CN102860872B - Laser scalpel device - Google Patents
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- CN102860872B CN102860872B CN201210180126.2A CN201210180126A CN102860872B CN 102860872 B CN102860872 B CN 102860872B CN 201210180126 A CN201210180126 A CN 201210180126A CN 102860872 B CN102860872 B CN 102860872B
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Abstract
The invention provides a kind of laser scalpel device, comprise LASER Light Source, optical fibers, coupling mirror and cutter head, LASER Light Source is used for Output of laser, coupling mirror is positioned in the transmission light path of laser, for reflecting and converging described laser, fibre-optic one end is positioned at the focus place of described coupling mirror, for transmitting laser.Wherein, cutter head is hollow structure, and the one end open of cutter head, the other end is closed; The fibre-optic other end is positioned at the cavity of cutter head through the opening port of cutter head; Being filled with laser absorption medium between this fibre-optic other end and blind end of cutter head, for converting the laser energy of absorption to heat, and transferring heat to cutter head.Laser scalpel device provided by the invention overcomes in prior art the wound surface out-of-flatness problem utilizing laser direct irradiation to cut and organize to cause, and eliminates optical maser wavelength and relies on the coupling of tissue absorbance spectrum.
Description
Technical Field
The invention relates to the structure technology of medical instruments, in particular to a laser scalpel device.
Background
The progress of the surgical operation is closely related to the invention and the development of the scalpel, the blade of the traditional scalpel can cut soft tissues and cut off blood vessels in the tissues at the same time, wound bleeding is caused, the hemostasis operation is required to be carried out continuously in the operation, the operation time is prolonged, and a series of complications are easily caused after the operation. How to effectively stop bleeding of a wound surface while cutting a tissue is one of the problems which are researched and solved in the technical field of scalpels, and various physical means are used for trying to solve the problem.
The laser scalpel in the prior art transmits laser by utilizing a mechanical light guide arm or an optical fiber, the tissue is irradiated by the laser, the tissue or the water in the tissue absorbs the laser energy and is converted into heat, so that the vaporized tissue is used for cutting, and blood hemostasis can be realized.
Disclosure of Invention
The invention provides a device for a laser scalpel, which is used for solving the problem that the surface of a wound is not flat when the laser scalpel cuts a tissue in the prior art and eliminating the matching dependence of laser wavelength on tissue absorption spectrum.
The invention provides a laser scalpel device, which comprises a laser light source, an optical fiber, a coupling mirror and a scalpel head, wherein the laser light source is used for outputting a laser beam, the coupling mirror is positioned on a transmission light path of the laser beam and is used for refracting and converging the laser beam, one end of the optical fiber is positioned at the focus of the coupling mirror and is used for transmitting the laser, and the laser scalpel device is characterized in that,
the cutter head is of a hollow structure, one end of the cutter head is open, and the other end of the cutter head is closed;
the other end of the optical fiber passes through the opening port of the cutter head and is positioned in the hollow cavity of the cutter head;
and a laser absorption medium is filled between the other end of the optical fiber and the closed end of the cutter head and is used for converting the absorbed laser energy into heat and transferring the heat to the cutter head.
The laser scalpel device provided by the invention has the advantages that the optical fiber is arranged in the hollow cavity of the scalpel head, the laser output by the optical fiber is absorbed by the laser absorption medium and converted into heat, and the heat is transferred to the scalpel head to vaporize the tissue to achieve the purpose of cutting the tissue, so that the problem of uneven wound surface caused by directly irradiating the cut tissue by the laser in the prior art is solved, and the matching dependence of the laser wavelength on the tissue absorption spectrum is eliminated.
Drawings
FIG. 1 is a schematic view of a laser scalpel device according to an embodiment of the present invention;
FIG. 2 is a schematic view of a tool tip according to one embodiment of the present invention;
FIG. 3 is a schematic diagram of a control device according to a second embodiment of the present invention;
fig. 4 is a schematic diagram of laser duty cycle modulation in the second embodiment of the present invention.
