CN115466486B - Epoxy resin composition and preparation method thereof - Google Patents
Epoxy resin composition and preparation method thereof Download PDFInfo
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- CN115466486B CN115466486B CN202210798377.0A CN202210798377A CN115466486B CN 115466486 B CN115466486 B CN 115466486B CN 202210798377 A CN202210798377 A CN 202210798377A CN 115466486 B CN115466486 B CN 115466486B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
The invention relates to the field of C08L63/00, in particular to an epoxy resin composition and a preparation method thereof, wherein the epoxy resin composition is provided by adopting 4-14 parts of epoxy resin, 2-9 parts of curing agent, 78-92 parts of inorganic filler, 0.05-1 part of catalyst and 0-6 parts of additive. The epoxy resin composition provided by the invention can improve the glass transition temperature (Tg) of the packaging material to meet the requirement of high-temperature application, and simultaneously can reduce the internal stress of a device by adding the novel structural resin or the flexible resin to reduce the modulus of the material, so that the delamination resistance and the reliability are improved, and the epoxy resin composition is effectively applied to the field of electronic packaging.
Description
Technical Field
The invention relates to the field of C08L63/00, in particular to an epoxy resin composition and a preparation method thereof.
Background
The third-generation semiconductor SiC device can obviously reduce the power lost by a motor control system of a pure electric vehicle or a hybrid electric vehicle, and realize low power consumption; the power device produced by the SiC process has lower on-resistance, smaller chip size and higher working frequency, and can withstand higher environmental temperature; the high integration of the power module also puts new demands on the stress of the packaging material.
Chinese patent CN109486100a discloses an epoxy resin composition for electronic packaging and a preparation method thereof, which uses epoxy resin, phenolic resin, curing accelerator, inorganic filler and the like as main raw materials, so that the provided epoxy resin composition for electronic packaging has low warpage, high fluidity and high adhesive property, but cannot meet the use requirement under high temperature condition; chinese patent CN101245173B discloses an epoxy resin electronic packaging material and an electronic component encapsulated by the same, which uses epoxy resin, nano silica, a curing agent, an inorganic filler and an auxiliary agent as raw materials to improve the heat resistance and water absorption resistance of the epoxy resin electronic packaging material, but the internal stress of the packaging material cannot be effectively reduced, and the delamination resistance and the reliability are required to be further improved.
Therefore, in view of the above problems, the present invention provides an epoxy resin composition and a method for preparing the same, which improves the glass transition temperature (Tg) of a packaging material to satisfy high temperature applications through optimization of formulation design and process, and simultaneously reduces the flexural modulus of the material by adding a novel structural resin or a flexible resin to reduce the internal stress of a device, thereby improving delamination resistance and reliability.
Disclosure of Invention
The invention provides an epoxy resin composition, which is prepared from the following raw materials in parts by weight: 4-14 parts of epoxy resin, 2-9 parts of curing agent, 78-92 parts of inorganic filler, 0.05-1 part of catalyst and 0-6 parts of additive.
As a preferred embodiment, the epoxy resin comprises at least two epoxy groups; preferably, the epoxy resin is selected from the group consisting of multifunctional structures, novel multifunctional structures, polyaromatic ring structures, ortho-cresol structured epoxy resins, and combinations thereof.
Preferably, the epoxy resin comprises one of the following formulas (I), (II), (III), (IV), (V) and (VI) or a combination thereof:
formula (I):
formula (II):
formula (iii):
formula (iv):
formula (v):formula (VI):
as a preferred technical scheme, n1-n6 in the formula (I), the formula (II), the formula (III), the formula (IV) and the formula (V) are respectively 1, 2 or 3.
Preferably, the epoxy resin has an epoxy equivalent of 160-300g/eq, represented by formula (I), formula (II), formula (III), formula (IV) and formula (V);
preferably, the epoxy resin of formula (I) has an epoxy equivalent weight of 163-175g/eq; the epoxy equivalent of the epoxy resin formula (II) is 200-220g/eq; the epoxy equivalent of the epoxy resin formula (III) is 270-284g/eq; the epoxy equivalent of the epoxy resin formula (IV) is 194-204g/eq; the epoxy equivalent of the epoxy resin formula (V) is 250-280g/eq; the epoxy equivalent of the epoxy resin formula (VI) is 187-197g/eq; the epoxy resin is of formula (I), formula (II), formula (III), formula (IV), formula (V) and formula (VI) from Shanghai semiconductor materials limited company.
