CN102820400A - LED packaged structure and surface roughening method for same - Google Patents
LED packaged structure and surface roughening method for same Download PDFInfo
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- CN102820400A CN102820400A CN2011101507560A CN201110150756A CN102820400A CN 102820400 A CN102820400 A CN 102820400A CN 2011101507560 A CN2011101507560 A CN 2011101507560A CN 201110150756 A CN201110150756 A CN 201110150756A CN 102820400 A CN102820400 A CN 102820400A
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Abstract
The invention relates to an LED packaged structure which comprises an LED packaged body and an LED chip arranged in the LED packaged body. A periodic concave-convex structure is arranged on the surface of the LED packaged body. The invention further relates to a surface roughening method for the LED packaged structure. The LED packaged structure and the surface roughening method have the advantages that the concave-convex structure is formed on the LED packaged structure, so that surfaces of the LED packaged body are roughened simply and effectively, and the luminous efficiency of an efficient LED is enhanced.
Description
Technical field
The present invention relates to a kind of LED encapsulating structure and realize the method for its surface coarsening.
Background technology
The lifting of high-capacity LED luminous efficiency except that seeing through the raising of led chip internal quantum efficiency, also can improve through the taking-up efficient that increases the LED photon.And the chip surface alligatoring is a kind of effective ways of taking-up efficient of the LED of raising photon.According to department is ear law (Snell ' s law), and when light was incident to the low medium of refractive index by the higher medium of refractive index, incidence angle will be reflected back toward in the middle of the former medium greater than the light of critical angle.For LED crystal grain; The grain material refractive index often is higher than outer field encapsulating material, such as materials such as silica gel or epoxy resin, so the light that luminescent layer sent in the crystal grain; Only have less than the light of critical angle and have an opportunity to leave crystal grain; And greater than the light that breaks away from the angle, will be reflected back toward in the crystal grain and absorbed again by material, the big limitations of inner total reflection that causes like this luminous efficiency of LED.
Utilizing geometry to destroy the inner total reflection phenomenon that the led chip surface takes place, is the method that the most often is used at present.Wherein, utilize Wet-type etching methods such as (Wet Etching) to realize that it is one of main method that chip surface is carried out miniature alligatoring (surface texturing).And photonic crystal (photonic crystal) technology; Then be to make the array that a series of rules are arranged such as 3 dimensional coil geometries such as circular holes at the LED grain surface; These array structures are straight through approximately near 100～250nm of nano-scale; And the light that luminescent layer sent in the LED crystal grain just can directly be derived assembly surface with light via these array holes.Utilize the photonic crystal technology can let LED crystal grain take out efficient and promote further, promote efficient and more win the surface coarsening technology.
In order further to promote the luminous efficiency of LED, also need to improve from the angle of encapsulation, modal is that aspects such as encapsulation clad material, heat radiation, optical design are improved.But come from department is that the inner total reflection phenomenon that ear law (Snell ' s law) causes not only can take place to chip clad material interface on every side at chip, can take place too from the LED packaging body to air interface at light.Because the refractive index of air is 1, be significantly less than the refractive index of LED packaging body.Therefore limited the light extraction efficiency of LED.If alligatoring is carried out on the table plane at the LED packaging body, will help the lifting of light extraction efficiency.Yet will on the LED packaging body that the such encapsulating material of silica gel or epoxy glue constitutes, carry out alligatoring the certain process difficulty is arranged, as to LED packaging body surface coarsening through compression molding, can have the phenomenon of silica gel adhesion.Realize that its production then is difficult for especially.
Summary of the invention
The present invention addresses the above problem the method that a kind of LED encapsulating structure is provided and realizes its surface coarsening.
The technical scheme that the present invention solves the problems of the technologies described above is following: a kind of LED encapsulating structure, comprise LED packaging body and the led chip that is arranged in the LED packaging body, and said LED packaging body surface is provided with concaveconvex structure.
Further, concaveconvex structure is to be the geometry that periodically is arranged in LED packaging body surface
Further, concaveconvex structure is a micro-structural.
Further, said concaveconvex structure and LED packaging body are one-body molded.
A kind of method of LED encapsulating structure surface coarsening, it may further comprise the steps:
Step 1: on plastic film, make concaveconvex structure;
Step 2: plastic film is placed between the compression tool patrix and compression tool counterdie that is provided with led chip, and a side that has concaveconvex structure on the plastic film is to led chip;
Led chip is arranged in the compression tool patrix, then plastic film is placed between compression tool patrix and the compression tool counterdie, and a side that has concaveconvex structure on the plastic film is to led chip.
Step 3: with vacuumizing between compression tool counterdie and the plastic film, thereby plastic film and compression tool counterdie are fitted tightly;
Step 4: in the compression tool counterdie, inject organic envelope mold materials, compression tool patrix and compression tool counterdie are carried out matched moulds, then compression tool is placed on 80～150
oToasted under the temperature of C 1～10 minute;
Step 5: open compression tool, take out the LED encapsulating structure of surface coarsening moulding, the separating plastic film.
