CN103074020A - Room-temperature cured, low-viscosity and low temperature-resistant adhesive - Google Patents
Room-temperature cured, low-viscosity and low temperature-resistant adhesive Download PDFInfo
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- CN103074020A CN103074020A CN2013100409343A CN201310040934A CN103074020A CN 103074020 A CN103074020 A CN 103074020A CN 2013100409343 A CN2013100409343 A CN 2013100409343A CN 201310040934 A CN201310040934 A CN 201310040934A CN 103074020 A CN103074020 A CN 103074020A
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Abstract
The invention discloses a room-temperature cured, low-viscosity and low temperature-resistant adhesive. The adhesive comprises the following components in parts by weight: 100 parts of composite epoxy resin and 20 to 50 parts of composite curing agent, wherein the composite epoxy resin consists of two or three types of resorcinol epoxy resin, liquid glycidic ester epoxy resin and polyether epoxy, and the composite curing agent consists of one or two types of liquid polyetheramine and liquid aromatic amine and a curing accelerator. The prepared adhesive has the advantages that the viscosity is low, the room-time curing is carried out, the curing time is less than 24 hours, the cured adhesive has higher shearing strength and stable performance under the conditions of room temperature and liquid nitrogen temperature, and the preparing method is simple.
Description
Technical field
The present invention relates to a kind of tackiness agent, be specifically related to the tackiness agent of a kind of low viscosity, self-vulcanizing, anti-very low temperature.
Background technology
Ultra-low temperature glue mainly is used as the matrix resin of the cryogenic liquid gas matrix material storage tanks such as liquid nitrogen and liquid oxygen; Bonding as the low temperature resistant system of aerospace industry, bonding such as liquid hydrogen, liquid-oxygen motor system, liquid hydrogen, liquid oxygen tank casing and thermal insulation layer, and bonding between thermal insulation layer and outside surface sealing ply; Carry the outer thermal insulation layer of liquid hydrogen, liquid oxygen line bonding, and other with component that the very low temperature structure is connected between bonding; The aerospacecraft sealing is bonding; Superconducting device etc.
In low temperature adhesive research, the normal operation bisphenol A epoxide resin is as matrix resin, because pure Resins, epoxy has very high cross-linking density, even also there are at normal temperatures the shortcomings such as crisp, the low toughness of matter, shock resistance is poor.When temperature was down to low temperature, matrix internal cause thermal contraction and the internal stress and the frozen segment that produce make Resins, epoxy present larger fragility affected Resins, epoxy application at low temperatures.In the toughening modifying research to Resins, epoxy, the main the following aspects of the approach of its modification:
1. adding filler improves the low-temperature performance of glue, such as Mcclintock etc. the aluminium powder of employing filler is arranged, improve the fragility problem of glue as paying usefulness nano-rubber, carbon nanotube, the polyethersulfones etc. such as Shao Yun, it can be used under the liquid nitrogen temperature condition, but its viscosity is larger, solidification value is higher.
2. polyurethane modified epoxy resin., use and be subject to certain restriction damp and hot responsive with polyurethane modified epoxy resin, such as H.Lee and k.Neville, " Handbook of Epoxy Resin ", McGraw-Hill, New Youk, 15,11,1967.
3. modified nylon Resins, epoxy: the reaction needed of nylon and Resins, epoxy could be reacted about 170 ℃, and glue sample viscosity is large (M.B.Smith and S.E.Susman, Proc.of CEC ' 62 300-305,1962.)
4. the soft agent modified epoxy is one of approach that improves the Resins, epoxy resistance to low temperature by adopting Flexible Curing Agent.
Shanghai synthetic resins Research Institute and the low temperature glue product of selling, by tetrahydrofuran (THF) modified bisphenol A epoxy resin, modified amine 590 solidifying agent, KH550, the solidification value of this glue is degree more than 60, self-vulcanizing is chronic.