Based on the system of the invention, the epoxy resin with the specific structure (I), the specific structure (II), the specific structure (III), the specific structure (IV) and the specific structure (V) is adopted, so that the glass transition temperature of the epoxy resin composition is improved, and meanwhile, the product has the characteristics of good heat resistance and good flexibility. In addition, the inventor finds that the introduction of the epoxy resin with the specific structure is beneficial to reducing the flexural modulus of the epoxy resin composition, absorbing thermal stress, improving delamination resistance and reliability and ensuring the subsequent practical application effect in the research process. The inventors analyzed the cause may be: the epoxy groups in the multifunctional epoxy resin formula (I) and the novel epoxy resin formula (II) have high density, and react with a curing agent in a system to obtain a high-crosslinking-density product, so that the glass transition temperature (Tg) is effectively improved; meanwhile, the multi-aromatic ring type epoxy resin formula (III) and the dicyclopentadiene epoxy resin formula (V) are beneficial to reducing the flexural modulus and absorbing the thermal stress after being added due to the special molecular structure.
As a preferable technical scheme, the curing agent is a phenolic resin curing agent.
Preferably, the phenolic resin curing agent is selected from the group consisting of a multi-functional structure, a multi-aromatic ring structure, a phenolic resin and combinations thereof, wherein the multi-functional structure is represented by formula (VII), the multi-aromatic ring structure is represented by formula (VIII), and the phenolic resin is represented by formula (IX):
formula (VII):formula (viii):formula (IX): />
Preferably, n7-n9 in the formula (VII), the formula (VIII) and the formula (IX) are respectively 1, 2 or 3.
Preferably, the hydroxyl equivalent weight in the phenolic resin curing agent formula (VII), formula (VIII) and formula (IX) is 90-210g/eq;
preferably, the phenolic resin curing agent has a hydroxyl equivalent weight of 96-106g/eq of formula (VII); the hydroxyl equivalent of the phenolic resin curing agent formula (VIII) is 190-210g/eq; the hydroxyl equivalent of the phenolic resin curing agent in the formula (IX) is 104-108g/eq; the phenolic resin curing agent is of the formulas (VII), (VIII) and (IX) from Shanghai semiconductor materials limited company.
Based on the epoxy resin in the system, the multifunctional bonded phenolic resin curing agent is adopted, and the density of hydroxyl groups in the curing agent is high, so that the cured epoxy resin composition has high crosslinking density, the glass transition temperature of the epoxy resin composition is effectively improved, and meanwhile, the viscosity is lower, and the production and the processing are easy. The adoption of the multi-aromatic ring type phenolic resin curing agent is beneficial to reducing the flexural modulus, so that the provided epoxy resin composition has excellent flexibility and adhesive property.
As a preferable technical scheme, the mass ratio of the epoxy resin to the inorganic filler is (4-14): (80-88); preferably, the inorganic filler is selected from crystalline silica, angular dioxygenSilicon oxide, spherical silica, alumina, and combinations thereof. Preferably, the inorganic filler is spherical silica; preferably, the particle size of the spherical silicon dioxide is less than or equal to 75um; the spherical silica has a median particle diameter (D50) of 20um and a Specific Surface Area (SSA) of 2.5m 2 And/g, purchased from Jiangsu-associated New Material Co., ltd.
As a preferred embodiment, the catalyst is selected from imidazoles, triphenylphosphine-benzoquinone adducts, and combinations thereof; preferably, the catalyst is selected from triphenylphosphine, triphenylphosphine-benzoquinone adducts, and combinations thereof.
