CN102802354A - Electronic subassembly - Google Patents
Electronic subassembly Download PDFInfo
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- CN102802354A CN102802354A CN2011101472434A CN201110147243A CN102802354A CN 102802354 A CN102802354 A CN 102802354A CN 2011101472434 A CN2011101472434 A CN 2011101472434A CN 201110147243 A CN201110147243 A CN 201110147243A CN 102802354 A CN102802354 A CN 102802354A
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- circuit board
- solder joints
- electronic subassembly
- electronic
- subassembly according
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Abstract
An electronic subassembly comprises a circuit board and electronic elements, wherein the circuit board comprises a welding point array including a plurality of welding points, the welding point array is positioned on a first surface of the circuit board, and through holes are respectively formed in the welding points. Each electronic element is arranged between the two adjacent welding points, and comprises two electrical connection points. The two electrical connection points are respectively electrically connected with the adjacent welding points, a connection line of the two electrical connection points and a central point of the two corresponding welding points form an acute angle. The through holes are separated from the electrical connection points by a long distance, so that the problem of badness as soldering tin is heated due to the reflow soldering and then flows in the through holes is avoided.
Description
Technical field
The present invention relates to a kind of electronic subassembly, particularly a kind of electronic subassembly about circuit board arrangement.
Background technology
Traditional coupling capacitor is in the layout of printed circuit board (PCB), and (Printed Circuit Board, mode PCB) are can the direct cloth of the electrical contact of electric capacity be put on the solder joint of printed circuit board (PCB).Yet; Printed circuit board (PCB) to the kenel that has through hole (via hole) on the solder joint; When the electrical contact of electric capacity electrically connects the solder joint of printed circuit board (PCB) through scolding tin; Scolding tin but is heated because of reflow easily and flows in the through hole, and then causes the problem of the electric connection poor effect between electrical contact and the solder joint.
In view of this; In order to overcome scolding tin because of flowing into the problem that causes the electric connection poor effect between electric capacity and the printed circuit board (PCB) in the through hole; Prior art is through the mode of electroplating consent (via in pad) through hole to be clogged, and takes place with the situation of avoiding scolding tin to flow in the through hole.Thus, can guarantee has enough soldering tin amounts between the solder joint of electrical contact and printed circuit board (PCB) of electric capacity, so that the good electric connection effect between electric capacity and the printed circuit board (PCB) to be provided.
Yet, can overcome the problem that scolding tin flows into the electric connection poor effect between electric capacity that through hole is caused and the printed circuit board (PCB) though have now with the mode of electroplating consent, so way will cause the significantly lifting on the manufacturing cost.And the situation that causes spot size to differ also simultaneously easily with the mode of electroplating consent takes place.Thus, when condenser welding was connected on the printed circuit board (PCB), the easily relative printed circuit board (PCB) of electric capacity slided and forms gravestone effect (tomb stone), and then caused the phenomenon of capacitance arrangement skew to take place.
Summary of the invention
In view of above problem, the object of the present invention is to provide a kind of electronic subassembly, use easy being heated of the scolding tin that solves on the available circuit plate and flow in the through hole because of reflow, cause the problem of the electric connection poor effect between electric capacity and the circuit board.
The electronic subassembly that the present invention disclosed, it comprises a circuit board and an electronic component.Circuit board comprises the pad array of a plurality of solder joints, and pad array is positioned on the first surface of circuit board, respectively has a through hole on these solder joints.Electronic component then is arranged between the two adjacent solder joints, and electronic component comprises two electrical contacts.Two electrical contacts electrically connect corresponding two solder joints respectively, and binding clip one acute angle of the central point of the line of the central point of two electrical contacts and adjacent two solder joints.
According to the electronic subassembly that the invention described above disclosed, be that electronic component is arranged between the two adjacent solder joints, and make line and binding clip one acute angle at two solder joint centers of two electrical contacts of electronic component.So the configuration of this electronic subassembly can make having maximum distance between electrical contact and the through hole.Thus, can avoid making between connecting scolding tin between electrical contact and the solder joint and be heated because of reflow and flow in the through hole, make that soldering tin amount between electrical contact and the solder joint is not enough and cause and electrically connect bad problem and take place.
Describe the present invention below in conjunction with accompanying drawing and specific embodiment, but not as to qualification of the present invention.
Description of drawings
Figure 1A is the structural representation of electronic subassembly according to an embodiment of the invention;
Figure 1B is the partial structurtes enlarged drawing of electronic subassembly according to an embodiment of the invention;
Fig. 2 is the cutaway view of circuit board according to an embodiment of the invention;
Fig. 3 is the partial structurtes enlarged drawing of electronic subassembly according to another embodiment of the present invention.
