CN102802346A - 一种液态金属印刷电路板及其制备方法 - Google Patents
一种液态金属印刷电路板及其制备方法 Download PDFInfo
- Publication number
- CN102802346A CN102802346A CN2011101401566A CN201110140156A CN102802346A CN 102802346 A CN102802346 A CN 102802346A CN 2011101401566 A CN2011101401566 A CN 2011101401566A CN 201110140156 A CN201110140156 A CN 201110140156A CN 102802346 A CN102802346 A CN 102802346A
- Authority
- CN
- China
- Prior art keywords
- particle
- liquid metal
- room temperature
- temperature liquid
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 191
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 129
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- 230000003064 anti-oxidating effect Effects 0.000 claims abstract description 11
- 239000002245 particle Substances 0.000 claims description 251
- 239000000463 material Substances 0.000 claims description 82
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 51
- 229910052733 gallium Inorganic materials 0.000 claims description 51
- 239000011133 lead Substances 0.000 claims description 28
- 229910052714 tellurium Inorganic materials 0.000 claims description 28
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 28
- 239000007788 liquid Substances 0.000 claims description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 20
- 239000000956 alloy Substances 0.000 claims description 20
- 239000003973 paint Substances 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 20
- 229910045601 alloy Inorganic materials 0.000 claims description 19
- 229910052738 indium Inorganic materials 0.000 claims description 18
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 17
- 239000004033 plastic Substances 0.000 claims description 17
- 229920003023 plastic Polymers 0.000 claims description 17
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 14
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 14
- 239000004922 lacquer Substances 0.000 claims description 13
- 239000007769 metal material Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 11
- 229910000846 In alloy Inorganic materials 0.000 claims description 11
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 229910052700 potassium Inorganic materials 0.000 claims description 11
- 239000011591 potassium Substances 0.000 claims description 11
- 229910052708 sodium Inorganic materials 0.000 claims description 11
- 239000011734 sodium Substances 0.000 claims description 11
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 10
- 229910052732 germanium Inorganic materials 0.000 claims description 10
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- 229910052718 tin Inorganic materials 0.000 claims description 10
- 239000011135 tin Substances 0.000 claims description 10
- 229910052725 zinc Inorganic materials 0.000 claims description 10
- 239000011701 zinc Substances 0.000 claims description 10
- 229910001152 Bi alloy Inorganic materials 0.000 claims description 9
- NDXSUDIGSOJBLQ-UHFFFAOYSA-N [In][Bi][Zn][Sn] Chemical compound [In][Bi][Zn][Sn] NDXSUDIGSOJBLQ-UHFFFAOYSA-N 0.000 claims description 9
- 239000004744 fabric Substances 0.000 claims description 9
- 229910003251 Na K Inorganic materials 0.000 claims description 8
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 8
