CN102832890A - Radio frequency low-temperature low-noise amplifier system of thermoelectric refrigeration - Google Patents
Radio frequency low-temperature low-noise amplifier system of thermoelectric refrigeration Download PDFInfo
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- CN102832890A CN102832890A CN2012102829034A CN201210282903A CN102832890A CN 102832890 A CN102832890 A CN 102832890A CN 2012102829034 A CN2012102829034 A CN 2012102829034A CN 201210282903 A CN201210282903 A CN 201210282903A CN 102832890 A CN102832890 A CN 102832890A
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Abstract
The invention relates to a radio frequency low-temperature low-noise amplifier system of thermoelectric refrigeration, belonging to the technical field of microwave communication. The system mainly comprises a sealing heat insulation cavity, a thermoelectric cooling assembly arranged in the cavity, a radio frequency low-temperature and low-noise amplifier, a temperature sensor, a heat dissipation assembly, a heat conduction assembly and an electric control assembly, wherein the radio frequency low-temperature and low-noise amplifier, the thermoelectric cooling assembly and the heat dissipation assembly are sequentially connected through the heat conduction assembly; the electric control assembly is respectively connected with the thermoelectric cooling assembly, the heat dissipation assembly and the radio frequency low-temperature and low-noise amplifier; the temperature sensor is arranged on one side of the heat dissipation assembly, which is close to the thermoelectric cooling assembly, and is connected with the electric control assembly; and the radio frequency input interface and the radio frequency output interface in two ends of the radio frequency low-temperature and low-noise amplifier are fixed in two end walls of the sealing heat insulation cavity. The radio frequency low-temperature low-noise amplifier system of thermoelectric refrigeration ensures vibration and water prevention and heat insulation when the low-temperature and low-noise radio frequency amplifier works in low-temperature, and meanwhile is capable of improving the sensitivity of the radio frequency receiving system.
Description
Technical field
The invention belongs to the microwave communication equipment technical field, particularly the structural design of thermoelectric cooling low noise amplifier in reducing receiver.
Background technology
The radio frequency communication module mainly is made up of radiofrequency emitting module and receiver module, and receiver module mainly is to select useful signal and amplification to numerous wireless signal in the space, supplies the radio frequency link of rear end to carry out signal processing.Because interference and loss and multipath effect on the transmission path, the signal that antenna receives is faint changeable, and therefore the sensitivity to receiver requires very high; And low noise amplifier is positioned at the front end of radio-frequency receiving system; Its major function is that the small-signal from antenna is amplified, and can be known by noise cascade formula, and the noise factor of pre-amplifier is maximum to the noise effect of whole microwave system; Its noise level has directly influenced the sensitivity of whole receiver; Therefore in other index such as power gain, under the situation that dynamic range etc. satisfy, the amplifier with low noise index is the most challenging work in the radio circuit design.
Common low noise amplifier receives the restriction of semiconductor device level; At present to be roughly L-band at the noise level of each frequency range be 0.5dB to the commercial product of the low noise amplifier of comparative maturity; S-band 0.8dB; About C-band 1.0dB, need low noise to improve in the application of receiver sensitivity at some, the method for generally taking is that liquid nitrogen refrigerating or refrigeration machine freeze low noise amplifier is moved at low temperatures; Reduce thermal noise and flicker noise effectively, thereby obtain lower system noise.Liquid nitrogen refrigerating or refrigeration machine refrigeration are owing to the refrigeration modes reason need be set up the heat exchange that a vacuum structure reduces the amplifier and the external world for the radio frequency low temperature low noise amplifier; The vacuum chamber structure is as shown in Figure 1; Introducing that air-tightness coaxial fitting 1-2 and 1-3 be used for radiofrequency signal is arranged in vacuum cavity 1-1 and draw; Half steel coaxial cable 1-4 with poor thermal conductivity in the vacuum chamber connects hermetic seal coaxial fitting and low temperature low noise amplifier, and low temperature low noise amplifier is positioned on the cold head 1-5 of refrigeration machine; Vacuum chamber connect outward compressor and supporting heat abstractor with the heat abstractor control circuit on limit mutually.When system works at low temperatures; The noise of low temperature low noise amplifier reduces; But because the insertion loss of the coaxial fitting of input and half steel coaxial cable is bigger; From system-level, though the noise of amplifier has obtained reduction, because the coaxial fitting and the insertion loss of half steel coaxial cable and the noise level of amplifier itself are same magnitude even the noise that is greater than amplifier itself; Therefore the system noise that obtains does not significantly reduce; And because vacuum cavity and the compressor of refrigeration machine and the supporting bigger problem of radiator structure volume that must be furnished with a fixed structure, such cryogenic system weight and volume comparatively speaking is not very desirable, and application has been caused certain difficulty.
