CN102898991A - Ultralow-temperature epoxy adhesive - Google Patents
Ultralow-temperature epoxy adhesive Download PDFInfo
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- CN102898991A CN102898991A CN201210360216XA CN201210360216A CN102898991A CN 102898991 A CN102898991 A CN 102898991A CN 201210360216X A CN201210360216X A CN 201210360216XA CN 201210360216 A CN201210360216 A CN 201210360216A CN 102898991 A CN102898991 A CN 102898991A
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Abstract
An ultralow-temperature epoxy adhesive comprises, by mass, 50 parts to 60 parts of tetrahydrofuran polyether epoxy resins, 5 parts to 10 parts of KH-550 and 5 parts to 10 parts of 590 curing agents, and further comprises, by mass, 10 parts to 20 parts of dichloramine and 5 parts to 10 parts of phthalic anhydride. According to the ultralow-temperature epoxy adhesive which is modified, a formula is composed of 5 ingredients, the lower limit of the temperature range achieves minus 200 DEG C, and the epoxy adhesive can be cured in curing time of 24 hours in a condition of pressurization attaching and in a range of 3 to 4 hours in a heating curing condition.
Description
Technical field
The invention belongs to the sizing agent technical field, relate in particular to the glutinous agent of a kind of Ultra-Low-Temperature Epoxy Adhesive.
Background technology
The glutinous agent of Ultra-Low-Temperature Epoxy Adhesive is a class sizing agent that has adhesiveproperties under condition of ultralow temperature, can under the conditions such as liquid nitrogen (269 ℃), use and have certain bonding strength, be mainly used in the missile flight device, use bonding on the medical treatment of liquid nitrogen, liquid hydrogen and the experimental installation.Very low temperature gluing agent commonly used, take urethane or formulated as body of material with the Resins, epoxy of the urethane of epoxy resin modification and urethane, modified nylon etc., the adhesive for polyurethane that some low-temperature performance is good is also available usually.For example high-quality the entangling succeeded in developing of Beijing Aviation university; The agent of vanadium tree very low temperature gluing take Resins, epoxy as major ingredient, is selected mixed type solidifying agent and is correspondingly added agent, and bonding strength surpasses 18MPa in-269 ℃ of temperature ranges, reaches as high as 3MPa, still can reach 20MPa 140 ℃ of its bonding strengths.The proportioning composition of existing sizing agent is many, and when pursuing better low-temperature performance, cohesive strength and set time all sacrifice to some extent.
Summary of the invention
The technical problem that solves:The invention provides the glutinous agent of a kind of improved Ultra-Low-Temperature Epoxy Adhesive, composition is simple, is meeting under the low temperature working conditions, and shorten its set time, and cohesive strength improves.
Technical scheme:Ultra-Low-Temperature Epoxy Adhesive sticks agent, comprises 50～60 parts of tetrahydrofuran (THF) polyethers Resins, epoxy, 5～10 parts of KH-550, and 5～10 parts in 590 solidifying agent also comprise by mass parts: 10～20 parts of Cls, 5～10 parts of Tetra hydro Phthalic anhydrides.
Preferred version 1: formed by following composition by mass parts: 55 parts of tetrahydrofuran (THF) polyethers Resins, epoxy, 8 parts of KH-550,8 parts in 590 solidifying agent, 15 parts of Cls, 8 parts of Tetra hydro Phthalic anhydrides.
Preferred version 2: formed by following composition by mass parts: 60 parts of tetrahydrofuran (THF) polyethers Resins, epoxy, 10 parts of KH-550,10 parts in 590 solidifying agent, 20 parts of Cls, 10 parts of Tetra hydro Phthalic anhydrides.
Beneficial effect:The invention provides the glutinous agent of a kind of improved Ultra-Low-Temperature Epoxy Adhesive, prescription adopts 5 kinds of compositions to make, and the temperature range lower limit reaches-200 ℃, set time is when adopting the pressurizing attaching condition, 24 hours namely curable, and under the condition of being heating and curing, curing in 3～4 hours can be finished.
Embodiment
Embodiment 1
Ultra-Low-Temperature Epoxy Adhesive sticks agent, is comprised of following composition by mass parts: 55 parts of tetrahydrofuran (THF) polyethers Resins, epoxy, 8 parts of KH-550,8 parts in 590 solidifying agent, 15 parts of Cls, 8 parts of Tetra hydro Phthalic anhydrides.The present invention fills a prescription and adopts 5 kinds of compositions to make, and the temperature range lower limit reaches-195 ℃, and set time, 24 hours namely curable when adopting the pressurizing attaching condition, and under 40 ℃ of conditions of cure of heating, curing in 4 hours can be finished.
