CN102898786A - Epoxy molding compound for packaging tantalum capacitor and manufacturing method for epoxy molding compound - Google Patents
Epoxy molding compound for packaging tantalum capacitor and manufacturing method for epoxy molding compound Download PDFInfo
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- CN102898786A CN102898786A CN2012104333067A CN201210433306A CN102898786A CN 102898786 A CN102898786 A CN 102898786A CN 2012104333067 A CN2012104333067 A CN 2012104333067A CN 201210433306 A CN201210433306 A CN 201210433306A CN 102898786 A CN102898786 A CN 102898786A
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- ALSPQOZTYHSYEA-XNJYKOPJSA-N C/C=C1/OC1COc1cc(OCC2OC2)ccc1 Chemical compound C/C=C1/OC1COc1cc(OCC2OC2)ccc1 ALSPQOZTYHSYEA-XNJYKOPJSA-N 0.000 description 1
Abstract
The invention relates to an epoxy molding compound for packaging a tantalum capacitor and a manufacturing method for the epoxy molding compound, and belongs to the technical field of epoxy molding compounds. The epoxy molding compound for packaging the tantalum capacitor is characterized by comprising the following components in percentage by mass: 3 to 10 percent of multifunctional epoxy resin, 1 to 5 percent of multifunctional phenolic resin, 0.5 to 3 percent of reactive diluent, 0.5 to 2 percent of stress-releasing agent, 0.1 to 1 percent of accelerant and 70 to 90 percent of mineral filler. The manufacturing method comprises the following steps of: adding the components of the epoxy molding compound into a mixer, mixing the components uniformly, extruding the mixture by using a twin-screw extruder at the temperature of between 100 and 150 DEG C, cooling, crushing and performing pre-press molding to obtain the epoxy molding compound for packaging the tantalum capacitor. The epoxy molding compound for packaging the tantalum capacitor is halogen-free and antimony-free, can package tantalum capacitors at low temperature and under low pressure, and is low in stress, and high in moldability, relux resistance, wet resistance and reliability; the manufacturing method is convenient to operate, high in production efficiency, safe and reliable, and product quality is stable; and the epoxy molding compound is particularly suitable for packaging a polymer solid chip tantalum capacitor.
Description
Technical field
The invention belongs to the epoxy plastic cement technical field, particularly relate to a kind of tantalum electric capacity encapsulation epoxy plastic cement and preparation method thereof.
Background technology
At present, epoxy plastic cement mainly is comprised of Resins, epoxy, crosslinking and curing agent, curing catalyst and additive etc.Because it has many outstanding characteristics, such as thermostability preferably, insulativity, adhesivity, good mechanical property, good building-up properties and lower cost etc., be widely used in the encapsulation of tantalum capacitor spare.Compare alminium electrolytic condenser, the characteristics of tantalum electric capacity be the life-span long, high temperature resistant, accuracy is high, filter high-frequency harmonic performance is fabulous, the common tantalum electric capacity that replacement just gradually is traditional.Different from common tantalum electric capacity is, polymer tantalum electric capacity cathode layer be fragile macromolecule membrane, intensity is very low, this has just proposed very high requirement to encapsulating plastic cement.
When using traditional epoxy plastic cement encapsulation polymer tantalum electric capacity, can cause very large destruction by the anticathode layer, have a strong impact on electrical property, the reliability of tantalum electric capacity.And because the vulnerability of polymer tantalum capacitance cathode layer, the manufacturer of tantalum electric capacity generally adopts low injection pressure, lower package temperature, the destruction of reducing to greatest extent the anticathode layer in packaging process.But under this processing condition, there are a lot of shortcomings in common epoxy plastic cement, for example when low injection pressure encapsulation, can occur leaking the problems such as envelope, pore, when low temperature encapsulates, the problems such as long, disconnected muscle set time, sticking to mould can occur.
Summary of the invention
The present invention provides a kind of tantalum electric capacity encapsulation epoxy plastic cement and preparation method thereof for solving the technical problem that exists in the known technology.
