsulates material C1 and is formed at the first lead frame M1 and the second lead frame M2 top, and electronic building brick d1 and wire W1, W2 are covered.(or with substrate together) also forms a space R1 among the encapsulation material C1, in will discharge jag structure S1 and S2 partly are coated on.Medium in the R1 of space generally can be air, only is not limited only to this, also can insert the material that has insulating property (properties) such as plastics etc.
Fig. 3 A is the plane graph that has the electronic installation 30 of electrostatic discharge (ESD) protection in one embodiment of the invention, and Fig. 3 B is that the electronic installation with electrostatic discharge (ESD) protection 30 of Fig. 3 A is along the profile in AA ' cross section.Be light-emitting diode component for example at this embodiment electronic installation 30, but be not to be defined in this.Electronic installation 30 comprises one first lead frame M1, one second lead frame M2 and a privates frame M3, is formed at respectively on the substrate (not being shown in accompanying drawing).The first lead frame M1, the second lead frame M2 and privates frame M3 can be formed by copper, silver or aluminium.In side circuit was used, the first lead frame M1 was biased to a reference potential node GND, and the second lead frame M2 is biased to a voltage source V dd, and privates frame M3 is biased to a voltage source V ss.The first lead frame M1 also comprises discharge jag S1 and S3, and the second lead frame M2 also comprises discharge jag S2, and privates frame M3 also comprises discharge jag S4.The shape of discharge jag S1, S2, S3 and S4 can be coniform, pyramidal, or for having the geometry of small curvature radius.Discharge jag S1 and S2 toward each other, to form a discharge assembly p3; Discharge jag S3 and S4 toward each other, to form a discharge assembly p2.Electronic building brick d1 structure is loaded on the first lead frame M1, and forms electric connection with the second lead frame M2 and privates frame M3 respectively by wire W1 and W2.
Fig. 3 C is the equivalent circuit diagram with electronic installation 30 of electrostatic discharge (ESD) protection, wherein the end of discharge assembly p2 and p3 respectively with the end coupling of the electronic building brick d1 of wish protection, the other end of discharge assembly p2 and p3 then is electrically connected with reference potential node GND.When static discharge phenomenon results from the second lead frame M2, one voltage official post discharge jag S1 and S2 conducting greater than the starting resistor of discharge assembly p3, static discharge current is disposed to reference potential node GND by discharge assembly p3, and reaches the effect that prevents that electronic building brick d1 from being destroyed by static discharge current; When static discharge phenomenon results from the second lead frame M3, one voltage official post discharge jag S3 and S4 conducting greater than the starting resistor of discharge assembly p2, static discharge current is disposed to reference potential node GND by discharge assembly p2, and reaches the effect that prevents that electronic building brick d1 from being destroyed by static discharge current.
Among Fig. 3 D display part embodiment; through having the profile of the electronic installation 31 of electrostatic discharge (ESD) protection after the encapsulation; wherein encapsulate material C1 and be formed at the first lead frame M1, the second lead frame M2 and privates frame M3 top, electronic building brick d1 and wire W1, W2 are covered.(or with substrate together) also forms space R3 and R2 among the encapsulation material C1, in the jag structure of will discharging respectively S1, S2 and S3, S4 partly are coated on.Medium in space R3 and the R2 generally can be air, only is not limited only to this, also can insert the material that has insulating property (properties) such as plastics etc.
Fig. 4 A is the plane graph that has the electronic installation 40 of electrostatic discharge (ESD) protection in one embodiment of the invention.Be light-emitting diode component for example at this embodiment electronic installation 40, but be not to be defined in this.Electronic installation 40 comprises one first lead frame M1, one second lead frame M2 and a privates frame M3, is formed at respectively on the substrate (not being shown in accompanying drawing).The first lead frame M1 is biased to a reference potential node GND, and the second lead frame M2 is biased to a voltage source V dd, and privates frame M3 is biased to a voltage source V ss.The first lead frame M1 also comprises discharge jag S1 and S3, and the second lead frame M2 also comprises discharge jag S2 and S5, and privates frame M3 also comprises discharge jag S4 and S6.The shape of discharge jag S1, S2, S3, S4, S5 and S6 can be coniform, pyramidal, or for having the geometry of small curvature radius.Wherein discharge jag S1 and S2 toward each other, to form a discharge assembly p3; Discharge jag S3 and S4 toward each other, to form a discharge assembly p2; Discharge jag S5 and S6 toward each other, to form a discharge assembly p4.Electronic building brick d1 structure is loaded on the first lead frame M1, and forms electric connection with the second lead frame M2 and privates frame M3 respectively by wire W1 and W2.
