CN102858147A - Electromagnetic suction patching head - Google Patents
Electromagnetic suction patching head Download PDFInfo
- Publication number
- CN102858147A CN102858147A CN 201110182366 CN201110182366A CN102858147A CN 102858147 A CN102858147 A CN 102858147A CN 201110182366 CN201110182366 CN 201110182366 CN 201110182366 A CN201110182366 A CN 201110182366A CN 102858147 A CN102858147 A CN 102858147A
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- Prior art keywords
- suction nozzle
- placement head
- exciting coil
- magnet exciting
- head
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- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention provides a novel patching head which uses an electromagnetic suction principle to change the technical scheme that the conventional patching head sucks and places an electronic element through a vacuum suction pipe. The novel patching head has no need of high-pressure gas. According to the novel patching head provided by the invention, a suction nozzle is made of permeability magnetic material with low residual magnetism; and a magnet exciting coil is sleeved outside the suction nozzle. Aiming at the property that most of elements, such as a patching resistor-capacitor unit, a diode and a triode, can be sucked by a magnet, direct-current voltage is supplied to the magnet exciting coil, so that the suction nozzle has magnetism and can suck the elements; and the direct-current voltage of the magnet exciting coil is switched off, so that the elements can be placed.
Description
Technical field
The invention belongs to the electronic product mounting equipment.
Background technology
In the electronic product production process, need to use chip mounter that electronic component is placed on the circuit board, then welding.The equipment that chip mounter is most critical in the whole production procedure, technology content is the highest.The placement head of chip mounter picks up, places electronic component by vaccum suction pipe.Vacuum is the rapid flow by high pressure gas, produces vacuum in manifold.Chip mounter is comprised of several bulks such as placement head, track drive mechanism, feed appliance, controllers.
The chip mounter of general electronic products assembly line is pressed the 2+1 configuration, and namely two is high by more than one.The paster of two elements that the high speed machine amount of being responsible for is large, volume is little (mainly being Resistor-Capacitor Unit).A Multi Role Aircraft is responsible for the paster of the large element such as IC.
China has more than 3,000 electronics manufacturing enterprise and tens thousand of electronic product assembly lines at present, all need spend every year on average tens dollars and buy approximately 9000 chip mounters, is external imported product.
Summary of the invention
The present invention is a kind of Novel patch head.It adopts electromagnetism to draw principle, has changed the technical scheme that existing placement head is drawn, placed electronic component by vaccum suction pipe, and placement head does not need high pressure gas.The suction nozzle of placement head of the present invention adopts the permeability magnetic material of low remanent magnetism to make magnet exciting coil of overcoat.For the characteristic that the element major parts such as paster Resistor-Capacitor Unit, diode, triode can both be attracted by magnetite, give the perfectly straight stream voltage of magnet exciting coil, make the suction nozzle carrying magnetic, just can draw element; Disconnect the magnet exciting coil direct voltage, but with regard to placing element.
Placement head of the present invention does not need high pressure gas to produce vacuum, controls simpler.Owing to having saved pneumatic element, volume, weight have all reduced a lot, and the requirement of driving mechanism has been reduced, and paster speed and precision can improve.Because the suction nozzle pore-free, precision and accuracy can improve when drawing tiny element (such as 0201,01005 element).Placement head of the present invention can also be drawn ultra-thin element not withstand voltage, not anti-distortion.
That placement head of the present invention has is simple in structure, volume is little, lightweight, precision is high, speed is fast, the advantage such as easy to control.
Description of drawings
Fig. 1, the mid-placement head generalized section of coil
Fig. 2, suction nozzle front view
Fig. 3, suction nozzle upward view
Fig. 4, axle bumper generalized section
Fig. 5, axle bumper vertical view
Fig. 6, flat suction nozzle cutaway view
Fig. 7, coil underlying placement head generalized section
Embodiment
Execution mode 1:(Fig. 1-Fig. 6)
Make the shell 07 of placement head of the cylinder of an opening, at shell 07 interior placement spring 06, circular suction nozzle 09 of spring 06 following placement.Suction nozzle 09 is comprised of suction nozzle core 02 bottom suction nozzle head 01 of cover.Open the twice groove in shell 07 bottom symmetry, put an axle bumper 05 in the groove.Open an aperture at shell 07 top and make steam vent 08.Above shell 07 outside axle bumper 05, place a magnet exciting coil 03, coil housing 04 of magnet exciting coil 03 overcoat.
