CN102842398A - Preparation method for chip-type ceramic sensitive element and corresponding product thereof - Google Patents
Preparation method for chip-type ceramic sensitive element and corresponding product thereof Download PDFInfo
- Publication number
- CN102842398A CN102842398A CN2012103079035A CN201210307903A CN102842398A CN 102842398 A CN102842398 A CN 102842398A CN 2012103079035 A CN2012103079035 A CN 2012103079035A CN 201210307903 A CN201210307903 A CN 201210307903A CN 102842398 A CN102842398 A CN 102842398A
- Authority
- CN
- China
- Prior art keywords
- senser
- electrode
- main body
- substrate
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Thermistors And Varistors (AREA)
Abstract
The invention discloses a preparation method for a chip-type ceramic sensitive element and a corresponding product thereof. The method comprises the steps of respectively processing a metal conducting layer, a transition layer and an easily-welding layer in sequence on the upper surface and the lower surface of a ceramic chip to form an upper electrode and a lower electrode, cutting the ceramic chip into a plurality of sensitive element main bodies, processing a plurality of rectangle areas used for placing the single sensitive element main body on a substrate, respectively arranging a first electrode and a second electrode in each rectangle area, leading out the two electrodes in parallel in a way of facing the same side of the rectangle areas which the two electrodes belong to, arranging each sensitive element main body on the first electrode and connecting the upper electrode of each sensitive element main body with the second electrode, sealing and wrapping each sensitive element main body and a connecting guide line of each sensitive element main body, leading out the first electrode and the second electrode through a lead out guide line, and obtaining the finished sensitive element. The preparation method can eliminate non-ohm contact when a silver electrode is adopted, leads out the lead out guide line in parallel without a requirement of being bent, and can obtain products which are good in electricity-conducting property, low in cost and convenient to produce in a standardized mode.
Description
Technical field
The invention belongs to the sensing measurement technical field, more specifically, relate to a kind of preparation method and corresponding product thereof of chip pottery senser.
Background technology
Senser is meant the components and parts that can in system, experience measured variable delicately and respond, usually as directly experiencing measured part in the transducer.Senser detects principle according to it, can be divided into mechanical property senser, electro permanent magnetic senser, optical senser, electrochemistry senser and microbe property senser; According to the kind of its constituent material, can be divided into semiconductor senser, metal sensitization sensing unit, ceramic senser, organic polymer senser, enzyme senser and microbe senser etc.In recent years, use the senser of ceramic material more and more and since it possess stable performance, with low cost, be suitable for other materials compoundly obtaining new characteristic, and be convenient to advantage such as sheet making, thereby possess vast potential for future development.For example; Can utilize two or more metal oxide in the elements such as manganese, silicon, cobalt, nickel, iron and copper to form semiconductive ceramic through abundant mixing, moulding, sintering process; Obtain to possess the ceramic composite of negative temperature coefficient (Negative Temperature Coefficient is abbreviated as NTC) thermistor phenomenon thus; In addition, can be base and other the polycrystalline ceramics of mixing with the barium titanate, obtain to possess the ceramic composite of positive temperature coefficient (Positive Temperature Coefficient is abbreviated as PTC) thermistor phenomenon thus.
Yet, in the preparation method of present ceramic senser, normally adopt silver, and carry out encapsulation through glass encapsulation or single-ended lead-in wire epoxy mode as electrode.Though silver electrode has the advantage of good conductivity, exist material cost high problem, especially silver ion and move defectives such as producing non-ohmic contact, the blending of silver-colored soldering layer easily; Secondly, when carrying out glass encapsulation or single-ended lead-in wire epoxy mode and encapsulate, the electrode of ceramic senser is drawn lead needs bending, sometimes even rupture, thereby can cause adverse effect to the quality of final finished; In addition, among the preparation method of prior art the resistance test of carrying out senser in encapsulation behind the finished product again, also can't adjust even if resistance test is defective like this, correspondingly caused that rate of finished products is low, cost raising and be unfavorable for problem such as standardized production.
Summary of the invention
Above defective and technical need to prior art; The object of the present invention is to provide a kind of preparation method and corresponding product thereof of ceramic senser; Wherein through aspects such as the upper and lower electrode structure of ceramic senser and packaged type thereof are adjusted; Should be able to eliminate mutually the non-ohmic contact phenomenon when adopting silver electrode, and parallel the drawing of lead of drawing of senser electrode need not bending, and can before encapsulation, carry out the resistance test and the adjustment of senser; It is strong to obtain good conductivity, hot matching performance and adhesion thus, and cost is lower and be convenient to the senser product of standardized production.