As a preferred embodiment, the additive is selected from one or more of the following: a coupling agent, a colorant, and a mold release agent; preferably, the coupling agent is selected from the group consisting of 3- (glycidoxypropyl) trimethoxysilane, 3-mercaptopropyl trimethoxysilane, 3-aminopropyl trimethoxysilane, and combinations thereof; preferably, the coupling agent is a combination of 3- (glycidoxypropyl) trimethoxysilane, 3-mercaptopropyl trimethoxysilane, 3-aminopropyl trimethoxysilane.
Preferably, the colorant is carbon black; preferably, the release agent is natural wax or synthetic wax; preferably, the release agent is carnauba wax.
As a preferred embodiment, the epoxy resin composition has one or more of the following properties:
A. curing at 175+ -2deg.C for 90 seconds with a helical flow length of 25-55 inches;
B. gelation time is 25-55 seconds at 175+ -2deg.C;
C. glass transition temperature 175-225 ℃ at 175+/-2 ℃;
D. the flexural modulus is 25MPa or less at 25 ℃.
In another aspect, the present invention provides a method for preparing an epoxy resin composition, comprising at least the steps of:
(1) Respectively pulverizing epoxy resin and curing agent to obtain powder, packaging, sealing, and preserving at low temperature;
(2) Adding inorganic filler, catalyst and additive into a high-speed stirrer in batches for stirring and mixing, and adding the epoxy resin and curing agent which are crushed in the step (1) for mixing;
(3) And pouring the uniformly mixed mixture into an extruder for mixing, and cooling and crushing the mixture to obtain the modified polypropylene composite material.
Preferably, the device for crushing in the step (1) is a resin crusher, and the crushing temperature is less than or equal to 25 ℃;
preferably, the temperature of the stirring and mixing of the high-speed stirrer in the step (2) is less than or equal to 25 ℃;
preferably, the extruder in the step (3) is a single screw extruder or a double screw extruder; preferably, the extrusion temperature of the extruder in the step (3) is 90-120 ℃.
The epoxy resin composition product is hermetically stored in a low-temperature environment; the temperature of the low temperature environment is lower than 5 ℃.
In a third aspect, the present invention provides an application of an epoxy resin composition in electronic packaging.
Advantageous effects
1. The invention provides an epoxy resin composition and a preparation method thereof, wherein the glass transition temperature (Tg) of a packaging material is improved to meet the requirement of high-temperature application through the design of a formula and the optimization of a process, and meanwhile, the flexural modulus of the material is reduced through the addition of a novel structural resin or the addition of a flexible resin, so that the internal stress of a device is reduced, and the delamination resistance and the reliability are improved.
2. Based on the system, the epoxy resin with specific structures (I), formula (II), formula (III), formula (IV) and formula (V) is introduced into the control system, so that the glass transition temperature of the epoxy resin composition is improved, and meanwhile, the product has the characteristics of good heat resistance and flexibility.
3. According to the invention, the epoxy resin with a specific structure is introduced, so that the flexural modulus of the epoxy resin composition is reduced, the thermal stress is absorbed, the delamination resistance and the reliability are improved, and the subsequent practical application effect is ensured.
4. Based on the epoxy resin in the system, the multifunctional bonded phenolic resin curing agent is adopted, and the density of hydroxyl groups in the curing agent is high, so that the cured epoxy resin composition has high crosslinking density, the glass transition temperature of the epoxy resin composition is effectively improved, and meanwhile, the viscosity is lower, and the production and the processing are easy.
Detailed Description
Examples
In one aspect, examples 1-10 of the present invention provide an epoxy resin composition, the preparation materials of which are specifically shown in Table 1.
In another aspect, embodiments 1 to 10 of the present invention provide a method for preparing an epoxy resin composition, comprising the steps of:
(1) Respectively pulverizing epoxy resin and curing agent to obtain powder, packaging, sealing, and preserving at low temperature;
(2) Adding inorganic filler, catalyst and additive into a high-speed stirrer in batches for stirring and mixing, and adding the epoxy resin and curing agent which are crushed in the step (1) for mixing;
(3) And pouring the uniformly mixed mixture into an extruder for mixing, and cooling and crushing the mixture to obtain the modified polypropylene composite material.
