CN102853950B - 采用倒装焊接的压阻式压力传感器芯片及其制备方法 - Google Patents
采用倒装焊接的压阻式压力传感器芯片及其制备方法 Download PDFInfo
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Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103335753B (zh) * | 2013-06-05 | 2016-01-20 | 厦门大学 | 硅-玻璃基梁膜结构的超微压力传感器芯片及制造方法 |
CN103407958A (zh) * | 2013-08-27 | 2013-11-27 | 上海先进半导体制造股份有限公司 | 埋层腔体型soi的制造方法 |
CN104677529A (zh) * | 2015-02-06 | 2015-06-03 | 北京大学 | 一种压力计芯片结构及其制备方法 |
CN105547533A (zh) * | 2015-12-09 | 2016-05-04 | 北京大学 | 一种压力计芯片结构及其制备方法 |
CN116907693A (zh) | 2017-02-09 | 2023-10-20 | 触控解决方案股份有限公司 | 集成数字力传感器和相关制造方法 |
US11243125B2 (en) | 2017-02-09 | 2022-02-08 | Nextinput, Inc. | Integrated piezoresistive and piezoelectric fusion force sensor |
CN111448446B (zh) * | 2017-07-19 | 2022-08-30 | 触控解决方案股份有限公司 | 在mems力传感器中的应变传递堆叠 |
US11423686B2 (en) | 2017-07-25 | 2022-08-23 | Qorvo Us, Inc. | Integrated fingerprint and force sensor |
WO2019023552A1 (en) | 2017-07-27 | 2019-01-31 | Nextinput, Inc. | PIEZORESISTIVE AND PIEZOELECTRIC FORCE SENSOR ON WAFER AND METHODS OF MANUFACTURING THE SAME |
US11579028B2 (en) | 2017-10-17 | 2023-02-14 | Nextinput, Inc. | Temperature coefficient of offset compensation for force sensor and strain gauge |
WO2019099821A1 (en) | 2017-11-16 | 2019-05-23 | Nextinput, Inc. | Force attenuator for force sensor |
CN112161738B (zh) * | 2020-09-17 | 2022-04-08 | 五邑大学 | 气压传感器及制作方法 |
Citations (4)
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CN1279184C (zh) * | 2003-12-19 | 2006-10-11 | 中国科学院上海微系统与信息技术研究所 | 聚合酶链式反应微芯片的结构设计及制作方法 |
CN101266176A (zh) * | 2008-04-18 | 2008-09-17 | 中国科学院上海微系统与信息技术研究所 | 硅硅键合的绝缘体上硅的高温压力传感器芯片及制作方法 |
CN101551284A (zh) * | 2009-04-22 | 2009-10-07 | 江苏英特神斯科技有限公司 | 基于硅硅直接键合的压力传感器及其制造方法 |
CN202267554U (zh) * | 2011-10-20 | 2012-06-06 | 刘胜 | 带有屏蔽层的硅压阻式压力传感器芯片 |
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CN202869715U (zh) * | 2012-09-10 | 2013-04-10 | 厦门海合达汽车电器有限公司 | 一种采用倒装焊接的压阻式压力传感器芯片 |
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Patent Citations (4)
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CN1279184C (zh) * | 2003-12-19 | 2006-10-11 | 中国科学院上海微系统与信息技术研究所 | 聚合酶链式反应微芯片的结构设计及制作方法 |
CN101266176A (zh) * | 2008-04-18 | 2008-09-17 | 中国科学院上海微系统与信息技术研究所 | 硅硅键合的绝缘体上硅的高温压力传感器芯片及制作方法 |
CN101551284A (zh) * | 2009-04-22 | 2009-10-07 | 江苏英特神斯科技有限公司 | 基于硅硅直接键合的压力传感器及其制造方法 |
CN202267554U (zh) * | 2011-10-20 | 2012-06-06 | 刘胜 | 带有屏蔽层的硅压阻式压力传感器芯片 |
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Application publication date: 20130102 Assignee: Xiamen Haihe things science and Technology Co. Assignor: Xiamen Haihe electronic Touchplus information Corp Contract record no.: 2016350000027 Denomination of invention: Piezoresistive pressure sensor chip adopting face down bonding and preparing method thereof Granted publication date: 20150311 License type: Common License Record date: 20160728 |
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