Further, it also comprises step 6: optionally, can put into baking box to the LED packaging body and further toast, make organic envelope mold materials realize full solidification.
Further, in the said step 1, the concaveconvex structure on the plastic film adopts the photoetching mould to process, or adopts the compression tool compression molding.
Further, in the said step 1, the concaveconvex structure on the plastic film is a micro-structural, according to the size of plastic film, and the degree of depth and the shape of predetermined concaveconvex structure, set the distribution of concaveconvex structure on plastic film.
Further, organic envelope mold materials is silica gel or epoxy resin in the said step 4.
Further, said plastic film material is an ethylene-tetrafluoroethylene copolymer, and its thickness is 25 microns～200 microns.
The invention has the beneficial effects as follows: through forming concaveconvex structure, effectively and simply realized the alligatoring on LED packaging body surface, thereby promoted the luminous efficiency of high efficiency LED on LED encapsulating structure surface.
Description of drawings
Fig. 1 is structure embodiment 1 sketch map of the present invention;
Fig. 2 is the utility model embodiment 2 structural representations;
Fig. 3 is the utility model embodiment 3 structural representations.
Fig. 4 is a flow chart of the present invention.
Embodiment
Below in conjunction with accompanying drawing principle of the present invention and characteristic are described, institute gives an actual example and only is used to explain the present invention, is not to be used to limit scope of the present invention.
As shown in Figure 1, a kind of LED encapsulating structure comprises LED packaging body 1 and the led chip 2 that is arranged in the LED packaging body, and said LED packaging body 1 surface is provided with concaveconvex structure 3.Concaveconvex structure 3 can be for periodically being arranged in the geometry on LED packaging body surface, or concaveconvex structure 3 is micro-structural, and the order of magnitude of micro-structural is a nanoscale, and promptly this concaveconvex structure 3 is of a size of nanoscale, like 300 nanometers～500 nano-widths and degree of depth.The size of concaveconvex structure 3 depends on wavelength and the package dimension and the structure of led chip, and the concavo-convex physical dimension of 1000 nanometers～2000 nanometers also can be effective.
Said concaveconvex structure 3 is one-body molded with LED packaging body 1.
As shown in Figure 2, embodiment 2: the difference of present embodiment and embodiment 1 is that the cross section of concaveconvex structure 3 is trapezoidal.
Like Fig. 3, shown in, embodiment 3: the difference of present embodiment and embodiment 1 is that the surface of LED packaging body is an overshooting shape, and its cross section is a circular arc, carries out alligatoring on such LED packaging body surface, the requirement of plastic film has very strong retractility.
As shown in Figure 4, a kind of method of LED encapsulating structure surface coarsening, it may further comprise the steps:
Step 1: on plastic film, make concaveconvex structure; Concaveconvex structure on the plastic film then can adopt the photoetching mould to process for the geometry of rule; Or to adopt compression tool compression molding, concaveconvex structure be micro-structural (must by means of light microscope or electron microscope could observed crystal structure), according to the size of plastic film; And the degree of depth and the shape of predetermined concaveconvex structure, set the distribution of concaveconvex structure on plastic film.Plastic film material can be ethylene-tetrafluoroethylene copolymer (ETFE), and film thickness is generally between 25 microns to 200 microns.
Step 2: plastic film is placed between the compression tool patrix and compression tool counterdie that is provided with led chip, and a side that has concaveconvex structure on the plastic film is to led chip;
Step 3: with vacuumizing between compression tool counterdie and the plastic film, thereby plastic film and compression tool counterdie are fitted tightly;
Step 4: in the compression tool counterdie, inject organic envelope mold materialss such as silica gel or epoxy resin, compression tool patrix and compression tool counterdie are carried out matched moulds, compression tool is arranged on 80～150
oUnder the temperature of C, toast 1～10 minute curing or semi-solid preparation, thereby form concaveconvex structure on LED packaging body surface when realizing the LED packaging body to realize organic envelope mold materials;
Step 5: open compression tool, take out the LED encapsulating structure of surface coarsening moulding, take off plastic film.When the plastic film in this step is used for the compression forming of LED encapsulating structure simultaneously from the mould film;
Organic envelope mold materials only reaches semi-solid preparation in step 4, then proceeds step 6,
Step 6: put into 100～200 to the LED encapsulating structure
oThe oven for baking 30-120 of C minute, so that organic envelope mold materials is realized full solidification.
The above is merely preferred embodiment of the present invention, and is in order to restriction the present invention, not all within spirit of the present invention and principle, any modification of being done, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a LED encapsulating structure comprises LED packaging body and the led chip that is arranged in the LED packaging body, and it is characterized in that: said LED packaging body surface is provided with concaveconvex structure.
2. a kind of LED encapsulating structure according to claim 1 is characterized in that: said concaveconvex structure is to be the geometry that periodically is arranged in LED packaging body surface.
3. a kind of LED encapsulating structure according to claim 1 is characterized in that: said concaveconvex structure is a micro-structural.
4. according to claim 1,2 or 3 described a kind of LED encapsulating structures, it is characterized in that: said concaveconvex structure and LED packaging body are one-body molded.
5. the method for a LED encapsulating structure surface coarsening is characterized in that, may further comprise the steps:
Step 1: on plastic film, make concaveconvex structure;
Step 2: plastic film is placed between the compression tool patrix and compression tool counterdie that is provided with led chip, and a side that has concaveconvex structure on the plastic film is towards led chip;
Step 3: with vacuumizing between compression tool counterdie and the plastic film, thereby plastic film and compression tool counterdie are fitted tightly;
Step 4: in the compression tool counterdie, inject organic envelope mold materials, compression tool patrix and compression tool counterdie are carried out matched moulds, then compression tool is placed on 80～150
oToasted under the temperature of C 1～10 minute;
Step 5: open compression tool, take out the LED encapsulating structure of accomplishing the envelope mould and forming surface coarsening, take off plastic film.
6. the method for a kind of LED encapsulating structure surface coarsening according to claim 5 is characterized in that: it also comprises step 6: the LED encapsulating structure is toasted, so that organic envelope mold materials is realized full solidification.
7. the method for a kind of LED encapsulating structure surface coarsening according to claim 5 is characterized in that: in the said step 1, the concaveconvex structure on the plastic film adopts the photoetching mould to process, or adopts the compression tool compression molding.
8. according to the method for claim 5,6 or 7 described a kind of LED encapsulating structure surface coarsenings; It is characterized in that: in the said step 1; Concaveconvex structure on the plastic film is a micro-structural; According to the size of plastic film, and the degree of depth and the shape of predetermined concaveconvex structure, set the distribution of concaveconvex structure on plastic film.
9. according to the method for claim 5,6 or 7 described a kind of LED encapsulating structure surface coarsenings, it is characterized in that: organic envelope mold materials is silica gel or epoxy resin in the said step 4.
10. according to the method for claim 5,6 or 7 described a kind of LED encapsulating structure surface coarsenings, it is characterized in that: said plastic film material is an ethylene-tetrafluoroethylene copolymer, and its thickness is 25 microns～200 microns.
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| CN201110150756.0A CN102820400B (en) | 2011-06-07 | 2011-06-07 | LED packaged structure and surface roughening method for same |
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| CN201110150756.0A CN102820400B (en) | 2011-06-07 | 2011-06-07 | LED packaged structure and surface roughening method for same |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103441207A (en) * | 2013-08-30 | 2013-12-11 | 华南理工大学 | All-angle even-light-emitting high-power LED lamp bar with fluorescent powder and chips separated |
| CN103915426A (en) * | 2013-12-20 | 2014-07-09 | 深圳市新光台电子科技有限公司 | Color LED lamp packaging structure with high light transmittance |
| CN106279746A (en) * | 2016-08-11 | 2017-01-04 | 苏州柯创电子材料有限公司 | High viscosity modification PI film |
| CN111574933A (en) * | 2019-02-19 | 2020-08-25 | 江苏罗化新材料有限公司 | Preparation method and manufacturing equipment of coarsened atomization film and mini LED packaging method |
| CN113635494A (en) * | 2021-08-04 | 2021-11-12 | 深圳市星元光电科技有限公司 | Method for manufacturing upper die lines of LED packaging die |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103441207A (en) * | 2013-08-30 | 2013-12-11 | 华南理工大学 | All-angle even-light-emitting high-power LED lamp bar with fluorescent powder and chips separated |
| CN103915426A (en) * | 2013-12-20 | 2014-07-09 | 深圳市新光台电子科技有限公司 | Color LED lamp packaging structure with high light transmittance |
| CN106279746A (en) * | 2016-08-11 | 2017-01-04 | 苏州柯创电子材料有限公司 | High viscosity modification PI film |
| CN111574933A (en) * | 2019-02-19 | 2020-08-25 | 江苏罗化新材料有限公司 | Preparation method and manufacturing equipment of coarsened atomization film and mini LED packaging method |
| CN113635494A (en) * | 2021-08-04 | 2021-11-12 | 深圳市星元光电科技有限公司 | Method for manufacturing upper die lines of LED packaging die |
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| CN102820400B (en) | 2015-02-18 |
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Effective date of registration: 20220811 Address after: 100176 2nd floor, building 3, courtyard 58, jinghaiwu Road, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee after: Beijing Yimei New Technology Co.,Ltd. Address before: 4th Floor, Building 2, Huilongsen Science and Technology Park, No. 99, Kechuang 14th Street, Economic and Technological Development Zone, Daxing District, Beijing 101111 Patentee before: SHINEON (BEIJING) TECHNOLOGY Co.,Ltd. |
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