CN102806697B - Dielectric substrate splicing structure and metamaterial - Google Patents

Dielectric substrate splicing structure and metamaterial Download PDF

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Publication number
CN102806697B
CN102806697B CN201110146306.4A CN201110146306A CN102806697B CN 102806697 B CN102806697 B CN 102806697B CN 201110146306 A CN201110146306 A CN 201110146306A CN 102806697 B CN102806697 B CN 102806697B
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Prior art keywords
medium substrate
splicing
stiffening plate
thinning part
meta materials
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CN201110146306.4A
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CN102806697A (en
Inventor
刘若鹏
赵治亚
缪锡根
张影
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Kuang Chi Institute of Advanced Technology
Kuang Chi Innovative Technology Ltd
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Kuang Chi Institute of Advanced Technology
Kuang Chi Innovative Technology Ltd
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Abstract

The invention provides a dielectric substrate splicing structure and a metamaterial with the same. The splicing structure comprises thinning portions, bonding layers and a reinforcing plate, each thinning portion is arranged at the edge of a splicing portion of each of two dielectric substrates, the thinning portions of the two dielectric substrates to be spliced are arranged oppositely to form a groove, the reinforcing plate matches with the groove in shape, and the bonding layers are arranged between the reinforcing plate and the groove and between the dielectric substrates. The dielectric substrate splicing structure and the metamaterial have the advantages that on one hand, the dielectric substrates can be manufactured by taking full advantage of existing equipment and processes, and on the other hand, dielectric substrates or metamaterial function boards larger in areas can be obtained.

