CN102809138A - Internal heat-conducting device for lamp body of LED (Light Emitting Diode) lamp - Google Patents
Internal heat-conducting device for lamp body of LED (Light Emitting Diode) lamp Download PDFInfo
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- CN102809138A CN102809138A CN2011101496689A CN201110149668A CN102809138A CN 102809138 A CN102809138 A CN 102809138A CN 2011101496689 A CN2011101496689 A CN 2011101496689A CN 201110149668 A CN201110149668 A CN 201110149668A CN 102809138 A CN102809138 A CN 102809138A
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- transfer device
- led lamp
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Abstract
The invention discloses an internal heat-conducting device for a lamp body of an LED (Light Emitting Diode) lamp, which comprises an LED lamp casing, a heat-conducting device body and a PCB (Printed Circuit Board) integrating LED bulbs, wherein the PCB is closely attached onto one plane of the heat-conducting device body; the plane of the heat-conducting device body on which the PCB is closely attached is provided with convex heat-radiating ribs; and the heat-conducting device body is connected with the LED lamp casing in a surface contact manner; thus, heat generated by the PCB integrating the LED bulbs can not only be radiated through the heat-conducting device body, but also be quickly conducted to the LED lamp casing through the heat-conducting device body for heat radiation, so that the heat-radiating area of the LED lamp is greatly increased, and the difficult problems of large power and small size of an LED lamp existed in the prior art can be better solved; and meanwhile, the effect that a casing of a traditional light source lamp is used as the casing of the LED lamp can also be realized, so that the universality of the casing is improved, and the manufacturing cost is greatly saved.
Description
Technical field
The present invention relates to LED electric lighting field, especially belong to heat-transfer device in a kind of LED lamp lamp body.
Background technology
The LED lamp is widely used in architectural lighting and municipal works.At present, the heat radiation of most of LED lamps is had relatively high expectations, owing to receive the long-pending restriction of LED lamp body, also be difficult to satisfy high-power small size occasion even be designed with special heat-transfer device, and present LED lamp heat-transfer device complex structure radiating effect is poor.
Summary of the invention
The objective of the invention is,, a kind of LED heat-transfer device of simple in structure, applied widely, the easy for installation and little good heat dissipation effect of volume is provided in order to overcome the shortcomings and deficiencies of prior art.
The object of the invention can reach through taking following technical scheme:
Heat-transfer device in a kind of LED lamp lamp body; Comprise LED lamp housing, heat-transfer device main body and be integrated with the pcb board of LED bulb; Described pcb board is close on plane of said heat-transfer device main body; The plane that described heat-transfer device main body and pcb board are close to has outstanding radiating ribs, and it is the face contact that the heat-transfer device main body is connected with the LED lamp housing, conducts rapidly with the heat that pcb board was produced of guaranteeing the described LED of being integrated with bulb and gives the LED lamp housing.
As patent preferred embodiment of the present invention, described pcb board is close on plane of said heat-transfer device main body through the silicone grease layer, and described heat-transfer device main body is connected with the LED lamp housing through thermal conductive silicon glue-line realization face and contacts.
As another preferred embodiment of patent of the present invention; Said heat-transfer device main body connects with the face that the heat-transfer device main body is connected with shell through the vertical strengthening ribs bar with the face of pcb board contact; Described vertical strengthening ribs bar and heat-transfer device main body are integrally formed or welding, and radiating ribs and heat-transfer device main body that heat-transfer device main body and PC B plate are close to the plane are integrally formed or welding.
Compared with prior art, the present invention has the following advantages:
(1) plane be close to of heat-transfer device main body of the present invention and pcb board has outstanding radiating ribs; The heat-transfer device main body also has the vertical strengthening ribs bar simultaneously; Increased the function of heat-transfer device main body heat radiation itself so greatly; And the matching design of heat-transfer device body shape and shell makes heat that the pcb board be integrated with the LED bulb produces dispel the heat through the shell that heat-transfer device itself is delivered to the LED lamp very soon; Increased the whole area of dissipation of LED lamp so greatly, thus the difficult problem of the LED lamp high-power small size that can fine solution exists at present.
(2) heat-transfer device of the present invention can be realized changing the conventional light source shell and uses as the LED lamp housing.
Description of drawings
Fig. 1 is the overall appearance figure of LED lamp of the present invention;
Fig. 2 Figure 1A-A direction cutaway view;
Fig. 3 is the overall appearance figure of conventional light source lamp;
Fig. 4 is the A-A direction cutaway view of Fig. 3.
The specific embodiment
Describe in detail below in conjunction with the accompanying drawing specific embodiments of the invention.
