CN102834664B - 微型smd-hpled可替换灯 - Google Patents
微型smd-hpled可替换灯 Download PDFInfo
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- CN102834664B CN102834664B CN201180017715.2A CN201180017715A CN102834664B CN 102834664 B CN102834664 B CN 102834664B CN 201180017715 A CN201180017715 A CN 201180017715A CN 102834664 B CN102834664 B CN 102834664B
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- Prior art keywords
- hpled
- main body
- hole
- smd
- replaceable lamp
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- Expired - Fee Related
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/04—Fastening of light sources or lamp holders with provision for changing light source, e.g. turret
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
一种微型SMD-HPLED可替换灯(10),它包括:一个可选地由陶瓷或金属材料制成的主体(1);一个容纳在所述主体(1)中的电连接器(20)和一个嵌入HPLED照明光源的印刷电路板(3a)。所述连接器(20)被适当地设计为确保印刷电路板(3a)和外部电源之间的电气连续性,以及将其锁定在布置于所述主体(1)上的插槽(2)中。
Description
本发明涉及到一种LED(发光二极管)灯,这种灯带有作为照明光源的LED,特别的,所述照明光源设计为安装在PCB(印刷电路板)上,所述印刷电路板可由用户替换。
如上所述的根据本发明的LED灯的照明光源是一种照明装置,它将大功率LED(下文的HPLED)通过制造工艺、因而牢固地安装在印刷电路板上,该印刷电路板提供每一个电气组件和所有向HPLED的电连接,因此,为了运行,仅仅需要将该印刷电路板连接到一个外部电源。这是许多其他的电子设备采纳的一种常规的制造工艺,通常被称为表面安装器件或SMD。
现有技术提供的可替换的SMD-LED灯,类似于本发明提出的技术方案,通过实际的SMD-LED从一个可滑动槽简单提取,进一步插入一个新的SMD-LED到所述槽内,以有机会替换SMD-LED光源。但是从现有技术的记载中并没有提出或者已知微型SMD-HPLED可替换灯:根据本发明的灯提供的构造技术方案,相反的,允许获得具有相当小尺寸的HPLED的灯,即微型HPLED灯,通过减少形成在所述灯上的电连接器的最小尺寸和供给的光源的必要电力,所述连接器也被用于将该SMD-HPLED锁定在为此提供的插槽上。此外,本发明通过以下公开的构造技术方案,允许所有的照明光束由光源在布置处产生,由于该SMD-HPLED被容纳到齐平于所述灯的外表面。最后,同一盏灯被用作与SMD-HPLED光源相关的散热片,通过以下的根据本发明的微型SMD-HPLED灯的优选实施例的详细描述,更为清楚地公开,所采取的描述结合附图,其中相同的参考标号表示类似或相同的元件。特别是:
图1是根据本发明的一个优选实施例的微型可替换SMD-HPLED灯的透视图;
图2是图1中实施例的第二透视图;
图3是图1中实施例的电气组件的透视图;和
图4是根据本发明的一个可选实施例的微型可替换SMD-HPLED灯的分解透视图。
下面公开的实施例能够被可选的采用,主要是基于灯的需要的材料。具体地说,两种不同的材料可以选择:陶瓷材料或金属材料,特别是铝。陶瓷材料通常是优选的,由于其更好的散热性能和消除与短路有关的所有风险的电绝缘特性;另一方面,陶瓷的成型工艺不能给予本发明的所有应用所要求的表面光洁度。因此,如果灯的部件和组件需要一个更为精确的装配,金属材料能够被采用和被机械加工,以便获取改善的制造质量。
现在参考图1和图2,一种微型可替换SMD-HPLED灯10由一个陶瓷主体1,一个SMD-HPLED3和一个电连接器20组成。该陶瓷主体1优选圆柱形成型并设置有形成在其上的上部插槽2。所述上部插槽2,依序具有一个近似矩形的形状,其深度相当于印刷电路板3a的厚度,HPLED和其成对的电源触点3b嵌入在该印刷电路板上。上部插槽2因此适当地定尺寸用于容纳SMD-HPLED3,一旦其插入到插槽2,印刷电路板3a便与陶瓷主体1的上表面1a同高。上部插槽2还设置有一对通孔2a和2b,它们中的每一个放置在同一插槽2最长边的中间。如图2所示,在主体1的下表面1b上形成有一个大致为矩形的凹槽4,其最长边沿垂直于插槽2的最长边的方向移动,其最短边在插槽2的所述通孔2a和2b之下:根据此配置,凹槽4使得与每个通孔2a和2b连通。