Embodiment 2
Ultra-Low-Temperature Epoxy Adhesive sticks agent, is comprised of following composition by mass parts: 60 parts of tetrahydrofuran (THF) polyethers Resins, epoxy, 10 parts of KH-550,10 parts in 590 solidifying agent, 20 parts of Cls, 10 parts of Tetra hydro Phthalic anhydrides.The invention provides the glutinous agent of a kind of improved Ultra-Low-Temperature Epoxy Adhesive, prescription adopts 5 kinds of compositions to make, and the temperature range lower limit reaches-200 ℃, set time is when adopting the pressurizing attaching condition, 24 hours namely curable, and under 60 ℃ of conditions of cure of heating, curing in 4 hours can be finished.
Claims (3)
1. the glutinous agent of Ultra-Low-Temperature Epoxy Adhesive comprises 50～60 parts of tetrahydrofuran (THF) polyethers Resins, epoxy, 5～10 parts of KH-550, and 5～10 parts in 590 solidifying agent is characterized in that also comprising by mass parts: 10～20 parts of Cls, 5～10 parts of Tetra hydro Phthalic anhydrides.
2. the glutinous agent of Ultra-Low-Temperature Epoxy Adhesive according to claim 1 is characterized in that being comprised of following composition by mass parts: 55 parts of tetrahydrofuran (THF) polyethers Resins, epoxy, 8 parts of KH-550,8 parts in 590 solidifying agent, 15 parts of Cls, 8 parts of Tetra hydro Phthalic anhydrides.
3. the glutinous agent of Ultra-Low-Temperature Epoxy Adhesive according to claim 1 is characterized in that being comprised of following composition by mass parts: 60 parts of tetrahydrofuran (THF) polyethers Resins, epoxy, 10 parts of KH-550,10 parts in 590 solidifying agent, 20 parts of Cls, 10 parts of Tetra hydro Phthalic anhydrides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210360216XA CN102898991A (en) | 2012-09-25 | 2012-09-25 | Ultralow-temperature epoxy adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210360216XA CN102898991A (en) | 2012-09-25 | 2012-09-25 | Ultralow-temperature epoxy adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102898991A true CN102898991A (en) | 2013-01-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210360216XA Pending CN102898991A (en) | 2012-09-25 | 2012-09-25 | Ultralow-temperature epoxy adhesive |
Country Status (1)
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| CN (1) | CN102898991A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103074020A (en) * | 2013-02-01 | 2013-05-01 | 中国工程物理研究院化工材料研究所 | Room-temperature cured, low-viscosity and low temperature-resistant adhesive |
| CN104559893A (en) * | 2015-01-27 | 2015-04-29 | 航天材料及工艺研究所 | Low-temperature epoxy resin adhesive and application thereof |
| CN104927755A (en) * | 2015-07-14 | 2015-09-23 | 黑龙江省科学院石油化学研究院 | Normal-temperature solidification instant-high-temperature-resistant high-flexibility epoxy adhesive and preparing method thereof |
| CN109207106A (en) * | 2018-09-11 | 2019-01-15 | 合肥绿普包装材料有限公司 | A kind of preparation method of the short curing time adhesive of ultralow temperature |
| CN113956828A (en) * | 2021-11-03 | 2022-01-21 | 上海华谊树脂有限公司 | Two-component epoxy adhesive |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101265399A (en) * | 2007-03-12 | 2008-09-17 | 中国科学院理化技术研究所 | Low-temperature epoxy adhesive |
| CN102190980A (en) * | 2011-03-28 | 2011-09-21 | 彩虹集团公司 | Low-temperature conductive adhesive and preparation method thereof |
-
2012
- 2012-09-25 CN CN201210360216XA patent/CN102898991A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101265399A (en) * | 2007-03-12 | 2008-09-17 | 中国科学院理化技术研究所 | Low-temperature epoxy adhesive |
| CN102190980A (en) * | 2011-03-28 | 2011-09-21 | 彩虹集团公司 | Low-temperature conductive adhesive and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 田晓蕾，冯润才: "端羧基四氢呋喃聚醚改性环氧树脂的研究", 《热固性树脂》 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103074020A (en) * | 2013-02-01 | 2013-05-01 | 中国工程物理研究院化工材料研究所 | Room-temperature cured, low-viscosity and low temperature-resistant adhesive |
| CN104559893A (en) * | 2015-01-27 | 2015-04-29 | 航天材料及工艺研究所 | Low-temperature epoxy resin adhesive and application thereof |
| CN104927755A (en) * | 2015-07-14 | 2015-09-23 | 黑龙江省科学院石油化学研究院 | Normal-temperature solidification instant-high-temperature-resistant high-flexibility epoxy adhesive and preparing method thereof |
| CN104927755B (en) * | 2015-07-14 | 2017-03-01 | 黑龙江省科学院石油化学研究院 | Resistance to TRANSIENT HIGH TEMPERATURE high flexibility epoxy adhesive of a kind of normal temperature cure and preparation method thereof |
| CN109207106A (en) * | 2018-09-11 | 2019-01-15 | 合肥绿普包装材料有限公司 | A kind of preparation method of the short curing time adhesive of ultralow temperature |
| CN113956828A (en) * | 2021-11-03 | 2022-01-21 | 上海华谊树脂有限公司 | Two-component epoxy adhesive |
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Application publication date: 20130130 |