CN102898838A - Nanometer modified electronic silicone adhesive and preparation method of nanometer modified electronic silicone adhesive - Google Patents
Nanometer modified electronic silicone adhesive and preparation method of nanometer modified electronic silicone adhesive Download PDFInfo
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- CN102898838A CN102898838A CN2012104037557A CN201210403755A CN102898838A CN 102898838 A CN102898838 A CN 102898838A CN 2012104037557 A CN2012104037557 A CN 2012104037557A CN 201210403755 A CN201210403755 A CN 201210403755A CN 102898838 A CN102898838 A CN 102898838A
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Abstract
The invention relates to the technical field of electronic silicone adhesive, belongs to the improvement of the prior art and particularly relates to a nanometer modified electronic silicone adhesive and a preparation method of the nanometer modified electronic silicone adhesive. The nanometer modified electronic silicone adhesive comprises the following ingredients in percentage by weight: 0.5 to 30 percent of plasticizers, 2.0 to 6.0 percent of cross-linking agents, 8.0 to 32.0 percent of nanometer fillings, 0.2 to 1.0 percent of promoting agents and the rest polymers, wherein the sum of all ingredients is 100 percent. Compared with the prior art, the nanometer modified electronic silicone adhesive and the preparation method have the following advantages that 1, through the addition of the nanometer fillings, the mechanical performance, the extrusion performance, the high-temperature and corrosion resistance performance and the long-period stability of the adhesive body are effectively improved; and 2, during the production, the heating is not needed, the vulcanization speed is high, and the production cost is effectively reduce. When the nanometer modified electronic silicone adhesive and the method are applied, the market potential is great.
Description
Technical field
The present invention relates to electronics silicone adhesive technical field, is improvements over the prior art, is specifically related to a kind of nano modification electronics silicone adhesive.
Background technology
Silicone adhesive is a kind of material of widespread use in the electronic industry.Along with improving constantly of electronic industrial technology, and people's continuous intensification that miniaturization of electronic products, functional diversity etc. are required, the improved performance of electronics silicone adhesive becomes the importance of guaranteeing Quality of electronic products.But existing electronics silicone adhesive often exists permanent stability, high temperature corrosion, extrudability etc. does not reach the growing product performance requirement of electronic industry, causes the too early inefficacy of electronic product.
Disclose a kind of production method of silicone adhesive in the CN 101724268 A patents, used material comprises polysiloxane, linking agent, filler, softening agent, coupling agent and catalyzer.But the organo-tin compound that this invention is selected is environmental pollutant, especially can damage aquatic environment and human health, is imposed strict restriction by European Union's rules (EU) 276/2010.
Because nano material has the characteristics such as Biao Mian Xiao Ying ﹑ quantum size effect and macro quanta tunnel effect, make it aspect physics and chemistry, all demonstrate special performance, show multiple peculiar Wu Li ﹑ chemical property, thereby cause that people pay close attention to widely.
Summary of the invention
A kind of nano modification electronics silicone adhesive that the objective of the invention is to avoid above-mentioned weak point of the prior art and provide.This nano modification electronics silicone adhesive have good permanent stability, high temperature corrosion and extrudability, do not contain human body or environment caused advantages such as material than major injury.
Purpose of the present invention can realize by following measure:
Nano modification electronics silicone adhesive of the present invention, its ingredient weight percent (%) is:
Softening agent 0.5 ~ 30%
Linking agent 2.0 ~ 6.0%
Nano filling 8.0 ~ 32.0%
Promotor 0.2 ~ 1.0%
All the other are polymkeric substance, and each composition weight sum is 100%.
Described softening agent is the polydimethylsiloxane of trimethylammonium polydimethylsiloxane, the silica-based ethyl capping of triethoxy, one or more in the epoxy Toenol 1140.Its Main Function is the viscosity of regulating colloid, improves processing characteristics and the workability of colloid.
Described linking agent is one or more in methyl tributanoximo silane, tetraethoxy, methyl silicate, the Trimethoxy silane.Its Main Function is to form the cross-linked network system, improves the mechanical property of colloid.
Described Nano filling is one or more in nanometer silicon carbide, the nanomete talc powder.Because microscopic appearance and the crystalline structure of Nano filling self, its interpolation will make colloid obtain fabulous mechanical property, extrusion performance, high temperature corrosion, simultaneously because being evenly distributed with of Nano filling helps improve the colloid permanent stability.
Described promotor is ethylene thiourea, 2, one or more in the 2-dithio-bis-benzothiazole.Its Main Function is to improve vulcanization rate, reduce production costs, thereby plays simultaneously the permanent stability that the effect such as anti-oxidant, anti-bacteria further improves colloid.
Described polymkeric substance is α, alpha, omega-dihydroxy polydimethyl siloxane, α, one or more in poly-(dimethyl-methyl ethylene) siloxanes of ω-hydroxyl.Its Main Function is to give product the basic performance such as bonding.
The preparation method of nano modification electronics silicone adhesive of the present invention, comprise the steps: that (1) is successively with polymkeric substance, 0.5 ~ 30% softening agent, add in the vacuum planetary mixer, stir 30min ± 2min, wherein vacuum tightness is that 0.065 ~ 0.099MPa, rotating speed are 30r/min ± 5 r/min; (2) add successively 2.0 ~ 6.0% linking agents, 8.0 ~ 32.0% Nano fillings, 0.2 ~ 1.0% promotor again, stir 80min ± 20min, wherein vacuum tightness is that 0.065 ~ 0.099 MPa, rotating speed are 300 r/min ± 50 r/min; Namely get nano modification electronics silicone adhesive of the present invention.