During pickup device, placement head moves down.When suction nozzle head 01 was run into element, suction nozzle 09 can not continue to move down, and suction nozzle 09 is with spring 06 compression, steam vent 08 exhaust.Placement head continues to move down into the lower position, magnet exciting coil 03 energising, and suction nozzle core 02 carrying magnetic, because the bottom of suction nozzle head 01 is very thin, suction nozzle core 02 can be adsorbed on suction nozzle head 01 surface by the element of magnetic attraction.After drawing element, move spring 06, suction nozzle 09 playback, steam vent 08 air inlet on the placement head.Magnet exciting coil 03 keeps energising, and element continues to be adsorbed on suction nozzle head 01 surface.
During paster, placement head moves down, and when element was run into circuit board, suction nozzle 09 can not continue to move down, and suction nozzle 09 is with spring 06 compression, steam vent 08 exhaust.Placement head continues to move down into the lower position, magnet exciting coil 03 outage, and suction nozzle core 02 is carrying magnetic not, and element is stayed on the circuit board.Then move spring 06, suction nozzle 09 playback, steam vent 08 air inlet on the placement head.Finish a paster job.
The size of suction nozzle head 01 is decided according to the size of element, when changing suction nozzle 09, can directly plug.
When paster ultra-thin or large tracts of land element not withstand voltage, not anti-distortion, use large-area flat suction nozzle 20 instead.
Execution mode 2:(Fig. 7)
Make the shell 07 of placement head of the cylinder of an opening, at shell 07 interior placement spring 06, circular suction nozzle 09 of spring 06 following placement.Suction nozzle 09 is comprised of suction nozzle core 02 bottom suction nozzle head 01 of cover.Open the twice groove in shell 07 middle part symmetry, put an axle bumper 05 in the groove.Open an aperture at shell 07 top and make steam vent 08.Below shell 07 outside axle bumper 05, place a magnet exciting coil 03, coil housing 04 of magnet exciting coil 03 overcoat.
During pickup device, placement head moves down.When suction nozzle head 01 was run into element, suction nozzle 09 can not continue to move down, and suction nozzle 09 is with spring 06 compression, steam vent 08 exhaust.Placement head continues to move down into the lower position, magnet exciting coil 03 energising, and suction nozzle core 02 carrying magnetic, because the bottom of suction nozzle head 01 is very thin, suction nozzle core 02 can be adsorbed on suction nozzle head 01 surface by the element of magnetic attraction.After drawing element, move spring 06, suction nozzle 09 playback, steam vent 08 air inlet on the placement head.Magnet exciting coil 03 keeps energising, and element continues to be adsorbed on suction nozzle head 01 surface.
During paster, placement head moves down, and when element was run into circuit board, suction nozzle 09 can not continue to move down, and suction nozzle 09 is with spring 06 compression, steam vent 08 exhaust.Placement head continues to move down into the lower position, magnet exciting coil 03 outage, and suction nozzle core 02 is carrying magnetic not, and element is stayed on the circuit board.Then move spring 06, suction nozzle 09 playback, steam vent 08 air inlet on the placement head.Finish a paster job.
The size of suction nozzle head 01 is decided according to the size of element, when changing suction nozzle 09, can directly plug.
When paster ultra-thin or large tracts of land element not withstand voltage, not anti-distortion, use large-area flat suction nozzle 20 instead.
Compare with execution mode 1, the magnet exciting coil 03 of execution mode 1 can be fixed on the mount pad of placement head, needn't move up and down with placement head during paster, and placement head and suction nozzle 09 are slightly long.
Obviously, embodiment described herein is the present invention's part embodiment, rather than whole embodiment.Based on the drawings and Examples among the present invention, those of ordinary skills belong to the scope of protection of the invention not making all other drawings and Examples that obtain under the creative work prerequisite.
Claims (6)
1. placement head that is used for chip mounter, it is characterized in that: its adopts electromagnetism to draw principle, gives the perfectly straight stream voltage of magnet exciting coil, make the suction nozzle carrying magnetic, can be adsorbed on the suction nozzle surface by the element of magnetic attraction, disconnect the magnet exciting coil direct voltage, but with regard to placing element.
2. placement head according to claim 1 is characterized in that: make the shell of placement head of the cylinder of an opening, place in the enclosure spring, place a circular suction nozzle below the spring, place a magnet exciting coil in enclosure.
3. placement head according to claim 1 is characterized in that: the suction nozzle of placement head is comprised of suction nozzle head of suction nozzle core bottom cover.The suction nozzle core adopts the permeability magnetic material of low remanent magnetism to make, and the suction nozzle head adopts wear-resistant plastic to make.
