CN102841616A - Temperature control method of inertial positioning directional device - Google Patents
Temperature control method of inertial positioning directional device Download PDFInfo
- Publication number
- CN102841616A CN102841616A CN2012103602808A CN201210360280A CN102841616A CN 102841616 A CN102841616 A CN 102841616A CN 2012103602808 A CN2012103602808 A CN 2012103602808A CN 201210360280 A CN201210360280 A CN 201210360280A CN 102841616 A CN102841616 A CN 102841616A
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- inertial positioning
- temperature
- orientation equipment
- positioning orientation
- microcontroller
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Abstract
The invention discloses a temperature control method of an inertial positioning directional device, and the method is characterized in that the temperature control of the inertial positioning directional device is realized by switching an internal heating and an internal refrigerating mode through a microcontroller, so that the problem the excessively high temperature inside the inertial positioning directional device can be effectively solved, and the precision of the inertial positioning directional device can be effectively guaranteed. The method has characteristics of convenience in use and convenience in control.
Description
Technical field
The present invention relates to a kind of temperature control method, particularly a kind of inertial positioning orientation equipment temperature control method.
Background technology
Accelerometer and laser gyro are to constitute one of core sensitive element of inertial positioning orientation equipment, and its precision directly has influence on attitude, speed and the bearing accuracy of navigational system.The precision of accelerometer is except that the performance impact that receives manufacturing process, inner structure etc. self, and is also relevant with residing environmental baseline.Wherein the influence of environment temperature is particularly outstanding, when environment temperature its drift error when changing for-40 ℃～+ 60 ℃ will reach 2 * 10g-4 even bigger.A kind of solution commonly used is warming-up device to the inertial positioning orientation equipment to be set, and the inertial positioning orientation equipment was started working after warming-up device was warmed to the temperature of appointment.In the process of inertial positioning orientation equipment work, adopt the housing heat radiation, radiating efficiency is very low.
Along with the progress of work, inertial positioning orientation equipment temperature inside may be very high, particularly under the environment of sealing even above 80 ℃.The overwhelming majority of laser gyro at present adopts indium welder skill, if inertial positioning orientation equipment internal temperature surpass 80 ℃ then indium can slowly melt, probably can cause laser gyro gas leakage, finally influence the laser gyro precision.
Summary of the invention
The object of the invention is to provide a kind of inertial positioning orientation equipment temperature control method, solves owing to inertial positioning orientation equipment internal components release heat, and inertial positioning orientation equipment housing can not fully discharge the too high problem of being brought of temperature again.
A kind of inertial positioning orientation equipment temperature control method, its concrete steps are:
The first step is built inertial positioning orientation equipment temperature control system
Inertial positioning orientation equipment temperature control system comprises: temperature sensor, microcontroller, warming module, semiconductor chilling plate.
The data-interface of temperature sensor is connected with microcontroller data-interface lead, and the control interface that powers up of heating module is connected with the control interface lead of microcontroller, and the control interface that powers up of semiconductor chilling plate is connected with the control interface lead of microcontroller.
Second step was confirmed the working temperature of inertial positioning orientation equipment
The acceleration of selecting according to the inertial positioning orientation equipment is taken into account the temperature characterisitic of gyro, confirms working temperature
～
of inertial positioning orientation equipment.Be that inner minimum temperature is
in the inertial positioning orientation equipment steady operation process, inner maximum temperature is
in the inertial positioning orientation equipment steady operation process.
The 3rd step microprocessor controls is heated
When the inertial positioning orientation equipment started, temperature sensor was gathered inertial positioning orientation equipment internal temperature
.If less than
, then the microprocessor controls warming module heats for the inertial positioning orientation equipment
.
Temperature sensor is gathered inertial positioning orientation equipment internal temperature
in real time; If more than or equal to
, then the microprocessor controls warming module stops to heat to the inertial positioning orientation equipment
.
The stable output of gyro and accelerometer, the inertial positioning orientation equipment carries out initial alignment work.The continuous release heat of internal components in the inertial positioning orientation equipment course of work, simultaneously the inertial positioning orientation equipment also carries out temperature exchange through self housing and outside.
The 4th Buwen's degree sensor temperature variation
In the inertial positioning orientation equipment course of work; Temperature sensor is gathered inertial positioning orientation equipment internal temperature
in real time, and sends this temperature to microcontroller.
The 5th step microprocessor controls warming module and semiconductor chilling plate work
Microcontroller reads inertial positioning orientation equipment internal temperature
; If
is less than
; Then the microprocessor controls warming module heats for the inertial positioning orientation equipment, until temperature more than or equal to
.
If
is greater than
; Then the microprocessor controls semiconductor chilling plate is given inertial positioning orientation equipment refrigeration, until temperature smaller or equal to
.
