CN102883523A - PCB (printed circuit board) with copper foil current carrying capability reinforcing function - Google Patents
PCB (printed circuit board) with copper foil current carrying capability reinforcing function Download PDFInfo
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- CN102883523A CN102883523A CN2012103733950A CN201210373395A CN102883523A CN 102883523 A CN102883523 A CN 102883523A CN 2012103733950 A CN2012103733950 A CN 2012103733950A CN 201210373395 A CN201210373395 A CN 201210373395A CN 102883523 A CN102883523 A CN 102883523A
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- hole
- copper foil
- pcb
- pcb board
- current carrying
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Abstract
The invention relates to a technical design of a PCB (printed circuit board), in particular to a PCB with a copper foil current carrying capability reinforcing function. The PCB is characterized in that copper foils are arranged on two sides of the PCB, and a plurality of metalized holes are arranged on the two sides of the PCB, hole wall area of each metalized hole is larger than the sum of the areas of two ends of each metalized hole. Without manufacturing processes of surface mounting and tin rolling, cost for manufacturing the PCB is reduced.
Description
Technical field
The application relates to a kind of pcb board designing technique, specifically a kind of pcb board with enhancing Copper Foil current carrying capacity.
Background technology
Along with electronic product develops towards miniaturization, part in the electronic product is also more and more less, the electronic component that carries on the pcb board is also more and more, the current carrying capacity of the Copper Foil of laying at pcb board is more and more stronger, is therefore becoming extremely important with the current carrying capacity that increases the Copper Foil of laying on the pcb board under the homalographic.
Prior art one, application number are that 201010242210.3 Chinese patent has been put down in writing and a kind ofly increased the method for PCB line conductor ampacity by paster, and the step of its specific implementation is as follows:
(1) when pcb board designs, copper foil plate line width stenosis or the oxide that has perforation place of part stitch cleaned out and be made into copper foil plate circuit Chip Area;
(2) make the copper foil plate paster, get a copper foil plate and remove surface film oxide, it is for subsequent use then to cut out the copper foil plate paster according to the shape of the copper foil plate circuit Chip Area that reserves during design on the copper foil plate circuit;
(3) the copper foil plate paster that cuts being attached to copper foil plate circuit paster position gets final product by rolling tin welding.
In two-sided pcb board, adopt technique scheme to increase PCB line conductor ampacity, it needs the manufacture craft that additionally increases paster and roll tin in manufacturing process, increased the cost of manufacture of pcb board.
Prior art two, pcb board hole metallization technology are one of key technologies of pcb board manufacturing.The plated-through hole technology is perforate between top layer and bottom, with chemical reaction the thin copper of one deck is plated on the inwall in hole, and the Copper Foil mutual conduction of the top layer of its purpose pcb board and bottom, rather than in order to increase the bearing capacity of Copper Foil electric current.
Summary of the invention
The application's purpose provides a kind of pcb board that strengthens the Copper Foil current carrying capacity that has cheaply.
Provide a kind of pcb board that strengthens the Copper Foil current carrying capacity that has for this reason, the two-sided Copper Foil that is provided with of pcb board, pcb board offers a plurality of plated-through holes, and plated-through hole hole wall area is greater than two ends, hole area sum.
Wherein, the arbitrary cross section perpendicular to the sense of current all passes through at least one plated-through hole.
Wherein, described plated-through hole is circular hole.
Wherein, described plated-through hole diameter is 0.5mm, and hole depth is 1～2mm.
Wherein, described plated-through hole is filled with tin.
Beneficial effect:
In the process of manufacturing, only need to design according to the hole wall area size of plated-through hole greater than the requirement of two ends, hole area sum, the Copper Foil amount at the two ends, hole during just greater than perforate not of the Copper Foil amount on the hole wall, be equivalent to increase the Copper Foil amount of tapping, thereby strengthened the bearing capacity of electric current, be compared with the prior art, the manufacture craft that need not to increase paster and roll tin has reduced the cost of making pcb board.
Description of drawings
Fig. 1 is a kind of structural representation with specific embodiment of the pcb board that strengthens the Copper Foil current carrying capacity of the present invention.
Fig. 2 is the plated-through hole structural representation.
Reference numeral:
1-plated-through hole, 2-PCB plate.
Embodiment
As shown in Figure 1, a kind of pcb board with enhancing Copper Foil current carrying capacity, the pcb board 2 two-sided Copper Foils that are provided with, pcb board 2 offers a plurality of plated-through holes 1, plated-through hole 1 hole wall area is greater than two ends, hole area sum, as shown in Figure 2, arrow indication place is hole wall, cross-hatching be the area at two ends, hole.
In the process of manufacturing, only need to design the hole greater than the requirement of two ends, hole area sum according to the hole wall area, the Copper Foil amount at the two ends, hole during just greater than perforate not of the Copper Foil amount on the hole wall, namely increased the Copper Foil amount of tapping, thereby strengthened the bearing capacity of electric current, be compared with the prior art, the manufacture craft that need not to increase paster and roll tin has reduced the cost of making pcb board 2.
