CN102843870A - Flexible circuit board heating and bending mechanism - Google Patents
Flexible circuit board heating and bending mechanism Download PDFInfo
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- CN102843870A CN102843870A CN 201110376076 CN201110376076A CN102843870A CN 102843870 A CN102843870 A CN 102843870A CN 201110376076 CN201110376076 CN 201110376076 CN 201110376076 A CN201110376076 A CN 201110376076A CN 102843870 A CN102843870 A CN 102843870A
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- bending mechanism
- cope match
- circuit board
- plate pattern
- heating
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Abstract
The invention discloses a flexible circuit board heating and bending mechanism comprising a lower template, a linear guide rail, a first equal-altitude block, a second equal-altitude block and an upper template, wherein the linear guide rail is fixed on the lower template, the first equal-altitude block and the second equal-altitude block are arranged on the sliding block and are connected with the upper template, an air cylinder is arranged on the rear side of the upper template, a lower template air cylinder is connected on the lower template and is connected with the upper template by a T-shaped connector, four equal-altitude columns are arranged on the upper template and are connected with an air cylinder fixing plate, an upper template module moves up and down in a cavity of the upper template, so that the movement shock is alleviated, and a heating module is arranged on the lower template, so that the lower template can be heated and bent through the back-forth movement. The flexible circuit board heating and bending mechanism also comprises a core, and a blow hole is arranged below the core. The flexible circuit board heating and bending mechanism has the advantages of convenience in installation, small volume, high processing precision, stability, cheap price and the like, is suitable for the processing of the flexible circuit board, and realizes the automatic bending of the flexible circuit board.
Description
Technical field
The present invention relates to a kind of bending mechanism, refer in particular to a kind of flexible electric circuit board heating bending mechanism.
Background technology
Flexible electric circuit board is claimed flexible circuit board or adagio again, is to be base material with mylar or polyimides, has height reliability, the printed circuit of excellent flexibility through being etched in form on the Copper Foil that circuit processes a kind of.This kind circuit board is bending, folding arbitrarily, and in light weight, volume is little, and thermal diffusivity is good, and is easy for installation, broken through traditional interconnection technique notion.At present, flexible electric circuit board has obtained in fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, digital cameras using very widely.
At present, the processings such as bending in the flexible electric circuit board production lean on the people manually to accomplish mostly, and efficient is low, waste of manpower, material resources, and production cost is high, and the very difficult mostly completion of adagio moulding bending, and resilience is very serious.
Summary of the invention
The object of the invention is to provide a kind of flexible electric circuit board reasonable in design heating bending mechanism.
In order to reach this purpose, technical solution of the present invention is: comprise lower bolster, be fixed on the line slideway on the lower bolster, be located at first isometry block and second isometry block on the slide block; What be attached thereto is cope match-plate pattern, and the cope match-plate pattern rear side has cylinder, is connected with the counterdie cylinder on the lower bolster; Link to each other with cope match-plate pattern through " T " shape connector, have four to wait Gao Zhu on the cope match-plate pattern, what be attached thereto is air cylinder fixed plate; The patrix module can move up and down in the chamber of cope match-plate pattern, has alleviated the bump of motion, and lower bolster is provided with heating module; Can seesaw and accomplish the heating bending, also comprise fuse, below fuse, be provided with gas hole.
The spacing employing cylinder of above-mentioned cope match-plate pattern, processing is once accomplished, and closing precision is very high.
Wherein, described cope match-plate pattern and lower bolster afterbody are equipped with hydraulic bjuffer, have alleviated the bump of matched moulds.
The piston rod of described little cylinder is connected with the patrix module through " T " shape connector.
Adopt post such as height such as circle grade to be connected between described air cylinder fixed plate and the cope match-plate pattern.
Described heating module is located at the lower bolster afterbody, and security performance is high.
Hollow out in the middle of the support of described connection heating module is beneficial to heat radiation.
Advantages such as that the present invention has is easy for installation, volume is little, machining accuracy is high, stable, low price are suitable for the processing of flexible electric circuit board, have realized the bending automation of flexible electric circuit board.
Description of drawings
Fig. 1 is a perspective view of the present invention.
Fig. 2 is an other direction structural representation of the present invention.
Fig. 3 is a partial structurtes A sketch map of the present invention.
Fig. 4 is a partial structurtes B sketch map of the present invention.
Among the figure:
1, cylinder; 2, hydraulic bjuffer; 3, little cylinder; 4, air cylinder fixed plate; 5, Gao Zhu such as; 6, cope match-plate pattern; 7, lower bolster; 8, counterdie cylinder; 9, support; 10, gas hole; 11, heating module; 12, fuse; 13, first isometry block; 14, patrix module; 15, flexible electric circuit board; 16, second isometry block; 17, " T " shape connector.
Embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is described further.
Shown in Fig. 1 ~ 4, the present invention includes lower bolster 7, be fixed on the line slideway on the lower bolster 7, be located at first isometry block 13 and second isometry block 16 on the slide block; What be attached thereto is cope match-plate pattern 6, and cope match-plate pattern 6 rear sides have cylinder 1, are connected with counterdie cylinder 8 on the lower bolster 7; Link to each other with cope match-plate pattern 6 through " T " shape connector 17, high posts 5 such as four are arranged on the cope match-plate pattern 6, what be attached thereto is air cylinder fixed plate 4; Patrix module 14 can move up and down in the chamber of cope match-plate pattern 6, has alleviated the bump of motion, and lower bolster 7 is provided with heating module 11; Can seesaw and accomplish the heating bending, also comprise fuse 12, below fuse 12, be provided with gas hole 10.
