CN102841616B - Temperature control method of inertial positioning directional device - Google Patents
Temperature control method of inertial positioning directional device Download PDFInfo
- Publication number
- CN102841616B CN102841616B CN201210360280.8A CN201210360280A CN102841616B CN 102841616 B CN102841616 B CN 102841616B CN 201210360280 A CN201210360280 A CN 201210360280A CN 102841616 B CN102841616 B CN 102841616B
- Authority
- CN
- China
- Prior art keywords
- inertial positioning
- orientation equipment
- positioning orientation
- temperature
- microcontroller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The invention discloses a temperature control method of an inertial positioning directional device, and the method is characterized in that the temperature control of the inertial positioning directional device is realized by switching an internal heating and an internal refrigerating mode through a microcontroller, so that the problem the excessively high temperature inside the inertial positioning directional device can be effectively solved, and the precision of the inertial positioning directional device can be effectively guaranteed. The method has characteristics of convenience in use and convenience in control.
Description
Technical field
The present invention relates to a kind of Temp. control method, particularly a kind of inertial positioning orientation equipment Temp. control method.
Background technology
Accelerometer and laser gyro are to form one of core sensitive element of inertial positioning orientation equipment, and its precision directly has influence on attitude, speed and the positioning precision of navigational system.The precision of accelerometer is except being subject to the performance impact of manufacturing process, inner structure etc. self, also relevant with residing environmental baseline.Wherein the impact of environment temperature is particularly outstanding, and when environment temperature its drift error when-40 ℃～+ 60 ℃ change, will to reach 2 * 10g-4 even larger.Conventional solution is, to inertial positioning orientation equipment, a warming-up device is set, and after warming-up device is warmed to the temperature of appointment, inertial positioning orientation equipment is started working.In the process of inertial positioning orientation equipment work, adopt housing heat radiation, radiating efficiency is very low.
Along with work progress, the temperature of inertial positioning orientation equipment inside may be very high, particularly sealing environment under even over 80 ℃.The at present laser gyro overwhelming majority adopts indium Welding, if inertial positioning orientation equipment internal temperature surpass 80 ℃ indium can slowly melt, probably can cause laser gyro gas leakage, finally affect laser gyro precision.
Summary of the invention
The object of the invention is to provide a kind of inertial positioning orientation equipment Temp. control method, solves due to inertial positioning orientation equipment internal components release heat, and inertial positioning orientation equipment housing can not fully discharge the problem of brought excess Temperature again.
An inertial positioning orientation equipment Temp. control method, its concrete steps are:
The first step is built inertial positioning orientation equipment temperature control system
Inertial positioning orientation equipment temperature control system, comprising: temperature sensor, microcontroller, warming module, semiconductor chilling plate.
The data-interface of temperature sensor is connected with microcontroller data-interface wire, and the control interface that powers up of heating module is connected with the control interface wire of microcontroller, and the control interface that powers up of semiconductor chilling plate is connected with the control interface wire of microcontroller.
An inertial positioning orientation equipment Temp. control method, its concrete steps are:
Second step is determined the working temperature of inertial positioning orientation equipment
The acceleration of selecting according to inertial positioning orientation equipment is taken into account the temperature characterisitic of gyro, determines the work temperature of inertial positioning orientation equipment
1～T
2.Be that in inertial positioning orientation equipment steady operation process, inner minimum temperature is T
1, in inertial positioning orientation equipment steady operation process, inner maximum temperature is T
2.
The 3rd step microprocessor controls is heated
When inertial positioning orientation equipment starts, temperature sensor gathers inertial positioning orientation equipment internal temperature T.If T is less than T
1, microprocessor controls warming module is heated to inertial positioning orientation equipment.
Temperature sensor Real-time Collection inertial positioning orientation equipment internal temperature T, if T is more than or equal to T
1, microprocessor controls warming module stops heating to inertial positioning orientation equipment.
The stable output of gyro and accelerometer, inertial positioning orientation equipment carries out initial alignment work.The continuous release heat of internal components in the inertial positioning orientation equipment course of work, simultaneously inertial positioning orientation equipment also carries out temperature exchange by self housing and outside.
