CN102806697A - Dielectric substrate splicing structure and metamaterial - Google Patents

Dielectric substrate splicing structure and metamaterial Download PDF

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Publication number
CN102806697A
CN102806697A CN2011101463064A CN201110146306A CN102806697A CN 102806697 A CN102806697 A CN 102806697A CN 2011101463064 A CN2011101463064 A CN 2011101463064A CN 201110146306 A CN201110146306 A CN 201110146306A CN 102806697 A CN102806697 A CN 102806697A
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China
Prior art keywords
medium substrate
splicing
stiffening plate
groove
thinning part
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CN2011101463064A
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Chinese (zh)
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CN102806697B (en
Inventor
刘若鹏
赵治亚
缪锡根
张影
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Kuang Chi Institute of Advanced Technology
Kuang Chi Innovative Technology Ltd
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Kuang Chi Institute of Advanced Technology
Kuang Chi Innovative Technology Ltd
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Priority to CN201110146306.4A priority Critical patent/CN102806697B/en
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Abstract

The invention provides a dielectric substrate splicing structure and a metamaterial with the same. The splicing structure comprises thinning portions, bonding layers and a reinforcing plate, each thinning portion is arranged at the edge of a splicing portion of each of two dielectric substrates, the thinning portions of the two dielectric substrates to be spliced are arranged oppositely to form a groove, the reinforcing plate matches with the groove in shape, and the bonding layers are arranged between the reinforcing plate and the groove and between the dielectric substrates. The dielectric substrate splicing structure and the metamaterial have the advantages that on one hand, the dielectric substrates can be manufactured by taking full advantage of existing equipment and processes, and on the other hand, dielectric substrates or metamaterial function boards larger in areas can be obtained.