Cope match-plate pattern 6 spacing employing cylinders as shown in Figure 1, above-mentioned, processing is once accomplished, and closing precision is very high.Wherein, described cope match-plate pattern 6 is equipped with hydraulic bjuffer 2 with lower bolster 7 afterbodys, has alleviated the bump of matched moulds.The piston rod of described stingy cylinder 3 is connected with patrix module 14 through " T " shape connector 17.Adopt post such as height such as circle grade 5 to be connected between described air cylinder fixed plate 4 and the cope match-plate pattern 6.
As shown in Figure 3, described heating module 11 is located at lower bolster 7 afterbodys, and security performance is high.
As shown in Figure 2, hollow out in the middle of the support 9 of described connection heating module 11 is beneficial to heat radiation.
Working method of the present invention is: shown in Fig. 1 ~ 4, flexible electric circuit board 15 is placed on the lower bolster 7, the steady matched moulds of patrix under the effect of cylinder 1 is after cylinder is spacing; Under the effect of stingy cylinder 3, patrix module 14 moves downward, and compresses flexible electric circuit board 15; Cylinder 8 effects, fuse 12 turns over the turnback moulding, and the heating module 11 of rear side travels forward and heats; Reset after the heating several seconds, the gas hole 10 of flexible electric circuit board 15 belows is blown and was cooled off in some seconds, and fuse resets; Take off flexible electric circuit board 15, accomplished the heating bending, flexible electric circuit board 15 moulding.
Claims (7)
1. a flexible electric circuit board heating bending mechanism comprises lower bolster (7), is fixed on the line slideway on the lower bolster (7); Be located at first isometry block (13) and second isometry block (16) on the slide block, what be attached thereto is cope match-plate pattern (6), and cope match-plate pattern (6) rear side has cylinder (1); Be connected with counterdie cylinder (8) on the lower bolster (7); Link to each other with cope match-plate pattern (6) through " T " shape connector (17), have four to wait Gao Zhu (5) on the cope match-plate pattern (6), what be attached thereto is air cylinder fixed plate (4); Patrix module (14) can move up and down in the chamber of cope match-plate pattern (6); Lower bolster (7) is provided with heating module (11), also comprises fuse (12), is provided with gas hole (10) in fuse (12) below.
2. heating bending mechanism according to claim 1 is characterized in that, the spacing employing cylinder processing of described cope match-plate pattern (6).
3. heating bending mechanism according to claim 1 is characterized in that, described cope match-plate pattern (6) and lower bolster (7) afterbody are equipped with hydraulic bjuffer (2).
4. heating bending mechanism according to claim 1 is characterized in that, the piston rod of described little cylinder (3) is connected with patrix module (14) through " T " shape connector (17).
5. heating bending mechanism according to claim 1 is characterized in that, adopts Gao Zhu (5) such as circle to be connected between described air cylinder fixed plate (4) and the cope match-plate pattern (6).
6. heating bending mechanism according to claim 1 is characterized in that, described heating module (11) is located at lower bolster (7) afterbody.
7. heating bending mechanism according to claim 1 is characterized in that, hollow out in the middle of the support (9) of described connection heating module (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110376076.0A CN102843870B (en) | 2011-11-23 | 2011-11-23 | Flexible electric circuit board heats bending mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110376076.0A CN102843870B (en) | 2011-11-23 | 2011-11-23 | Flexible electric circuit board heats bending mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102843870A true CN102843870A (en) | 2012-12-26 |
| CN102843870B CN102843870B (en) | 2017-07-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110376076.0A Active CN102843870B (en) | 2011-11-23 | 2011-11-23 | Flexible electric circuit board heats bending mechanism |
Country Status (1)
| Country | Link |
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| CN (1) | CN102843870B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI578868B (en) * | 2016-01-13 | 2017-04-11 | 摩爾創新科技股份有限公司 | Manufacturing method of circuit substrate with curved surface |
| CN112074086A (en) * | 2020-08-12 | 2020-12-11 | 黄石市星光电子有限公司 | Manufacturing method of novel three-dimensional (3D) circuit board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201846532U (en) * | 2010-11-04 | 2011-05-25 | 英华达（上海）科技有限公司 | Bending device for flexible circuit board |
| CN202374571U (en) * | 2011-11-23 | 2012-08-08 | 南通力德尔机电科技有限公司 | Heating bending mechanism for flexible circuit board |
-
2011
- 2011-11-23 CN CN201110376076.0A patent/CN102843870B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI578868B (en) * | 2016-01-13 | 2017-04-11 | 摩爾創新科技股份有限公司 | Manufacturing method of circuit substrate with curved surface |
| CN112074086A (en) * | 2020-08-12 | 2020-12-11 | 黄石市星光电子有限公司 | Manufacturing method of novel three-dimensional (3D) circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102843870B (en) | 2017-07-07 |
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Owner name: JIANGSU LEADER ELECTRONIC INFORMATION TECHNOLOGY C Free format text: FORMER OWNER: NANTONG LIDEER ELECTROMECHANICAL TECHNOLOGY CO., LTD. Effective date: 20130121 |
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Free format text: CORRECT: ADDRESS; FROM: 226009 NANTONG, JIANGSU PROVINCE TO: 226017 NANTONG, JIANGSU PROVINCE |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20130121 Address after: 226017, No. 9, Xin Dong Road, Nantong economic and Technological Development Zone, Nantong, Jiangsu Applicant after: JIANGSU LEADER ELECTRONIC INFORMATION TECHNOLOGY CO., LTD. Address before: 226009 Nantong Development Zone, Jiangsu, Shanghai Road Applicant before: Nantong Lideer Electromechanical Technology Co.,Ltd. |
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