Description

A kind of medium substrate splicing construction and Meta Materials
[technical field]
The present invention relates to advanced composite material (ACM) field, relate to composite electromagnetic wave to specific electromagnetism modulation function particularly.
[background technology]
Meta Materials is a kind of composite artificial material, its basic composition structure is Meta Materials feature board, thickness is generally grade, and by medium substrate and array, man-made microstructure on medium substrate forms Meta Materials feature board, and namely metamaterial board is formed Meta Materials by the combination of certain arrangement rule.The material of Metamaterial dielectric substrate can Ceramics, macromolecular material, polytetrafluoroethylene (PTFE), ferroelectric material, ferrite material, ferromagnetic material etc. in selection, man-made microstructure on medium substrate is then generally the material such as metallic copper, silver, its structure and pcb board similar.
In Meta Materials feature board, the multiple man-made microstructure of array on medium substrate have specific electromagnetic property, electromagnetic response can be produced to electric field or magnetic field, by carrying out careful design and control to the structure of man-made microstructure and arrangement regulation, the electromagnetic property that Meta Materials can be made to present various general material do not have, if converge, disperse and deviation electromagnetic wave etc.Although the medium substrate of existing Meta Materials can adopt the manufacturing process of PCB to manufacture, but there is the less problem of size in the produced medium substrate of existing PCB processing technology, for Meta Materials, in some occasion, as antenna for base station field, its area can reach several square metres even tens square metres, and to this, the medium substrate of existing manufacture technics can not be satisfied the demand.
[summary of the invention]
The present invention do solve above-mentioned technical problem, a kind of splicing construction of medium substrate is provided and there is the Meta Materials of this splicing construction.
The technical scheme that the present invention realizes goal of the invention employing is, a kind of medium substrate splicing construction, for the splicing between medium substrate, described splicing construction comprises thinning part, tack coat and stiffening plate, described thinning part is arranged on the edge of the splicing part of described medium substrate, the described thinning part intending two medium substrates of splicing is oppositely arranged formation one groove, the shape of described stiffening plate and described fit depressions, be provided with tack coat between described stiffening plate and described groove and between described medium substrate.
Better, also tack coat is provided with between the described described thinning part intending two medium substrates of splicing.
Better, the material of described tack coat is identical with the material of described medium substrate.
Better, the material of described stiffening plate is identical with the material of described medium substrate.
Better, the width of described thinning part is 10-50 times of its thickness.
Better, the thickness of described thinning part is 0.2-0.8 times of dielectric substrate thickness.
The present invention also provides a kind of Meta Materials, comprise multiple Meta Materials feature board, described Meta Materials feature board is made up of multiple base board unit, by medium substrate and array, the multiple man-made microstructure on medium substrate form described base board unit, the medium substrate of described multiple base board unit is spliced mutually by splicing construction, described splicing construction comprises thinning part, tack coat and stiffening plate, described thinning part is arranged on the edge of the splicing part of described base board unit, the described thinning part intending two base board units of splicing is oppositely arranged formation one groove, the shape of described stiffening plate and described fit depressions, described tack coat is between described stiffening plate and described groove, described stiffening plate is fixedly connected with described groove by described tack coat.
Better, the material of described tack coat is identical with the material of described base board unit.
Better, the material of described stiffening plate is identical with the material of described base board unit.
Better, the width of described thinning part is 10-50 times of its thickness.
Better, the thickness of described thinning part is 0.2-0.8 times of base board unit thickness.
Better, described medium substrate is epoxy resin.
Better, the outer surface of described stiffening plate is provided with man-made microstructure.
Better, described man-made microstructure is that I shape, I-shaped derivative type or opening are ring-like.
By using according to medium substrate splicing construction of the present invention and the Meta Materials with this splicing construction, tack coat is utilized to bond fixing for the thinning part of the splicing edge of the stiffening plate cooperatively interacted and medium substrate, thus mutually splice compared with the medium substrate of small size or Meta Materials feature board, the manufacture that existing equipment and technique carry out medium substrate can be made full use of on the one hand, can obtain that there is more large-area medium substrate or Meta Materials feature board on the other hand.
[accompanying drawing explanation]
Fig. 1, the structural representation of embodiment 1 medium substrate.
Fig. 2, embodiment 1 medium substrate splicing construction schematic diagram.
Fig. 3, the perspective view of Meta Materials feature board in embodiment 1.
Fig. 4, embodiment 2 medium substrate splicing construction schematic diagram.
Fig. 5, the perspective view of Meta Materials feature board in embodiment 2.
Fig. 6, I-shaped derivative type structure chart.
Fig. 7, the ring-like structure chart of opening.
[detailed description of the invention]
Below in conjunction with drawings and Examples, the present invention is described in detail.
Embodiment 1
The structural representation of medium substrate is referring to accompanying drawing 1, and the edge of medium substrate 1 splicing part is provided with thinning part 2, and the thinning part 2 intending two medium substrates 1 of splicing is oppositely arranged and forms groove 3.