图3显示了电元件或连接器20设计成被插入和容纳到上述公开的矩形凹槽4中,连接器20包括具有与凹槽4的形状共轭的形状的电绝缘部件5,此外,所述绝缘部件5的中部提供有一对通孔5a。一对引导件5b然后形成在绝缘部件5上,每个引导件5b放置在所述成对通孔5a占据的位置的之外。导体6以金属带的形式提供,在其一端带有通孔6a,该通孔6a容纳在每个引导件5b中,以便所述通孔6a同轴于所述通孔5a。所述导体6是塑性变形的,并折叠回到它自身上,使得金属带的轮廓成为C形;因此导体6的另一端部6b通过C形轮廓的垂直侧将会悬浮。电气终端7以针的形式插入到每个带6的通孔6a中,并插入到绝缘部件5的每个通孔5a中。以这样的方式来实现从每个终端7的前端7a到每个金属带导体6的端部6b的电气连续性。头部7b,在前端7a的相反的一端,形成在每个终端7上,以避免同一终端7的任何垂直运动;而且所述终端7的杆,即所述头部7b下面与通孔6a连接的部分,提供有一个增大的直径7c,其在装配过程中,使通孔6a的直径变形并允许它们的一种改进的连接。因此,在导体的端部6b穿过所述成对通孔2a和2b时,连接器20可以被插入到凹槽4中。因此金属带C形轮廓的垂直边必须定尺寸,以便在SMD-HPLED3插入时,导体的端部6b被充分按压在印刷电路板3a的电源触点3b上。为了达到这一结果,每个导体的端部6b稍微向下进一步变形,因此,它们通过每个电源触点3b产生弹性装载;此外,每个导体的端部6b具有一个方向向下的凹部,用于进一步确保与电源触点3b的可靠的连接。在这样的条件下,所述连接器20不仅用于为该SMD-HPLED3供电,还用于将其锁定到插槽2中。最后,成对的每个通孔5a之间的距离有利的选择,以便终端7的轴线之间的距离符合电气连接标准G4,G5.3,GX5.3,G6.35,甚至GY6.35。
图4展示了本发明的可选实施例:灯10由仍具有优选圆筒状的铝主体1构成:插槽2形成在所述筒状体上,其尺寸适于容纳SMD-HPLED3,即一个近似矩形的槽,产生于从上表面1a铣削向下到深度等于印刷电路板3a的厚度,并且宽度小于所述铝主体1的直径。沿垂直于所述插槽2的最长边的方向,近似矩形的凹槽4的纵向侧边大于插槽2的宽度,并且在其底面具有一对通孔4a,也是铣削的。设计所述凹槽4和所述通孔4a是为了容纳先前公开的连接器20,所述通孔4a的轴之间的距离适用于同轴地接收所述终端7。
所有公开的实施例都设置有一对形成于陶瓷或金属主体1上的凸部1d。布置所述凸部1d,以便通过卡扣配合与环8连接,反过来,环8支撑透镜9,也由图4所示。
Claims (7)
1.一种微型SMD-HPLED可替换灯(10),包括:
(i)一个主体(1),该主体(1)设置有形成在其上的上部插槽(2),和布置在主体(1)的下表面(1b)上的凹槽(4),上部插槽(2)具有一个近似矩形的形状,上部插槽(2)设置有一对通孔(2a,2b),它们中的每一个设置在同一上部插槽(2)最长边的中间,该凹槽(4)通过所述一对通孔(2a,2b)与所述上部插槽(2)连通,
(ii)一个SMD-HPLED(3),其容纳到所述上部插槽(2)中并带有多个电源触点(3b),
(iii)一个容纳在所述凹槽(4)中的绝缘部件(5),
(iv)一对金属带导体(6),它们中的每一个放置在所述绝缘部件(5)上,于其第一端部(6b)折叠回到它自身上,所述金属带导体(6)在所述第一端部(6b)具有一个C形轮廓,所述第一端部(6b)穿过所述通孔通过电源触点(3b)弹性装载,每个金属带导体(6)的第一端部(6b)具有一个方向向下的凹部,用于确保与电源触点(3b)的连接,
(v)一对电气终端(7),另一对通孔(5a)设置在所述绝缘部件(5)的中部,每个电气终端(7)穿过形成在相对于所述第一端部(6b)的第二端部上的孔(6a),并插入到绝缘部件(5)的所述另一对通孔(5a)的每个通孔中。
2.如权利要求1所述的微型SMD-HPLED可替换灯(10),其中,所述主体(1)通过陶瓷成型工艺获得。
3.如权利要求1所述的微型SMD-HPLED可替换灯(10),其中,所述主体(1)由金属材料制造。
4.如权利要求1所述的微型SMD-HPLED可替换灯(10),其中,所述主体(1)由铝制造。
5.如权利要求1所述的微型SMD-HPLED可替换灯(10),其中,绝缘部件(5)通过陶瓷成型工艺形成。
6.如权利要求1-5中任一权利要求所述的微型SMD-HPLED可替换灯(10),还包括由环(8)支撑的透镜(9)。
7.如权利要求6所述的微型SMD-HPLED可替换灯(10),其中,所述环(8)通过卡扣配合连接到所述主体(1)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI2010U000108 | 2010-04-08 | ||
IT000108U ITMI20100108U1 (it) | 2010-04-08 | 2010-04-08 | Lampada miniaturizzata a led di potenza sostituibile |