4. placement head according to claim 1, it is characterized in that: the shell symmetry of placement head is opened the twice groove, puts an axle bumper in the groove, cuts the groove of two symmetries on the suction nozzle, and axle bumper is stuck in the groove of suction nozzle, and suction nozzle can not fallen down.
5. placement head according to claim 1, it is characterized in that: the cover top portion of placement head or sidepiece are opened an aperture and are done the inlet and outlet hole.
6. placement head according to claim 1, it is characterized in that: the suction nozzle of placement head can also adopt large-area flat suction nozzle, uses when paster ultra-thin or large tracts of land element not withstand voltage, not anti-distortion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110182366 CN102858147A (en) | 2011-06-30 | 2011-06-30 | Electromagnetic suction patching head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110182366 CN102858147A (en) | 2011-06-30 | 2011-06-30 | Electromagnetic suction patching head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102858147A true CN102858147A (en) | 2013-01-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110182366 Pending CN102858147A (en) | 2011-06-30 | 2011-06-30 | Electromagnetic suction patching head |
Country Status (1)
| Country | Link |
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| CN (1) | CN102858147A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170142411A (en) * | 2016-06-17 | 2017-12-28 | 한화테크윈 주식회사 | A nozzle assembly for component mounter |
| CN107634127A (en) * | 2017-09-11 | 2018-01-26 | 聚灿光电科技（宿迁）有限公司 | It is a kind of to be used to adsorb the suction nozzle of LED wafer and there is its screening installation |
| CN108213647A (en) * | 2018-03-22 | 2018-06-29 | 深圳捷创电子科技有限公司 | A kind of patch pen |
| CN108925128A (en) * | 2018-09-27 | 2018-11-30 | 黄金铭 | A kind of chip mounter suction nozzle attachment device |
| CN110816966A (en) * | 2018-08-14 | 2020-02-21 | 徐雅雯 | Feeding device and feeding method of electronic assembly |
| RU2735860C1 (en) * | 2017-05-27 | 2020-11-09 | Гуандун Оппо Мобайл Телекоммьюникейшнз Корп., Лтд. | Wireless communication method and device |
| CN112310797A (en) * | 2019-07-26 | 2021-02-02 | 山东华光光电子股份有限公司 | Suction nozzle device for picking and placing COS and COS picking and placing method |
-
2011
- 2011-06-30 CN CN 201110182366 patent/CN102858147A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107529332B (en) * | 2016-06-17 | 2020-11-06 | 韩华精密机械株式会社 | Suction nozzle assembly for component mounter |
| CN107529332A (en) * | 2016-06-17 | 2017-12-29 | 韩华泰科株式会社 | Component suction nozzle for part placement equipment |
| KR20170142411A (en) * | 2016-06-17 | 2017-12-28 | 한화테크윈 주식회사 | A nozzle assembly for component mounter |
| KR102467237B1 (en) * | 2016-06-17 | 2022-11-15 | 한화정밀기계 주식회사 | A nozzle assembly for component mounter |
| RU2735860C1 (en) * | 2017-05-27 | 2020-11-09 | Гуандун Оппо Мобайл Телекоммьюникейшнз Корп., Лтд. | Wireless communication method and device |
| CN107634127A (en) * | 2017-09-11 | 2018-01-26 | 聚灿光电科技（宿迁）有限公司 | It is a kind of to be used to adsorb the suction nozzle of LED wafer and there is its screening installation |
| CN108213647A (en) * | 2018-03-22 | 2018-06-29 | 深圳捷创电子科技有限公司 | A kind of patch pen |
| CN108213647B (en) * | 2018-03-22 | 2024-04-09 | 深圳捷创电子科技有限公司 | Patch pen |
| CN110816966A (en) * | 2018-08-14 | 2020-02-21 | 徐雅雯 | Feeding device and feeding method of electronic assembly |
| CN110816966B (en) * | 2018-08-14 | 2022-01-18 | 徐雅雯 | Feeding device and feeding method of electronic assembly |
| CN108925128A (en) * | 2018-09-27 | 2018-11-30 | 黄金铭 | A kind of chip mounter suction nozzle attachment device |
| CN108925128B (en) * | 2018-09-27 | 2023-08-22 | 深圳市森瑞达贴装技术有限公司 | Connecting device for suction nozzle of chip mounter |
| CN112310797A (en) * | 2019-07-26 | 2021-02-02 | 山东华光光电子股份有限公司 | Suction nozzle device for picking and placing COS and COS picking and placing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| DD01 | Delivery of document by public notice |
Addressee: Wang Jie Document name: Notification of Publication of the Application for Invention |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130102 |