CN102821535A - Printed circuit board - Google Patents

Printed circuit board Download PDF

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Publication number
CN102821535A
CN102821535A CN 201210260393 CN201210260393A CN102821535A CN 102821535 A CN102821535 A CN 102821535A CN 201210260393 CN201210260393 CN 201210260393 CN 201210260393 A CN201210260393 A CN 201210260393A CN 102821535 A CN102821535 A CN 102821535A
Authority
CN
China
Prior art keywords
circuit board
printed circuit
substrate
conduction path
electric conduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 201210260393
Other languages
Chinese (zh)
Inventor
潘太文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TAIZHOU SAIFU ELECTRONICS CO Ltd
Original Assignee
TAIZHOU SAIFU ELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TAIZHOU SAIFU ELECTRONICS CO Ltd filed Critical TAIZHOU SAIFU ELECTRONICS CO Ltd
Priority to CN 201210260393 priority Critical patent/CN102821535A/en
Publication of CN102821535A publication Critical patent/CN102821535A/en
Pending legal-status Critical Current

Links

Abstract

The invention aims to provide a printed circuit board capable of reducing electromagnetic interference. The printed circuit board comprises a substrate, wherein the substrate is provided with a ground layer and a signal layer. The printed circuit board is characterized in that the periphery of the signal layer of the substrate is provided with a closed electric conduction path; the electric conduction path is connected with the ground layer, so that the potential of the electric conduction path is same with that of the ground layer because the electric conduction path is connected with the ground layer; each type of electromagnetic interference signal generated by the signal layer is subjected to electric conduction path shielding in the process of outwards transmitting along the substrate, so that the electromagnetic interference on the outside is reduced by the printed circuit board; and meanwhile, because the signal layer is surrounded by the closed electric conduction path, influence on the signal layer by an external electromagnetic field can be reduced.

Description

A kind of printed circuit board (PCB)
Technical field
The invention belongs to electronic technology field, specially refer to a kind of printed circuit board (PCB).
Background technology
Printed circuit board (PCB) is as the carrier of each electronic component and signal path, extensive use in various electronic products.Along with development of electronic technology, the frequency of signal is increasingly high, and this just makes that electromagnetic interference is also more and more serious.And electronic component and cabling are intensive in the printed circuit board (PCB), are the districts occurred frequently of electromagnetic interference, therefore how to limit the electromagnetic interference in the printed circuit board (PCB), have become Electronics Engineer's urgent problem.
Summary of the invention
The objective of the invention is to propose a kind of printed circuit board (PCB) that can reduce electromagnetic interference.
Printed circuit board (PCB) of the present invention comprises substrate, and said substrate is provided with ground plane and signals layer, and key is that the signals layer of said substrate is provided with closed conductive path all around, and said conductive path is connected with ground plane.
Above-mentioned conductive path is connected with ground plane; The current potential of conductive path is just identical with ground plane like this; The various electromagnetic interference signals that signals layer produced can run into the shielding of conductive path, thereby can reduce printed circuit board (PCB) electromagnetic interference to external world in the process of outwards propagating along substrate; Simultaneously because signals layer has the encirclement of closed conductive path, so can reduce the influence of the external electromagnetic field that signals layer receives.
Further, said conductive path is connected with ground plane through a plurality of via holes that are provided with along conductive path, and is all identical to guarantee conductive path current potential everywhere.
Further, for improving shield effectiveness, the spacing of said adjacent vias is less than 1mm.
Printed circuit board (PCB) of the present invention can effectively reduce electromagnetic interference and leak, and can also reduce the interference of outer its internal signal of bound pair simultaneously, has good practicability.
Description of drawings
Fig. 1 is the structural representation of printed circuit board (PCB) of the present invention.
Embodiment
Contrast accompanying drawing below; Through the description to embodiment, the effect of mutual alignment between the shape of specific embodiments of the invention such as related each member, structure, the each several part and annexation, each several part and operation principle etc. are done further to specify.
Embodiment 1:
As shown in Figure 1; The printed circuit board (PCB) of present embodiment comprises substrate 1, and the bottom surface of substrate 1 is provided with ground plane 2, and end face is provided with signals layer 3; Be provided with closed conductive path 4 around the signals layer 3 of substrate 1, conductive path 4 is connected with ground plane 2 through a plurality of via holes 5 that are provided with along conductive path 4.
Above-mentioned conductive path 4 is connected with ground plane 2; The current potential of conductive path 4 is just identical with ground plane 2 like this; The various electromagnetic interference signals that signals layer 3 is produced are in the process of outwards propagating along substrate 1; The shielding of conductive path 4 can be run into, thereby printed circuit board (PCB) electromagnetic interference to external world can be reduced; Simultaneously because signals layer 3 has the encirclement of closed conductive path 4, so can reduce the influence of the external electromagnetic field that signals layer receives.

Claims (3)

1. a printed circuit board (PCB) comprises substrate, and said substrate is provided with ground plane and signals layer, it is characterized in that the signals layer of said substrate is provided with closed conductive path all around, and said conductive path is connected with ground plane.
2. printed circuit board (PCB) according to claim 1 is characterized in that said conductive path is connected with ground plane through a plurality of via holes that are provided with along conductive path.
3. printed circuit board (PCB) according to claim 2, the spacing that it is characterized in that said adjacent vias is less than 1mm.
CN 201210260393 2012-07-26 2012-07-26 Printed circuit board Pending CN102821535A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201210260393 CN102821535A (en) 2012-07-26 2012-07-26 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201210260393 CN102821535A (en) 2012-07-26 2012-07-26 Printed circuit board

Publications (1)

Publication Number Publication Date
CN102821535A true CN102821535A (en) 2012-12-12

Family

ID=47305297

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201210260393 Pending CN102821535A (en) 2012-07-26 2012-07-26 Printed circuit board

Country Status (1)

Country Link
CN (1) CN102821535A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109348613A (en) * 2018-10-12 2019-02-15 张立江 A kind of software circuit board and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109348613A (en) * 2018-10-12 2019-02-15 张立江 A kind of software circuit board and preparation method thereof
CN109348613B (en) * 2018-10-12 2021-06-11 广西容县菱通竞业电子有限公司 Soft circuit board and preparation method thereof

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20121212