Detailed Description
In order to make the technical solution of the present invention clearer, the following will clearly and completely describe the technical solution of the present invention with reference to the embodiments and the accompanying drawings.
Example one
Fig. 1 is a schematic view illustrating a laser scalpel device according to an embodiment of the present invention. As shown in fig. 1, the laser scalpel device provided in this embodiment includes a laser light source 10, an optical fiber (referred to as "optical fiber") 6, a coupling mirror 4 and a scalpel head 61, wherein the laser light source 10 is configured to output a laser beam 14, the coupling mirror 4 is located on a transmission light path of the laser beam 14 and is configured to refract and converge the laser beam 14, and one end of the optical fiber 6 is located at a focus of the coupling mirror 4 and is configured to transmit laser.
The application of the laser scalpel needs a laser generating device, namely a laser light source 10, to output laser beams, so that the tissue can be cut by using laser energy and the wound tissue is coagulated to close the end of a blood vessel to stop bleeding.
The laser light source generally comprises a laser, a laser power supply and a cooling system, wherein the laser comprises a working substance, a pumping system and a laser resonant cavity, the working substance has a proper energy level structure and can realize population inversion; the pumping system excites atoms in the working substance and maintains population inversion; the laser resonant cavity ensures light amplification, so that laser has good directivity and monochromaticity; the laser power supply 13 is used for driving the pumping system to generate energy to excite atoms in the working substance so as to realize population inversion; because a lot of heat is emitted during the laser generation process, and the performance of the laser light source is affected by the increase of the temperature, a cooling system 16 must be arranged to take away the heat to ensure the performance of the laser light source.
As shown in fig. 1, the laser scalpel device further includes a switch device 20, and a user can turn on or off the laser power supply 13 through the switch device 20, so as to control the temperature of the scalpel head 61 to be increased or normal temperature, so as to ensure that the laser scalpel device only cuts tissue to be treated during a surgical procedure, and prevent additional damage to other tissues, such as: during the puncture treatment, the switch device 20 is turned on only when the cutting head 61 reaches the tissue to be treated, so that the temperature of the cutting head 61 is increased.
Fig. 2 is a schematic structural diagram of the cutter head provided in this embodiment, and as shown in fig. 2, the cutter head 61 is a hollow structure, and one end of the cutter head 61 is open, and the other end is closed; the other end of the optical fiber 6 passes through the opening port of the cutter head 61 and is positioned in the hollow cavity of the cutter head 61; a laser absorbing medium 68 is filled between the other end of the optical fiber 6 and the closed end of the cutter head 61 for converting the absorbed laser energy into heat and transferring the heat to the cutter head 61.
The laser light source provided by this embodiment can be implemented in various forms, is not limited to that shown in fig. 1, and can provide a laser beam. Various lasers may be used in the laser light source 10, such as solid state lasers, semiconductor lasers, for generating laser light to provide a source of laser energy for the laser scalpel device.
Of these, the optical fiber 6 is preferably a single core optical fiber, and may have a diameter of 50 to 1000 μm. In the embodiment, the diameter of the single-core optical fiber is 600 microns, and the single-core optical fiber with the size can meet the transmission requirement, has certain strength and can have better hand feeling; the cutter head 61 is used for connecting and fixing the optical fiber 6, loading the absorbing medium 68, and providing an acting surface with good biocompatibility and good heat transfer, the inner diameter of the hollow cavity of the cutter head 61 is larger than the core diameter of the optical fiber 6, so that the optical fiber 6 is embedded in the hollow cavity of the cutter head 61, the closed end of the cutter head 61 in the embodiment is preferably a spherical surface, the material of the cutter head 61 can be selected in many ways, as long as the biocompatibility is satisfied, and the heat transfer is good, in the embodiment, quartz is selected, and the cutter head 61 is in the shape of a quartz cap with one open end and the other closed end and; the laser absorption medium 68 is preferably a micro-granular material with an absorption coefficient of more than 95% for laser, which can effectively absorb laser energy, and prevent the laser from penetrating through the cutter head 61 and entering into deeper tissues to cause extra loss, in this embodiment, the laser absorption medium 68 may be graphite powder; the wavelength of the laser beam 14 output by the laser light source 10 in this embodiment is 810-1550nm, which ensures that the output laser can be sufficiently and effectively absorbed by the laser absorption medium 68, and the laser energy is converted into heat to be transferred to the tool bit.