Description

A kind of medium substrate splicing construction and ultra material
[technical field]
The present invention relates to the advanced composite material (ACM) field, relate to the composite that electromagnetic wave is had specific electromagnetism modulation function particularly.
[background technology]
Ultra material is a kind of composite artificial material; Its basic composition structure is ultra material function plate; Thickness is generally the millimeter level, and ultra material function plate is made up of medium substrate and array artificial micro-structural on medium substrate, and ultra plate of material is promptly formed ultra material through certain rule combination of arranging.The material of ultra material medium substrate can be selected pottery, macromolecular material, polytetrafluoroethylene (PTFE), ferroelectric material, ferrite material, ferromagnetic material or the like for use in selection; Artificial micro-structural on the medium substrate then is generally materials such as metallic copper, silver, and its structure and pcb board are similar.
In ultra material function plate; The a plurality of artificial micro-structural of array on medium substrate has specific electromagnetic property; Can produce electromagnetic response to electric field or magnetic field; Structure and arrangement regulation through to artificial micro-structural carry out precise design and control, can make ultra material demonstrate the electromagnetic property that various general material does not have, and if can converge, disperse and deviation electromagnetic wave etc.Though the medium substrate of existing ultra material can adopt the manufacturing process of PCB circuit board to make; But there is the size problem of smaller in the existing produced medium substrate of PCB circuit board processing technology, for ultra material, in some occasion; Like the antenna for base station field; Its area can reach several square metres even tens square metres, and to this, the medium substrate of existing technology manufacturing can not be satisfied the demand.
[summary of the invention]
The above-mentioned technical problem that the present invention does and solves, the ultra material that a kind of splicing construction of medium substrate is provided and has this splicing construction.
The present invention realizes that the technical scheme that goal of the invention adopts is; A kind of medium substrate splicing construction; Be used for the splicing between the medium substrate; Said splicing construction comprises thinning part, tack coat and stiffening plate, and said thinning part is arranged on the edge of the splicing part of said medium substrate, and the said thinning part of intending two medium substrates of splicing is oppositely arranged and forms a groove; The shape of said stiffening plate matches with said groove, is provided with tack coat between said stiffening plate and the said groove and between the said medium substrate.
Better, also be provided with tack coat between the said thinning part of two medium substrates of said plan splicing.
Better, the material of said tack coat is identical with the material of said medium substrate.
Better, the material of said stiffening plate is identical with the material of said medium substrate.
Better, the width of said thinning part be its thickness 10-50 doubly.
Better, the thickness of said thinning part be dielectric substrate thickness 0.2-0.8 doubly.
The present invention also provides a kind of ultra material; Comprise a plurality of ultra material function plates; Said ultra material function plate is made up of a plurality of base board units, and said base board unit is made up of medium substrate and a plurality of artificial micro-structural of array on medium substrate, and the medium substrate of said a plurality of base board units splices through splicing construction each other; Said splicing construction comprises thinning part, tack coat and stiffening plate; Said thinning part is arranged on the edge of the splicing part of said base board unit, and the said thinning part of intending two base board units of splicing is oppositely arranged and forms a groove, and the shape of said stiffening plate matches with said groove; Said tack coat is between said stiffening plate and said groove, and said tack coat is fixedly connected said stiffening plate with said groove.
Better, the material of said tack coat is identical with the material of said base board unit.
Better, the material of said stiffening plate is identical with the material of said base board unit.
Better, the width of said thinning part be its thickness 10-50 doubly.
Better, the thickness of said thinning part be base board unit thickness 0.2-0.8 doubly.
Better, said medium substrate is an epoxy resin.
Better, the outer surface of said stiffening plate is provided with artificial micro-structural.
Better, said artificial micro-structural is that I shape, I-shaped derivative type or opening are ring-like.
Through using according to medium substrate splicing construction of the present invention and ultra material with this splicing construction; Utilize tack coat with the fixing bonding of the thinning part of the splicing edge of stiffening plate that cooperatively interacts and medium substrate; Thereby will splice each other than the medium substrate or the ultra material function plate of small size; One side can make full use of existing equipment and technology is carried out the manufacturing of medium substrate, can obtain having more large-area medium substrate or ultra material function plate on the other hand.
[description of drawings]
Fig. 1, the structural representation of embodiment 1 medium substrate.
Fig. 2, embodiment 1 medium substrate splicing construction sketch map.
Fig. 3, the perspective view of ultra material function plate among the embodiment 1.
Fig. 4, embodiment 2 medium substrate splicing construction sketch mapes.
Fig. 5, the perspective view of ultra material function plate among the embodiment 2.
Fig. 6, I-shaped derivative type structure chart.
Fig. 7, the ring-like structure chart of opening.
[specific embodiment]
Below in conjunction with accompanying drawing and embodiment the present invention is elaborated.
Embodiment 1
The structural representation of medium substrate is referring to accompanying drawing 1, and the edge of medium substrate 1 splicing part is provided with thinning part 2, and the thinning part 2 of intending two medium substrates 1 of splicing is oppositely arranged and forms groove 3.