Wherein, Reference numeral
10 electronic subassemblies
100 circuit boards
101 first surfaces
102 second surfaces
110 solder joints
112 through holes
114 conductive layers
116 internal faces
117 first openings
118 second openings
119 pad array
120 circuits
200 electronic components
200 ' electronic component
210 electrical contacts
210 ' electrical contact
Embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and operation principle are done concrete description:
Please be simultaneously with reference to Figure 1A, Figure 1B and Fig. 2; Figure 1A is the structural representation of electronic subassembly according to an embodiment of the invention; Figure 1B is the partial structurtes enlarged drawing of electronic subassembly according to an embodiment of the invention, and Fig. 2 is the cutaway view of circuit board according to an embodiment of the invention.
The electronic subassembly 10 of present embodiment comprises a circuit board 100 and an electronic component 200.Wherein, circuit board 100 is that (Printed Circuit Board PCB) is example, and electronic component 200 is to be example with an electric capacity, but not as limit with printed circuit board (PCB).
Please continue with reference to Figure 1A and Fig. 2.Wherein, circuit board 100 also can be the two plane type circuit board, and circuit board 100 has a relative first surface 101 and a second surface 102, first surface 101 and second surface 102 have respectively one comprise a plurality of solder joints 110 pad array 119.In other words, a plurality of solder joints 110 are to be arranged on the first surface 101 and second surface 102 of circuit board 100, and these solder joints 110 are to arrange with the array kenel to appear.And these solder joints 110 are to be circular aspect, and solder joint 110 is formed on the circuit board 100 with the mode of printing or plating.
In addition, the position that is positioned at the solder joint 110 on the first surface 101 is the position corresponding to the solder joint on the second surface 102 110.And, the through hole 112 that also has corresponding solder joint 110 quantity on the circuit board 100, through hole 112 is through to second surface 102 by first surface 101.Further, through hole 112 runs through circuit board 100, and respectively at forming one first opening 117 and one second opening 118 on first surface 101 and the second surface 102.Wherein, first opening 117 is solder joint 110 centre that are positioned on the first surface 101, and second opening 118 is solder joint 110 centre that are positioned on the second surface 102.In other words, the axle center of through hole 112 is the central points through the solder joint 110 on solder joint on the first surface 101 110 and the second surface 102.And, on an internal face 116 that forms through hole 112, also having a conductive layer 114, the mode that conductive layer 114 can be electroplated is formed on the internal face 116.Solder joint 110 on the conductive layer 114 electric connection first surfaces 101 and the solder joint 110 on the second surface 102.In other words, solder joint 110 on the first surface 101 and the solder joint 110 on the second surface 102 are to electrically connect mutually through conductive layer 114.
The relative dimensions of the circuit board 100 that is suitable in the electronic subassembly 10 of present embodiment in addition, is down.Please with reference to Fig. 2, in the middle of present embodiment, the solder joint 110 on the circuit board 100 has an external diameter b, and through hole 112 has an aperture a, and has an axle center distance c between adjacent two through holes 112.Wherein, external diameter b is 18 Mills (mil), and aperture a is 9 Mills (mil), and the axle center distance c then is 0.8mm.
Please continue with reference to Figure 1A and Figure 1B, electronic component 200 is to be arranged on the first surface 101 of circuit board 100, but not as limit.In another embodiment of the present invention, electronic component 200 also can be arranged on the second surface 102.
Wherein, the angular range of acute angle, theta be 65 the degree to 70 the degree, and the optimum value of acute angle, theta be 67.5 the degree.When acute angle, theta is above-mentioned numerical value, has maximum distance between electrical contact 210 and the through hole 112.Thus, the scolding tin that can avoid being used to connecting electrical contact 210 and solder joint 110 is heated because of reflow and flows in the through hole 112, makes that soldering tin amount between electrical contact 210 and the solder joint 110 is not enough and causes and electrically connect bad problem generation.
Be noted that in the middle of Figure 1B embodiment, two electrical contacts 210 are directly electrically to be contacted with solder joint 110, but this characteristic is non-in order to limit the present invention.For example, in the middle of another embodiment of the present invention as shown in Figure 3, circuit board 100 also can have two circuits, 120, two circuits 120 and be positioned on the first surface 101 of circuit board 100.And two circuits 120 electrically connect two adjacent solder joints 110 respectively, and electronic component 200 ' two electrical contacts 210 ' be electrically connected at two solder joints 110 through electrical contact two circuits 120 respectively.