Medium substrate splicing construction schematic diagram is referring to accompanying drawing 2, respective slot 3 is provided with stiffening plate 4, the shape of stiffening plate 4 matches with groove 3, tack coat 5 is provided with between the inner surface and the joint portion of stiffening plate 4 of groove 3, stiffening plate 4 and groove 3 bond fixing by tack coat 5, and then two medium substrates 1 intending splicing are spliced into one.
A kind of Meta Materials, comprise multiple Meta Materials feature board, the perspective view of Meta Materials feature board is referring to accompanying drawing 3, Meta Materials feature board A is made up of two base board units 100, by medium substrate 1 and array, the multiple I shape man-made microstructure 6 on medium substrate 1 form base board unit 100, the medium substrate 1 of two base board units 100 is spliced mutually by splicing construction, forms the Meta Materials feature board with larger area.The structural representation of medium substrate is referring to accompanying drawing 1, and the edge comprising medium substrate 1 splicing part is provided with thinning part 2, and the thinning part 2 intending two medium substrates 1 of splicing is oppositely arranged and forms groove 3.Medium substrate splicing construction schematic diagram is referring to accompanying drawing 2, respective slot 3 is provided with stiffening plate 4, the shape of stiffening plate 4 matches with groove 3, tack coat 5 is provided with between the inner surface and the joint portion of stiffening plate 4 of groove 3, stiffening plate 4 and groove 3 bond fixing by tack coat 5, and then two medium substrates 1 intending splicing are spliced into one.
During concrete enforcement, in accompanying drawing 2, the thickness d of thinning part 2 is the half of the thickness D of medium substrate 1, i.e. d=1/2D; The width w of thinning part is 10 times of the thickness d of thinning part 2, i.e. w=10d.By the design of this size, add the contact area of stiffening plate 4 and groove 3 significantly, also namely add the area of tack coat 5 significantly, the bonding force between two medium substrates 1 that plan is spliced strengthens greatly, improves the fastness of bonding.
Embodiment 2
The splicing construction schematic diagram of medium substrate is referring to accompanying drawing 4, the edge of medium substrate 1 splicing part is provided with thinning part 2, the thinning part 2 intending two medium substrates 1 of splicing is oppositely arranged and forms groove (not indicating in figure), respective slot is provided with stiffening plate 4, the shape of stiffening plate 4 and fit depressions, tack coat 5 is provided with between the inner surface and the joint portion of stiffening plate 4 of groove 3, also tack coat 5 is provided with between the thinning part 2 of two medium substrates 1 of plan splicing, stiffening plate 4 and groove 3 bond fixing by tack coat 5, and then two medium substrates 1 intending splicing are spliced into one.
A kind of Meta Materials, comprise multiple Meta Materials feature board, the perspective view of Meta Materials feature board is referring to accompanying drawing 5, Meta Materials feature board A is made up of two base board units 100, by medium substrate 1 and array, the multiple I shape man-made microstructure 6 on medium substrate 1 form base board unit 100, the medium substrate 1 of two base board units 100 is spliced mutually by splicing construction, forms the Meta Materials feature board with larger area.The structural representation of medium substrate is referring to accompanying drawing 4, the edge comprising medium substrate 1 splicing part is provided with thinning part 2, the thinning part 2 intending two medium substrates 1 of splicing is oppositely arranged and forms groove (not indicating in figure), respective slot is provided with stiffening plate 4, the shape of stiffening plate 4 and fit depressions, tack coat 5 is provided with between the inner surface and the joint portion of stiffening plate 4 of groove 3, also tack coat 5 is provided with between the thinning part 2 of two medium substrates 1 of plan splicing, stiffening plate 4 and groove 3 bond fixing by tack coat 5, and then two medium substrates 1 intending splicing are spliced into one.
During concrete enforcement, have an impact for reducing the dielectric constant of splicing construction to whole Meta Materials feature board, man-made microstructure 6 can be set at the outer surface of stiffening plate 4, the man-made microstructure 6 of the man-made microstructure 6 on stiffening plate 4 and array on two medium substrates 1 is connected arranging in rule, can consumptive material be saved on the one hand, the seamless consecutive variations of electromagnetic property of Meta Materials can be realized on the other hand.
During concrete enforcement, in accompanying drawing 4, the pass of the thickness d of thinning part 2 and the thickness D of medium substrate 1 is d=2/3D; The width w of thinning part is 30 times of the thickness d of thinning part 2, i.e. w=30d.By the design of this size, can add the contact area of stiffening plate 4 and groove 3 to greatest extent, also namely add the area of tack coat 5 substantially, the bonding force between two medium substrates 1 that plan is spliced strengthens greatly, improves the fastness of bonding.
During concrete enforcement, medium substrate 1 can select epoxy resin as base material, and epoxy adhesive selected by the binding agent of tack coat, simultaneously, the material of stiffener also selects epoxy resin, its objective is as being that whole Meta Materials feature board has homogeneous medium substrate material, thus reduce to adopt unlike material on the impact of Meta Materials feature board overall dielectric constant, prevent the electromagnetic property changing Meta Materials in splicing afterwards.
During concrete enforcement, the concrete structure of man-made microstructure can also be that I shape, I-shaped derivative type or opening are ring-like, and Fig. 6 is I-shaped derivative type structure chart, and Fig. 7 is the ring-like structure chart of opening.
In the above-described embodiments, only to invention has been exemplary description, but those skilled in the art can carry out various amendment to the present invention without departing from the spirit and scope of the present invention after reading present patent application.