Fig. 4 B is the equivalent circuit diagram with electronic installation 40 of electrostatic discharge (ESD) protection, wherein the end of discharge assembly p2 and p3 respectively with the end coupling of the electronic building brick d1 of wish protection, the other end of discharge assembly p2 and p3 then is electrically connected with reference potential node GND; Discharge assembly p4 is then in parallel with the electronic building brick d1 of wish protection.When static discharge phenomenon results from the second lead frame M2, one voltage official post discharge jag S1 and S2 conducting greater than the starting resistor of discharge assembly p3, static discharge current is disposed to reference potential node GND by discharge assembly p3, and reaches the effect that prevents that electronic building brick d1 from being destroyed by static discharge current; When static discharge phenomenon results from the second lead frame M3, one voltage official post discharge jag S3 and S4 conducting greater than the starting resistor of discharge assembly p2, static discharge current is disposed to reference potential node GND by discharge assembly p2, and reaches the effect that prevents that electronic building brick d1 from being destroyed by static discharge current.When static discharge phenomenon results between the second lead frame M2 and the M3, one voltage official post discharge jag S5 and S6 conducting greater than the starting resistor of discharge assembly p4, static discharge current discharges by discharge assembly p4, and reaches the effect that prevents that electronic building brick d1 from being destroyed by static discharge current.
Electronic installation with electrostatic discharge (ESD) protection proposed by the invention is applicable in the semiconductor device fabrication processes, in particular for the light-emitting diode component of tool electrostatic discharge (ESD) protection is provided; Also can improve the problem that luminance that traditional zener diode protective device causes because of light absorption descends, and make simply, effect cheaply, and have the function of bidirectional protective.
Claims (19)
1. the electronic installation of a tool electrostatic discharge (ESD) protection comprises:
One first lead frame, this first lead frame have at least one the first discharge jag;
One second lead frame has at least one the second discharge jag; And
One electronic building brick is arranged on this first lead frame, the two ends of this electronic building brick be electrically connected respectively this first and this second lead frame;
This first and this second discharge jag be the subtend setting and separate a both set a distance; When electrostatic discharge event come across this first or during this second lead frame by this first and this second discharge jag carry out static discharge.
2. the electronic installation of a tool electrostatic discharge (ESD) protection comprises:
One first lead frame, this first lead frame have at least one the first discharge jag;
One second lead frame has at least one the second discharge jag, and this second lead frame is electrically connected to a reference potential node; And
One electronic building brick is electrically connected this first lead frame;
This first and this second discharge jag be the subtend setting and separate a both set a distance; When electrostatic discharge event comes across this first lead frame by this first and this second the discharge jag carry out static discharge.
3. the electronic installation of tool electrostatic discharge (ESD) protection according to claim 1 and 2 wherein also comprises an encapsulation material, in order to coating this electronic building brick, and this first, second lead frame of part, and expose this first and this second discharge jag.
4. the electronic installation of tool electrostatic discharge (ESD) protection according to claim 1 and 2 wherein also comprises an encapsulation material, in order to coat this electronic building brick and part this first with this second lead frame;
Wherein, this encapsulation material inside form in addition a discharge space in order to hold this first and this second the discharge jag, this discharge space can insert air, plastics etc. have insulator character medium one of them.
5. the electronic installation of tool electrostatic discharge (ESD) protection according to claim 1 and 2, wherein this first is formed by copper, silver or aluminium with this second lead frame.
6. the electronic installation of tool electrostatic discharge (ESD) protection according to claim 1 and 2, wherein this first and this second discharge jag be coniform, pyramidal or have the geometry of small curvature radius.
7. the electronic installation of tool electrostatic discharge (ESD) protection according to claim 1 and 2, wherein this first and this second discharge jag between this both set a distance, determine this first and this second discharge jag carry out the trigger voltage value of electrostatic discharge (ESD) protection.
8. the electronic installation of tool electrostatic discharge (ESD) protection according to claim 1 and 2, wherein this first and this second discharge jag this both set a distance be 1 micron to 200 microns.
9. the electronic installation of tool electrostatic discharge (ESD) protection according to claim 1 and 2, wherein this electronic building brick is light-emitting diode.
10. the electronic installation of tool electrostatic discharge (ESD) protection according to claim 1 wherein also comprises an earth lead frame, is electrically connected with a reference potential node;
Wherein this earth lead frame has at least one the 3rd discharge jag, is the subtend setting and separates a both set a distance with this first discharge jag of part; When electrostatic discharge event comes across this first lead frame by part this first and should be at least one the 3rd jag that discharges carry out static discharge.
11. the electronic installation of a tool electrostatic discharge (ESD) protection comprises:
One first lead frame has at least one the first discharge jag;
One second lead frame has at least one the second discharge jag;
One earth lead frame has at least one the 3rd discharge jag and at least one the 4th discharge jag;
One electronic building brick is arranged on this earth lead frame, the two ends of this electronic building brick be electrically connected respectively this first and this second lead frame;
This first and the 3rd discharge jag is the subtend setting and separates one first both set a distance; This second and the 4th discharge jag is the subtend setting and separates one second both set a distance; When electrostatic discharge event come across this first or during this second lead frame, carry out static discharge or carry out static discharge by this second and the 4th discharge jag by this first and the 3rd discharge jag.