The working principle of the laser scalpel device provided by the embodiment is as follows:
the laser power supply is turned on to drive the laser light source 10 to generate a laser beam 14, the coupling mirror 4 arranged on a transmission light path of the laser beam 14 refracts and converges the laser beam 14, the converged laser beam 14 enters the optical fiber 6 arranged at the focus of the coupling mirror 4, the optical fiber 6 transmits laser, the laser absorbing medium 68 effectively absorbs the laser transmitted by the optical fiber 6 in the hollow cavity of the cutter head 61, the laser energy is converted into heat to be transmitted to the cutter head 61, the temperature of the cutter head 61 is increased, and therefore tissue can be vaporized to be cut, and wound tissue can be solidified to seal the end of a blood vessel to stop bleeding.
According to the invention, the optical fiber 6 is arranged in the hollow cavity of the cutter head 61, and the laser absorption medium 68 is filled between the optical fiber 6 and the closed end of the cutter head 61, so that the laser energy transmitted by the optical fiber 6 is effectively absorbed and converted into heat, and the heat is transferred to the cutter head 61, thereby vaporizing and cutting the tissue, overcoming the problem of uneven wound surface caused by directly irradiating the tissue with laser for cutting, ensuring stable cutting performance, eliminating the absorption spectrum matching dependence of laser wavelength on soft tissue, and further preventing additional damage caused by the fact that the laser enters deeper tissue.
Example two
One of the key technologies for using laser energy in a laser scalpel device is to control the average power of laser output by a laser light source 10, and there are two methods for controlling the average power of laser output by the laser light source 10: one is to control the duty ratio of the laser light source 10 to output laser light; one is to control the power of the laser light output from the laser light source 10 when the laser light is continuously output, that is: for a laser which can be provided with an acousto-optic modulator, the average power of the laser output by the laser light source 10 can be adjusted by controlling the acousto-optic modulator to adjust the duty ratio of the output laser; for a laser capable of adjusting the power of the laser light output by the laser light source 10 when the laser light is continuously output, for example: by adjusting the working current of the laser, the current of the pump lamp, the power of the pump laser, and the like, the power of the laser light source 10 outputting laser light when the laser light is continuously output can be adjusted. Of course, a combination of these two ways may be used to control the average power of the output laser.
In selecting which way to control the average power of the laser light output by the laser light source 10, it is necessary to ensure the stability of the performance of the laser light source 10, and whichever way is selected, it is within the scope of the present invention.
In practical applications, in order to ensure the stability of the performance of the laser light source 10, the laser scalpel device that provides laser energy through different lasers has different modes of controlling the selection of the average power of the laser output by the laser light source.
Fig. 3 is a schematic diagram of the control device provided by the embodiment of the invention, and when the temperature of the cutting head 61 is controlled by the switch device 20 to be raised to the set temperature required by the treatment, the control device 3 further stabilizes the temperature of the cutting head 61 to the set temperature required by the treatment.