The 4th step temperature sensor detected temperatures changes
In the inertial positioning orientation equipment course of work, temperature sensor Real-time Collection inertial positioning orientation equipment internal temperature T, and send this temperature to microcontroller.
The 5th step microprocessor controls warming module and semiconductor chilling plate work
Microcontroller reads inertial positioning orientation equipment internal temperature T, if T is less than T
1, microprocessor controls warming module is heated to inertial positioning orientation equipment, until temperature is more than or equal to T
1.
If T is greater than T
2, microprocessor controls semiconductor chilling plate is to inertial positioning orientation equipment refrigeration, until temperature is less than or equal to T
2.
The 6th step microcontroller keeps device interior temperature
Microcontroller is constantly repeated temperature sensor detected temperatures variation in the inertial positioning orientation equipment course of work.Microcontroller guarantees that by switching warming module and semiconductor chilling plate duty inertial positioning orientation equipment is operated in a stable temperature range.
Through above step, guarantee that inertial positioning orientation equipment works in a stable temperature range.
This method is the control to inner warming module and semiconductor chilling plate by microcontroller, realizing the temperature of inertial positioning orientation equipment controls, effectively solved due to inertial positioning orientation equipment internal components release heat, inertial positioning orientation equipment housing can not fully discharge the problem of brought excess Temperature again.Excess Temperature finally affects the navigation accuracy of inertial positioning orientation equipment, and semiconductor chilling plate volume little, be convenient to install, the feature such as refrigerating efficiency is high, easy to use, be convenient to control.
Embodiment
An inertial positioning orientation equipment Temp. control method, its concrete steps are:
The first step is built inertial positioning orientation equipment temperature control system
Inertial positioning orientation equipment temperature control system, comprising: temperature sensor, microcontroller, warming module, semiconductor chilling plate.
The data-interface of temperature sensor is connected with microcontroller data-interface wire, and the control interface that powers up of heating module is connected with the control interface wire of microcontroller, and the control interface that powers up of semiconductor chilling plate is connected with the control interface wire of microcontroller.
Second step is determined the working temperature of inertial positioning orientation equipment
The acceleration of selecting according to inertial positioning orientation equipment is taken into account the temperature characterisitic of gyro, determines the work temperature of inertial positioning orientation equipment
1～T
2.Be that in inertial positioning orientation equipment steady operation process, inner minimum temperature is T
1, in inertial positioning orientation equipment steady operation process, inner maximum temperature is T
2.
The 3rd step microprocessor controls is heated
When inertial positioning orientation equipment starts, temperature sensor gathers inertial positioning orientation equipment internal temperature T.If T is less than T
1, microprocessor controls warming module is heated to inertial positioning orientation equipment.
The stable output of gyro and accelerometer, inertial positioning orientation equipment carries out initial alignment work.The continuous release heat of internal components in the inertial positioning orientation equipment course of work, simultaneously inertial positioning orientation equipment also carries out temperature exchange by self housing and outside.
The 4th step temperature sensor detected temperatures changes
In the inertial positioning orientation equipment course of work, temperature sensor Real-time Collection inertial positioning orientation equipment internal temperature T, and send this temperature to microcontroller.
The 5th step microprocessor controls warming module and semiconductor chilling plate work
Microcontroller reads inertial positioning orientation equipment internal temperature T, if T is less than T
1, microprocessor controls warming module is heated to inertial positioning orientation equipment, until temperature is more than or equal to T
1.
The 6th step microcontroller keeps device interior temperature
Microcontroller is constantly repeated temperature sensor detected temperatures variation in the inertial positioning orientation equipment course of work.Microcontroller guarantees that by switching warming module and semiconductor chilling plate working time inertial positioning orientation equipment is operated in a stable temperature range.
Through above step, guarantee that inertial positioning orientation equipment works in a stable temperature range.