The employing Versamid that has is as the curing toughner of glue, the viscosity of polyamide curing agent is larger, this quasi-molecule has long fatty carbon chain, play inner toughening effect, room temperature can be solidified, set time is longer, generally all to be heating and curing, mention in publish an article " optimization design of low temperature curable epoxy resin adhesive formulations " such as Wang Rumin such as Northwestern Polytechnical University's department of chemistry engineering with Versamid PA-650 as solidifying toughner, its viscosity is larger, 40 ℃ of its conditions of cure/0.5h+60 ℃/0.5h/+80 ℃/2h.
The employing that has contains the Flexible Curing Agent of ehter bond, can play toughening effect to epoxy glue such as polyetheramine 230, can satisfy the very low temperature performance and use.Mention in the article " impact of Flexible Amine Modifier on Mechanical Properties of Epoxy Resins " of delivering such as Yang Guo of physics and chemistry institute of the Chinese Academy of Sciences etc. and publish an article " mixed type solidifying agent are on the impact of epoxy resin at room temp and cryogenic mechanics performance " such as Wang Rong of Wuhan University of Technology's college of materials science and engineering and use respectively Flexible Amine D230, D400 modified aromatic amine DETD (about 20% 3,5-diethyl-2,4-tolylene diamine and about 20%3,5-diethyl-2, the 6-tolylene diamine consists of) (in mass), condition of cure is respectively 60 ℃/8h+100 ℃/12h, 60 ℃/4h+100 ℃/4h/+130 ℃/10h, although low temperature and room temperature can be toughness reinforcing, can't realize room temperature rapid curing.The patent of invention of Zhao Lizhong application " low temperature adhesive and the solidifying agent that is used for low temperature adhesive ", its epoxy resin toughener mixes under 60～120 ℃ of conditions, and prepolymer is made in cooling; Add in proportion the varies solidifying agent, after stirring, add silane coupling agent, can use after mixing, also can in advance silane coupling agent be joined in the prepolymer of 30 ℃/72 hours Resins, epoxy and toughner or in the varies solidifying agent.Its condition of cure 30 ℃/72 hours, 60 ℃/8 hours, 160 ℃/2 hours, its solidifying agent was that amine condensation and aromatic amine are mixed, and adding polyetheramine and tertiary amine promotor, mixed.If amine condensation is or/and aromatic amine is solid, after amine condensation and aromatic amine mix, need be heated to dissolving, as heats 60～150 ℃, in cooling.This tackiness agent can obtain to have the two phase structure of toughness characteristics, and Resins, epoxy forms external phase, the two phase structure take toughner as disperse phase.Need in the production of adhesive process in this invention to heat up, the viscosity of glue is larger, and solidification value is higher, and set time is longer.
For the deficiencies in the prior art, the objective of the invention is to propose a kind of low temperature resistant tackiness agent of low viscosity self-vulcanizing.The present invention adopts the complex methods such as flexible epoxy, flexible amine curing agent toughness reinforcing to glue; The modes such as employing high reactivity epoxy reduce the solidification value of glue, the set time of reducing glue; Adopt low viscosity flexible epoxy and high reactivity epoxy to reduce the viscosity of glue, take into account simultaneously resistance to low temperature.Tackiness agent viscosity of the present invention is low, self-vulcanizing, and set time, the tackiness agent after the curing had higher shearing resistance under room temperature and liquid nitrogen temperature condition less than 24 hours, and stable performance, preparation method are simple.
Summary of the invention
The invention provides the low temperature resistant tackiness agent of a kind of room temperature-curing low-viscosity, comprise composite epoxy resin and composite curing agent, formulated by composite epoxy resin and composite curing agent, tackiness agent has short, the texts of anti-very low temperature of low viscosity, self-vulcanizing and set time.
In order to reach above-mentioned technique effect, the present invention takes following technical scheme:
The low temperature resistant tackiness agent of a kind of room temperature-curing low-viscosity is characterized in that comprising the component of following weight part:
The first component: 100 parts of composite epoxy resins, described composite epoxy resin are by Resorcinol type Resins, epoxy, and two or three in liquid glycidyl ester type epoxy resin and the polyethers epoxy forms;
The second component: composite curing agent 20-50 part, described composite curing agent is comprised of a kind of in liquid polyetheramine, the aromatic liquid amine or two kinds and curing catalyst.