According to the electronic subassembly of the foregoing description, be that electronic component is arranged between the two adjacent solder joints, and make the binding clip one at line and two solder joint centers of two electrical contacts of electronic component near the acute angle of 67.5 degree.So the configuration of this electronic subassembly can make having maximum distance between electrical contact and the through hole.Thus, can avoid making between connecting scolding tin between electrical contact and the solder joint and be heated because of reflow and flow in the through hole, make that soldering tin amount between electrical contact and the solder joint is not enough and cause and electrically connect bad problem and take place.
Certainly; The present invention also can have other various embodiments; Under the situation that does not deviate from spirit of the present invention and essence thereof; Those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (10)
1. an electronic subassembly is characterized in that, comprises:
One circuit board comprises the pad array of a plurality of solder joints, and this pad array is positioned on the first surface of this circuit board, respectively has a through hole on those solder joints; And
One electronic component; Be arranged between two adjacent these solder joints; This electronic component comprises two electrical contacts, and this two electrical contact electrically connects corresponding two these solder joints respectively, and binding clip one acute angle of the central point of the line of the central point of this two electrical contact and adjacent two these solder joints.
2. electronic subassembly according to claim 1 is characterized in that, the scope of this acute angle is that 65 degree are to 70 degree.
3. electronic subassembly according to claim 1 is characterized in that, this acute angle is 67.5 degree.
4. electronic subassembly according to claim 1; It is characterized in that, also comprise two circuits, this two circuit is positioned on this first surface of this circuit board; And this two circuit electrically connects two adjacent these solder joints respectively, and this of this electronic component two electrical contacts electrically contact this two circuit respectively.
5. electronic subassembly according to claim 1; It is characterized in that; This circuit board has a second surface; This second surface and this first surface are positioned at the relative both sides of this circuit board, and this pad array is positioned at this first surface and this second surface, and the position of this solder joint on this first surface is corresponding to the position of this solder joint on this second surface; Has a conductive layer on one internal face of this through hole, this solder joint on this this first surface of conductive layer electric connection and this solder joint on this second surface.
6. electronic subassembly according to claim 1 is characterized in that, those solder joints are circular, and an external diameter of those solder joints is 18 Mills.
7. electronic subassembly according to claim 1 is characterized in that, an aperture of this through hole is 9 Mills.
8. electronic subassembly according to claim 1 is characterized in that, a distance of shaft centers of adjacent two these through holes is from being 0.8mm.
9. electronic subassembly according to claim 1 is characterized in that, this electronic component is an electric capacity.
10. electronic subassembly according to claim 1 is characterized in that, those solder joints are circular, and an external diameter of those solder joints is 18 Mills, and an aperture of this through hole is 9 Mills, and a distance of shaft centers of adjacent two these through holes is from being 0.8mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101472434A CN102802354A (en) | 2011-05-27 | 2011-05-27 | Electronic subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101472434A CN102802354A (en) | 2011-05-27 | 2011-05-27 | Electronic subassembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102802354A true CN102802354A (en) | 2012-11-28 |
Family
ID=47201281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101472434A Pending CN102802354A (en) | 2011-05-27 | 2011-05-27 | Electronic subassembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102802354A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106358101A (en) * | 2016-11-30 | 2017-01-25 | 宇龙计算机通信科技(深圳)有限公司 | Microphone leading-note design structure and mobile terminal |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5875102A (en) * | 1995-12-20 | 1999-02-23 | Intel Corporation | Eclipse via in pad structure |
| US20030101585A1 (en) * | 2001-06-22 | 2003-06-05 | Intel Corporation | Methods of manufacturing via intersect pad for electronic components |
| CN1951161A (en) * | 2004-01-22 | 2007-04-18 | 阿尔卡特公司 | Shared via decoupling for area arrays components |
| US20080205011A1 (en) * | 2007-02-23 | 2008-08-28 | Alex Chan | In-grid decoupling for ball grid array (BGA) devices |
-
2011
- 2011-05-27 CN CN2011101472434A patent/CN102802354A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5875102A (en) * | 1995-12-20 | 1999-02-23 | Intel Corporation | Eclipse via in pad structure |
| US20030101585A1 (en) * | 2001-06-22 | 2003-06-05 | Intel Corporation | Methods of manufacturing via intersect pad for electronic components |
| CN1951161A (en) * | 2004-01-22 | 2007-04-18 | 阿尔卡特公司 | Shared via decoupling for area arrays components |
| US20080205011A1 (en) * | 2007-02-23 | 2008-08-28 | Alex Chan | In-grid decoupling for ball grid array (BGA) devices |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106358101A (en) * | 2016-11-30 | 2017-01-25 | 宇龙计算机通信科技(深圳)有限公司 | Microphone leading-note design structure and mobile terminal |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121128 |