One of purpose of the present invention provides a kind of halogen-free stibium-free, can satisfy the encapsulation of low temperature and low pressure, possesses simultaneously the tantalum electric capacity encapsulation epoxy plastic cement of the characteristics such as outstanding low-stress, formability, anti-backflow, wet fastness and reliability; Can when low injection pressure and low temperature injection moulding, have good formability.
Technological innovation of the present invention is that arrange in pairs or groups simultaneously reactive thinner and stress relief agent can be prepared the epoxy plastic cement of reaching above-mentioned purpose by use polyfunctional epoxy resin and multifunctional phenolic resin.
The technical scheme that tantalum electric capacity encapsulation of the present invention is taked with epoxy plastic cement is:
A kind of tantalum electric capacity encapsulation epoxy plastic cement, be characterized in: epoxy plastic cement contains following component, the mass percent of each component is polyfunctional epoxy resin 3-10%, multifunctional phenolic resin 1-5%, reactive thinner 0.5-3%, stress relief agent 0.5-2%, promotor 0.1-1%, mineral filler 70-90%;
Polyfunctional epoxy resin is one or more in trifunctional or the four-functional group epoxy resin, and structure is as shown in the formula shown in (1), (2), (3), (4):
Formula (1) formula (2)
Formula (3) formula (4)
Wherein n represents 1-10;
The multifunctional phenolic resin is in the resol that contains at least 2 hydroxyls in each molecule one or more, and its structure is suc as formula shown in (5) and (6):
Wherein n represents 1-10;
Reactive thinner is one or more in simple function group or the multi-functional Resins, epoxy, and structural formula is as shown in the formula (7), shown in (8):
The stress relief agent is one or more in organic silicone oil, silicone rubber powder, the silicone powders.
Tantalum electric capacity encapsulation of the present invention can also be adopted following technical scheme with epoxy plastic cement:
Epoxy plastic cement is used in described tantalum electric capacity encapsulation, and be characterized in: promotor is one or more in glyoxal ethyline, 2-phenyl-4 Methylimidazole, triphenyl phosphorus, the diazabicylo.
Epoxy plastic cement is used in described tantalum electric capacity encapsulation, and be characterized in: mineral filler is preparing spherical SiO 2, and the meta particle diameter is 5%-30% less than 5 microns mass percent.
Epoxy plastic cement is used in described tantalum electric capacity encapsulation, and be characterized in: epoxy plastic cement contains the pigment that mass percent is 0.1%-4%.Pigment can be selected carbon black.
Epoxy plastic cement is used in described tantalum electric capacity encapsulation, and be characterized in: epoxy plastic cement contains the coupling agent of mass percent 0.1%-1%.Coupling agent can be selected KH560.
Epoxy plastic cement is used in described tantalum electric capacity encapsulation, and be characterized in: epoxy plastic cement contains the releasing agent that mass percent is 0.1%-1%.Releasing agent can be selected carnauba wax.
Two of purpose of the present invention provides a kind of polymer solid sheet type tantalum electric capacity that is applicable to encapsulate, and is easy to operate, safe and reliable, steady quality, the tantalum electric capacity encapsulation of the production efficiency high preparation method of epoxy plastic cement.
Tantalum electric capacity of the present invention encapsulation with the technical scheme that the preparation method of epoxy plastic cement takes is:
A kind of tantalum electric capacity encapsulation preparation method of epoxy plastic cement, be characterized in: will contain following component, the mass percent of each component is polyfunctional epoxy resin 3-10%, multifunctional phenolic resin 1-5%, reactive thinner 0.5-3%, stress relief agent 0.5-2%, promotor 0.1-1%, the epoxy plastic cement of mineral filler 70-90%, join in the mixing machine and mix, extrude under 100-150 ℃ through twin screw extruder, pre-molding behind cooling crush obtains tantalum electric capacity encapsulation epoxy plastic cement.