According to a preferred embodiment of the invention, in above-mentioned tackiness agent, described composite epoxy resin is comprised of the component of following weight part: Resorcinol type Resins, epoxy 20-50 part, liquid glycidyl ester type epoxy resin 20-50 part, polyethers epoxy 0-30 part.
According to a preferred embodiment of the invention, in described tackiness agent, preferably: described composite curing agent is comprised of the component of following weight part: liquid polyetheramine 80-95 part, aromatic liquid amine 0-10 part, curing catalyst 5-20 part.
Described Resorcinol type Resins, epoxy contains ehter bond and links to each other with phenyl ring in the molecule, be characterized in that viscosity is little, and reactive behavior is high, and according to a preferred embodiment of the invention, described Resorcinol type Resins, epoxy is Resorcinol type Resins, epoxy 680.
Said liquid ethylene oxidic ester epoxy resin, contain two or two above glycidyl ester ester groups in its molecule, be characterized in that viscosity is less, resistance to low temperature is good, according to a preferred embodiment of the invention, described liquid glycidyl ester type epoxy resin is tetrahydrophthalic acid 2-glycidyl ester (711).
Described polyethers epoxy contains a plurality of ehter bonds in its molecular structure, according to a preferred embodiment of the invention, preferably: described polyethers epoxy is flexible polyethers epoxy; More preferably: described polyethers epoxy is polyglycol type epoxy resins.
Described liquid polyetheramine contains a plurality of ehter bonds in its molecular structure, according to a preferred embodiment of the invention, described liquid polyetheramine is at least a among polyetheramine EDR104, the polyetheramine EDR176.
Described aromatic liquid amine contains amido, phenyl ring and is liquid in its molecule, according to a preferred embodiment of the invention, described aromatic liquid amine is at least a among MXDA and the DETD.
Described curing catalyst comprises the tertiary amines curing catalyst, and according to a preferred embodiment of the invention, preferably: described curing catalyst is at least a among DMP-30, the BDMA.
The present invention has following beneficial effect compared to existing technology:
(1) prescription of the present invention adopts flexible-epoxy, flexible amine curing agent, strengthens the toughness of glue, has stronger toughness when the low temperature to guarantee glue.
(2) adopt the mode such as high reactivity epoxy to reduce the solidification value of glue, the set time of reducing glue.
(3) adopt low viscosity flexible-epoxy and high reactivity Resins, epoxy to reduce the viscosity of glue, take into account simultaneously resistance to low temperature.
(4) tackiness agent viscosity of the present invention is low, self-vulcanizing, and set time, the tackiness agent after the curing had higher shearing resistance under room temperature and liquid nitrogen temperature condition less than 24 hours, and stable performance, preparation method are simple.
Embodiment
In order to make purpose of the present invention, technical scheme and beneficial effect more clear, below in conjunction with specific embodiments of the invention the present invention is made further explanation and description.
The product application embodiment of present embodiment adopts under viscosity test and the normal temperature condition, drawing under the liquid nitrogen temperature condition cut strength test.
Viscosity test: after the glue sample mixed, under the envrionment conditions of 22 ℃ of probe temperatures, place the viscosity of testing the glue sample by rotational rheometer after 30 minutes.
The test aluminium flake: aluminium flake is of a size of: 76mm * 26mm * 2mm, and bonding plane: 25mm * 12.5mm, aluminium test piece sand papering is cleaned with gasoline, and is clean with alcohol wash.
Drawing under the liquid nitrogen temperature condition cut strength test: standard test specimen is produced in the requirement according to GB GB7124-86, test sample is put into liquid nitrogen soak more than 20 minutes, and rate of extension 2mm/s finishes drawing of sample and cuts strength test in liquid nitrogen.
Embodiment 1:
The first component: 20g Resorcinol type Resins, epoxy 680,20g tetrahydrophthalic acid 2-glycidyl ester (711), 10g polyglycol type epoxy resins (vitrification Der732) mixes, and the vacuum stripping bubble is stand-by.
The second component: the graceful polyetheramine EDR104 of 10g Hensel and 2g DMP-30 mix, and the vacuum stripping bubble is stand-by.