Medium substrate splicing construction sketch map is referring to accompanying drawing 2; Respective slot 3 is provided with stiffening plate 4; The shape of stiffening plate 4 matches with groove 3; Between the joint portion of the inner surface of groove 3 and stiffening plate 4, be provided with tack coat 5, tack coat 5 is fixing with groove 3 bondings with stiffening plate 4, and then will intend two medium substrates 1 that splice and be spliced into one.
A kind of ultra material; Comprise a plurality of ultra material function plates; The perspective view of ultra material function plate is referring to accompanying drawing 3, and ultra material function plate A is made up of two base board units 100, and base board unit 100 is made up of medium substrate 1 and the artificial micro-structural 6 of a plurality of I shapes of array on medium substrate 1; The medium substrate 1 of two base board units 100 splices through splicing construction each other, forms to have the ultra material function plate of larger area.The structural representation of medium substrate comprises that referring to accompanying drawing 1 edge of medium substrate 1 splicing part is provided with thinning part 2, and the thinning part 2 of intending two medium substrates 1 of splicing is oppositely arranged and forms groove 3.Medium substrate splicing construction sketch map is referring to accompanying drawing 2; Respective slot 3 is provided with stiffening plate 4; The shape of stiffening plate 4 matches with groove 3; Between the joint portion of the inner surface of groove 3 and stiffening plate 4, be provided with tack coat 5, tack coat 5 is fixing with groove 3 bondings with stiffening plate 4, and then will intend two medium substrates 1 that splice and be spliced into one.
During practical implementation, the thickness d of thinning part 2 is thickness D half the of medium substrate 1, i.e. d=1/2D in the accompanying drawing 2; The width w of thinning part is 10 times of thickness d of thinning part 2, i.e. w=10d.Through the design of this size, increased the contact area of stiffening plate 4 significantly with groove 3, also promptly increased the area of tack coat 5 significantly, the bonding force between two medium substrates 1 intending splicing is strengthened greatly, improved the fastness of bonding.
Embodiment 2
The splicing construction sketch map of medium substrate is referring to accompanying drawing 4; The edge of medium substrate 1 splicing part is provided with thinning part 2; The thinning part 2 of intending two medium substrates 1 of splicing is oppositely arranged and forms groove (not indicating among the figure), and respective slot is provided with stiffening plate 4, and the shape of stiffening plate 4 matches with groove; Between the joint portion of the inner surface of groove 3 and stiffening plate 4, be provided with tack coat 5; Intend between the thinning part 2 of two medium substrates 1 of splicing and also be provided with tack coat 5, tack coat 5 is fixing with groove 3 bondings with stiffening plate 4, and then will intend two medium substrates 1 that splice and be spliced into one.
A kind of ultra material; Comprise a plurality of ultra material function plates; The perspective view of ultra material function plate is referring to accompanying drawing 5, and ultra material function plate A is made up of two base board units 100, and base board unit 100 is made up of medium substrate 1 and the artificial micro-structural 6 of a plurality of I shapes of array on medium substrate 1; The medium substrate 1 of two base board units 100 splices through splicing construction each other, forms to have the ultra material function plate of larger area.The structural representation of medium substrate is referring to accompanying drawing 4; The edge that comprises medium substrate 1 splicing part is provided with thinning part 2; The thinning part 2 of intending two medium substrates 1 of splicing is oppositely arranged and forms groove (not indicating among the figure), and respective slot is provided with stiffening plate 4, and the shape of stiffening plate 4 matches with groove; Between the joint portion of the inner surface of groove 3 and stiffening plate 4, be provided with tack coat 5; Intend between the thinning part 2 of two medium substrates 1 of splicing and also be provided with tack coat 5, tack coat 5 is fixing with groove 3 bondings with stiffening plate 4, and then will intend two medium substrates 1 that splice and be spliced into one.
During practical implementation; For reducing splicing construction the dielectric constant of whole ultra material function plate is exerted an influence; Artificial micro-structural 6 can be set at the outer surface of stiffening plate 4; The artificial micro-structural 6 of array on artificial micro-structural 6 and two medium substrates 1 on the stiffening plate 4 is connected on the rule of arranging, can saves consumptive material on the one hand, can realize the seamless continuous variation of electromagnetic property of ultra material on the other hand.
During practical implementation, the relation of the thickness D of the thickness d of thinning part 2 and medium substrate 1 is d=2/3D in the accompanying drawing 4; The width w of thinning part is 30 times of thickness d of thinning part 2, i.e. w=30d.Through the design of this size, can increase the contact area of stiffening plate 4 to greatest extent with groove 3, also promptly increased the area of tack coat 5 substantially, the bonding force between two medium substrates 1 intending splicing is strengthened greatly, improved the fastness of bonding.
During practical implementation; Medium substrate 1 can select for use epoxy resin as base material, and the binding agent of tack coat selects epoxy adhesive for use, simultaneously; The material of stiffener is also selected epoxy resin for use; Its objective is to being that whole ultra material function plate has homogeneous medium substrate material, thereby reduce to adopt the influence of unlike material, prevent after splicing, to change the electromagnetic property of ultra material ultra material function slab integral dielectric constant.
During practical implementation, the concrete structure of artificial micro-structural can also be ring-like for I shape, I-shaped derivative type or opening, and Fig. 6 is an I-shaped derivative type structure chart, and Fig. 7 is the ring-like structure chart of opening.
In the above-described embodiments, only the present invention has been carried out exemplary description, but those skilled in the art can carry out various modifications to the present invention after reading present patent application under the situation that does not break away from the spirit and scope of the present invention.