According to one aspect of the present invention, a kind of preparation method of chip pottery senser is provided, this preparation method comprises the following steps:
(a) preparation process of senser main body:
Processing metal conductive layer, intermediate metal and metal are prone to layer successively respectively on the upper and lower surfaces of flaky pottery material; Formation has the senser main body overall structure of upper and lower electrode thus, is cut into a plurality of senser main bodys that are of a size of unified specification then;
(b) preparation process of senser substrate:
Select Al
2O
3Ceramic wafer or printed circuit board (PCB) are as the substrate of ceramic senser; And a plurality of cuttings of processing on this substrate; Thus whole base plate is divided into a plurality of rectangular areas, wherein each rectangular area is respectively applied for and places each senser main body that is obtained through step (a);
(c) overall package step, this step specifically comprises following substep:
(c1) first electrode and second electrode of each interval are set respectively in each said rectangular area of senser substrate, and equal parallel the drawing in phase the same side of rectangular area under them of first and second electrodes;
(c2) each senser main body is arranged on first electrode in each said rectangular area of senser substrate, and the top electrode of senser main body is linked to each other with second electrode in this rectangular area through being welded to connect lead;
(c3) through gluing process each senser main body and connection lead thereof are given sealed envelope; Said grooving according to the senser substrate cuts line by line then, and after cutting, respectively first and second electrodes in each said zone of the every row of senser substrate is drawn through welding two leads of drawing that are parallel to each other;
(c4) through gluing process with said port sealing of drawing lead, and then cut one by one according to the said grooving of senser substrate and along the direction of row, obtain single ceramic senser finished product thus.
Through above design; Electrode through adopt the common formation of three-layer metal layer institute is replaced silver electrode layer of the prior art; Can in the measurement performance precision that guarantees senser, reduce cost, and especially can eliminate when adopting silver electrode because the non-ohmic contact phenomenon that migration caused of silver ion; Through possess the substrate of two parallel extraction electrodes for the setting of senser main body; The upper/lower electrode of senser main body at first can be drawn out to respectively on two electrodes on the substrate; Can under the state that is in a plane basically, lead to the outside then through parallel wire; Correspondingly, can avoid lead bending even phenomenon of rupture in the conventional processing, and help improving the quality of finished product; In addition,, be convenient to large batch of standardization like this and generate, and can improve working (machining) efficiency to form a plurality of zones that hold the senser main body through processing cutting on substrate.
As further preferably, said flaky pottery material is NTC or PTC pottery, and metal conducting layer, intermediate metal and the metal of processing are prone to layer and are followed successively by copper layer, nickel dam and tin layer respectively on its upper and lower surfaces.
Through the above concrete qualification to flaky pottery material and metal level thereof, more test and practice show, can form good electrical conductivity with NTC or PTC pottery as the copper layer of metal conducting layer, possesses stronger adhesion simultaneously; As the nickel dam of transition zone can effectively avoid between copper layer and the tin layer since coefficient of thermal expansion different the disengaging that possibly cause; In addition, can be convenient to process welding in the above as the tin layer that is prone to layer and for example be the lead of silver-colored line.
As further preferably, the specification of said senser main body is: long * wide in the scope of 0.2mm * 0.2mm to 1.0mm * 1.0mm, height is in the scope of 0.2mm to 0.4mm; The specification in each said zone is on the senser substrate: long * wide in the scope of 0.5mm * 0.5mm to 2.0mm * 2.0mm, thickness is in the scope of 0.5mm to 1.0mm.
As further preferably, said first electrode by two rectangles interconnect form and in the junction form right angle, said second electrode is rectangular, and second electrode is in the inboard of first electrode institute form right angle.
Through on the senser substrate, setting two electrodes of above given shape, be convenient to so on the one hand on first electrode, for example mount the senser main body, and can improve the compactedness of design through a glue mode; Can be convenient on the other hand in follow-up encapsulation operation through the welding lead extraction electrode, to avoid drawing lead generation bending or fracture.
As further preferably, in step (c2) afterwards, can also carry out resistance detection to each sensing element after the connection of completion electrode, and corresponding controller resistance value.