According to the first component: component B=10:2.4 ratio takes by weighing first, component B, and stirring is mixed, and glue is put into 22 ℃ of rooms, begins to record set time.
Glue evenly is coated on the aluminium test specimen of polishing, two aluminium test pieces are sticked together, make test sample, put into and anchor clamps are housed solidify self-vulcanizing 24H.Glue sample viscosity 0.1Pas, the shearing resistance under the normal temperature condition is 12.1MPa, the shearing resistance under the liquid nitrogen temperature condition is 17.5MPa.
Embodiment 2:
The first component: 20g Resorcinol type Resins, epoxy 680,20g tetrahydrophthalic acid 2-glycidyl ester (711), 10g polyglycol type epoxy resins (vitrification Der732) mixes, and the vacuum stripping bubble is stand-by.
The second component: the graceful polyetheramine EDR176 of 15g Hensel and 2g DMP-30 mix, and the vacuum stripping bubble is stand-by.
According to the first component: component B=10:3.4 ratio takes by weighing the first and second components, and stirring is mixed, and glue is put into 22 ℃ of rooms, begins to record set time.
Glue evenly is coated on the aluminium test specimen of polishing, two aluminium test pieces are sticked together, make test sample, put into and anchor clamps are housed solidify self-vulcanizing 24H.Glue sample viscosity 0.10Pas, the normal temperature shearing resistance is 13.6MPa, the shearing resistance under the liquid nitrogen temperature condition is 20.68MPa.
Embodiment 3:
The first component: 20g Resorcinol type Resins, epoxy 680,20g tetrahydrophthalic acid 2-glycidyl ester (711), 10g polyglycol type epoxy resins (vitrification Der732) mixes, and the vacuum stripping bubble is stand-by.
The second component: the graceful polyetheramine EDR176 of 15g Hensel, 0.5g DETD and 2g DMP-30 mix, and the vacuum stripping bubble is stand-by.
According to the first component: component B=10:3.4 ratio takes by weighing the first and second components, and stirring is mixed, and glue is put into 22 ℃ of rooms, begins to record set time.
Glue evenly is coated on the aluminium test specimen of polishing, two aluminium test pieces are sticked together, make test sample, put into and anchor clamps are housed solidify self-vulcanizing 24H.Glue sample viscosity 0.11Pas, the normal temperature shearing resistance is 12.0MPa, the shearing resistance under the liquid nitrogen temperature condition is 17MPa.
Embodiment 4:
The first component: 20g Resorcinol type Resins, epoxy 680,30g tetrahydrophthalic acid 2-glycidyl ester (711) mixes, and the vacuum stripping bubble is stand-by.
The second component: the graceful polyetheramine EDR176 of 32g Hensel and 4g DMP-30 mix, and the vacuum stripping bubble is stand-by.
According to the first component: component B=10:4 ratio takes by weighing the first and second components, and stirring is mixed, and glue is put into 22 ℃ of rooms, begins to record set time.
Glue evenly is coated on the aluminium test specimen of polishing, two aluminium test pieces are sticked together, make test sample, put into and anchor clamps are housed solidify self-vulcanizing 16H.Glue sample viscosity 0.12Pas, the normal temperature shearing resistance is 16.8MPa, the shearing resistance under the liquid nitrogen temperature condition is 19.6MPa.
Embodiment 5:
The first component: 20g Resorcinol type Resins, epoxy 680,30g tetrahydrophthalic acid 2-glycidyl ester (711) mixes, and the vacuum stripping bubble is stand-by.
The second component: the graceful polyetheramine EDR176 of 32g Hensel and 4g DMP-30 mix, and the vacuum stripping bubble is stand-by.
According to the first component: component B=10:4.5 ratio takes by weighing the first and second components, and stirring is mixed, and glue is put into 22 ℃ of rooms, begins to record set time.
Glue evenly is coated on the aluminium test specimen of polishing, two aluminium test pieces are sticked together, make test sample, put into and anchor clamps are housed solidify self-vulcanizing 16H.Glue sample viscosity 0.12Pas, the normal temperature shearing resistance is 17.8MPa, the shearing resistance under the liquid nitrogen temperature condition is 20.9MPa.