As shown in fig. 3, the control device 3 in the laser scalpel device provided in the second embodiment of the present invention includes an interaction device 31, a collection device 32, a comparison device 33, and an adjustment device 34. Wherein,
the interaction device 31 is used for receiving a control instruction of a user to set the average power of the laser output by the laser light source 10 so as to enable the cutter head 61 to reach the set working temperature;
the interaction device 31 may include an input device and a display device, wherein the input device, such as a touch screen, is used for receiving a control instruction input by a user and transmitting the control instruction to a corresponding device to perform a corresponding control operation; the display device, such as an LCD display screen, is used for displaying the measurement and control data, including the set working temperature of the tool bit 61, the current working temperature of the tool bit 61, the average power of the laser output by the laser source 10, and the like. In order to set the working temperature of the cutting head 61, the interactive device 31 receives a control instruction of a user, where the control instruction may be a set working temperature value of the cutting head 61, a duty ratio value of the laser light source 10 outputting laser light, or an average power value of the laser light source 10 outputting laser light, and the control device 3 controls the average power of the laser light source 10 outputting laser light according to the control instruction, and finally controls the current working temperature of the cutting head 61 to be the set working temperature, where the set working temperature is a set temperature required by treatment. In this embodiment, the working temperature range of the cutter head 61 set by the interaction device 31 receiving the control instruction is 38-600 ℃, so that vaporization cutting, drying, carbonization and coagulation of soft tissue can be generated, the treatment requirements of cutting and hemostasis in various surgical operations and the requirement of tissue thermal ablation treatment are met, the device is particularly suitable for the operation of parenchymal organs with rich blood circulation, and the device has the advantages of smooth and flat soft tissue cutting surface and strong hemostasis capability.
The acquisition device 32 is used for acquiring the current working temperature of the cutter head 61;
as shown in fig. 2, the acquisition device 32 in this embodiment is preferably a K-type thermocouple 69, which is disposed in the laser absorbing medium 68 of the tool bit 61 and is used for acquiring the current working temperature of the tool bit 61, because the measurement range of the thermocouple 69 is large and the thermal response time is fast, the requirements of the laser scalpel device in this embodiment for wide temperature control range and real-time monitoring of the current working temperature of the tool bit 61 can be satisfied. Wherein, the thermocouple 69 is led out through two outgoing lines 64 and 65, and transmits the collected current working temperature voltage signal of the cutter head 61 to the comparison device 33 through the connector 62 through the cable 3 b; an insulating filling medium 67 is filled between the two outgoing lines 64 and 65 for insulation between the two outgoing lines, and the insulating filling medium 67 is preferably quartz particles with a particle size of 500 meshes; the open port of the cutting head 61 is provided with a sealing means 66 for sealing the gap between the cutting head 61, the optical fiber 6 and the outgoing lines 64 and 65.
Wherein, the part of the optical fiber 6 not in the hollow cavity of the tool bit 6 is further wrapped with an optical fiber protective layer 63 for protecting the optical fiber 6 and the thermocouple outgoing lines 64 and 65.
A voltage amplifying device 35 may be further disposed between the connector 62 of the collecting device 31 and the comparing device 33 for amplifying the current operating temperature voltage signal of the cutter head 61 collected by the collecting device 32.
And a comparison device 33 for comparing the current working temperature of the cutter head 61 with the working temperature of the cutter head 61 set by the user through the interaction device 31, and outputting Δ T to the adjustment device 34 when a difference Δ T between the current working temperature of the cutter head 61 and the working temperature of the cutter head 61 set by the user through the interaction device 31 is not zero.
And the adjusting device 34 is used for adjusting the average power of the laser output by the laser light source 10 according to the delta T. The adjustment device 34 may in particular comprise: a power reducing unit 341 configured to reduce an average power of the laser light output by the laser light source 10 when Δ T is greater than zero; and a power increasing unit 342 for increasing the average power of the laser light source 10 outputting the laser light when Δ T is less than zero.
The following description will be given of the specific operation of the adjustment device 34, taking the adjustment of the average power of the output laser light of the solid laser and the semiconductor laser as an example.
When the average power of the laser output by the solid-state laser is adjusted, the specific working process of the adjusting device 34 is as follows:
referring to fig. 1, in order to adjust the average power of the output laser, the laser scalpel device for providing laser energy by the solid laser in this embodiment further includes:
the acousto-optic switch 2 is arranged at one side of the laser resonant cavity close to the total reflection mirror 12, and can modulate the duty ratio of the output laser beam 14 through the acousto-optic switch 2 so as to adjust the average power of the output laser beam 14; and the acousto-optic switch driving power supply 21 is connected with the acousto-optic switch 2 through a cable 22 and is used for driving the acousto-optic switch 2 to enable the solid laser 1 to generate laser oscillation or stop the laser oscillation.