Extremely shown in Figure 2 like Fig. 1; Heat-transfer device in a kind of LED lamp lamp body; Comprise LED lamp housing 1, heat-transfer device main body 2 and be integrated with the pcb board 3 of LED bulb; Described pcb board 3 is close on 2 one plane 2-1 of said heat-transfer device main body through silicone grease layer 4, and described heat-transfer device main body 2 has outstanding radiating ribs 2-1-1 with the plane 2-1 that pcb board 3 is close to, and radiating ribs 2-1-1 and heat-transfer device main body 2 are integrally formed or welding; Radiating ribs 2-1-1 has increased the area of dissipation of heat-transfer device main body 2 greatly; Heat-transfer device main body 2 contacts through thermal conductive silicon glue-line 5 realization faces with the LED lamp housing, and the heat that is produced with the pcb board 3 of guaranteeing the described LED of being integrated with bulb conducts rapidly to LED lamp housing 1, and heat-transfer device main body 2 connects with the face that heat-transfer device main body 2 is connected with shell through vertical strengthening ribs bar 2-3 with the face 2-2 of the pcb board that is integrated with the LED bulb 3 contacts; Vertical strengthening ribs bar 2-3 and heat-transfer device main body 2 are integrally formed or are welded to; Heat-transfer device main body 2 has the area of dissipation that vertical strengthening ribs bar 2-3 has increased heat-transfer device main body 2 on the one hand, has also strengthened the intensity of heat-transfer device main body 2 on the other hand, makes that also heat-transfer device main body 2 inside are hollow simultaneously; Help the inner cross-ventilation of LED lamp housing, thereby increase radiating effect.
Extremely shown in Figure 4 like Fig. 3; Adopt patent of the present invention as long as the inside that changes the inside of conventional light source lamp into the LED lamp can realize the shell of conventional light source lamp is used as the LED lamp housing; Also improve the versatility of lamp housing, practiced thrift manufacturing cost so greatly.
Above disclosedly be merely preferred embodiment of the present invention, can not limit the present invention's interest field certainly with this, the equivalent variations of therefore doing according to claim of the present invention still belongs to the scope that the present invention is contained.
Claims (5)
1. heat-transfer device in the LED lamp lamp body; Comprise LED lamp housing, heat-transfer device main body and be integrated with the pcb board of LED bulb; It is characterized in that: described pcb board is close on plane of said heat-transfer device main body; The plane that described heat-transfer device main body and pcb board are close to has outstanding radiating ribs, and it is the face contact that the heat-transfer device main body is connected with the LED lamp housing, conducts rapidly with the heat that pcb board was produced of guaranteeing the described LED of being integrated with bulb and gives the LED lamp housing.
2. heat-transfer device in the LED lamp lamp body as claimed in claim 1; It is characterized in that: described pcb board is close on plane of said heat-transfer device main body through the silicone grease layer, and described heat-transfer device main body is connected with the LED lamp housing through thermal conductive silicon glue-line realization face and contacts.
3. heat-transfer device in the LED lamp lamp body as claimed in claim 1 is characterized in that: said heat-transfer device main body connects with the face that the heat-transfer device main body is connected with shell through the vertical strengthening ribs bar with the face of pcb board contact.
4. heat-transfer device in the LED lamp lamp body as claimed in claim 3 is characterized in that: described vertical strengthening ribs bar and heat-transfer device main body are integrally formed or welding.
5. heat-transfer device in the LED lamp lamp body as claimed in claim 1 is characterized in that: radiating ribs and heat-transfer device main body that heat-transfer device main body and pcb board are close to the plane are integrally formed or welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101496689A CN102809138A (en) | 2011-06-02 | 2011-06-02 | Internal heat-conducting device for lamp body of LED (Light Emitting Diode) lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101496689A CN102809138A (en) | 2011-06-02 | 2011-06-02 | Internal heat-conducting device for lamp body of LED (Light Emitting Diode) lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102809138A true CN102809138A (en) | 2012-12-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101496689A Pending CN102809138A (en) | 2011-06-02 | 2011-06-02 | Internal heat-conducting device for lamp body of LED (Light Emitting Diode) lamp |
Country Status (1)
| Country | Link |
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| CN (1) | CN102809138A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105805708A (en) * | 2014-12-31 | 2016-07-27 | 罗周连 | Special heat conducting device for practical ultrahigh-power LED illuminating system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201212667Y (en) * | 2008-06-25 | 2009-03-25 | 刘艾林 | Improved LED lamp |
| CN201221709Y (en) * | 2008-06-25 | 2009-04-15 | 昆山太得隆机械有限公司 | Multi-light source LED road lamp |
| CN202101203U (en) * | 2011-06-02 | 2012-01-04 | 广东诺博尔电子科技有限公司 | Heat-conducting device in light-emitting diode (LED) lamp body |
-
2011
- 2011-06-02 CN CN2011101496689A patent/CN102809138A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201212667Y (en) * | 2008-06-25 | 2009-03-25 | 刘艾林 | Improved LED lamp |
| CN201221709Y (en) * | 2008-06-25 | 2009-04-15 | 昆山太得隆机械有限公司 | Multi-light source LED road lamp |
| CN202101203U (en) * | 2011-06-02 | 2012-01-04 | 广东诺博尔电子科技有限公司 | Heat-conducting device in light-emitting diode (LED) lamp body |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105805708A (en) * | 2014-12-31 | 2016-07-27 | 罗周连 | Special heat conducting device for practical ultrahigh-power LED illuminating system |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| DD01 | Delivery of document by public notice |
Addressee: Guangdong Nuober Electronic Science and Technology Co., Ltd. Document name: Notification of Publication and of Entering the Substantive Examination Stage of the Application for Invention |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121205 |