Summary of the invention
The objective of the invention is for overcoming the weak point of prior art, proposed a kind of low temperature low noise radio frequency amplifier system of thermoelectric cooling.Native system has guaranteed vibrationproof, the waterproof and heat insulation of low temperature low noise radio frequency amplifier when low-temperature working, has guaranteed radio signal transmission simultaneously, can improve the sensitivity of radio-frequency receiving system.
A kind of thermoelectric cooling radio frequency low temperature low noise amplifier system that the present invention proposes; It is characterized in that this system mainly comprises: seal heat insulation cavity, be arranged at thermoelectric cooling assembly, radio frequency low temperature low noise amplifier, temperature sensor, radiating subassembly, termal conductor module and electrically-controlled component in this cavity; Said radio frequency low temperature low noise amplifier, thermoelectric cooling assembly, radiating subassembly link to each other through termal conductor module successively; Electrically-controlled component links to each other with thermoelectric cooling assembly, radiating subassembly and radio frequency low temperature low noise amplifier respectively; Temperature sensor is positioned at the side of radiating subassembly near the thermoelectric cooling assembly; And link to each other with electrically-controlled component through lead, the monitoring of realization temperature makes system works at the normal temperature state; Rf input interface, the radio frequency output interface at these radio frequency low temperature low noise amplifier two ends is fixed on the heat insulation cavity end walls of said sealing.
Characteristics of the present invention and beneficial effect:
The radio frequency low temperature low noise amplifier system of thermoelectric cooling of the present invention adopts thermoelectric cooling device that the working temperature of radio frequency low temperature low noise amplifier is reduced; Obtain low noise; And the hermetic seal joint and the half steel cable of input have been saved through structural design; The Cryo Equipment of comparing has so in the past been avoided the insertion loss of input joint and cable, thereby can access lower system noise.The radio frequency low temperature low noise amplifier system equipment of thermoelectric cooling is simple in structure, advantages of small volume, and cost is low, is convenient to flexible Application.
Through adopting thermoelectric cooling and taking corresponding provision for thermal insulation to make the working temperature of radio frequency low temperature low noise amplifier between 200K-250K; Reduced the thermal noise of amplifier effectively; In addition because the total also corresponding reduction of insertion loss of input passive device before rf inputs minimizing use radio frequency cable and joint etc. make amplifier; The feasible more conventional amplifier of noise objective of the radio frequency low temperature low noise amplifier system of thermoelectric cooling that adopts will hang down 0.3dB-0.5dB; Can reach and under very little volume, make the noise objective of radio frequency amplifier be in the leading level in the world; This system applies can be reduced the overall noise index of receiver, the sensitivity that improves receiver as pre-low-noise amplifier in radio-frequency transmitter.
Description of drawings
Fig. 1 is the structural representation of the low temperature low noise amplifier system of existing employing compressor cooling Vacuum Package.
Fig. 2 is the sketch map of the radio frequency low temperature low noise amplifier system of thermoelectric cooling of the present invention.
Fig. 3 is the thermoelectric cooling radio frequency low temperature low noise amplifier system implementation example structural representation of SMA interface of the present invention.
Fig. 4 is the thermoelectric cooling radio frequency low temperature low noise amplifier system implementation example structural representation of Waveguide interface of the present invention.
Fig. 5 is the radio frequency low temperature low noise amplifier system noise test curve figure of thermoelectric cooling of the present invention.
Embodiment
The present invention proposes a kind of radio frequency low temperature low noise amplifier system of thermoelectric cooling, the present invention is carried out detailed explaining in conjunction with accompanying drawing and embodiment.