In the embodiment, the pumping system 8 of the solid laser 1 is preferably semiconductor laser pumping, and the semiconductor laser pumping solid laser 1 uses a laser diode to replace a flash lamp to pump working substances, so that the solid laser has the advantages of high efficiency, small volume, long service life and the like; the laser power supply 13 is connected with the semiconductor laser pumping system 8 through a cable 15 and is used for driving the semiconductor laser pumping system to enable the solid working substance to generate laser; the output mirror 11 and the total reflection mirror 12 form a laser resonant cavity of the semiconductor laser pumping solid laser 1; a coupling mirror 4 for refracting and condensing the laser beam 14; the optical fiber connector 5 is used for fixing the center of the plug end face of the optical fiber connector 5 at a laser convergence focus; the optical fiber 6 is used for transmitting laser energy, and one end of the optical fiber 6 is fixed at a laser convergence focus through the optical fiber connector 5, so that laser enters the optical fiber 6; and the cooling system 16 is connected with the pumping system 8 of the semiconductor laser pumping solid-state laser 1 through a water outlet pipe 18 and a water return pipe 17 and is used for cooling the semiconductor laser pumping system 8.
The control device 3 of the laser scalpel device in this embodiment is connected to the acousto-optic switch driving power supply 21 through a cable 3a, connected to the laser power supply 13 through a cable 3c, and connected to the cooling system 16 through a cable 3d, and is configured to control the working temperature of the scalpel head to be stabilized at the set working temperature of the scalpel head.
Referring to fig. 1 and 3, for the laser scalpel device providing laser energy by the solid laser, the adjusting device 34 controls the acousto-optic switch 2 to modulate the duty ratio of the laser pulse output by the solid laser 1, so as to provide fast response and feedback compensation for the temperature change of the optical fiber scalpel head. FIG. 4 is a schematic diagram of laser duty cycle modulation in an embodiment of the present invention, where tonThe pulse width of the modulated output laser beam, T the repetition period of the laser modulation pulse, and P the output power of the continuous laser beam. The average laser power of the modulated output can be calculated by:
because the temperature of the surgical knife head is in direct proportion to the laser power absorbed by the absorption medium, the temperature of the surgical knife head can be adjusted in a large range by adjusting the duty ratio of the laser pulse.
When the Δ T received by the adjusting device 34 from the comparing device 33 is not zero, the adjusting device 34 controls the on/off of the acousto-optic switch driving power supply 21, so as to control the acousto-optic switch 2 to modulate the duty ratio of the output laser pulse, specifically:
when Δ T is greater than zero, the power reduction unit 341 reduces the duty ratio of the laser light output from the laser light source 10 by controlling the on/off of the acousto-optic switch driving power supply 21
When Δ T is less than zero, the power increasing unit 342 increases the duty ratio of the laser light output from the laser light source 10 by controlling the on/off of the acousto-optic switch driving power supply 21
The solid-state laser can also adjust the average power of the output laser by controlling the laser power supply 13, but since the input power of the laser power supply 13 is changed, the thermal load of the cooling system is changed, and the performance of the laser light source 10 is affected. Therefore, the laser scalpel device which supplies laser energy by the solid laser, the adjusting device 34 adjusts the average power of the output laser by modulating the duty ratio of the laser pulse output by the solid laser 1 by the acousto-optic switch 2.