The crushing instrument in the step (1) is a resin crusher, and the crushing temperature is 20 ℃;
the temperature of stirring and mixing by the high-speed stirrer in the step (2) is 20 ℃;
the extruder in the step (3) is a double-screw extruder; the extrusion temperature of the extruder in the step (3) is 100 ℃.
The epoxy resin composition product is hermetically stored in a low-temperature environment; the temperature of the low temperature environment is 4 ℃.
TABLE 1,
Wherein: the epoxy resin has an epoxy equivalent of 163-175g/eq (manufacturer: japanese chemical Co., ltd.: EPPN-501 HY); the epoxy equivalent of the epoxy resin formula (II) is 200-220g/eq (manufacturer: japanese chemical Co., ltd.: NC-3500); the epoxy equivalent of the epoxy resin formula (III) is 270-284g/eq (manufacturer: japanese chemical Co., ltd.: NC-3000); the epoxy equivalent of the epoxy resin formula (IV) is 194-204g/eq (manufacturer: vinblastine resin manufacturer: CNE-195 LL); the Epoxy equivalent of the Epoxy resin formula (V) is 250-280g/eq (manufacturer: DIC Epoxy (Malaysia) Sdn. Bhd. Brand: HP-7200); the epoxy resin of formula (VI) has an epoxy equivalent of 187-197g/eq (manufacturer: mitsubishi chemical Co., ltd.: jER YX 4000).
The hydroxyl equivalent of the phenolic resin curing agent formula (VII) is 96-106g/eq (manufacturer: ivory Co., ltd.: HE 910-09); the hydroxyl equivalent of the phenolic resin curing agent formula (VIII) is 190-210g/eq (manufacturer: brand name of Hunan Jia Sheng De materials science and technology Co., ltd.: BPNH 9781S); the phenolic resin curing agent has a hydroxyl equivalent of 104-108g/eq (manufacturer: brand name of Shandong san spring New Material Co., ltd.: PF 8011).
Comparative example 1
Comparative example 1 of the present invention provides an epoxy resin composition, the raw materials for its preparation are specifically shown in table 1, and the preparation method is the same as examples 1 to 10.
Comparative example 2
Comparative example 2 of the present invention provides an epoxy resin composition, the raw materials for its preparation are specifically shown in table 1, and the preparation method is the same as examples 1 to 10.
Performance test method
1. The gelation times of examples 1-10 and comparative examples 1-2 were tested with reference to GB/T33316-2016 and the test results are shown in Table 2.
2. Referring to ASTM D3123-09, examples 1-10 and comparative examples 1-2 were tested for spiral flow length, and the test results are shown in Table 2.
3. With reference to GB/T22567-2008, examples 1-10 and comparative examples 1-2 were tested for glass transition temperatures, and the test results are shown in Table 2.
4. Examples 1-10 and comparative examples 1-2 were tested for flexural modulus with reference to ASTM 790D-17, with test results shown in Table 2.
Claims (4)
1. An epoxy resin composition is characterized by comprising the following preparation raw materials in parts by weight: 7.2-12.4 parts of epoxy resin, 5.4-8.6 parts of curing agent, 80-86 parts of inorganic filler, 0.05-1 part of catalyst and 0-6 parts of additive; the epoxy resin comprises one or a combination of the following formulas (I), (II), (III), (IV), (V) and (VI):
formula (I):
formula (II):
formula (iii):
formula (iv):
formula (v):
formula (VI):
the epoxy equivalent of the epoxy resin formula (I) is 163-175g/eq; the epoxy equivalent of the epoxy resin formula (II) is 200-220g/eq; the epoxy equivalent of the epoxy resin formula (III) is 270-284g/eq; the epoxy equivalent of the epoxy resin formula (IV) is 194-204g/eq; the epoxy equivalent of the epoxy resin formula (V) is 250-280g/eq; the epoxy equivalent of the epoxy resin formula (VI) is 187-197g/eq;
the curing agent is phenolic resin curing agent, and the phenolic resin curing agent is formula (VII) or a combination of formula (VII) and formula (VIII); the hydroxyl equivalent of the phenolic resin curing agent formula (VII) is 96-106g/eq; the phenolic resin curing agent has a hydroxyl equivalent weight of 190-210g/eq:
formula (VII):formula (viii):
2. an epoxy resin composition according to claim 1, characterized by one or more of the following properties:
A. curing at 175+ -2deg.C for 90 seconds with a helical flow length of 25-55 inches;
B. gelation time is 25-55 seconds at 175+ -2deg.C;
C. glass transition temperature 175-225 ℃ at 175+/-2 ℃;
D. the flexural modulus is 25GPa or less at 25 ℃.
3. A method of preparing an epoxy resin composition according to claim 2, comprising at least the steps of:
(1) Respectively pulverizing epoxy resin and curing agent to obtain powder, packaging, sealing, and preserving at low temperature;
(2) Adding inorganic filler, catalyst and additive into a high-speed stirrer in batches for stirring and mixing, and adding the epoxy resin and curing agent which are crushed in the step (1) for mixing;
(3) And pouring the uniformly mixed mixture into an extruder for mixing, and cooling and crushing the mixture to obtain the modified polypropylene composite material.
4. Use of an epoxy resin composition according to claim 2, in electronic packaging.
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| CN116970262A (en) * | 2023-04-24 | 2023-10-31 | 上海道宜半导体材料有限公司 | Epoxy resin composition for large-size QFN (quad Flat No-lead) product and preparation method thereof |
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| JP2003040981A (en) * | 2001-07-30 | 2003-02-13 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
| KR20040049355A (en) * | 2002-12-03 | 2004-06-12 | 에스케이케미칼주식회사 | Liquid-phase device-protecting chemical composition for packaging semiconductor |
| KR20070016049A (en) * | 2005-08-02 | 2007-02-07 | 제일모직주식회사 | Epoxy resin for packaging semiconductor device |
| CN101523588A (en) * | 2006-08-10 | 2009-09-02 | 住友电木株式会社 | Semiconductor package and method for manufacturing same, and sealing resin |
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| CN104962040B (en) * | 2015-07-13 | 2018-01-19 | 江苏中鹏新材料股份有限公司 | A kind of method for improving composition epoxy resin glass transition temperature |
| CN106280256B (en) * | 2016-08-15 | 2019-05-17 | 江苏中鹏新材料股份有限公司 | A kind of high heat resistance moulding type epoxy bottom filler and preparation method thereof and purposes |
| CN112980139A (en) * | 2019-12-17 | 2021-06-18 | 衡所华威电子有限公司 | Epoxy resin composition for tantalum capacitor packaging and preparation method thereof |
| CN112980138A (en) * | 2019-12-17 | 2021-06-18 | 衡所华威电子有限公司 | Epoxy resin composition for packaging electronic components and preparation method thereof |
| CN114644810B (en) * | 2020-12-18 | 2024-03-01 | 衡所华威电子有限公司 | High-temperature fast-curing low-stress epoxy resin composition and preparation method thereof |
| CN113201204B (en) * | 2021-04-23 | 2023-06-02 | 衡所华威电子有限公司 | High Tg and low warp MUF epoxy resin composition and preparation method thereof |
| CN114276650A (en) * | 2021-11-05 | 2022-04-05 | 衡所华威电子有限公司 | Epoxy resin composition and preparation method thereof |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003040981A (en) * | 2001-07-30 | 2003-02-13 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
| KR20040049355A (en) * | 2002-12-03 | 2004-06-12 | 에스케이케미칼주식회사 | Liquid-phase device-protecting chemical composition for packaging semiconductor |
| KR20070016049A (en) * | 2005-08-02 | 2007-02-07 | 제일모직주식회사 | Epoxy resin for packaging semiconductor device |
| CN101523588A (en) * | 2006-08-10 | 2009-09-02 | 住友电木株式会社 | Semiconductor package and method for manufacturing same, and sealing resin |
| CN111527145A (en) * | 2017-12-29 | 2020-08-11 | 三星Sdi株式会社 | Epoxy resin composition for encapsulating semiconductor device, and semiconductor device encapsulated using the same |
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