PCT/IB2011/000752 WO2011124974A1 (en) | 2010-04-08 | 2011-04-04 | Miniature smd-hpled replaceable lamp |
Publications (2)
Publication Number | Publication Date |
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CN102834664A CN102834664A (zh) | 2012-12-19 |
CN102834664B true CN102834664B (zh) | 2015-12-02 |
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Application Number | Title | Priority Date | Filing Date |
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CN201180017715.2A Expired - Fee Related CN102834664B (zh) | 2010-04-08 | 2011-04-04 | 微型smd-hpled可替换灯 |
Country Status (10)
Country | Link |
---|---|
US (1) | US8807804B2 (zh) |
EP (1) | EP2556297B1 (zh) |
JP (2) | JP2013524455A (zh) |
KR (1) | KR101678721B1 (zh) |
CN (1) | CN102834664B (zh) |
ES (1) | ES2617444T3 (zh) |
HU (1) | HUE032305T2 (zh) |
IT (1) | ITMI20100108U1 (zh) |
PL (1) | PL2556297T3 (zh) |
WO (1) | WO2011124974A1 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4963736B2 (ja) | 2010-10-28 | 2012-06-27 | 日本航空電子工業株式会社 | 照明装置 |
CN102927540B (zh) * | 2012-11-02 | 2014-09-03 | 阳江纳谷科技有限公司 | 用于模块化发光二极管电路组件的装置、方法及系统 |
JP2014216435A (ja) * | 2013-04-24 | 2014-11-17 | 日東電工株式会社 | 発光装置の電気接続部材、発光装置モジュールおよびその製造方法 |
CN105849461B (zh) * | 2014-01-02 | 2019-11-12 | 泰科电子连接荷兰公司 | Led插座组件 |
EP2918906B1 (en) * | 2014-03-12 | 2019-02-13 | TE Connectivity Nederland B.V. | Socket assembly and clamp for a socket assembly |
KR101588270B1 (ko) * | 2015-05-19 | 2016-01-25 | 주식회사 삼원파워텍 | 엘이디 조명기구 |
ITUB20161076A1 (it) * | 2016-02-25 | 2017-08-25 | Marco Gaeta | Kit per l’assemblaggio di apparecchio di illuminazione a led, metodo di assemblaggio e apparecchio di illuminazione a led assemblato |
US10605412B1 (en) | 2018-11-16 | 2020-03-31 | Emeryallen, Llc | Miniature integrated omnidirectional LED bulb |
FR3142532A1 (fr) * | 2022-11-30 | 2024-05-31 | Louss | Dispositif pour interchanger des led dans un luminaire |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62163977U (zh) * | 1986-04-09 | 1987-10-17 | ||
CN100504146C (zh) * | 2001-08-09 | 2009-06-24 | 松下电器产业株式会社 | Led照明装置和led照明光源 |
US7264378B2 (en) * | 2002-09-04 | 2007-09-04 | Cree, Inc. | Power surface mount light emitting die package |