- 229920001971 elastomer Polymers 0.000 claims description 8
- 239000011152 fibreglass Substances 0.000 claims description 8
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 claims description 8
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 8
- 229910052753 mercury Inorganic materials 0.000 claims description 8
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 claims description 7
- QIHHYQWNYKOHEV-UHFFFAOYSA-N 4-tert-butyl-3-nitrobenzoic acid Chemical compound CC(C)(C)C1=CC=C(C(O)=O)C=C1[N+]([O-])=O QIHHYQWNYKOHEV-UHFFFAOYSA-N 0.000 claims description 7
- 229910000673 Indium arsenide Inorganic materials 0.000 claims description 7
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 claims description 7
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 claims description 7
- 239000006011 Zinc phosphide Substances 0.000 claims description 7
- YRXWPCFZBSHSAU-UHFFFAOYSA-N [Ag].[Ag].[Te] Chemical compound [Ag].[Ag].[Te] YRXWPCFZBSHSAU-UHFFFAOYSA-N 0.000 claims description 7
- 229910052946 acanthite Inorganic materials 0.000 claims description 7
- CZJCMXPZSYNVLP-UHFFFAOYSA-N antimony zinc Chemical compound [Zn].[Sb] CZJCMXPZSYNVLP-UHFFFAOYSA-N 0.000 claims description 7
- CVXNLQMWLGJQMZ-UHFFFAOYSA-N arsenic zinc Chemical compound [Zn].[As] CVXNLQMWLGJQMZ-UHFFFAOYSA-N 0.000 claims description 7
- KBPGBEFNGHFRQN-UHFFFAOYSA-N bis(selanylidene)tin Chemical compound [Se]=[Sn]=[Se] KBPGBEFNGHFRQN-UHFFFAOYSA-N 0.000 claims description 7
- MPZNMEBSWMRGFG-UHFFFAOYSA-N bismuth indium Chemical compound [In].[Bi] MPZNMEBSWMRGFG-UHFFFAOYSA-N 0.000 claims description 7
- KDSXXMBJKHQCAA-UHFFFAOYSA-N disilver;selenium(2-) Chemical compound [Se-2].[Ag+].[Ag+] KDSXXMBJKHQCAA-UHFFFAOYSA-N 0.000 claims description 7
- 239000008187 granular material Substances 0.000 claims description 7
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 claims description 7
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 claims description 7
- 229910003437 indium oxide Inorganic materials 0.000 claims description 7
- AKUCEXGLFUSJCD-UHFFFAOYSA-N indium(3+);selenium(2-) Chemical compound [Se-2].[Se-2].[Se-2].[In+3].[In+3] AKUCEXGLFUSJCD-UHFFFAOYSA-N 0.000 claims description 7
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 7
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 7
- 229910000464 lead oxide Inorganic materials 0.000 claims description 7
- YTHCQFKNFVSQBC-UHFFFAOYSA-N magnesium silicide Chemical compound [Mg]=[Si]=[Mg] YTHCQFKNFVSQBC-UHFFFAOYSA-N 0.000 claims description 7
- 229910021338 magnesium silicide Inorganic materials 0.000 claims description 7
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims description 7
- HOKBIQDJCNTWST-UHFFFAOYSA-N phosphanylidenezinc;zinc Chemical compound [Zn].[Zn]=P.[Zn]=P HOKBIQDJCNTWST-UHFFFAOYSA-N 0.000 claims description 7
- GGYFMLJDMAMTAB-UHFFFAOYSA-N selanylidenelead Chemical compound [Pb]=[Se] GGYFMLJDMAMTAB-UHFFFAOYSA-N 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- XUARKZBEFFVFRG-UHFFFAOYSA-N silver sulfide Chemical compound [S-2].[Ag+].[Ag+] XUARKZBEFFVFRG-UHFFFAOYSA-N 0.000 claims description 7
- 229940056910 silver sulfide Drugs 0.000 claims description 7