Obtaining to carry out resistance test again behind the finished product often in the prior art; Also can't adjust even if resistance test is defective like this, correspondingly cause that rate of finished products is low, cost improves and be unfavorable for problem such as standardized production, in the present invention can be in manufacture process; For example the electrode layer that does not comprise the electrode connecting portion branch in the senser after testing is suitably cut away a part through modes such as laser resistor trimmings; Make that thus the resistance value after the cutting can reach designing requirement, correspondingly, can improve rate of finished products; Reduce cost, and be convenient to high efficiency operation.
According to another aspect of the present invention, corresponding ceramic senser product is provided also.
In general, according to preparation method of ceramic senser of the present invention and products thereof, compared with prior art, mainly possess following advantage:
1,, can in the measurement performance precision that guarantees senser, reduce cost, and especially can eliminate when adopting silver electrode because the non-ohmic contact phenomenon that migration caused of silver ion through adjustment to the senser electrode layer structure;
2, through the base main body that possesses parallel extraction electrode on it is set; Can corresponding change encapsulate flow process and make the electrode of senser under the state that is in a plane basically, to lead to the outside through parallel wire; Correspondingly; Can avoid lead bending even phenomenon of rupture in the conventional processing, and help improving the quality of finished product;
3, according to encapsulation step of the present invention, can carry out resistance adjustment to senser in process of production, improved rate of finished products thus, reduce cost, and be convenient to operation;
4, according to preparation method's mechanization of the present invention, automaticity height, be suitable for large batch of standardized production, and can obtain good conductivity, hot matching performance and the strong product of adhesion.
Description of drawings
Fig. 1 is the overall structure sketch map that has been processed with the multiple layer metal layer and has been cut into the senser main body of a plurality of unified specifications according to of the present invention;
Fig. 2 is the board structure sketch map that is used to hold the senser main body according to the present invention;
Fig. 3 is the structural representation that is provided with the senser substrate behind first and second electrodes;
Fig. 4 is the structural representation of accomplishing after electrode is connected between senser main body and the substrate;
Fig. 5 a is according to the structural representation of one embodiment of the invention after to senser main body adjustment resistance;
Fig. 5 b is according to the structural representation of another embodiment of the present invention after to senser main body adjustment resistance;
Fig. 6 is the structural representation after accomplishing the senser main body and connect the sealed envelope between the lead according to the present invention.
Fig. 7 is achieved in accordance with the invention by the structural representation after two parallel wires of welding are drawn electrode;
Fig. 8 will draw the port sealing of lead and carry out the structural representation that cuts the single finished product that obtains according to the present invention;
Fig. 9 is the structural representation after single senser is put into container and sealed.
Embodiment
In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
Fig. 1 ~ 8 have shown the different structure sketch map that is obtained according in preparation method's process of the present invention.As shown in fig. 1, at first, carry out the preparation process of senser main body.With the NTC pottery is example; Can (for example cut into big sheet; On the upper and lower surfaces of the NTC pottery rectangle of φ 50mm disc or 50mm * 50mm), for example respectively the ground floor metal conducting layer is attached on the NTC potsherd through modes such as printing, vapor deposition, sputters.In the present embodiment, the metal conducting layer that is adopted is the copper layer, and sputter thickness is 1 micron.Then, on this ground floor, adhere to second layer metal transition zone and the easy layer of three-layer metal successively through modes such as printing, vapor deposition, sputters equally.In the present embodiment, the intermediate metal that is adopted is a nickel dam, and its sputter thickness is 2 microns; It is the tin layer that the metal that is adopted is prone to layer, and its sputter thickness is 1 micron, has obtained respectively to comprise up and down the three-layer metal layer thus, and the senser main body overall structure of the upper and lower electrode layer of corresponding formation.At last, with a plurality of senser main bodys that are of a size of unified specification of this overall structure, form structure as shown in fig. 1 thus.In the present embodiment, the specification of senser main body can be set at: long * wide in the scope of 0.2mm * 0.2mm to 1.0mm * 1.0mm, height is in the scope of 0.2mm to 0.4mm.
As shown in Figure 2, can select Al
2O
3Ceramic wafer or printed circuit board (PCB) are as the substrate of ceramic senser; And a plurality of cuttings of processing on this substrate; Thus whole base plate is divided into a plurality of rectangular areas, wherein each rectangular area is respectively applied for and places each senser main body that the front operation is obtained.The size merchandiser of a senser substrate senser main body is relevant; In the present embodiment; Each specification through the formed rectangular area of cutting is on the senser substrate: long * wide in the scope of 0.5mm * 0.5mm to 2.0mm * 2.0mm, thickness is in the scope of 0.5mm to 1.0mm.