When the average power of the laser light output by the semiconductor laser is adjusted, the specific working process of the adjusting device 34 is as follows:
referring to fig. 1 and 3, for the laser scalpel device providing laser energy by the semiconductor laser, the power P of the output laser is adjusted by controlling the current of the laser power supply 13 when the laser is continuously output, or the duty ratio of the output laser of the laser light source 10 is modulated by controlling the on/off of the laser power supply 13The method specifically comprises the following steps:
when Δ T is greater than zero, the power reducing unit 341 reduces the power of the laser light output by the laser light source 10 when the laser light is continuously output by controlling the current of the laser power supply 13, or reduces the duty ratio of the laser light output by the laser light source 10 by controlling the on/off of the laser power supply 13
When Δ T is less than zero, the power increasing unit 341 increases the power of the laser light source 10 outputting the laser light when the laser light is continuously output by controlling the current of the laser power supply 13, or increases the duty ratio of the laser light source 10 outputting the laser light by controlling the on/off of the laser power supply 13
Compared with a solid laser, the semiconductor laser omits the acousto-optic switch 2, the acousto-optic switch driving power supply 21 and corresponding interfaces of the acousto-optic switch driving power supply and the control device 3, and the structure of the laser scalpel device is simplified.
The control device 3 can control the working temperature of the laser scalpel, in the embodiment, the controllable temperature can reach 600 ℃ at most, the low end can be stabilized at 38 ℃, different soft tissue treatment effects can be obtained by setting and adjusting the temperature of the scalpel head, and different focus tissues can be treated in an operation. Meanwhile, by adopting closed-loop temperature control, the current working temperature of the laser surgical knife head can be stabilized so as to meet the requirements of different operations such as tissue ablation, hemostasis, soft tissue cutting and the like.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (8)
1. A laser scalpel device comprises a laser source, an optical fiber, a coupling mirror and a scalpel head, wherein the laser source is used for outputting a laser beam, the coupling mirror is positioned on a transmission light path of the laser beam and is used for refracting and converging the laser beam, one end of the optical fiber is positioned at a focus of the coupling mirror and is used for transmitting the laser, and the laser scalpel device is characterized in that,
the cutter head is of a hollow structure, one end of the cutter head is open, and the other end of the cutter head is closed;
the other end of the optical fiber passes through the opening port of the cutter head and is positioned in the hollow cavity of the cutter head;
a laser absorption medium is filled between the other end of the optical fiber and the closed end of the cutter head and is used for converting absorbed laser energy into heat and transferring the heat to the cutter head;
the laser light source comprises a laser, a laser power supply and a cooling system,
the laser comprises a working substance, a pumping system and a laser resonant cavity, wherein the laser resonant cavity consists of an output mirror and a total reflector, one side of the laser resonant cavity close to the total reflector is provided with an acousto-optic switch, the acousto-optic switch is connected with an acousto-optic switch driving power supply through a cable, the acousto-optic switch driving power supply is used for driving the acousto-optic switch, and the acousto-optic switch is used for modulating the duty ratio of an output laser beam so as to adjust the average power of the output laser beam;
the laser power supply is used for driving the pumping system to generate energy to excite atoms in the working substance and realize population inversion, and is connected with the switching device which is used for switching on or off the laser power supply;
the cooling system is connected with the pumping system through a water outlet pipe and a water return pipe and is used for cooling the pumping system;
the laser scalpel device further includes:
the control device is respectively connected with the acousto-optic switch driving power supply, the laser power supply and the cooling system through cables and is used for controlling the working temperature of the cutter head to be stabilized at the set working temperature of the cutter head;
the control device includes:
the interaction device is used for receiving a control instruction of a user to set the average power of the laser output by the laser light source so as to enable the cutter head to reach a set working temperature;
the acquisition device is used for acquiring the current working temperature of the cutter head;
the comparison device is used for comparing the current working temperature of the cutter head with the set working temperature, and when the difference delta T between the current working temperature of the cutter head and the set working temperature is not zero, the delta T is output to the adjusting device;
and the adjusting device is used for adjusting the average power of the laser output by the laser light source according to the delta T.
2. The laser scalpel device of claim 1, wherein the adjustment device comprises:
the power reducing unit is used for reducing the average power of the laser output by the laser light source when the delta T is larger than zero;
and the power increasing unit is used for increasing the average power of the laser light source output laser when the delta T is less than zero.