Claims (12)

1. a medium substrate splicing construction, for uniform material medium substrate between splicing, it is characterized in that: described splicing construction comprises thinning part, tack coat and stiffening plate, described thinning part is arranged on the edge of the splicing part of described medium substrate and forms " L " shape open slot between the main body of described thinning part and described medium substrate and its opening is positioned at the face side of described medium substrate, the described thinning part of two medium substrates intending splicing is oppositely arranged and " L " shape open slot described in two surrounds formation one groove and the opening of described groove is positioned at the face side of described medium substrate, the shape of described stiffening plate is with described fit depressions and the material of the material of described stiffening plate and described medium substrate is identical, tack coat is provided with between described stiffening plate and described groove and between described medium substrate.
2. medium substrate splicing construction according to claim 1, is characterized in that: be also provided with tack coat between the described described thinning part intending two medium substrates of splicing.
3. medium substrate splicing construction according to claim 1, is characterized in that: the material of described tack coat is identical with the material of described medium substrate.
4. medium substrate splicing construction according to claim 1, is characterized in that: the width of described thinning part is 10-50 times of its thickness.
5. medium substrate splicing construction according to claim 1, is characterized in that: the thickness of described thinning part is 0.2-0.8 times of dielectric substrate thickness.
6. a Meta Materials, comprise multiple Meta Materials feature board, it is characterized in that: described Meta Materials feature board is made up of multiple base board unit, described base board unit is made up of the medium substrate of uniform material and multiple man-made microstructure of array on medium substrate, the medium substrate of described multiple base board unit is spliced mutually by splicing construction, described splicing construction comprises thinning part, tack coat and stiffening plate, described thinning part is arranged on the edge of the splicing part of described base board unit and forms the face side that " L " shape open slot and its opening are positioned at described medium substrate, the described thinning part of two base board units intending splicing is oppositely arranged and " L " shape open slot described in two surrounds formation one groove and the opening of described groove is positioned at the face side of described medium substrate, the shape of described stiffening plate and described fit depressions, described tack coat is between described stiffening plate with described groove and the material of the material of described stiffening plate and described medium substrate is identical, described stiffening plate is fixedly connected with described groove by described tack coat.
7. Meta Materials according to claim 6, is characterized in that: the material of described tack coat is identical with the material of described base board unit.
8. Meta Materials according to claim 6, is characterized in that: the width of described thinning part is 10-50 times of its thickness.
9. Meta Materials according to claim 7, is characterized in that: the thickness of described thinning part is 0.2-0.8 times of base board unit thickness.
10. Meta Materials according to claim 6, is characterized in that: described medium substrate is epoxy resin.
11. Meta Materials according to claim 6, is characterized in that: the outer surface of described stiffening plate is provided with man-made microstructure.
12. Meta Materials according to any one of claim 6 to 11, is characterized in that: described man-made microstructure is that I shape, I-shaped derivative type or opening are ring-like.
CN201110146306.4A 2011-06-01 2011-06-01 Dielectric substrate splicing structure and metamaterial Active CN102806697B (en)

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Application Number Priority Date Filing Date Title
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CN102806697B true CN102806697B (en) 2015-03-25

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10002281A1 (en) * 2000-01-20 2001-07-26 Volkswagen Ag Component with sandwich structure, in particular, for motor vehicle bodywork comprises a distancing layer which is provided with cutouts serving for spot attachment of the cover layer to the base sheet
CN2806630Y (en) * 2005-06-24 2006-08-16 常州麦西诺贝木业有限公司 Noise damping moisture-proof floor
CN101158366A (en) * 2007-08-27 2008-04-09 支亮 Split joint process of wind pipe plate and wind pipe plate therefrom

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10002281A1 (en) * 2000-01-20 2001-07-26 Volkswagen Ag Component with sandwich structure, in particular, for motor vehicle bodywork comprises a distancing layer which is provided with cutouts serving for spot attachment of the cover layer to the base sheet
CN2806630Y (en) * 2005-06-24 2006-08-16 常州麦西诺贝木业有限公司 Noise damping moisture-proof floor
CN101158366A (en) * 2007-08-27 2008-04-09 支亮 Split joint process of wind pipe plate and wind pipe plate therefrom

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Microwave transmission through a two-dimensional, isotropic, left-handed metamaterial;R.A.Shelby等;《APPLIED PHYSICS LETTERS》;20010122;第4卷(第78期);第489页右栏第5行-最后一行及第490页左栏第1行-第9行及附图1 *

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