12. the electronic installation of tool electrostatic discharge (ESD) protection according to claim 11, wherein this first lead frame also has at least one the 5th discharge jag, and this second lead frame also has at least one the 6th discharge jag, and the 5th and the 6th discharge jag is the subtend setting and separates one the 3rd both set a distance; When electrostatic discharge event come across this first or during this second lead frame, carry out static discharge by the 5th and the 6th discharge jag.
13. the electronic installation of tool electrostatic discharge (ESD) protection according to claim 11, wherein also comprise one the encapsulation material, in order to coat this electronic building brick, and the part this first and second lead frame, and expose this first to the 4th the discharge jag.
14. the electronic installation of tool electrostatic discharge (ESD) protection according to claim 11, wherein also comprise one the encapsulation material, in order to coat this electronic building brick and the part this first with this second lead frame;
Wherein, this encapsulation material inside form in addition two discharge spaces respectively in order to hold this first, the 3rd and this second, the 4th discharge jag, this discharge space can be inserted and select from one of them medium of air, plastics.
15. the electronic installation of tool electrostatic discharge (ESD) protection according to claim 11, wherein this first is formed by copper, silver or aluminium with this second lead frame.
16. the electronic installation of tool electrostatic discharge (ESD) protection according to claim 11, wherein this first to the 4th discharge jag is coniform, pyramidal or has the geometry of small curvature radius.
17. the electronic installation of tool electrostatic discharge (ESD) protection according to claim 11; wherein this first and second both set a distance determines that respectively this first and the 3rd discharge jag and this second and the 4th discharge jag carry out the trigger voltage value of electrostatic discharge (ESD) protection.
18. the electronic installation of tool electrostatic discharge (ESD) protection according to claim 11, wherein this first and this second both set a distance be 1 micron to 200 microns.
19. the electronic installation of tool electrostatic discharge (ESD) protection according to claim 11, wherein this electronic building brick is light-emitting diode.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100126298 | 2011-07-26 | ||
| TW100126298A TWI488282B (en) | 2011-07-26 | 2011-07-26 | Electronic device with electrostatic discharging protection and method of fabricating the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102903727A true CN102903727A (en) | 2013-01-30 |
Family
ID=47575893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103078254A Pending CN102903727A (en) | 2011-07-26 | 2011-10-12 | Electronic device with electrostatic discharge protection |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102903727A (en) |
| TW (1) | TWI488282B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105993204A (en) * | 2014-02-14 | 2016-10-05 | 欧司朗有限公司 | Lighting system comprising a protection circuit, and corresponding method for protecting light sources from electrostatic discharges |
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| JPH06224367A (en) * | 1993-01-22 | 1994-08-12 | Toshiba Corp | Integrated circuit |
| CN1529197A (en) * | 2003-10-17 | 2004-09-15 | 友达光电股份有限公司 | Static discharging protection structure |
| JP2006288687A (en) * | 2005-04-11 | 2006-10-26 | Sensatec Co Ltd | Touch sensor |
| CN101542856A (en) * | 2007-05-28 | 2009-09-23 | 株式会社村田制作所 | Esd protection device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI280820B (en) * | 2005-05-24 | 2007-05-01 | Benq Corp | A printed circuit board (PCB) with electrostatic discharge protection |
| US20080266730A1 (en) * | 2007-04-25 | 2008-10-30 | Karsten Viborg | Spark Gaps for ESD Protection |
| TW200945956A (en) * | 2008-04-22 | 2009-11-01 | Wintek Corp | Electrostatic discharge protection device for touch panels |
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2011
- 2011-07-26 TW TW100126298A patent/TWI488282B/en active
- 2011-10-12 CN CN2011103078254A patent/CN102903727A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06224367A (en) * | 1993-01-22 | 1994-08-12 | Toshiba Corp | Integrated circuit |
| CN1529197A (en) * | 2003-10-17 | 2004-09-15 | 友达光电股份有限公司 | Static discharging protection structure |
| JP2006288687A (en) * | 2005-04-11 | 2006-10-26 | Sensatec Co Ltd | Touch sensor |
| CN101542856A (en) * | 2007-05-28 | 2009-09-23 | 株式会社村田制作所 | Esd protection device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105993204A (en) * | 2014-02-14 | 2016-10-05 | 欧司朗有限公司 | Lighting system comprising a protection circuit, and corresponding method for protecting light sources from electrostatic discharges |
| CN105993204B (en) * | 2014-02-14 | 2017-12-08 | 欧司朗有限公司 | The correlation method of illuminator and protection light source including protection circuit from static discharge |
| US10455662B2 (en) | 2014-02-14 | 2019-10-22 | Osram Gmbh | Lighting system including a protection circuit, and corresponding method for protecting light sources from electrostatic discharges |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI488282B (en) | 2015-06-11 |
| TW201306223A (en) | 2013-02-01 |
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Application publication date: 20130130 |