Advantage and positively effect that the present invention has are:
The polyfunctional epoxy resin that epoxy plastic cement of the present invention is used and resol are because its rapidly-curable, can be that plastic cement can reach higher cross-linking density under lower temperature, satisfy normal encapsulation requirement, simultaneously by the use of spherical silicon powder and the interpolation of reactive thinner, can reduce significantly the melt viscosity of epoxy plastic cement, guarantee that plastic cement has good flowability under lower pressure, satisfy the seal pressure requirement of product.Because the vulnerability of polymer tantalum capacitance cathode layer is used global-type silicon-dioxide and stress relief agent, greatly reduces the internal stress of epoxy plastic cement, has improved the reliability of tantalum electric capacity.
Tantalum electric capacity encapsulates with epoxy plastic cement and preparation method thereof owing to adopted the brand-new technical scheme of the present invention, compared with prior art, the present invention has halogen-free stibium-free, can satisfy the encapsulation of low temperature and low pressure, possess simultaneously outstanding low-stress, formability, anti-backflow, wet fastness and reliability, and easy to operate, safe and reliable, steady quality, the production efficiency advantages of higher; Can when low injection pressure and low temperature injection moulding, have good formability, be specially adapted to encapsulate polymer solid sheet type tantalum electric capacity.
Embodiment
For further understanding summary of the invention of the present invention, Characteristic, hereby exemplify following examples, and be described in detail as follows:
Embodiment 1
Epoxy plastic cement is used in the encapsulation of tantalum electric capacity, and each component according to the weighing of table 1 ratio, is mixed, and the material that mixes is spent melting mixings at twin screw extruder with 100, pulverizes pancake making machine pre-molding, test products performance index after the compressing tablet cooling.
Embodiment 2
Each component according to the weighing of table 1 ratio, is mixed, the material that mixes is spent melting mixings at twin screw extruder with 120, pulverize pancake making machine pre-molding, test products performance index after the compressing tablet cooling.
Embodiment 3
Each component according to the weighing of table 1 ratio, is mixed, the material that mixes is spent melting mixings at twin screw extruder with 150, pulverize pancake making machine pre-molding, test products performance index after the compressing tablet cooling.
Embodiment 4
Each component according to the weighing of table 1 ratio, is mixed, the material that mixes is spent melting mixings at twin screw extruder with 120, pulverize pancake making machine pre-molding, test products performance index after the compressing tablet cooling.
Embodiment 5
Each component according to the weighing of table 1 ratio, is mixed, the material that mixes is spent melting mixings at twin screw extruder with 120, pulverize pancake making machine pre-molding, test products performance index after the compressing tablet cooling.
Embodiment 6
Each component according to the weighing of table 1 ratio, is mixed, the material that mixes is spent melting mixings at twin screw extruder with 120, pulverize pancake making machine pre-molding, test products performance index after the compressing tablet cooling.
Embodiment 7
Each component according to the weighing of table 1 ratio, is mixed, the material that mixes is spent melting mixings at twin screw extruder with 120, pulverize pancake making machine pre-molding, test products performance index after the compressing tablet cooling.
The comparative example 1
Except Resins, epoxy and solidifying agent use is common o-cresol epoxy resin and common resol, other each components are identical with ratio in the table 1, mix, the material that mixes is spent melting mixings at twin screw extruder with 120, pulverize after the compressing tablet cooling, the pancake making machine pre-molding, the test products performance index.
The comparative example 2
Except not adding the reactive thinner, other each components are identical with ratio in the table 1, mix, and the material that mixes is spent melting mixings at twin screw extruder with 120, pulverize pancake making machine pre-molding, test products performance index after the compressing tablet cooling.
The comparative example 3
Except not adding the stress relief agent, other each components are identical with ratio in the table 1, mix, and the material that mixes is spent melting mixings at twin screw extruder with 120, pulverize pancake making machine pre-molding, test products performance index after the compressing tablet cooling.