As shown in Figure 3; Can for example pass through gluing process in each rectangular area of senser substrate; First electrode and second electrode of each interval are set respectively, and equal parallel the drawing in phase the same side of rectangular area under them of first and second electrodes.In a preferred embodiment, as shown in Figure 3, wherein first electrode by two rectangles interconnect form and in the junction form right angle, said second electrode is rectangular, and second electrode is in the inboard of first electrode institute form right angle.Like this, be convenient on the one hand on first electrode, for example mount the senser main body, and can improve the compactedness of design through a glue mode; Can be convenient on the other hand in follow-up encapsulation operation through the welding lead extraction electrode, to avoid drawing lead generation bending or fracture.
As shown in Figure 4; After each rectangular area is provided with first and second electrodes; Then each senser main body is arranged on first electrode in each rectangular area of senser substrate, and the top electrode of senser main body is linked to each other with second electrode in this rectangular area through being welded to connect lead.Like this, the upper/lower electrode of senser main body at first can be drawn out to respectively on two electrodes on the substrate.
As shown in Figure 5, can in the manufacture process of senser, carry out resistance detection to each unit according to the present invention, and the adjustment of corresponding execution resistance.For example; Can be at 25 ℃ of resistance that adopt each unit of probe test; And for example the electrode layer that does not comprise the electrode connecting portion branch in the senser after testing is suitably cut away a part through the laser resistor trimming mode, make the resistance value after the cutting can reach designing requirement thus.Its concrete adjustment mode is multiple, can shown in Fig. 5 a, cut resistance trimming along the direction of triangle oblique line, also can shown in Fig. 5 b, give resistance trimming along the position of rectangle.After carrying out adjustment, send them to 50 ℃ of constant temperature field, adopt probe to measure each unit resistance, and automatic computing element B value (also promptly obtaining the tangent line efficiency value with respect to resistance-temperature variation curve).To being adjusted to standard resistance or the still non-compliant unit of resistance, adjustment back individually, then make circular mark, pointing out it is waste product.
As among Fig. 6 and shown in Fig. 7; Can for example each senser main body and connection lead thereof be given sealed envelope through gluing process; Said grooving according to the senser substrate cuts line by line then, and after cutting, respectively first and second electrodes in each said zone of the every row of senser substrate is drawn through welding two leads of drawing that are parallel to each other.Like this, electrode can lead to the outside through parallel wire under the state that is in a plane basically, correspondingly, can avoid lead bending even phenomenon of rupture in the conventional processing, and helps improving the quality of finished product.In addition, through the mode of processing cutting on substrate, be convenient to large batch of standardization and generate, and can improve working (machining) efficiency.
Fig. 8 will draw the port sealing of lead and carry out the structural representation that cuts the single finished product that obtains according to the present invention.As shown in Figure 8, can for example will draw the port sealing of lead, and then cut one by one, obtain single ceramic senser finished product thus according to the said grooving of senser substrate and along the direction of row through gluing process.In addition, can also the single finished product that obtained is placed on such as seal in the container of test tube, this test tube size be complementary with the senser size, and element can just be put in the test tube, plays automatic positioning action.
Those skilled in the art will readily understand; The above is merely preferred embodiment of the present invention; Not in order to restriction the present invention, all any modifications of within spirit of the present invention and principle, being done, be equal to and replace and improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. the preparation method of chip pottery senser, this preparation method comprises the following steps:
(a) preparation process of senser main body:
Processing metal conductive layer, intermediate metal and metal are prone to layer successively respectively on the upper and lower surfaces of flaky pottery material; Formation has the senser main body overall structure of upper and lower electrode thus, is cut into a plurality of senser main bodys that are of a size of unified specification then;
(b) preparation process of senser substrate:
Select Al
2O
3Ceramic wafer or printed circuit board (PCB) are as the substrate of ceramic senser; And a plurality of cuttings of processing on this substrate; Thus whole base plate is divided into a plurality of rectangular areas, wherein each rectangular area is respectively applied for and places each senser main body that is obtained through step (a);
(c) overall package step, this step specifically comprises following substep:
(c1) first electrode and second electrode of each interval are set respectively in each said rectangular area of senser substrate, and equal parallel the drawing in phase the same side of rectangular area under them of first and second electrodes;
(c2) each senser main body is arranged on first electrode in each said rectangular area of senser substrate, and the top electrode of senser main body is linked to each other with second electrode in this rectangular area through being welded to connect lead;
(c3) through gluing process each senser main body and connection lead thereof are given sealed envelope; Said grooving according to the senser substrate cuts line by line then, and after cutting, respectively first and second electrodes in each said zone of the every row of senser substrate is drawn through welding two leads of drawing that are parallel to each other;
(c4) through gluing process with said port sealing of drawing lead, and then cut one by one according to the said grooving of senser substrate and along the direction of row, obtain single ceramic senser finished product thus.