- VDNSGQQAZRMTCI-UHFFFAOYSA-N sulfanylidenegermanium Chemical compound [Ge]=S VDNSGQQAZRMTCI-UHFFFAOYSA-N 0.000 claims description 7
- GKCNVZWZCYIBPR-UHFFFAOYSA-N sulfanylideneindium Chemical compound [In]=S GKCNVZWZCYIBPR-UHFFFAOYSA-N 0.000 claims description 7
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 claims description 7
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 claims description 7
- 239000011787 zinc oxide Substances 0.000 claims description 7
- 229940048462 zinc phosphide Drugs 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000002887 superconductor Substances 0.000 claims description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- 239000004923 Acrylic lacquer Substances 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 4
- 229910002651 NO3 Inorganic materials 0.000 claims description 4
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 229920000180 alkyd Polymers 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000004816 latex Substances 0.000 claims description 4
- 229920000126 latex Polymers 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 229920006305 unsaturated polyester Polymers 0.000 claims description 4
- 239000002966 varnish Substances 0.000 claims description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 44
- 239000010410 layer Substances 0.000 description 19
- 239000003822 epoxy resin Substances 0.000 description 11
- 239000003365 glass fiber Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 10
- 229910052755 nonmetal Inorganic materials 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 235000008429 bread Nutrition 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002905 metal composite material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000003447 ipsilateral effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000004549 pulsed laser deposition Methods 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 230000005676 thermoelectric effect Effects 0.000 description 1
Images
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110140156.6A CN102802346B (zh) | 2011-05-27 | 2011-05-27 | 一种液态金属印刷电路板及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110140156.6A CN102802346B (zh) | 2011-05-27 | 2011-05-27 | 一种液态金属印刷电路板及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102802346A true CN102802346A (zh) | 2012-11-28 |
CN102802346B CN102802346B (zh) | 2015-08-05 |
Family
ID=47201274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110140156.6A Active CN102802346B (zh) | 2011-05-27 | 2011-05-27 | 一种液态金属印刷电路板及其制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102802346B (zh) |
Cited By (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103163197A (zh) * | 2013-03-12 | 2013-06-19 | 西安交通大学 | 一种加工电化学微电极的方法 |
CN103868259A (zh) * | 2012-12-12 | 2014-06-18 | 中国科学院理化技术研究所 | 选择性吸收涂层生产工艺及真空集热器 |
CN104108248A (zh) * | 2013-04-19 | 2014-10-22 | 中国科学院理化技术研究所 | 液态金属喷墨打印设备及打印方法 |
CN104178721A (zh) * | 2013-05-22 | 2014-12-03 | 中国科学院理化技术研究所 | 室温下直接制作导电薄膜的装置及方法 |
CN104425207A (zh) * | 2013-08-20 | 2015-03-18 | 中国科学院理化技术研究所 | 多管芯电子直写式圆珠笔 |
CN105206761A (zh) * | 2015-09-25 | 2015-12-30 | 南方科技大学 | 一种发光二极管及其制备方法 |
CN105611753A (zh) * | 2016-02-24 | 2016-05-25 | 北京梦之墨科技有限公司 | 一种液态金属多层电路制作方法及装置 |