The thermoelectric cooling radio frequency low temperature low noise amplifier system that the present invention proposes is as shown in Figure 2; It mainly comprises: seal heat insulation cavity 2-1, be arranged at thermoelectric cooling assembly 2-5, radio frequency low temperature low noise amplifier, temperature sensor 2-7, radiating subassembly 2-8, termal conductor module 2-4 and electrically-controlled component 2-6 in this cavity; Said radio frequency low temperature low noise amplifier, thermoelectric cooling assembly 2-5, radiating subassembly 2-8 link to each other through termal conductor module successively; Electrically-controlled component 2-6 links to each other with thermoelectric cooling assembly, radiating subassembly and radio frequency low temperature low noise amplifier respectively; Be they power supplies; Temperature sensor 2-7 is positioned at radiating subassembly 2-8 and links to each other with electrically-controlled component near the side of thermoelectric cooling assembly 2-5 and through lead; Realize the monitoring of temperature, when system is under the disadvantageous situation of heat radiation, temperature sensor detects the radiating subassembly temperature and raises and can combine electrically-controlled component with the power-off of thermoelectric cooling assembly and the power supply that keeps radio frequency low temperature low noise amplifier and radiating subassembly; Make system works at the normal temperature state, guarantee the stable operation of radio-frequency transmitter.Rf input interface 2-2, the radio frequency output interface 2-3 of this thermoelectric cooling radio frequency low temperature low noise amplifier system is fixed on the heat insulation cavity end walls of said sealing.For the insertion loss that reduces the input passive device reduces the noise of whole system, the rf input interface of this radio frequency low temperature low noise amplifier directly adopts the rf input interface of this radio frequency low temperature low noise amplifier system; The output interface of this radio frequency low temperature low noise amplifier links to each other with the radio frequency output interface of radio frequency low temperature low noise amplifier system through the RF coaxial cable.
The low temperature low noise radio frequency amplifier system of thermoelectric cooling of the present invention has realized lower noise under the situation of compact conformation, be mainly used in the video receiver, improves the sensitivity of system.
The embodiment of each parts of the low temperature low noise radio-frequency receiving system of a kind of thermoelectric cooling of the present invention and function specify as follows:
The example structure of the low temperature low noise radio-frequency receiving system of a kind of thermoelectric cooling of the present invention is as shown in Figure 3; Two radiating subassembly 3-3 are continuous and fixing by four metal upright post 3-10; Place the heat insulation cavity 3-14 of sealing that panel has been formed a hollow at peripheral four faces of radiating subassembly, radiating subassembly generally is to adopt the fin-shaped metal fin to add the liquid cooling heat radiator that fan dispels the heat or in aluminium sheet, digs out water circulation channel employing liquid circulation heat radiation.Seal and place radio frequency low temperature low noise amplifier 3-2 in the heat insulation cavity; The optional usefulness of the radio frequency low-noise amplifier of present embodiment has low noise and wide characteristics such as operating temperature range; The radio frequency low temperature low noise amplifier can guarantee operate as normal and parameters index can keep relative stability (manufacture craft of amplifier can be with reference to radio frequency low temperature low noise amplifier patent, and its patent No. is 200410074736) between 350K-200K; The radio frequency low temperature low noise amplifier is provided with the shell of gold-plated aluminum, guarantees heat conduction and electromagnetic shielding.Be equipped with one group of thermoelectric cooling assembly 3-4 up and down respectively at the radio frequency low temperature low noise amplifier; Every group of single layer structure (each P type is formed a unit with each N type semiconductor particle) that the thermoelectric cooling assembly is made up of P type conductive particles unit of placing at interval side by side and N type semiconductor particulate units; Metal (like the aluminum) layer that all units in series are got up, and one deck heat conduction good insulation performance body that is provided with respectively in the both sides up and down of single layer structure (generally adopting conductive coefficient greater than the good ceramic composite of the thermal conductivity of 20W/m.K) is formed.This thermoelectric cooling assembly 3-4 can also select the mode of individual layer, bilayer or multilayer refrigeration according to the required working temperature of device.Be provided with the mechanical structure 3-5 (having adopted polytetrafluoroethylene (conductive coefficient 0.256W/m.K) material of lower thermal conductivity) that is used for fixing the thermoelectric cooling assembly at the two ends of thermoelectric cooling assembly.