Claims (1)
1. an inertial positioning orientation equipment Temp. control method, comprising: inertial positioning orientation equipment temperature control system, and this system comprises: temperature sensor, microcontroller, warming module, semiconductor chilling plate; The data-interface of temperature sensor is connected with microcontroller data-interface wire, and the control interface that powers up of warming module is connected with the control interface wire of microcontroller, and the control interface that powers up of semiconductor chilling plate is connected with the control interface wire of microcontroller; The concrete steps that it is characterized in that this method are:
The first step is determined the working temperature of inertial positioning orientation equipment
The acceleration of selecting according to inertial positioning orientation equipment is taken into account the temperature characterisitic of gyro, determines the work temperature of inertial positioning orientation equipment
1～T
2; Be that in inertial positioning orientation equipment steady operation process, inner minimum temperature is T
1, in inertial positioning orientation equipment steady operation process, inner maximum temperature is T
2;
Second step microprocessor controls is heated
When inertial positioning orientation equipment starts, temperature sensor gathers inertial positioning orientation equipment internal temperature T; If T is less than T
1, microprocessor controls warming module is heated to inertial positioning orientation equipment;
Temperature sensor Real-time Collection inertial positioning orientation equipment internal temperature T, if T is more than or equal to T
1, microprocessor controls warming module stops heating to inertial positioning orientation equipment;
The stable output of gyro and accelerometer, inertial positioning orientation equipment carries out initial alignment work; The continuous release heat of internal components in the inertial positioning orientation equipment course of work, simultaneously inertial positioning orientation equipment also carries out temperature exchange by self housing and outside;
The 3rd step temperature sensor detected temperatures changes
In the inertial positioning orientation equipment course of work, temperature sensor Real-time Collection inertial positioning orientation equipment internal temperature T, and send this temperature to microcontroller;
The 4th step microprocessor controls warming module and semiconductor chilling plate work
Microcontroller reads inertial positioning orientation equipment internal temperature T, if T is less than T
1, microprocessor controls warming module is heated to inertial positioning orientation equipment, until temperature is more than or equal to T
1;
If T is greater than T
2, microprocessor controls semiconductor chilling plate is to inertial positioning orientation equipment refrigeration, until temperature is less than or equal to T
2;
The 5th step microcontroller keeps device interior temperature
Microcontroller is constantly repeated temperature sensor detected temperatures variation in the inertial positioning orientation equipment course of work; Microcontroller guarantees that by switching warming module and semiconductor chilling plate duty inertial positioning orientation equipment is operated in a stable temperature range;
Through above step, guarantee that inertial positioning orientation equipment works in a stable temperature range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210360280.8A CN102841616B (en) | 2012-09-25 | 2012-09-25 | Temperature control method of inertial positioning directional device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210360280.8A CN102841616B (en) | 2012-09-25 | 2012-09-25 | Temperature control method of inertial positioning directional device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102841616A CN102841616A (en) | 2012-12-26 |
| CN102841616B true CN102841616B (en) | 2014-11-05 |
Family
ID=47369084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210360280.8A Active CN102841616B (en) | 2012-09-25 | 2012-09-25 | Temperature control method of inertial positioning directional device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102841616B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104035460A (en) * | 2013-03-05 | 2014-09-10 | 上海新跃仪表厂 | Temperature control circuit of hemisphere resonance gyro combination |
| JP6313452B2 (en) * | 2015-04-20 | 2018-04-18 | エスゼット ディージェイアイ テクノロジー カンパニー リミテッドＳｚ Ｄｊｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ | System, method and unmanned aerial vehicle for thermally adjusting sensor operation |
| CN105912049A (en) * | 2016-06-23 | 2016-08-31 | 北京合众思壮科技股份有限公司 | Method, device and system for temperature control |