JP4343720B2 (ja) * | 2004-01-23 | 2009-10-14 | 株式会社小糸製作所 | 灯具 |
TWI289945B (en) * | 2005-12-23 | 2007-11-11 | Jiahn-Chang Wu | Light board with cassette light unit |
JP2008016362A (ja) * | 2006-07-07 | 2008-01-24 | Koito Mfg Co Ltd | 発光モジュール及び車輌用灯具 |
US7540761B2 (en) * | 2007-05-01 | 2009-06-02 | Tyco Electronics Corporation | LED connector assembly with heat sink |
CN101765740A (zh) * | 2007-05-25 | 2010-06-30 | 莫列斯公司 | 用于发热装置与电源的散热器 |
US20090207617A1 (en) | 2008-02-20 | 2009-08-20 | Merchant Viren B | Light emitting diode (led) connector clip |
WO2009104211A1 (en) * | 2008-02-22 | 2009-08-27 | Marco Gaeta | Led lamp with replaceable light source |
CN101435562A (zh) * | 2008-12-05 | 2009-05-20 | 缪仙荣 | 一种将t8灯具升级为t5灯具的荧光灯升级装置 |
-
2010
- 2010-04-08 IT IT000108U patent/ITMI20100108U1/it unknown
-
2011
- 2011-04-04 ES ES11722504.5T patent/ES2617444T3/es active Active
- 2011-04-04 PL PL11722504T patent/PL2556297T3/pl unknown
- 2011-04-04 EP EP11722504.5A patent/EP2556297B1/en active Active
- 2011-04-04 CN CN201180017715.2A patent/CN102834664B/zh not_active Expired - Fee Related
- 2011-04-04 US US13/639,665 patent/US8807804B2/en not_active Expired - Fee Related
- 2011-04-04 WO PCT/IB2011/000752 patent/WO2011124974A1/en active Application Filing
- 2011-04-04 JP JP2013503185A patent/JP2013524455A/ja active Pending
- 2011-04-04 KR KR1020127028940A patent/KR101678721B1/ko active IP Right Grant
- 2011-04-04 HU HUE11722504A patent/HUE032305T2/en unknown
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2014
- 2014-09-10 JP JP2014004843U patent/JP3194443U/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN102834664A (zh) | 2012-12-19 |
JP2013524455A (ja) | 2013-06-17 |
KR20130084225A (ko) | 2013-07-24 |
HUE032305T2 (en) | 2017-09-28 |
KR101678721B1 (ko) | 2016-11-22 |
ITMI20100108U1 (it) | 2011-10-09 |
EP2556297B1 (en) | 2016-12-07 |
PL2556297T3 (pl) | 2017-06-30 |
US8807804B2 (en) | 2014-08-19 |
US20130027948A1 (en) | 2013-01-31 |
ES2617444T3 (es) | 2017-06-19 |
WO2011124974A1 (en) | 2011-10-13 |
JP3194443U (ja) | 2014-11-20 |
EP2556297A1 (en) | 2013-02-13 |
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