Embodiment 6:
The first component: 20g Resorcinol type Resins, epoxy 680,30g tetrahydrophthalic acid 2-glycidyl ester (711) mixes, and the vacuum stripping bubble is stand-by.
The second component: the graceful polyetheramine EDR176 of 32g Hensel and 4g BDMA mix, and the vacuum stripping bubble is stand-by.
According to the first component: component B=10:4.5 ratio takes by weighing the first and second components, and stirring is mixed, and glue is put into 22 ℃ of rooms, begins to record set time.
Glue evenly is coated on the aluminium test specimen of polishing, two aluminium test pieces are sticked together, make test sample, put into and anchor clamps are housed solidify self-vulcanizing 16H.Glue sample viscosity 0.12Pas, the normal temperature shearing resistance is 11.2MPa, the shearing resistance under the liquid nitrogen temperature condition is 15.6MPa.
Embodiment 7:
The first component: 20g Resorcinol type Resins, epoxy 680,20g tetrahydrophthalic acid 2-glycidyl ester (711), 10g polyglycol type epoxy resins (vitrification Der732) mixes, and the vacuum stripping bubble is stand-by.
The second component: the graceful polyetheramine EDR176 of 15g Hensel, 0.5g MXDA and 2g DMP-30 mix, and the vacuum stripping bubble is stand-by.
According to the first component: component B=10:3.4 ratio takes by weighing the first and second components, and stirring is mixed, and glue is put into 22 ℃ of rooms, begins to record set time.
Glue evenly is coated on the aluminium test specimen of polishing, two aluminium test pieces are sticked together, make test sample, put into and anchor clamps are housed solidify self-vulcanizing 24H.Glue sample viscosity 0.12Pas, the normal temperature shearing resistance is 10.8MPa, the shearing resistance under the liquid nitrogen temperature condition is 14.5MPa.
Although invention has been described with reference to explanatory embodiment of the present invention here, above-described embodiment only is the better embodiment of the present invention, embodiments of the present invention are not restricted to the described embodiments, should be appreciated that, those skilled in the art can design a lot of other modification and embodiments, and these are revised and embodiment will drop within the disclosed principle scope and spirit of the application.
Claims (10)
1. low temperature resistant tackiness agent of room temperature-curing low-viscosity is characterized in that comprising the component of following weight part:
100 parts of composite epoxy resins, described composite epoxy resin are by Resorcinol type Resins, epoxy, and two or three in liquid glycidyl ester type epoxy resin and the polyethers epoxy forms;
Composite curing agent 20-50 part, described composite curing agent is comprised of a kind of in liquid polyetheramine, the aromatic liquid amine or two kinds and curing catalyst.
2. the low temperature resistant tackiness agent of room temperature-curing low-viscosity according to claim 1, it is characterized in that described composite epoxy resin is comprised of the component of following weight part: Resorcinol type Resins, epoxy 20-50 part, liquid glycidyl ester type epoxy resin 20-50 part, polyethers epoxy 0-30 part.
3. the low temperature resistant tackiness agent of room temperature-curing low-viscosity according to claim 1 is characterized in that described composite curing agent is comprised of the component of following weight part: liquid polyetheramine 80-95 part, aromatic liquid amine 0-10 part, curing catalyst 5-20 part.
4. the low temperature resistant tackiness agent of room temperature-curing low-viscosity according to claim 1 is characterized in that described Resorcinol type Resins, epoxy is Resorcinol type Resins, epoxy 680.
5. the low temperature resistant tackiness agent of room temperature-curing low-viscosity according to claim 1 is characterized in that described liquid glycidyl ester type epoxy resin is tetrahydrophthalic acid 2-glycidyl ester (711).
6. the low temperature resistant tackiness agent of room temperature-curing low-viscosity according to claim 1 is characterized in that described polyethers epoxy is polyglycol type epoxy resins.