Claims (14)

1. medium substrate splicing construction; Be used for the splicing between the medium substrate; It is characterized in that: said splicing construction comprises thinning part, tack coat and stiffening plate, and said thinning part is arranged on the edge of the splicing part of said medium substrate, and the said thinning part of intending two medium substrates of splicing is oppositely arranged and forms a groove; The shape of said stiffening plate matches with said groove, is provided with tack coat between said stiffening plate and the said groove and between the said medium substrate.
2. medium substrate splicing construction according to claim 1 is characterized in that: also be provided with tack coat between the said thinning part of two medium substrates of said plan splicing.
3. medium substrate splicing construction according to claim 1 is characterized in that: the material of said tack coat is identical with the material of said medium substrate.
4. medium substrate splicing construction according to claim 1 is characterized in that: the material of said stiffening plate is identical with the material of said medium substrate.
5. medium substrate splicing construction according to claim 1 is characterized in that: the width of said thinning part is 10-50 a times of its thickness.
6. medium substrate splicing construction according to claim 1 is characterized in that: the thickness of said thinning part is 0.2-0.8 times of dielectric substrate thickness.
7. ultra material; Comprise a plurality of ultra material function plates; It is characterized in that: said ultra material function plate is made up of a plurality of base board units, and said base board unit is made up of medium substrate and a plurality of artificial micro-structural of array on medium substrate, and the medium substrate of said a plurality of base board units splices through splicing construction each other; Said splicing construction comprises thinning part, tack coat and stiffening plate; Said thinning part is arranged on the edge of the splicing part of said base board unit, and the said thinning part of intending two base board units of splicing is oppositely arranged and forms a groove, and the shape of said stiffening plate matches with said groove; Said tack coat is between said stiffening plate and said groove, and said tack coat is fixedly connected said stiffening plate with said groove.
8. ultra material according to claim 7 is characterized in that: the material of said tack coat is identical with the material of said base board unit.
9. ultra material according to claim 7 is characterized in that: the material of said stiffening plate is identical with the material of said base board unit.
10. ultra material according to claim 7 is characterized in that: the width of said thinning part is 10-50 a times of its thickness.
11. ultra material according to claim 7 is characterized in that: the thickness of said thinning part is 0.2-0.8 times of base board unit thickness.
12. ultra material according to claim 7 is characterized in that: said medium substrate is an epoxy resin.
13. ultra material according to claim 7 is characterized in that: the outer surface of said stiffening plate is provided with artificial micro-structural.
14. according to each described ultra material of claim 7 to 13, it is characterized in that: said artificial micro-structural is that I shape, I-shaped derivative type or opening are ring-like.
CN201110146306.4A 2011-06-01 2011-06-01 Dielectric substrate splicing structure and metamaterial Active CN102806697B (en)

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Application Number Priority Date Filing Date Title
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CN102806697A true CN102806697A (en) 2012-12-05
CN102806697B CN102806697B (en) 2015-03-25

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10002281A1 (en) * 2000-01-20 2001-07-26 Volkswagen Ag Component with sandwich structure, in particular, for motor vehicle bodywork comprises a distancing layer which is provided with cutouts serving for spot attachment of the cover layer to the base sheet
CN2806630Y (en) * 2005-06-24 2006-08-16 常州麦西诺贝木业有限公司 Noise damping moisture-proof floor
CN101158366A (en) * 2007-08-27 2008-04-09 支亮 Split joint process of wind pipe plate and wind pipe plate therefrom

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10002281A1 (en) * 2000-01-20 2001-07-26 Volkswagen Ag Component with sandwich structure, in particular, for motor vehicle bodywork comprises a distancing layer which is provided with cutouts serving for spot attachment of the cover layer to the base sheet
CN2806630Y (en) * 2005-06-24 2006-08-16 常州麦西诺贝木业有限公司 Noise damping moisture-proof floor
CN101158366A (en) * 2007-08-27 2008-04-09 支亮 Split joint process of wind pipe plate and wind pipe plate therefrom

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
R.A.SHELBY等: "Microwave transmission through a two-dimensional, isotropic, left-handed metamaterial", 《APPLIED PHYSICS LETTERS》, vol. 4, no. 78, 22 January 2001 (2001-01-22) *

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