Use following mineral filler:
Mineral filler 1: median particle diameter is the spherical silica of 2 μ m
Mineral filler 2: median particle diameter is the spherical silica of 20 μ m
Use following Resins, epoxy
Resins, epoxy 1: formula (1) structural epoxy resins
Resins, epoxy 2: formula (2) structural epoxy resins
Resins, epoxy 3: formula (3) structural epoxy resins
Resins, epoxy 4: formula (4) structural epoxy resins
Use following solidifying agent:
Solidifying agent 1: formula (5) structure phenolic aldehyde resin
Solidifying agent 2: formula (6) structure phenolic aldehyde resin
Use following epoxide diluent:
Reactive thinner 1: the reactive thinner of formula (7) structure
Reactive thinner 2: the reactive thinner of formula (8) structure
Use following curing catalyst
Curing catalyst 1:2-Methylimidazole
Curing catalyst 2: triphenyl phosphorus
Curing catalyst 3: diazabicylo
Use following stress relief agent
Stress relief agent 1:PMX200
Stress relief agent 2:DY33
Table 1
Product performance:
1. helix length
In low temperature (150 ℃) and low pressure (5MPa) situation, the length of flow of test plastic cement in mould, the flowability of the longer explanation plastic cement of helix length is better, and encapsulation performance is better.
2. set time
Use the gel instrument to measure plastic cement gel time in 150 ℃ of situations, set time, the curing performance of shorter explanation plastic cement was better.
3. hot hardness
Hardness during hot when using Shore durometer to measure 150 ℃ of plastic cements to solidify 45 seconds, the curing of the higher explanation plastic cement of hardness is better.
4. linear expansivity
Use TMA to measure linear expansivity α 1 and the α 2 of plastic cement before and after the Tg point, the coefficient of expansion is less, illustrates that the stress when plastic cement solidifies is lower, and the reliability of encapsulating products is higher.
5. thermal shock experiment
Use the plastic cement encapsulation polymer tantalum electric capacity among the embodiment, the thermal shock that then product is carried out 5 circulations, the leakage current of test products after taking out, the qualification rate of test products.Qualification rate is higher, illustrates that the stress of plastic cement is less, and the reliability of product is higher.
The result who tests each embodiment and comparative example is as shown in table 2
Each embodiment product performance of table 2
Claims (7)
1. a tantalum electric capacity encapsulates and uses epoxy plastic cement, it is characterized in that: epoxy plastic cement contains following component, the mass percent of each component is polyfunctional epoxy resin 3-10%, multifunctional phenolic resin 1-5%, reactive thinner 0.5-3%, stress relief agent 0.5-2%, promotor 0.1-1%, mineral filler 70-90%;
Polyfunctional epoxy resin is one or more in trifunctional or the four-functional group epoxy resin, and structure is as shown in the formula shown in (1), (2), (3), (4):
Formula (1) formula (2)
Formula (3) formula (4)
Wherein n represents 1-10;
The multifunctional phenolic resin is in the resol that contains at least 2 hydroxyls in each molecule one or more, and its structure is suc as formula shown in (5) and (6):
Formula (6)
Wherein n represents 1-10;
Reactive thinner is one or more in simple function group or the multi-functional Resins, epoxy, and structural formula is as shown in the formula (7), shown in (8):
Formula (7)
The stress relief agent is one or more in organic silicone oil, silicone rubber powder, the silicone powders.
2. epoxy plastic cement is used in tantalum electric capacity encapsulation according to claim 1, and it is characterized in that: promotor is one or more in glyoxal ethyline, 2-phenyl-4 Methylimidazole, triphenyl phosphorus, the diazabicylo.
3. epoxy plastic cement is used in tantalum electric capacity encapsulation according to claim 1, and it is characterized in that: mineral filler is preparing spherical SiO 2, and the meta particle diameter is 5%-30% less than 5 microns mass percent.
4. according to claim 1, the encapsulation of 2 or 3 described tantalum electric capacity uses epoxy plastic cement, it is characterized in that: epoxy plastic cement contains the pigment that mass percent is 0.1%-4%.