The 6th step microcontroller keeps the device interior temperature
Microcontroller is continuous repeated temperature sensor temperature variation in the inertial positioning orientation equipment course of work.Microcontroller guarantees that through switching warming module and semiconductor chilling plate duty the inertial positioning orientation equipment is operated in the stable temperature range.
Guarantee that through above step the inertial positioning orientation equipment works in a stable temperature range.
This method is through the control of microcontroller to inner warming module and semiconductor chilling plate; Realize the temperature control of inertial positioning orientation equipment; Effectively solved owing to inertial positioning orientation equipment internal components release heat, inertial positioning orientation equipment housing can not fully discharge the too high problem of being brought of temperature again.The too high final navigation accuracy that influences the inertial positioning orientation equipment of temperature, and the semiconductor chilling plate volume little, be convenient to install, characteristics such as refrigerating efficiency is high, easy to use, be convenient to control.
Embodiment
A kind of inertial positioning orientation equipment temperature control method, its concrete steps are:
The first step is built inertial positioning orientation equipment temperature control system
Inertial positioning orientation equipment temperature control system comprises: temperature sensor, microcontroller, warming module, semiconductor chilling plate.
The data-interface of temperature sensor is connected with microcontroller data-interface lead, and the control interface that powers up of heating module is connected with the control interface lead of microcontroller, and the control interface that powers up of semiconductor chilling plate is connected with the control interface lead of microcontroller.
Second step was confirmed the working temperature of inertial positioning orientation equipment
The acceleration of selecting according to the inertial positioning orientation equipment is taken into account the temperature characterisitic of gyro, confirms working temperature
～
of inertial positioning orientation equipment.Be that inner minimum temperature is
in the inertial positioning orientation equipment steady operation process, inner maximum temperature is
in the inertial positioning orientation equipment steady operation process.
The 3rd step microprocessor controls is heated
When the inertial positioning orientation equipment started, temperature sensor was gathered inertial positioning orientation equipment internal temperature
.If less than
, then the microprocessor controls warming module heats for the inertial positioning orientation equipment
.
The stable output of gyro and accelerometer, the inertial positioning orientation equipment carries out initial alignment work.The continuous release heat of internal components in the inertial positioning orientation equipment course of work, simultaneously the inertial positioning orientation equipment also carries out temperature exchange through self housing and outside.
The 4th Buwen's degree sensor temperature variation
In the inertial positioning orientation equipment course of work; Temperature sensor is gathered inertial positioning orientation equipment internal temperature
in real time, and sends this temperature to microcontroller.
The 5th step microprocessor controls warming module and semiconductor chilling plate work
Microcontroller reads inertial positioning orientation equipment internal temperature
; If
is less than
; Then the microprocessor controls warming module heats for the inertial positioning orientation equipment, until temperature more than or equal to
.
The 6th step microcontroller keeps the device interior temperature
Microcontroller is continuous repeated temperature sensor temperature variation in the inertial positioning orientation equipment course of work.Microcontroller guarantees that through switching warming module and semiconductor chilling plate working time the inertial positioning orientation equipment is operated in the stable temperature range.
Guarantee that through above step the inertial positioning orientation equipment works in a stable temperature range.
Claims (1)
1. inertial positioning orientation equipment temperature control method is characterized in that the concrete steps of this method are:
The first step is built inertial positioning orientation equipment temperature control system
Inertial positioning orientation equipment temperature control system comprises: temperature sensor, microcontroller, warming module, semiconductor chilling plate;
The data-interface of temperature sensor is connected with microcontroller data-interface lead, and the control interface that powers up of heating module is connected with the control interface lead of microcontroller, and the control interface that powers up of semiconductor chilling plate is connected with the control interface lead of microcontroller;
Second step was confirmed the working temperature of inertial positioning orientation equipment
The acceleration of selecting according to the inertial positioning orientation equipment is taken into account the temperature characterisitic of gyro, confirms working temperature
～
of inertial positioning orientation equipment; Be that inner minimum temperature is
in the inertial positioning orientation equipment steady operation process, inner maximum temperature is
in the inertial positioning orientation equipment steady operation process;
The 3rd step microprocessor controls is heated
When the inertial positioning orientation equipment started, temperature sensor was gathered inertial positioning orientation equipment internal temperature