CN105741696A (zh) * | 2016-02-18 | 2016-07-06 | 云南科威液态金属谷研发有限公司 | 一种柔性显示控制装置及制备方法 |
CN105726119A (zh) * | 2016-01-26 | 2016-07-06 | 清华大学 | 一种液态金属浴池式电极电疗装置 |
CN106550547A (zh) * | 2016-10-17 | 2017-03-29 | 北京梦之墨科技有限公司 | 一种印刷电路彩色打印设备、方法及印刷电路 |
CN106580543A (zh) * | 2015-10-19 | 2017-04-26 | 中国科学院理化技术研究所 | 基于液态金属的适形化体表治疗系统 |
CN106817846A (zh) * | 2015-11-30 | 2017-06-09 | 中国科学院理化技术研究所 | 基于3d打印工艺的液态金属立体电路及其制造方法 |
CN107086483A (zh) * | 2017-06-13 | 2017-08-22 | 河南森源电气股份有限公司 | 一种绝缘型金属活门板及其制备方法 |
CN107452434A (zh) * | 2017-07-27 | 2017-12-08 | 深圳大学 | 一种导电粉末‑液态金属液滴及其制备方法与应用 |
CN107545846A (zh) * | 2016-06-28 | 2018-01-05 | 云南科威液态金属谷研发有限公司 | 柔性显示屏 |
CN107557718A (zh) * | 2016-06-24 | 2018-01-09 | 中国科学院理化技术研究所 | 一种在柔性材料表面制备无机纳米材料层的方法 |
CN107643837A (zh) * | 2016-07-20 | 2018-01-30 | 北京梦之墨科技有限公司 | 一种电子电路手写系统、电子电路的手写方法及电子电路 |
CN107834207A (zh) * | 2017-11-28 | 2018-03-23 | 电子科技大学 | 一种汞基温度可调谐电磁超材料及制造方法 |
CN108064120A (zh) * | 2016-11-09 | 2018-05-22 | 中国科学院宁波材料技术与工程研究所 | 一种弹性电路或电极的制备方法以及制备装置 |
CN108449863A (zh) * | 2018-05-07 | 2018-08-24 | 北京梦之墨科技有限公司 | 一种多层电路 |
CN108770222A (zh) * | 2018-06-22 | 2018-11-06 | 北京梦之墨科技有限公司 | 一种低熔点金属的印刷方法 |
CN108909343A (zh) * | 2018-06-08 | 2018-11-30 | 北京梦之墨科技有限公司 | 一种智能图绘及其制作方法 |
CN109246938A (zh) * | 2018-09-21 | 2019-01-18 | 北京梦之墨科技有限公司 | 一种印制电路的打印制备方法及装置 |
CN110108771A (zh) * | 2019-05-13 | 2019-08-09 | 北京镓族科技有限公司 | 液态镓或液态镓基合金作为电极材料的方法和用途 |
US10637074B2 (en) | 2017-07-19 | 2020-04-28 | Microsoft Technology Licensing, Llc | Flexible battery with liquid metal electrode |
CN111134401A (zh) * | 2018-11-02 | 2020-05-12 | 国家纳米科学中心 | 基于液态金属的高弹性的智能衣物、其制备方法及应用 |
CN111534282A (zh) * | 2019-12-16 | 2020-08-14 | 有研工程技术研究院有限公司 | 一种低熔点高体积潜热的相变储热材料及其制备方法和应用 |
WO2020173441A1 (zh) * | 2019-02-26 | 2020-09-03 | 武汉华星光电半导体显示技术有限公司 | 一种折叠屏弯折区走线结构、显示装置及其制造方法 |
CN111812176A (zh) * | 2020-07-09 | 2020-10-23 | 哈尔滨工业大学(深圳) | 一种基于液态金属纳米墨水的柔性生物电极及其制备方法 |
CN111864400A (zh) * | 2020-07-15 | 2020-10-30 | 航天材料及工艺研究所 | 一种新型超材料结构及其制备方法 |
CN112333928A (zh) * | 2020-11-25 | 2021-02-05 | 青岛理工大学 | 一种基于液态金属的柔性电路一体化打印及封装方法 |
CN112449546A (zh) * | 2019-08-27 | 2021-03-05 | 华硕电脑股份有限公司 | 液态金属散热膏涂布方法及散热模块 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101135791A (zh) * | 2006-08-31 | 2008-03-05 | 株式会社半导体能源研究所 | 液晶显示装置 |
CN101189926A (zh) * | 2005-05-30 | 2008-05-28 | 日立化成工业株式会社 | 多层配线板 |
CN101228646A (zh) * | 2005-07-27 | 2008-07-23 | 皇家飞利浦电子股份有限公司 | 制造电元件的方法 |
US20090053400A1 (en) * | 2005-02-23 | 2009-02-26 | La Vega Fernando De | Ink jet printable compositions for preparing electronic devices and patterns |
-
2011
- 2011-05-27 CN CN201110140156.6A patent/CN102802346B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090053400A1 (en) * | 2005-02-23 | 2009-02-26 | La Vega Fernando De | Ink jet printable compositions for preparing electronic devices and patterns |
CN101189926A (zh) * | 2005-05-30 | 2008-05-28 | 日立化成工业株式会社 | 多层配线板 |
CN101228646A (zh) * | 2005-07-27 | 2008-07-23 | 皇家飞利浦电子股份有限公司 | 制造电元件的方法 |
CN101135791A (zh) * | 2006-08-31 | 2008-03-05 | 株式会社半导体能源研究所 | 液晶显示装置 |
Cited By (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103868259A (zh) * | 2012-12-12 | 2014-06-18 | 中国科学院理化技术研究所 | 选择性吸收涂层生产工艺及真空集热器 |
CN103868259B (zh) * | 2012-12-12 | 2016-03-23 | 中国科学院理化技术研究所 | 选择性吸收涂层生产工艺及真空集热器 |