3. The laser scalpel device of claim 1, wherein the control device further comprises: and the voltage amplifying device is connected between the acquisition device and the comparison device and is used for amplifying the working temperature voltage signal of the cutter head acquired by the acquisition device.
4. The laser scalpel device of claim 1, wherein the working temperature range of the scalpel head set by the interaction device receiving the control command is 38-600 ℃.
5. The laser scalpel device of claim 1, wherein the collection device is a thermocouple disposed in the laser absorbing medium;
the thermocouple is led out through two outgoing lines, and the collected working temperature voltage signal of the cutter head is transmitted to the comparison device through the connector;
an insulating filling medium is filled between the two outgoing lines and is used for insulating the two outgoing lines;
and the opening port of the cutter head is provided with a sealing device for sealing a gap among the cutter head, the optical fiber and the outgoing line.
6. A laser scalpel device according to any one of claims 1 to 5, wherein the material of the blade is quartz.
7. The laser scalpel device of any one of claims 1-5, wherein the laser light absorbing medium is a granular material having an absorption coefficient for laser light greater than 95%.
8. The laser scalpel device of claim 7, wherein the laser absorbing medium is graphite powder.
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CN201210180126.2A CN102860872B (en) | 2012-06-01 | 2012-06-01 | Laser scalpel device |
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CN102860872B true CN102860872B (en) | 2015-10-28 |
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CN201210180126.2A Expired - Fee Related CN102860872B (en) | 2012-06-01 | 2012-06-01 | Laser scalpel device |
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CN103211648A (en) * | 2013-04-03 | 2013-07-24 | 首都医科大学 | Laser device and laser system |
CN107982645A (en) * | 2017-12-13 | 2018-05-04 | 武汉市海沁医疗科技有限公司 | A kind of radiotherapy unit |
JP7125705B2 (en) * | 2018-06-06 | 2022-08-25 | 株式会社ユニタック | Follicle growth induction device |
CN109116468B (en) * | 2018-11-26 | 2019-02-22 | 中聚科技股份有限公司 | A kind of optical fiber and preparation method thereof of the end for laser therapy with optothermal material |
CN112741686A (en) * | 2019-10-29 | 2021-05-04 | 广州星际悦动股份有限公司 | Temperature balance control method and device |
CN112741687A (en) * | 2019-10-29 | 2021-05-04 | 中国福利会国际和平妇幼保健院 | Laser scalpel with replaceable scalpel head |
CN111419395A (en) * | 2020-04-13 | 2020-07-17 | 西安交通大学医学院第一附属医院 | Magnetic anchoring laser scalpel robot device for single-hole endoscopic surgery |
CN111831039A (en) * | 2020-07-28 | 2020-10-27 | 北京计算机技术及应用研究所 | Independent cooler control system for laser scalpel |
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CN2419942Y (en) * | 2000-05-10 | 2001-02-21 | 邓梁 | Laser heat pole scalpel |
CN1335117A (en) * | 2000-07-21 | 2002-02-13 | 中国科学院福建物质结构研究所 | Laser therapeutic machine |
CN101194857A (en) * | 2007-12-28 | 2008-06-11 | 马君显 | Laser lancet |
CN201617947U (en) * | 2009-12-14 | 2010-11-03 | 武汉奇致激光技术有限公司 | Multifunctional laser therapy apparatus |
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US5549600A (en) * | 1994-07-01 | 1996-08-27 | Cynosure, Inc. | Surgical laser probe with thermal cutting |
CN2419942Y (en) * | 2000-05-10 | 2001-02-21 | 邓梁 | Laser heat pole scalpel |
CN1335117A (en) * | 2000-07-21 | 2002-02-13 | 中国科学院福建物质结构研究所 | Laser therapeutic machine |
CN101194857A (en) * | 2007-12-28 | 2008-06-11 | 马君显 | Laser lancet |
CN201617947U (en) * | 2009-12-14 | 2010-11-03 | 武汉奇致激光技术有限公司 | Multifunctional laser therapy apparatus |
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