The present invention has following advantage compared to existing technology: the one, the interpolation of Nano filling, Effective Raise the mechanical property of colloid, extrusion performance, high temperature corrosion and permanent stability; The 2nd, need not heating when producing, vulcanization rate is fast, effectively reduces production cost.The present invention is practical, and market potential is large.
Embodiment
Embodiment 1: α, alpha, omega-dihydroxy polydimethyl siloxane 89.3%
Trimethylammonium polydimethylsiloxane 0.5%
Methyl tributanoximo silane 2.0%
Nanometer silicon carbide 8.0%
2,2-dithio-bis-benzothiazole 0.2%
Embodiment 2: α, alpha, omega-dihydroxy polydimethyl siloxane 60.4%
Trimethylammonium polydimethylsiloxane 15.0%
Methyl tributanoximo silane 4.0%
Nanometer silicon carbide 20.0%
Ethylene thiourea 0.3%
2,2-dithio-bis-benzothiazole 0.3%
Embodiment 3: α, ω-hydroxyl gathers (dimethyl-methyl ethylene) siloxanes 33%
Epoxy Toenol 1140 30.0%
Methyl tributanoximo silane 6.0%
Nanometer silicon carbide 10.0%
Nanomete talc powder 20.0%
Ethylene thiourea 1.0%
Table 1 is the salient features Experimental Comparison data of embodiment of the invention 1-3 and a commercially available electronics silicone adhesive.
The salient features comparison of test results data of table 1 embodiment 1-3
Claims (7)
1. nano modification electronics silicone adhesive, its ingredient weight percent (%) is:
Softening agent 0.5 ~ 30%
Linking agent 2.0 ~ 6.0%
Nano filling 8.0 ~ 32.0%
Promotor 0.2 ~ 1.0%
All the other are polymkeric substance, and each composition weight sum is 100%.
2. nano modification electronics silicone adhesive according to claim 1, it is characterized in that: described softening agent is the polydimethylsiloxane of trimethylammonium polydimethylsiloxane, the silica-based ethyl capping of triethoxy, one or more in the epoxy Toenol 1140.
3. nano modification electronics silicone adhesive according to claim 1, it is characterized in that: described linking agent is one or more in methyl tributanoximo silane, tetraethoxy, methyl silicate, the Trimethoxy silane.
4. nano modification electronics silicone adhesive according to claim 1, it is characterized in that: described Nano filling is one or more in nanometer silicon carbide, the nanomete talc powder.
5. nano modification electronics silicone adhesive according to claim 1, it is characterized in that: described promotor is ethylene thiourea, 2, one or more in the 2-dithio-bis-benzothiazole.
6. nano modification electronics silicone adhesive according to claim 1, it is characterized in that: described polymkeric substance is α, alpha, omega-dihydroxy polydimethyl siloxane, α, one or more in poly-(dimethyl-methyl ethylene) siloxanes of ω-hydroxyl.
7. the preparation method of nano modification electronics silicone adhesive according to claim 1, it is characterized in that, comprise the steps: that (1) is successively with polymkeric substance, 0.5 ~ 30% softening agent, add in the vacuum planetary mixer, stir 30min ± 2min, wherein vacuum tightness is that 0.065 ~ 0.099MPa, rotating speed are 30r/min ± 5 r/min; (2) add successively 2.0 ~ 6.0% linking agents, 8.0 ~ 32.0% Nano fillings, 0.2 ~ 1.0% promotor again, stir 80min ± 20min, wherein vacuum tightness is that 0.065 ~ 0.099 MPa, rotating speed are 300 r/min ± 50 r/min; Namely get nano modification electronics silicone adhesive of the present invention.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2012104037557A CN102898838A (en) | 2012-10-22 | 2012-10-22 | Nanometer modified electronic silicone adhesive and preparation method of nanometer modified electronic silicone adhesive |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012104037557A CN102898838A (en) | 2012-10-22 | 2012-10-22 | Nanometer modified electronic silicone adhesive and preparation method of nanometer modified electronic silicone adhesive |
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| CN102898838A true CN102898838A (en) | 2013-01-30 |
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Cited By (3)
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| CN104497633A (en) * | 2014-11-25 | 2015-04-08 | 广西华纳新材料科技有限公司 | Nano calcium carbonate surface treatment method |
| CN105062078A (en) * | 2015-09-09 | 2015-11-18 | 蓝星（成都）新材料有限公司 | Silicon rubber for room-temperature quick-curing potting and preparation method thereof |
| CN105324364A (en) * | 2013-06-20 | 2016-02-10 | 莫门蒂夫性能材料股份有限公司 | Moisture curable compound with thiourea |
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| CN105324364A (en) * | 2013-06-20 | 2016-02-10 | 莫门蒂夫性能材料股份有限公司 | Moisture curable compound with thiourea |
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| CN104497633B (en) * | 2014-11-25 | 2017-04-19 | 广西华纳新材料科技有限公司 | Nano calcium carbonate surface treatment method |
| CN105062078A (en) * | 2015-09-09 | 2015-11-18 | 蓝星（成都）新材料有限公司 | Silicon rubber for room-temperature quick-curing potting and preparation method thereof |
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Application publication date: 20130130 |