CN103163197A (zh) * | 2013-03-12 | 2013-06-19 | 西安交通大学 | 一种加工电化学微电极的方法 |
CN103163197B (zh) * | 2013-03-12 | 2015-10-28 | 西安交通大学 | 一种加工电化学微电极的方法 |
CN104108248A (zh) * | 2013-04-19 | 2014-10-22 | 中国科学院理化技术研究所 | 液态金属喷墨打印设备及打印方法 |
CN104178721A (zh) * | 2013-05-22 | 2014-12-03 | 中国科学院理化技术研究所 | 室温下直接制作导电薄膜的装置及方法 |
CN104178721B (zh) * | 2013-05-22 | 2016-08-10 | 中国科学院理化技术研究所 | 室温下直接制作导电薄膜的装置及方法 |
CN104425207A (zh) * | 2013-08-20 | 2015-03-18 | 中国科学院理化技术研究所 | 多管芯电子直写式圆珠笔 |
CN105206761A (zh) * | 2015-09-25 | 2015-12-30 | 南方科技大学 | 一种发光二极管及其制备方法 |
CN105206761B (zh) * | 2015-09-25 | 2017-11-17 | 南方科技大学 | 一种发光二极管及其制备方法 |
CN106580543B (zh) * | 2015-10-19 | 2019-09-06 | 中国科学院理化技术研究所 | 基于液态金属的适形化体表治疗系统 |
CN106580543A (zh) * | 2015-10-19 | 2017-04-26 | 中国科学院理化技术研究所 | 基于液态金属的适形化体表治疗系统 |
CN106817846A (zh) * | 2015-11-30 | 2017-06-09 | 中国科学院理化技术研究所 | 基于3d打印工艺的液态金属立体电路及其制造方法 |
CN105726119A (zh) * | 2016-01-26 | 2016-07-06 | 清华大学 | 一种液态金属浴池式电极电疗装置 |
CN105741696A (zh) * | 2016-02-18 | 2016-07-06 | 云南科威液态金属谷研发有限公司 | 一种柔性显示控制装置及制备方法 |
CN105611753B (zh) * | 2016-02-24 | 2018-05-04 | 北京梦之墨科技有限公司 | 一种液态金属多层电路制作方法及装置 |
CN105611753A (zh) * | 2016-02-24 | 2016-05-25 | 北京梦之墨科技有限公司 | 一种液态金属多层电路制作方法及装置 |
CN107557718A (zh) * | 2016-06-24 | 2018-01-09 | 中国科学院理化技术研究所 | 一种在柔性材料表面制备无机纳米材料层的方法 |
CN107545846A (zh) * | 2016-06-28 | 2018-01-05 | 云南科威液态金属谷研发有限公司 | 柔性显示屏 |
CN107643837A (zh) * | 2016-07-20 | 2018-01-30 | 北京梦之墨科技有限公司 | 一种电子电路手写系统、电子电路的手写方法及电子电路 |
CN106550547A (zh) * | 2016-10-17 | 2017-03-29 | 北京梦之墨科技有限公司 | 一种印刷电路彩色打印设备、方法及印刷电路 |
CN108064120A (zh) * | 2016-11-09 | 2018-05-22 | 中国科学院宁波材料技术与工程研究所 | 一种弹性电路或电极的制备方法以及制备装置 |
CN108064120B (zh) * | 2016-11-09 | 2019-11-19 | 中国科学院宁波材料技术与工程研究所 | 一种弹性电路或电极的制备方法以及制备装置 |
CN107086483B (zh) * | 2017-06-13 | 2024-03-26 | 河南森源电气股份有限公司 | 一种绝缘型金属活门板及其制备方法 |
CN107086483A (zh) * | 2017-06-13 | 2017-08-22 | 河南森源电气股份有限公司 | 一种绝缘型金属活门板及其制备方法 |
US10637074B2 (en) | 2017-07-19 | 2020-04-28 | Microsoft Technology Licensing, Llc | Flexible battery with liquid metal electrode |
CN107452434A (zh) * | 2017-07-27 | 2017-12-08 | 深圳大学 | 一种导电粉末‑液态金属液滴及其制备方法与应用 |
CN107834207B (zh) * | 2017-11-28 | 2020-07-31 | 电子科技大学 | 一种汞基温度可调谐电磁超材料及制造方法 |
CN107834207A (zh) * | 2017-11-28 | 2018-03-23 | 电子科技大学 | 一种汞基温度可调谐电磁超材料及制造方法 |
CN108449863A (zh) * | 2018-05-07 | 2018-08-24 | 北京梦之墨科技有限公司 | 一种多层电路 |
CN108909343A (zh) * | 2018-06-08 | 2018-11-30 | 北京梦之墨科技有限公司 | 一种智能图绘及其制作方法 |
CN108909343B (zh) * | 2018-06-08 | 2019-06-07 | 北京梦之墨科技有限公司 | 一种智能图绘及其制作方法 |
CN108770222A (zh) * | 2018-06-22 | 2018-11-06 | 北京梦之墨科技有限公司 | 一种低熔点金属的印刷方法 |
CN109246938A (zh) * | 2018-09-21 | 2019-01-18 | 北京梦之墨科技有限公司 | 一种印制电路的打印制备方法及装置 |
CN109246938B (zh) * | 2018-09-21 | 2019-10-11 | 北京梦之墨科技有限公司 | 一种印制电路的打印制备方法及装置 |
CN111134401A (zh) * | 2018-11-02 | 2020-05-12 | 国家纳米科学中心 | 基于液态金属的高弹性的智能衣物、其制备方法及应用 |
WO2020173441A1 (zh) * | 2019-02-26 | 2020-09-03 | 武汉华星光电半导体显示技术有限公司 | 一种折叠屏弯折区走线结构、显示装置及其制造方法 |
CN110108771A (zh) * | 2019-05-13 | 2019-08-09 | 北京镓族科技有限公司 | 液态镓或液态镓基合金作为电极材料的方法和用途 |
CN112449546A (zh) * | 2019-08-27 | 2021-03-05 | 华硕电脑股份有限公司 | 液态金属散热膏涂布方法及散热模块 |
CN111534282A (zh) * | 2019-12-16 | 2020-08-14 | 有研工程技术研究院有限公司 | 一种低熔点高体积潜热的相变储热材料及其制备方法和应用 |
CN111812176A (zh) * | 2020-07-09 | 2020-10-23 | 哈尔滨工业大学(深圳) | 一种基于液态金属纳米墨水的柔性生物电极及其制备方法 |