7. the low temperature resistant tackiness agent of room temperature-curing low-viscosity according to claim 1 is characterized in that described liquid polyetheramine is at least a among polyetheramine EDR104, the polyetheramine EDR176.
8. the low temperature resistant tackiness agent of room temperature-curing low-viscosity according to claim 1 is characterized in that described aromatic liquid amine is at least a among MXDA and the DETD.
9. the low temperature resistant tackiness agent of room temperature-curing low-viscosity according to claim 1 is characterized in that described curing catalyst comprises the tertiary amines curing catalyst.
10. according to claim 1 or the low temperature resistant tackiness agent of 9 described room temperature-curing low-viscosities, it is characterized in that described curing catalyst is at least a among DMP-30, the BDMA.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103897643A (en) * | 2014-03-12 | 2014-07-02 | 南京艾布纳密封技术有限公司 | Room-temperature cured high heat-proof epoxy adhesive |
| CN104559893A (en) * | 2015-01-27 | 2015-04-29 | 航天材料及工艺研究所 | Low-temperature epoxy resin adhesive and application thereof |
| CN104559813A (en) * | 2015-01-30 | 2015-04-29 | 中国工程物理研究院化工材料研究所 | Double cured adhesive suitable for ultralow-temperature environment and preparation method of double cured adhesive |
| CN106750189A (en) * | 2016-12-05 | 2017-05-31 | 中建材中岩科技有限公司 | Epoxy resin injecting paste material |
| CN108485567A (en) * | 2018-03-16 | 2018-09-04 | 韩德辉 | A kind of ultralow temperature glue and preparation method thereof |
| CN110437781A (en) * | 2019-08-15 | 2019-11-12 | 中国工程物理研究院化工材料研究所 | A kind of epoxy pouring sealant and preparation method thereof that room temperature curing is used in the case where temperature rushes environmental condition |
| CN111675948A (en) * | 2020-04-10 | 2020-09-18 | 苏州吉人高新材料股份有限公司 | Epoxy cryogenic-resistant anticorrosive paint |
| CN113307948A (en) * | 2021-07-15 | 2021-08-27 | 中国工程物理研究院化工材料研究所 | Mussel bionic phenolic aldehyde amine curing agent capable of being bonded underwater and preparation method thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103897643A (en) * | 2014-03-12 | 2014-07-02 | 南京艾布纳密封技术有限公司 | Room-temperature cured high heat-proof epoxy adhesive |
| CN104559893A (en) * | 2015-01-27 | 2015-04-29 | 航天材料及工艺研究所 | Low-temperature epoxy resin adhesive and application thereof |
| CN104559813A (en) * | 2015-01-30 | 2015-04-29 | 中国工程物理研究院化工材料研究所 | Double cured adhesive suitable for ultralow-temperature environment and preparation method of double cured adhesive |
| CN106750189A (en) * | 2016-12-05 | 2017-05-31 | 中建材中岩科技有限公司 | Epoxy resin injecting paste material |
| CN106750189B (en) * | 2016-12-05 | 2019-01-15 | 中建材中岩科技有限公司 | Epoxy resin injecting paste material |
| CN108485567A (en) * | 2018-03-16 | 2018-09-04 | 韩德辉 | A kind of ultralow temperature glue and preparation method thereof |
| CN110437781A (en) * | 2019-08-15 | 2019-11-12 | 中国工程物理研究院化工材料研究所 | A kind of epoxy pouring sealant and preparation method thereof that room temperature curing is used in the case where temperature rushes environmental condition |
| CN110437781B (en) * | 2019-08-15 | 2021-06-22 | 中国工程物理研究院化工材料研究所 | Room-temperature-curing epoxy pouring sealant used under warm-flushing environmental condition and preparation method thereof |
| CN111675948A (en) * | 2020-04-10 | 2020-09-18 | 苏州吉人高新材料股份有限公司 | Epoxy cryogenic-resistant anticorrosive paint |
| CN113307948A (en) * | 2021-07-15 | 2021-08-27 | 中国工程物理研究院化工材料研究所 | Mussel bionic phenolic aldehyde amine curing agent capable of being bonded underwater and preparation method thereof |
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Application publication date: 20130501 |