The refrigeration end of two groups of thermoelectric cooling assemblies links to each other heat conduction pad or heat pipe that termal conductor module 3-7 has adopted good material of heat conduction such as composite materials such as indium metal or heat conductive silica gel (thermal conductivity is greater than 2W/mK) to process through termal conductor module 3-7 with the upper and lower surface of radio frequency low temperature low noise amplifier shell.The hot junction of thermoelectric cooling assembly links to each other with the medial surface of radiating subassembly 3-3 through termal conductor module.At local laying temperature transducer 3-6 and temperature sensor and the electrically-controlled component 3-15 of radiating subassembly near the hot junction of thermoelectric cooling assembly; Electrically-controlled component is positioned at the back space of seal chamber; Mainly form by direct current 28V-6V transducer, high power switch and adjustable resistance; The serial connection adjustable resistance was given the power supply of radio frequency low temperature low noise amplifier after 28V was transformed into 6V, and the 28V DC power supply is given the thermoelectric cooling assembly power supply through high power relay.Temperature sensor has adopted the temperature switch of overheated auto-closing; When system radiating is unfavorable when causing the radiating subassembly temperature too high; The high power relay on the electrically-controlled component is broken off in control after the temperature sensor closure, realizes breaking off the power supply to the thermoelectric cooling assembly behind the temperature overheating, and system is no longer freezed; This moment, the low temperature low noise amplifier system was in the normal temperature mode of operation, and protection system can not crossed cause thermal damage (controlled function of above-mentioned electrically-controlled component belongs to routine techniques).Above structure places the heat insulation cavity 3-14 of sealing; Other spaces in the cavity are filled by the material of the good heat insulation such as polyurethane material (conductive coefficient 0.022W/m.K), polytetrafluoroethylene (conductive coefficient 0.256W/m.K), foam glass (conductive coefficient 0.058W/m.K) or silica gel of poor thermal conduction; The slit of cavity is filled by silica gel or glass cement, plays insulation, heat insulation, vibrationproof and waterproof effect after waiting to solidify.It is that the RF coaxial input interface 3-1 of system is by exposing in the cavity that the front panel 3-8 perforate of cavity makes the RF coaxial input interface of radio frequency low temperature low noise amplifier; And utilize silica gel, glass cement or rubber ring that input interface 3-1 is fixed on the front panel, realize the input of radiofrequency signal.The radio frequency output interface 3-16 of radio frequency low temperature low noise amplifier adopts the radio frequency output interface 3-12 of the system on RF coaxial cable 3-11 and the panel that is fixed on afterbody to link to each other, and has realized the output of radiofrequency signal.The general supply interface 3-13 of system is positioned on the rear board 3-9 of system, and it is through link to each other with the electrically-controlled component 3-15 power supply input of the system that realized of lead.At a plurality of radio-frequency devices that can also add as required between the RF output end mouth 3-16 of radio frequency low temperature low noise amplifier and the radio frequency output interface 3-12 of system among the straight-through pass devices of two-stage amplifier, attenuator, phase shifter, filter, amplitude limiter, automatic gain controller and radio frequency etc.; Also can add amplitude limiter at input according to design requirement, a plurality of radio-frequency devices among coupler, isolator or the RF switch etc.; Therefore the present invention can reduce the noise of receiver, improves the sensitivity of radio-frequency transmitter.
It is the radio frequency low temperature low noise amplifier system implementation example of input interface with the waveguide that Fig. 4 has provided one; Its main structure is identical with Fig. 3; Just the RF coaxial input interface of system has made Waveguide interface 4-1 into, and mechanical structure with matching has also been done certain change.Correspondingly, the radio frequency output interface of system also can be changed as required.