5. according to claim 1, the encapsulation of 2 or 3 described tantalum electric capacity uses epoxy plastic cement, it is characterized in that: epoxy plastic cement contains the coupling agent of mass percent 0.1%-1%.
6. according to claim 1, the encapsulation of 2 or 3 described tantalum electric capacity uses epoxy plastic cement, it is characterized in that: epoxy plastic cement contains the releasing agent that mass percent is 0.1%-1%.
7. tantalum electric capacity according to claim 1 encapsulates the preparation method with epoxy plastic cement, it is characterized in that: will contain following component, the mass percent of each component is polyfunctional epoxy resin 3-10%, multifunctional phenolic resin 1-5%, reactive thinner 0.5-3%, stress relief agent 0.5-2%, promotor 0.1-1%, the epoxy plastic cement of mineral filler 70-90%, join in the mixing machine and mix, extrude under 100-150 ℃ through twin screw extruder, pre-molding behind cooling crush obtains tantalum electric capacity encapsulation epoxy plastic cement.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104017332A (en) * | 2014-06-09 | 2014-09-03 | 浙江恒耀电子材料有限公司 | Preparation method for environment-friendly epoxy molding composite material for encapsulating tantalum capacitor |
| CN105385101A (en) * | 2015-12-14 | 2016-03-09 | 苏州鑫德杰电子有限公司 | Packaging material of high capacity film capacitor |
| CN107004482A (en) * | 2014-12-04 | 2017-08-01 | 日东电工株式会社 | Soft magnetism resin combination and soft magnetic film |
| CN112980139A (en) * | 2019-12-17 | 2021-06-18 | 衡所华威电子有限公司 | Epoxy resin composition for tantalum capacitor packaging and preparation method thereof |
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| CN1621479A (en) * | 2003-11-26 | 2005-06-01 | 江苏中电华威电子股份有限公司 | Epoxy resin composition for semiconductor packaging and its preparation |
| CN1876740A (en) * | 2006-07-12 | 2006-12-13 | 海洋化工研究院 | Solvent-free expansion type fire-proof epoxy coating and its preparation method |
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| CN1621479A (en) * | 2003-11-26 | 2005-06-01 | 江苏中电华威电子股份有限公司 | Epoxy resin composition for semiconductor packaging and its preparation |
| CN1876740A (en) * | 2006-07-12 | 2006-12-13 | 海洋化工研究院 | Solvent-free expansion type fire-proof epoxy coating and its preparation method |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104017332A (en) * | 2014-06-09 | 2014-09-03 | 浙江恒耀电子材料有限公司 | Preparation method for environment-friendly epoxy molding composite material for encapsulating tantalum capacitor |
| CN107004482A (en) * | 2014-12-04 | 2017-08-01 | 日东电工株式会社 | Soft magnetism resin combination and soft magnetic film |
| US10636553B2 (en) | 2014-12-04 | 2020-04-28 | Nitto Denko Corporation | Soft magnetic resin composition and soft magnetic film |
| CN105385101A (en) * | 2015-12-14 | 2016-03-09 | 苏州鑫德杰电子有限公司 | Packaging material of high capacity film capacitor |
| CN105385101B (en) * | 2015-12-14 | 2017-12-05 | 南安市威速电子科技有限公司 | The encapsulating material of Large Copacity thin-film capacitor |
| CN112980139A (en) * | 2019-12-17 | 2021-06-18 | 衡所华威电子有限公司 | Epoxy resin composition for tantalum capacitor packaging and preparation method thereof |
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Effective date of registration: 20230412 Address after: No.27, Yijing Road, Dongli District, Tianjin Patentee after: TIANJIN KAIHUA INSULATING MATERIALS Co.,Ltd. Address before: No. 27 Yijing Road, Dongli Development Zone, Dongli District, Tianjin, 300300 Patentee before: TIANJIN SHENGYUANDA TECH CO.,LTD. |
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