2. preparation method as claimed in claim 1 is characterized in that, said flaky pottery material is NTC or PTC pottery, and the easy layer of metal conducting layer, intermediate metal and the metal processed respectively on its upper and lower surfaces is followed successively by copper layer, nickel dam and tin layer.
3. according to claim 1 or claim 2 preparation method, it is characterized in that the specification of said senser main body is: long * wide in the scope of 0.2mm * 0.2mm to 1.0mm * 1.0mm, height is in the scope of 0.2mm to 0.4mm; The specification in each said zone is on the senser substrate: long * wide in the scope of 0.5mm * 0.5mm to 2.0mm * 2.0mm, thickness is in the scope of 0.5mm to 1.0mm.
4. like any described preparation method of claim 1-3; It is characterized in that; Said first electrode by two rectangles interconnect form and in the junction form right angle, said second electrode is rectangular, and second electrode is in the inboard of first electrode institute form right angle.
5. like any described preparation method of claim 1-4, it is characterized in that in step (c2) afterwards, each senser after can also connecting the completion electrode is carried out resistance detection, and corresponding controller resistance value.
6. like the prepared ceramic senser product of any described method of claim 1-5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210307903.5A CN102842398B (en) | 2012-08-27 | 2012-08-27 | A kind of preparation method of chip Ceramic sensible devices and corresponding product thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210307903.5A CN102842398B (en) | 2012-08-27 | 2012-08-27 | A kind of preparation method of chip Ceramic sensible devices and corresponding product thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102842398A true CN102842398A (en) | 2012-12-26 |
| CN102842398B CN102842398B (en) | 2015-08-26 |
Family
ID=47369669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210307903.5A Expired - Fee Related CN102842398B (en) | 2012-08-27 | 2012-08-27 | A kind of preparation method of chip Ceramic sensible devices and corresponding product thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102842398B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103310926A (en) * | 2013-06-08 | 2013-09-18 | 好利来（中国）电子科技股份有限公司 | Subminiature surface-mounted type over-current over-heat protection device and manufacture method thereof |
| CN103698035A (en) * | 2013-12-05 | 2014-04-02 | 宁波工程学院 | Single arm structure for thermoelectric semiconductor temperature sensing sheet and preparation process |
| CN106158175A (en) * | 2015-05-11 | 2016-11-23 | 博格华纳路德维希堡有限公司 | Add thermal resistor and method that making adds thermal resistor |
| CN108109791A (en) * | 2017-12-20 | 2018-06-01 | 广东爱晟电子科技有限公司 | A kind of surface-adhered type thermal-sensitive electric resistance device and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5852397A (en) * | 1992-07-09 | 1998-12-22 | Raychem Corporation | Electrical devices |
| CN1471632A (en) * | 2000-08-24 | 2004-01-28 | 希脱鲁尼克斯 | High temperature circuit structures |
| CN101022048A (en) * | 2007-03-23 | 2007-08-22 | 上海维安热电材料股份有限公司 | Sheet type NTC and producing method thereof |
| CN201210433Y (en) * | 2008-06-19 | 2009-03-18 | 兴勤（常州）电子有限公司 | Pasted sheet type thermistor |
| CN101859620A (en) * | 2009-04-08 | 2010-10-13 | 深圳市信特科技有限公司 | Manufacturing method of high-frequency high-power resistor |
| CN101923928A (en) * | 2010-03-25 | 2010-12-22 | 四平市吉华高新技术有限公司 | High-frequency patch resistor and manufacturing method thereof |
| CN102288320A (en) * | 2011-07-22 | 2011-12-21 | 肇庆爱晟电子科技有限公司 | Metal-sheet-based negative temperature coefficient (NTC) thermistor temperature sensor and manufacturing method thereof |
-
2012
- 2012-08-27 CN CN201210307903.5A patent/CN102842398B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5852397A (en) * | 1992-07-09 | 1998-12-22 | Raychem Corporation | Electrical devices |
| CN1471632A (en) * | 2000-08-24 | 2004-01-28 | 希脱鲁尼克斯 | High temperature circuit structures |
| CN101022048A (en) * | 2007-03-23 | 2007-08-22 | 上海维安热电材料股份有限公司 | Sheet type NTC and producing method thereof |
| CN201210433Y (en) * | 2008-06-19 | 2009-03-18 | 兴勤（常州）电子有限公司 | Pasted sheet type thermistor |