; If less than
, then the microprocessor controls warming module heats for the inertial positioning orientation equipment
;
Temperature sensor is gathered inertial positioning orientation equipment internal temperature
in real time; If more than or equal to
, then the microprocessor controls warming module stops to heat to the inertial positioning orientation equipment
;
The stable output of gyro and accelerometer, the inertial positioning orientation equipment carries out initial alignment work; The continuous release heat of internal components in the inertial positioning orientation equipment course of work, simultaneously the inertial positioning orientation equipment also carries out temperature exchange through self housing and outside;
The 4th Buwen's degree sensor temperature variation
In the inertial positioning orientation equipment course of work; Temperature sensor is gathered inertial positioning orientation equipment internal temperature
in real time, and sends this temperature to microcontroller;
The 5th step microprocessor controls warming module and semiconductor chilling plate work
Microcontroller reads inertial positioning orientation equipment internal temperature
; If
is less than
; Then the microprocessor controls warming module heats for the inertial positioning orientation equipment, until temperature more than or equal to
;
If
is greater than
; Then the microprocessor controls semiconductor chilling plate is given inertial positioning orientation equipment refrigeration, until temperature smaller or equal to
;
The 6th step microcontroller keeps the device interior temperature
Microcontroller is continuous repeated temperature sensor temperature variation in the inertial positioning orientation equipment course of work; Microcontroller guarantees that through switching warming module and semiconductor chilling plate duty the inertial positioning orientation equipment is operated in the stable temperature range;
Guarantee that through above step the inertial positioning orientation equipment works in a stable temperature range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210360280.8A CN102841616B (en) | 2012-09-25 | 2012-09-25 | Temperature control method of inertial positioning directional device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210360280.8A CN102841616B (en) | 2012-09-25 | 2012-09-25 | Temperature control method of inertial positioning directional device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102841616A true CN102841616A (en) | 2012-12-26 |
| CN102841616B CN102841616B (en) | 2014-11-05 |
Family
ID=47369084
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210360280.8A Active CN102841616B (en) | 2012-09-25 | 2012-09-25 | Temperature control method of inertial positioning directional device |
Country Status (1)
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| CN (1) | CN102841616B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104035460A (en) * | 2013-03-05 | 2014-09-10 | 上海新跃仪表厂 | Temperature control circuit of hemisphere resonance gyro combination |
| CN105912049A (en) * | 2016-06-23 | 2016-08-31 | 北京合众思壮科技股份有限公司 | Method, device and system for temperature control |
| CN106595650A (en) * | 2016-11-23 | 2017-04-26 | 北京航天控制仪器研究所 | Miniature, low-cost and temperature-controlled inertial measurement system |
| CN111459211A (en) * | 2015-04-20 | 2020-07-28 | 深圳市大疆创新科技有限公司 | System and method for thermally regulating sensor operation |
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| KR19980061593A (en) * | 1996-12-31 | 1998-10-07 | 추호석 | Tuning Gyro Temperature Control Circuit Using AD590 and Darlington Transistor |
| RU2004139143A (en) * | 2004-12-22 | 2006-06-10 | Федеральное государственное унитарное предпри тие"Центральный научно-исследовательский институт "Электроприбор" (RU) | METHOD FOR THERMOSTATING A GYROSCOPE IN A FLOW THERMOSTAT |
| CN101025635A (en) * | 2007-03-07 | 2007-08-29 | 北京航空航天大学 | Full digital temperature control device suitable for optical fiber gyro inertial measurement combination |
| CN201097241Y (en) * | 2007-11-12 | 2008-08-06 | 中国科学院长春光学精密机械与物理研究所 | Peg-top temperature control device |
| CN201134053Y (en) * | 2007-12-27 | 2008-10-15 | 中国船舶重工集团公司第七○七研究所 | Linear temperature-control circuit of gyroscopes |
| CN102095419A (en) * | 2010-12-01 | 2011-06-15 | 东南大学 | Method for modeling and error compensation of temperature drift of fiber optic gyroscope |
-
2012
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980061593A (en) * | 1996-12-31 | 1998-10-07 | 추호석 | Tuning Gyro Temperature Control Circuit Using AD590 and Darlington Transistor |
| RU2004139143A (en) * | 2004-12-22 | 2006-06-10 | Федеральное государственное унитарное предпри тие"Центральный научно-исследовательский институт "Электроприбор" (RU) | METHOD FOR THERMOSTATING A GYROSCOPE IN A FLOW THERMOSTAT |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104035460A (en) * | 2013-03-05 | 2014-09-10 | 上海新跃仪表厂 | Temperature control circuit of hemisphere resonance gyro combination |
| CN111459211A (en) * | 2015-04-20 | 2020-07-28 | 深圳市大疆创新科技有限公司 | System and method for thermally regulating sensor operation |
| US11703522B2 (en) | 2015-04-20 | 2023-07-18 | SZ DJI Technology Co., Ltd. | Systems and methods for thermally regulating sensor operation |
| CN105912049A (en) * | 2016-06-23 | 2016-08-31 | 北京合众思壮科技股份有限公司 | Method, device and system for temperature control |
| CN106595650A (en) * | 2016-11-23 | 2017-04-26 | 北京航天控制仪器研究所 | Miniature, low-cost and temperature-controlled inertial measurement system |
| CN106595650B (en) * | 2016-11-23 | 2019-09-06 | 北京航天控制仪器研究所 | A kind of inexpensive temperature control type inertial measurement system of miniaturization |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102841616B (en) | 2014-11-05 |
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