Because the maximum current bearing capacity of Copper Foil is subjected to limit perpendicular to the minimum current bearing capacity of Copper Foil on the cross section of the sense of current on the monoblock pcb board 2, therefore, for strengthening the carrying of Copper Foil electric current on the monoblock pcb board 2, the arbitrary cross section perpendicular to the sense of current in the present embodiment all passes through at least one plated-through hole 1.
For the ease of manufacturing, described plated-through hole 1 adopts the mode of boring to form circular hole, then with hole wall copper simultaneously.
Particularly, take a pcb board 2 with said structure feature as example, such as Fig. 1, CD or DC direction are the sense of current, AB or BA direction are perpendicular to sense of current, plated-through hole 1 on this pcb board 2 is circular hole, its aperture is 0.5mm, its hole depth is 1～2mm, plated-through hole 1 is arranged according to certain rules, and plated-through hole 1 is equidistant on AB or BA direction, be arranged in parallel, and adjacent two row's plated-through holes, 1 hole dislocation is arranged, arbitrary cross section perpendicular to the sense of current can both pass through a plurality of plated-through holes 1, so that be enhanced perpendicular to the current carrying capacity of the Copper Foil on arbitrary cross section of the sense of current.
Described plated-through hole 1 usefulness tin is filled, and has further strengthened current carrying capacity.
Should be noted that at last; above embodiment is only in order to illustrate technical scheme of the present invention; but not limiting the scope of the invention; although with reference to preferred embodiment the present invention has been done to explain; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement technical scheme of the present invention, and not break away from essence and the scope of technical solution of the present invention.
Claims (5)
1. one kind has the pcb board that strengthens the Copper Foil current carrying capacity, and the two-sided Copper Foil that is provided with of pcb board is characterized in that pcb board offers a plurality of plated-through holes, and plated-through hole hole wall area is greater than two ends, hole area sum.
2. a kind of pcb board that strengthens the Copper Foil current carrying capacity that has according to claim 1 is characterized in that, all passes through at least one plated-through hole perpendicular to arbitrary cross section of the sense of current.
3. a kind of pcb board that strengthens the Copper Foil current carrying capacity that has according to claim 1 is characterized in that described plated-through hole is circular hole.
4. a kind of pcb board that strengthens the Copper Foil current carrying capacity that has according to claim 3 is characterized in that described plated-through hole diameter is 0.5mm, and hole depth is 1～2mm.
5. a kind of pcb board that strengthens the Copper Foil current carrying capacity that has according to claim 1 is characterized in that described plated-through hole is filled with tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210373395.0A CN102883523B (en) | 2012-09-27 | 2012-09-27 | A kind of pcb board with enhancing Copper Foil current carrying capacity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210373395.0A CN102883523B (en) | 2012-09-27 | 2012-09-27 | A kind of pcb board with enhancing Copper Foil current carrying capacity |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102883523A true CN102883523A (en) | 2013-01-16 |
| CN102883523B CN102883523B (en) | 2016-05-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210373395.0A Active CN102883523B (en) | 2012-09-27 | 2012-09-27 | A kind of pcb board with enhancing Copper Foil current carrying capacity |
Country Status (1)
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| CN (1) | CN102883523B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08335754A (en) * | 1995-06-05 | 1996-12-17 | Hewlett Packard Japan Ltd | Guard structure employing via hole/through hole |
| CN1296375A (en) * | 1999-11-12 | 2001-05-23 | 荏原优莱特科技股份有限公司 | Method for filling through hole |
| CN101066005A (en) * | 2004-11-24 | 2007-10-31 | 大日本印刷株式会社 | Multilayer wiring board and method for manufacturing same |
| CN101192542A (en) * | 2006-11-22 | 2008-06-04 | 全懋精密科技股份有限公司 | Circuit board structure and its manufacture method |
| CN102076174A (en) * | 2011-01-30 | 2011-05-25 | 乐健线路板（珠海）有限公司 | Method for manufacturing dual-layer sandwiched metal base PCB (printed circuit board) with high thermal conductivity |
| CN202799386U (en) * | 2012-09-27 | 2013-03-13 | 广东易事特电源股份有限公司 | PCB plate enhancing copper foil current bearing capability |
-
2012
- 2012-09-27 CN CN201210373395.0A patent/CN102883523B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08335754A (en) * | 1995-06-05 | 1996-12-17 | Hewlett Packard Japan Ltd | Guard structure employing via hole/through hole |
| CN1296375A (en) * | 1999-11-12 | 2001-05-23 | 荏原优莱特科技股份有限公司 | Method for filling through hole |
| CN101066005A (en) * | 2004-11-24 | 2007-10-31 | 大日本印刷株式会社 | Multilayer wiring board and method for manufacturing same |
| CN101192542A (en) * | 2006-11-22 | 2008-06-04 | 全懋精密科技股份有限公司 | Circuit board structure and its manufacture method |
| CN102076174A (en) * | 2011-01-30 | 2011-05-25 | 乐健线路板（珠海）有限公司 | Method for manufacturing dual-layer sandwiched metal base PCB (printed circuit board) with high thermal conductivity |
| CN202799386U (en) * | 2012-09-27 | 2013-03-13 | 广东易事特电源股份有限公司 | PCB plate enhancing copper foil current bearing capability |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102883523B (en) | 2016-05-04 |
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