| CN101859620A (en) * | 2009-04-08 | 2010-10-13 | 深圳市信特科技有限公司 | Manufacturing method of high-frequency high-power resistor |
| CN101923928A (en) * | 2010-03-25 | 2010-12-22 | 四平市吉华高新技术有限公司 | High-frequency patch resistor and manufacturing method thereof |
| CN102288320A (en) * | 2011-07-22 | 2011-12-21 | 肇庆爱晟电子科技有限公司 | Metal-sheet-based negative temperature coefficient (NTC) thermistor temperature sensor and manufacturing method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103310926A (en) * | 2013-06-08 | 2013-09-18 | 好利来（中国）电子科技股份有限公司 | Subminiature surface-mounted type over-current over-heat protection device and manufacture method thereof |
| CN103310926B (en) * | 2013-06-08 | 2015-11-18 | 好利来（中国）电子科技股份有限公司 | Microminiature surface attaching type overcurrent overtemperature protection system and preparation method thereof |
| CN103698035A (en) * | 2013-12-05 | 2014-04-02 | 宁波工程学院 | Single arm structure for thermoelectric semiconductor temperature sensing sheet and preparation process |
| CN103698035B (en) * | 2013-12-05 | 2015-12-02 | 宁波工程学院 | The preparation technology of the single arm structure of thermoelectric semiconductor temperature sensing sheet |
| CN106158175A (en) * | 2015-05-11 | 2016-11-23 | 博格华纳路德维希堡有限公司 | Add thermal resistor and method that making adds thermal resistor |
| CN108109791A (en) * | 2017-12-20 | 2018-06-01 | 广东爱晟电子科技有限公司 | A kind of surface-adhered type thermal-sensitive electric resistance device and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102842398B (en) | 2015-08-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| RU2668087C2 (en) | Planar heating element with ptc resistance structure | |
| CN105209872B (en) | Thermoelectric pile differential scanning calorimeter sensor | |
| CN103545285B (en) | Semicondutor module and method for determining a current flowing through a load connection | |
| CN102842398A (en) | Preparation method for chip-type ceramic sensitive element and corresponding product thereof | |
| CN106783755A (en) | A kind of ceramic packaging substrate preparation method with copper facing box dam | |
| CN108109792B (en) | Thermistor with base and preparation method thereof | |
| CN105318983A (en) | Flexible thin film thermocouple temperature sensor and preparation method thereof | |
| CN105606246A (en) | High-temperature-resistant quick-response thermistor and temperature sensor including the same | |
| CN104198079A (en) | Quick response thermosensitive chip with high precision and reliability and manufacturing method thereof | |
| CN102889933B (en) | Chip of MEMS (micro-electromechanical system) thermopile infrared detector and method for manufacturing inner chip in chip of MEMS thermopile infrared detector and chip of MEMS thermopile infrared detector | |
| CN103177836B (en) | Adopt critesistor and the manufacture method thereof of ceramic membrane manufacture | |
| CN102222627B (en) | Packaging method possessing wafer dimension plaster | |
| CN105428330A (en) | Semiconductor device and manufacturing method thereof | |
| CN105606247B (en) | A kind of thermistor and its manufactured temperature sensor of high temperature resistant quick response | |
| CN106205911A (en) | A kind of heat sensitive chip of anti-short circuit and preparation method thereof | |
| CN109166679B (en) | NTC thermistor processing method | |
| CN100382344C (en) | Light-emitting diode packaging structure and method for making same | |
| CN103280424B (en) | A kind of integrated approach of high integration power thick film hybrid integrated circuit | |
| CN105609472B (en) | The encapsulating structure and its manufacture method of pressure sensor | |
| CN109100398A (en) | A kind of Alcohol mental disorders system packaging structure and its manufacturing method | |
| CN108336053A (en) | The manufacturing method of packaging and packaging | |
| CN105990298A (en) | Chip packaging structure and preparation method thereof | |
| CN102903645B (en) | Planar semiconductor element and manufacturing method thereof | |
| CN107785470A (en) | UV LED auxiliary frames ceramic substrates and its manufacture method | |
| CN108508283B (en) | Electric field sensor package assembly and batch manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150826 Termination date: 20200827 |