CN111864400A (zh) * | 2020-07-15 | 2020-10-30 | 航天材料及工艺研究所 | 一种新型超材料结构及其制备方法 |
CN112333928A (zh) * | 2020-11-25 | 2021-02-05 | 青岛理工大学 | 一种基于液态金属的柔性电路一体化打印及封装方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102802346B (zh) | 2015-08-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102802346B (zh) | 一种液态金属印刷电路板及其制备方法 | |
Tee et al. | Soft electronically functional polymeric composite materials for a flexible and stretchable digital future | |
JP6928114B2 (ja) | 誘電体インク組成物 | |
Jeong et al. | Tape transfer atomization patterning of liquid alloys for microfluidic stretchable wireless power transfer | |
Zhao et al. | A fast and cost-effective transfer printing of liquid metal inks for three-dimensional wiring in flexible electronics | |
Gao et al. | Direct writing of flexible electronics through room temperature liquid metal ink | |
KR102417311B1 (ko) | 가요성 전자 표면을 위한 연신성 상호접속재 | |
CN102318450B (zh) | 印刷电子设备 | |
WO2019055680A1 (en) | LIQUID METAL FUSION WITH INKS AND CONDUCTIVE PASTES | |
US20110201190A1 (en) | Composition for printing a seed layer and process for producing conductor tracks | |
WO2010071858A1 (en) | Inks and coatings containing multi-chain lipids | |
CN104312292B (zh) | 石墨烯/银复合导电油墨的制备方法 | |
CN106082693A (zh) | 一种制备石墨烯透明导电薄膜的方法 | |
CN108305704A (zh) | 一种石墨烯基高导电碳浆及其制备方法 | |
Wang et al. | Printing low-melting-point alloy ink to directly make a solidified circuit or functional device with a heating pen | |
Yao et al. | Multi‐Substrate Liquid Metal Circuits Printing via Superhydrophobic Coating and Adhesive Patterning | |
Cai et al. | Highly-facile template-based selective electroless metallization of micro-and nanopatterns for plastic electronics and plasmonics | |
Zulfiqar et al. | Alternative manufacturing process of 3-dimensional interconnect device using thermoforming process | |
Šakalys et al. | Fabrication of multi-material electronic components applying non-contact printing technologies: A review | |
CN104538087A (zh) | 一种透明导电膜 | |
US20140290988A1 (en) | Patterned conductive polymer with dielectric patch | |
JP2020011502A (ja) | 成形フィルムおよびその製造方法、成形体およびその製造方法 | |
CN107390798B (zh) | 折纸式手机/电脑一体化超柔性设备 | |
US20080102294A1 (en) | Electrically conductive paste and method of making the same | |
Gordon et al. | Advances in conductive inks across multiple applications and deposition platforms |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20121128 Assignee: BEIJING DREAM INK TECHNOLOGIES Co.,Ltd. Assignor: TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY OF THE CHINESE ACADEMY OF SCIENCES Contract record no.: 2016990000417 Denomination of invention: Liquid-metal printed circuit board and preparation method thereof Granted publication date: 20150805 License type: Exclusive License Record date: 20161008 |
|
LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240223 Address after: 100081 room 9009, 9 / F, 65 North Fourth Ring Road West, Haidian District, Beijing Patentee after: BEIJING DREAM INK TECHNOLOGIES Co.,Ltd. Country or region after: China Address before: 100190 No. 2, north of Haidian District, Beijing, Zhongguancun Patentee before: TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY OF THE CHINESE ACADEMY OF SCIENCES Country or region before: China |