Fig. 5 is the test result of the noise of the radio frequency link part of the L-band thermoelectric cooling radio-frequency receiving system of employing present embodiment structure; Can find out when cooling assembly is worked; The working temperature of low temperature low noise radio frequency amplifier has dropped to 220K; The noise of receiving system is below the 0.3dB, and system noise is about 0.6dB during room temperature 300K, and noise factor has improved 0.3dB.
Also can add a radio frequency two in the foregoing description and change a switch, can guarantee under the situation of the radio frequency link structure that does not change former receiver, native system to be incorporated in the receiver at native system radio frequency input/output interface front end.Use the path of two commentaries on classics, one switch switching radiofrequency signal can control radiofrequency signal through the low noise amplifier amplification of former receiver or through the amplification of radio frequency low temperature low noise amplifier system, this parallelly connected mode that inserts receiver system can make receiving system under high sensitivity and high reliability, work.
Though on the basis of the foregoing description, describe the present invention, the present invention is not limited thereto, the people with association area background knowledge can carry out various deformation on this basis.For example at radiating end; The insulation end waits and adopts material different; Adopt air-cooled and liquid cooling different radiating form such as heat radiation; Insulation material is chosen polyurethane, polytetrafluoroethylene etc., and cooling assembly is selected one-level secondary or multi-stage refrigerating etc. for use, and the radio frequency component etc. that adds difference in functionality in radio frequency link front end rear end.These distortion also should belong to the category of the technical scheme of protecting of the present invention.
Claims (8)
1. thermoelectric cooling radio frequency low temperature low noise amplifier system; It is characterized in that this system mainly comprises: seal heat insulation cavity, be arranged at thermoelectric cooling assembly, radio frequency low temperature low noise amplifier, temperature sensor, radiating subassembly, termal conductor module and electrically-controlled component in this cavity; Said radio frequency low temperature low noise amplifier, thermoelectric cooling assembly, radiating subassembly link to each other through termal conductor module successively; Electrically-controlled component links to each other with thermoelectric cooling assembly, radiating subassembly and radio frequency low temperature low noise amplifier respectively; Temperature sensor is positioned at the side of radiating subassembly near the thermoelectric cooling assembly; And link to each other with electrically-controlled component through lead, the monitoring of realization temperature makes system works at the normal temperature state; Rf input interface, the radio frequency output interface of this thermoelectric cooling radio frequency low temperature low noise amplifier system is fixed on the heat insulation cavity end walls of said sealing; The rf input interface of this radio frequency low temperature low noise amplifier directly adopts the rf input interface of this radio frequency low temperature low noise amplifier system; The output interface of this radio frequency low temperature low noise amplifier links to each other with the radio frequency output interface of radio frequency low temperature low noise amplifier system through the RF coaxial cable.
2. the system of claim 1; It is characterized in that; Described thermoelectric cooling assembly is for placing two groups of thermoelectric cooling assemblies up and down of radio frequency low temperature low noise amplifier respectively; The single layer structure that every group of thermoelectric cooling assembly is made up of P type conductive particles unit of placing at interval side by side and N type semiconductor particulate units, the metal level that all units in series are got up, and one deck thermal conductive insulator that is provided with respectively in the both sides up and down of single layer structure composition.
3. the system of claim 1; It is characterized in that; Bilayer or sandwich construction that described every group of thermoelectric cooling assembly is made up of P type conductive particles unit of placing at interval side by side and N type semiconductor particulate units; The metal level that all units in series are got up, and one deck heat conduction good insulation performance body that is provided with respectively in the both sides up and down of bilayer or sandwich construction is formed.
4. the system of claim 1 is characterized in that, the heat insulation cavity of described sealing connects and fix four metal upright posts of two radiating subassemblies mainly by two radiating subassemblies, and four panels compositions that are placed on the radiating subassembly periphery; Space in this cavity is filled with insulation material, and the slit of cavity is filled with silica gel or glass cement; The front panel of cavity have make the radio frequency low temperature low noise amplifier rf input interface by the hole of exposing in the cavity, make this rf input interface be fixed on silica gel, glass cement or rubber ring on the front panel; Be fixed on the coaxial out splice going splice on the afterbody panel of cavity, this coaxial out splice going splice links to each other with the RF output end mouth of radio frequency low temperature low noise amplifier through the coaxial radio-frequency cable.