| CN106595650B (en) * | 2016-11-23 | 2019-09-06 | 北京航天控制仪器研究所 | A kind of inexpensive temperature control type inertial measurement system of miniaturization |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2004139143A (en) * | 2004-12-22 | 2006-06-10 | Федеральное государственное унитарное предпри тие"Центральный научно-исследовательский институт "Электроприбор" (RU) | METHOD FOR THERMOSTATING A GYROSCOPE IN A FLOW THERMOSTAT |
| CN101025635A (en) * | 2007-03-07 | 2007-08-29 | 北京航空航天大学 | Full digital temperature control device suitable for optical fiber gyro inertial measurement combination |
| CN201097241Y (en) * | 2007-11-12 | 2008-08-06 | 中国科学院长春光学精密机械与物理研究所 | Peg-top temperature control device |
| CN201134053Y (en) * | 2007-12-27 | 2008-10-15 | 中国船舶重工集团公司第七○七研究所 | Linear temperature-control circuit of gyroscopes |
| CN102095419A (en) * | 2010-12-01 | 2011-06-15 | 东南大学 | Method for modeling and error compensation of temperature drift of fiber optic gyroscope |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980061593A (en) * | 1996-12-31 | 1998-10-07 | 추호석 | Tuning Gyro Temperature Control Circuit Using AD590 and Darlington Transistor |
-
2012
- 2012-09-25 CN CN201210360280.8A patent/CN102841616B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2004139143A (en) * | 2004-12-22 | 2006-06-10 | Федеральное государственное унитарное предпри тие"Центральный научно-исследовательский институт "Электроприбор" (RU) | METHOD FOR THERMOSTATING A GYROSCOPE IN A FLOW THERMOSTAT |
| CN101025635A (en) * | 2007-03-07 | 2007-08-29 | 北京航空航天大学 | Full digital temperature control device suitable for optical fiber gyro inertial measurement combination |
| CN201097241Y (en) * | 2007-11-12 | 2008-08-06 | 中国科学院长春光学精密机械与物理研究所 | Peg-top temperature control device |
| CN201134053Y (en) * | 2007-12-27 | 2008-10-15 | 中国船舶重工集团公司第七○七研究所 | Linear temperature-control circuit of gyroscopes |
| CN102095419A (en) * | 2010-12-01 | 2011-06-15 | 东南大学 | Method for modeling and error compensation of temperature drift of fiber optic gyroscope |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102841616A (en) | 2012-12-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102841616B (en) | Temperature control method of inertial positioning directional device | |
| CN101619975B (en) | Laser gyro temperature compensation and control device and application | |
| CN201364507Y (en) | Constant temperature control system | |
| WO2010062888A3 (en) | Absorption cycle system having dual absorption circuits | |
| CN109032200B (en) | Temperature control equipment for semiconductor production and control method of electronic expansion valve of temperature control equipment | |
| CN202948346U (en) | Thermotank used for fiber-optic gyroscope | |
| CN106774492A (en) | A kind of small-sized quick high accuracy constant temperature system based on TEC | |
| US8693186B2 (en) | Heat transferring module and start up method of electronic device | |
| CN104345750A (en) | Semiconductor laser constant current driving and temperature control system | |
| CN203595940U (en) | Intelligent obstacle avoidance trolley circuit | |
| CN103279146A (en) | Method and system for temperature rise based on PID control | |
| CN201593641U (en) | Intelligent control valve | |
| CN104421611A (en) | Fuel gas filling device | |
| CN102830642B (en) | Low speed adhesive dispensing robot servo-control system in five axles | |
| CN103064443A (en) | Active constant temperature control device and method capable of guaranteeing temperature stability performance of Micro-electromechanical Systems (MEMS) angular velocity sensor by using Peltier Effect | |
| CN107117047B (en) | Calibration method and calibration system for heat capacity of energy storage unit of new energy automobile | |
| CN102305879B (en) | Heating method for accelerometer | |
| CN203232277U (en) | A high-precision temperature generator based on a microprocessor | |
| CN103063858A (en) | Subsection type active constant temperature control device and method for guaranteeing temperature stability performance of micro-electromechanical system (MEMS) angular velocity sensor | |
| CN203103462U (en) | Automatic temperature control system for automotive lithium ion batteries | |
| CN203734132U (en) | Laser light source | |
| CN105790065A (en) | Multi-wavelength tunable laser diode (LD) driving power supply system capable of remote control and working method of system | |
| CN202474144U (en) | Cooling-heating device for power car battery system | |
| CN105413131A (en) | Automatic obstacle avoiding method for golf caddie robot | |
| CN102841559B (en) | Low speed adhesive dispensing robot servo-control system in four axles |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |