CN102819185A - Etching method and etching device for non-planar base material - Google Patents
Etching method and etching device for non-planar base material Download PDFInfo
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- CN102819185A CN102819185A CN2012102772426A CN201210277242A CN102819185A CN 102819185 A CN102819185 A CN 102819185A CN 2012102772426 A CN2012102772426 A CN 2012102772426A CN 201210277242 A CN201210277242 A CN 201210277242A CN 102819185 A CN102819185 A CN 102819185A
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- planar substrates
- photosensitive resist
- resist agent
- nonplanar
- etching
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Abstract
The invention discloses an etching method for a non-planar base material, which comprises the following steps of: providing the non-planar base material; covering at least one part of a non-planar face in the non-planar base material with a sensitive resist; carrying out exposure on the sensitive resist covered at at least one part of the non-planar face in the non-planar base material by a pattern transfer tool; developing the exposed sensitive resist; and etching the non-planar base material which is exposed after the development is carried out by using a stereoscopic etching method. The invention also discloses an etching device for the non-planar base material. The etching method and the etching device for the non-planar base material, which are disclosed by the invention, can adapt to the large-scale non-planar base material by covering the sensitive resist at at least one part of the non-planar face in the non-planar base material, carrying out exposure and development on the sensitive resist and then etching the non-planar base material which is exposed after the development is carried out by using the stereoscopic etching method.
Description
Technical field
The present invention relates to figure etching technique field, particularly relate to a kind of engraving method and Etaching device that is used for non-planar substrates.
Background technology
For making line pattern on the non-planar substrates surface, prior art generally adopts laser surface modification technology and electroplating technology to realize.Laser surface modification technology has been because it has increased substantially the hardness, wearing quality etc. of substrate surface, and can control cost, and is used widely at present.Electroplating technology is because technical maturity is used also comparatively extensive at present.
But, because the laser surface modification technology exists laser beam little, cause its treated side little, therefore do not fit into large-sized non-planar substrates; The electroplating bath that electroplating technology adopts is that the non-planar substrates of electroplating as required designs, if not planar substrate is oversize, the then necessary corresponding increase of the size of electroplating bath causes the control accuracy in the electroplating process to reduce.Therefore electroplating technology does not fit into large-sized non-planar substrates yet.
Summary of the invention
The technical matters that the present invention mainly solves provides a kind of engraving method and Etaching device that is used for non-planar substrates, can be adapted to large-sized non-planar substrates.
For solving the problems of the technologies described above, the invention provides a kind of engraving method that is used for non-planar substrates, it comprises: non-planar substrates is provided; Cover nonplanar at least a portion in the non-planar substrates with the photosensitive resist agent; Through the figure transfer instrument photosensitive resist agent that covers nonplanar at least a portion in the non-planar substrates is made public; Photosensitive resist agent to after making public is developed; Use three-dimensional engraving method that the non-planar substrates that comes out after developing is carried out etching.
Wherein, use three-dimensional engraving method that the step of the non-planar substrates that comes out after developing is specially: nonplanar each part all is provided with a nozzle relatively in non-planar substrates, makes the relative non-planar substrates of a plurality of nozzles be three-dimensional and distributes; The non-planar substrates jet etching agent that nozzle comes out after developing, thus make non-planar substrates form predetermined pattern.
Wherein, the step of the non-planar substrates jet etching agent that nozzle comes out after developing comprises: in the rotation non-planar substrates nozzle to the agent of non-planar substrates jet etching, the non-planar substrates that etching comes out after developing.
Wherein, the step that covers nonplanar at least a portion in the non-planar substrates with the photosensitive resist agent comprises: immerse in the photosensitive resist agent non-planar substrates and taking-up, make the photosensitive resist agent cover nonplanar each part in the non-planar substrates.
Wherein, the photosensitive resist agent is the resin type photoactive material.
Wherein, non-planar substrates is ultra material non-planar substrates.
For solving the problems of the technologies described above; The present invention also provides a kind of Etaching device that is used for non-planar substrates; It comprises: supporting part, be used to carry non-planar substrates, and nonplanar at least a portion is coated with the photosensitive resist agent that makes public and developed in the non-planar substrates; At least one nozzle that is used for the jet etching agent, supporting part setting relatively; Wherein, at least one nozzle uses three-dimensional engraving method that the non-planar substrates that comes out after developing is carried out etching.
Wherein, supporting part comprises rotating mechanism, and rotating mechanism drives supporting part and is rotated.
Wherein, device comprises: solution tank is used for containing a year photosensitive resist agent; Operating mechanism is used for non-planar substrates is immersed the photosensitive resist agent and takes out, and makes that nonplanar each part all is coated with the photosensitive resist agent in the non-planar substrates, again non-planar substrates is inserted supporting part.
Wherein, nozzle is a plurality of, and the relative supporting part of a plurality of nozzles is three-dimensional and distributes, so that nonplanar each part all is provided with a nozzle relatively in the non-planar substrates.
Engraving method that is used for non-planar substrates of the present invention and Etaching device are through covering the photosensitive resist agent in the nonplanar at least a portion of non-planar substrates and agent makes public and develops to photosensitive resist; Re-use three-dimensional engraving method the non-planar substrates that comes out after developing is carried out etching; The etching scope is big, can be adapted to the etch processes to large-sized non-planar substrates.
Description of drawings
Fig. 1 is the process flow diagram of engraving method one embodiment of the present invention;
Fig. 2 is the particular flow sheet of engraving method shown in Figure 1;
Fig. 3 is the schematic side view of Etaching device one embodiment of the present invention.
Embodiment
To combine the accompanying drawing in the embodiment of the present invention below, the technical scheme in the embodiment of the present invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiments.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
See also Fig. 1, Fig. 1 is the process flow diagram of engraving method one embodiment of the present invention.Engraving method may further comprise the steps:
Step S10: non-planar substrates is provided.
Wherein, the surface of non-planar substrates is not the plane, and for example non-planar substrates is semisphere or cone-shaped.In this embodiment, non-planar substrates is ultra material non-planar substrates.Ultra material is meant artificial composite structure or the compound substance with the not available extraordinary physical property of natural material.Structurally ordered design through on the key physical yardstick of material can break through the restriction of some apparent natural law, thereby obtains to exceed the meta-materials function of the intrinsic common character of nature.The character of ultra material and function mainly come from its inner structure but not constitute their material.
Step S20: cover nonplanar at least a portion in the non-planar substrates with the photosensitive resist agent.
Wherein, step S20 further comprises non-planar substrates is immersed in the photosensitive resist agent and takes out, and makes the photosensitive resist agent cover nonplanar at least a portion in the non-planar substrates.Certainly, those skilled in the art can be easy to adopt alternate manner nonplanar at least a portion in non-planar substrates to cover the photosensitive resist agent, for example adopt modes such as sprinkle, sprinkling.
The photosensitive resist agent is a kind of macromolecular compound that after illumination, can change resistance to corrosion, and is a kind of acid etching solution (mainly comprising compositions such as hydrochloric acid, sodium hypochlorite or ferric trichloride).In this embodiment, the photosensitive resist agent is the resin type photoactive material.The time of non-planar substrates immersion photosensitive resist agent can be set according to actual needs.
Step S30: the photosensitive resist agent that covers nonplanar at least a portion in the non-planar substrates is made public through the figure transfer instrument.
Wherein, can agent makes public to photosensitive resist according to predetermined pattern.Predetermined pattern is located on the figure transfer instrument, and light sees through the figure transfer instrument, and agent makes public to photosensitive resist.In this embodiment, agent makes public to photosensitive resist through adopting three-dimensional exposure method, and its step comprises: nonplanar each part all is provided with a light source relatively in non-planar substrates, makes the relative non-planar substrates of a plurality of light sources be three-dimensional and distributes; In each light source and non-planar substrates, between nonplanar each part the figure transfer instrument is set; Utilize light source irradiation figure transfer instrument, make the photosensitive resist agent react, thereby make figure transfer on the figure transfer instrument to non-planar substrates from the light of figure transfer instrument transmission.
Wherein, for the on-plane surface that makes non-planar substrates all is in the range of exposures of light source, nonplanar each part all is provided with a light source relatively in non-planar substrates.In order to practice thrift quantity of light source, improve light efficiency, a light source can respectively be set on nonplanar four direction all around in non-planar substrates.Through three-dimensional exposure method, after the part that the photosensitive resist agent receives illumination reacted, the part that under the protection of figure transfer instrument, does not receive illumination just formed predetermined pattern; Perhaps the photosensitive resist agent receives the part formation predetermined pattern of illumination.
Step S40: the photosensitive resist agent to after making public is developed.
Wherein, the photosensitive resist agent is developed has dual mode: the part that the photosensitive resist agent receives illumination disappears through the back of developing; The part that the photosensitive resist agent does not receive illumination disappears.
Step S50: use three-dimensional engraving method that the non-planar substrates that comes out after developing is carried out etching.
Wherein, the photosensitive resist agent that made public is through after developing, and the on-plane surface of non-planar substrates just part comes out, use the on-plane surface of the non-planar substrates that three-dimensional engraving method etch exposed comes out after, just form predetermined pattern.Three-dimensional engraving method is compared prior art and is only carried out on the etched basis at the single direction of non-planar substrates, on non-planar substrates multi-direction, carries out three-dimensional etching.
Below, the stereo engraving method is elaborated.Please consult Fig. 2 in the lump, Fig. 2 is the particular flow sheet of engraving method shown in Figure 1.In engraving method, step S50 specifically is divided into following steps:
Step S51: nonplanar each part all is provided with a nozzle relatively in non-planar substrates, makes the relative non-planar substrates of a plurality of nozzles be three-dimensional and distributes.
Wherein, Because being 3 D stereo for the plane, the on-plane surface of non-planar substrates distributes; For the on-plane surface that makes non-planar substrates all is in the spray regime of nozzle; On-plane surface in the non-planar substrates is divided into a plurality of parts, and nonplanar each part all is provided with a nozzle relatively in non-planar substrates.In order to reduce nozzle quantity as far as possible, improve ejection efficiency, a nozzle can respectively be set on nonplanar four direction all around in non-planar substrates.
Step S52: the non-planar substrates jet etching agent that nozzle comes out after developing, thus make non-planar substrates form predetermined pattern.
Wherein, the figure transfer instrument can be the film, steel mesh figures carrier.After making public and develop through the figure transfer instrument, the figure that remaining photosensitive resist agent forms is the figure on the figure transfer instrument.The non-planar substrates jet etching agent that each nozzle all comes out after developing, through after the etching, the on-plane surface of non-planar substrates receives photosensitive resist agent protection and just forms predetermined pattern.
Further, the step of the non-planar substrates jet etching agent that nozzle comes out after developing also comprises: in the rotation non-planar substrates nozzle to the agent of non-planar substrates jet etching, the photosensitive resist agent that etching has made public.Through the rotation non-planar substrates, can make the abundant contact corrosion agent of the non-planar substrates that comes out after the development.Because the emitted dose and the jet length of nozzle can be regulated, the spray regime of nozzle can be enough big, therefore can the large-sized non-planar substrates of etching.And operation is simple relatively, and cost is lower.
See also Fig. 3, Fig. 3 is the schematic side view of Etaching device one embodiment of the present invention.Show for clear, show non-planar substrates 100 among the figure simultaneously.Etaching device comprises supporting part 110 and at least one nozzle 120.
Particularly, Etaching device comprises solution tank 130 and operating mechanism 140.Solution tank 130 is used for containing a year photosensitive resist agent.Operating mechanism 140 can be the equipment that mechanical arm etc. has holding function, and operating mechanism 140 is used for non-planar substrates 100 is immersed the photosensitive resist agent and takes out, and makes that nonplanar each part all is coated with the photosensitive resist agent in the non-planar substrates 100.Again the photosensitive resist agent on the on-plane surface is made public and develop, make that nonplanar at least a portion is coated with exposure and the remaining photosensitive resist agent in back of developing in the non-planar substrates 100.The supporting part 110 that is used to carry non-planar substrates 100 inserted non-planar substrates 100 by operating mechanism 140 then.In this embodiment, supporting part 110 comprises rotating mechanism 111, and rotating mechanism 111 can drive supporting part 110 and be rotated.
At least one nozzle 120 relative supporting parts 110 are provided with, and nozzle 120 is used for the jet etching agent.In this embodiment; Nozzle 120 is a plurality of, and for example 4, a plurality of nozzle 120 relative supporting parts 110 are three-dimensional and distribute; So that nonplanar each part all is provided with a nozzle 120 relatively in the non-planar substrates 100, promptly a plurality of nozzle 120 relative non-planar substrates 100 also are three-dimensional and distribute.
At least one nozzle 120 uses three-dimensional engraving method that the non-planar substrates 100 that comes out after developing is carried out etching; Such as a plurality of nozzles 120 simultaneously to non-planar substrates 100 jet etching agent; The on-plane surface that mordant etching non-planar substrates 100 comes out is accomplished etching.
In more embodiments, nozzle 120 is one and supporting part 110 settings relatively, and supporting part 110 can be rotated.During nozzle 120 jet etching agent, supporting part 110 drives non-planar substrates 100 rotations, makes the fully contact corrosion agent of part that comes out through developing in the non-planar substrates 100.
By the way; Engraving method that is used for non-planar substrates of the present invention and Etaching device are through covering the photosensitive resist agent and the part exposure being carried out in the photosensitive resist agent in the nonplanar at least a portion of non-planar substrates; Re-use three-dimensional engraving method etching is carried out in the photosensitive resist agent that has made public, the etching scope is big, can be adapted to the etch processes to large-sized non-planar substrates; And simplify the operation, reduce cost.
The above is merely embodiment of the present invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes instructions of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (10)
1. an engraving method that is used for non-planar substrates is characterized in that, said method comprises:
Non-planar substrates is provided;
Cover nonplanar at least a portion in the said non-planar substrates with the photosensitive resist agent;
Through the figure transfer instrument the said photosensitive resist agent that covers nonplanar at least a portion in the non-planar substrates is made public;
Photosensitive resist agent to carrying out after the said exposure is developed;
Use three-dimensional engraving method that the non-planar substrates that carries out coming out after the said development is carried out etching.
2. engraving method according to claim 1 is characterized in that, the three-dimensional engraving method of said use is specially the step of the non-planar substrates that carries out coming out after the said development:
Nonplanar each part all is provided with a nozzle relatively in said non-planar substrates, makes the relative non-planar substrates of a plurality of said nozzles be three-dimensional and distributes;
The non-planar substrates jet etching agent that said nozzle comes out after developing, thus make said non-planar substrates form predetermined pattern.
3. engraving method according to claim 2 is characterized in that, the step of the non-planar substrates jet etching agent that said nozzle comes out after developing comprises:
Nozzle is to the agent of non-planar substrates jet etching in the said non-planar substrates of rotation, the non-planar substrates that comes out after etching is developed.
4. engraving method according to claim 1 is characterized in that, the said step that covers nonplanar at least a portion in the said non-planar substrates with the photosensitive resist agent comprises:
Immerse in the photosensitive resist agent said non-planar substrates and taking-up, make said photosensitive resist agent cover nonplanar each part in the non-planar substrates.
5. engraving method according to claim 4 is characterized in that, said photosensitive resist agent is the resin type photoactive material.
6. engraving method according to claim 1 is characterized in that said non-planar substrates is ultra material non-planar substrates.
7. an Etaching device that is used for non-planar substrates is characterized in that, said device comprises:
Supporting part is used to carry non-planar substrates, and nonplanar at least a portion is coated with the photosensitive resist agent that makes public and developed in the said non-planar substrates;
At least one nozzle that is used for the jet etching agent, said relatively supporting part setting;
Wherein, the non-planar substrates that comes out after using three-dimensional engraving method to said development of said at least one nozzle carries out etching.
8. Etaching device according to claim 7 is characterized in that said supporting part comprises rotating mechanism, and said rotating mechanism drives supporting part and is rotated.
9. Etaching device according to claim 7 is characterized in that, said device comprises:
Solution tank is used for containing a year photosensitive resist agent;
Operating mechanism is used for said non-planar substrates is immersed the photosensitive resist agent and takes out, and makes that nonplanar each part all is coated with the photosensitive resist agent in the said non-planar substrates, more said non-planar substrates is inserted supporting part.
10. Etaching device according to claim 7 is characterized in that, said nozzle is a plurality of, and the relative supporting part of a plurality of said nozzles is three-dimensional and distributes, so that nonplanar each part all is provided with a nozzle relatively in the said non-planar substrates.
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| CN201210277242.6A CN102819185B (en) | 2012-08-06 | 2012-08-06 | A kind of engraving method for non-planar substrates and Etaching device |
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| CN201210277242.6A CN102819185B (en) | 2012-08-06 | 2012-08-06 | A kind of engraving method for non-planar substrates and Etaching device |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6268281B1 (en) * | 1999-11-15 | 2001-07-31 | Taiwan Semiconductor Manufacturing Company | Method to form self-aligned contacts with polysilicon plugs |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6268281B1 (en) * | 1999-11-15 | 2001-07-31 | Taiwan Semiconductor Manufacturing Company | Method to form self-aligned contacts with polysilicon plugs |
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Effective date of registration: 20210413 Address after: 2 / F, software building, No.9, Gaoxin Zhongyi Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: KUANG-CHI INSTITUTE OF ADVANCED TECHNOLOGY Address before: 18B, building a, CIC international business center, 1061 Xiangmei Road, Futian District, Shenzhen, Guangdong 518034 Patentee before: KUANG-CHI INNOVATIVE TECHNOLOGY Ltd. |