5. system as claimed in claim 3 is characterized in that, the rf input interface of said radio frequency low temperature low noise amplifier system is RF coaxial joint or Waveguide interface.
6. the system of claim 1; It is characterized in that; Also be included in a plurality of radio-frequency devices that add between RF output end mouth and the system's radio frequency output interface of radio frequency low temperature low noise amplifier among the straight-through pass devices of two-stage amplifier, attenuator, phase shifter, filter, amplitude limiter, automatic gain controller and radio frequency; Add amplitude limiter, a plurality of radio-frequency devices among coupler, isolator or the RF switch at input.
7. the system of claim 1 is characterized in that, said radiating subassembly adopts the fin-shaped metal fin to add fan heat radiation or liquid cooling heat radiator; Said termal conductor module adopts silicone grease, heat conduction pad or heat pipe.
8. the system of claim 1 is characterized in that, also is included in said system radio frequency input/output interface front end and adds a radio frequency two commentaries on classics one switch.
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Cited By (8)
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| CN103746712A (en) * | 2013-12-24 | 2014-04-23 | 中国电子科技集团公司第十六研究所 | High-temperature superconducting receiver front-end device in space |
| CN106059600A (en) * | 2016-07-29 | 2016-10-26 | 无锡信大气象传感网科技有限公司 | Working method of wireless data receiver for big data transmission |
| CN110210075A (en) * | 2019-05-14 | 2019-09-06 | 西北工业大学 | Global sensitivity analysis method based on the independent single stage thermoelectric refrigeration system of square |
| CN113131953A (en) * | 2019-12-31 | 2021-07-16 | 清华大学 | Terahertz security check equipment and radio frequency system and temperature control device thereof |
| CN116469842A (en) * | 2023-06-20 | 2023-07-21 | 中国工程物理研究院激光聚变研究中心 | Low-temperature sensor chip packaging structure and packaging method |
| CN116566414A (en) * | 2023-07-06 | 2023-08-08 | 成都中微达信科技有限公司 | Low-temperature low-noise signal receiving system for microwave transmission and use method |
| CN116846413A (en) * | 2023-07-18 | 2023-10-03 | 成都中微达信科技有限公司 | Microwave receiving system based on composite channel |
| CN116846413B (en) * | 2023-07-18 | 2024-06-21 | 成都中微达信科技有限公司 | Microwave receiving system based on composite channel |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103746712A (en) * | 2013-12-24 | 2014-04-23 | 中国电子科技集团公司第十六研究所 | High-temperature superconducting receiver front-end device in space |
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| CN106059600A (en) * | 2016-07-29 | 2016-10-26 | 无锡信大气象传感网科技有限公司 | Working method of wireless data receiver for big data transmission |
| CN110210075A (en) * | 2019-05-14 | 2019-09-06 | 西北工业大学 | Global sensitivity analysis method based on the independent single stage thermoelectric refrigeration system of square |
| CN113131953A (en) * | 2019-12-31 | 2021-07-16 | 清华大学 | Terahertz security check equipment and radio frequency system and temperature control device thereof |
| CN116469842A (en) * | 2023-06-20 | 2023-07-21 | 中国工程物理研究院激光聚变研究中心 | Low-temperature sensor chip packaging structure and packaging method |
| CN116469842B (en) * | 2023-06-20 | 2024-01-09 | 中国工程物理研究院激光聚变研究中心 | Low-temperature sensor chip packaging structure and packaging method |
| CN116566414A (en) * | 2023-07-06 | 2023-08-08 | 成都中微达信科技有限公司 | Low-temperature low-noise signal receiving system for microwave transmission and use method |
| CN116566414B (en) * | 2023-07-06 | 2023-09-22 | 成都中微达信科技有限公司 | Low-temperature low-noise signal receiving system for microwave transmission and use method |
| CN116846413A (en) * | 2023-07-18 | 2023-10-03 | 成都中微达信科技有限公司 | Microwave receiving system based on composite channel |
| CN116846413B (en) * | 2023-07-18 | 2024-06-21 | 成都中微达信科技有限公司 | Microwave receiving system based on composite channel |
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Application publication date: 20121219 |