CN102801004A - Distributing board - Google Patents
Distributing board Download PDFInfo
- Publication number
- CN102801004A CN102801004A CN2011104358515A CN201110435851A CN102801004A CN 102801004 A CN102801004 A CN 102801004A CN 2011104358515 A CN2011104358515 A CN 2011104358515A CN 201110435851 A CN201110435851 A CN 201110435851A CN 102801004 A CN102801004 A CN 102801004A
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- Prior art keywords
- splicing ear
- distributing board
- mark
- substrate
- row
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
Abstract
The invention provides a distributing board (1) which includes a distributing board substrate (11) and a terminal row (21). The terminal row (21) is arranged on one side of the distributing board substrate (11) to be connected with a connected terminal row (51) of a connected substrate (40). The distributing board (1) is provided with a mark which indicates the position of the terminal row (21) of the distributing board (1) relative to the connected terminal row (51) of the connected substrate (40). The mark is arranged on a specific position on the distributing board (1) on the basis of a specific part (KA) of the terminal row (21). The mark of the distributing board (1) and a part of the connected substrate (40) can be observed.
Description
Technical field
The present invention relates to a kind of have be used for and be connected substrate by the distributing board of splicing ear row connection terminals row.
Background technology
Current, be listed as under the situation about being connected with the splicing ear of other substrate at splicing ear row substrate, connect via the splicing ear row of connector both.But, being accompanied by the miniaturization of electronic equipment, the requirement that both space of coupling part of splicing ear row is reduced uprises.Therefore, shown in japanese kokai publication hei 10-41599 communique, proposed not use connector and method that both splicing ear row are connected.
According to the technology of japanese kokai publication hei 10-41599 communique, is connected with the splicing ear of distributing board row connected substrate by the splicing ear row around form insulating barrier, on this insulating barrier, form and be listed as corresponding groove by splicing ear.In this groove of splicing ear row embedding, thereby confirm that the splicing ear row of distributing board and quilt connect the position between being listed as by splicing ear of substrate with distributing board.
Summary of the invention
The technology of japanese kokai publication hei 10-41599 communique can be applied to splicing ear row and the situation about being connected by the splicing ear row that is connected substrate from the base board end surface protrusion.But this technology can't be applied to the splicing ear that is arranged on the substrate front side is listed as situation connected to one another.
In addition, be listed as under the situation connected to one another at the splicing ear that will be arranged at substrate front side, owing to make the splicing ear row against each other, the operating personnel can only observe the back side of splicing ear row.Therefore, the operating personnel can't observe the splicing ear row, so be difficult to confirm splicing ear row position each other.
The present invention proposes in view of above-mentioned actual conditions, and its purpose is, a kind of distributing board is provided, and it can confirm easily that splicing ear is listed as with respect to connected the position that is listed as by splicing ear of substrate.
Below, record is used to realize the method and the action effect thereof of above-mentioned purpose.
(1) according to an example of the present invention; Distributing board has distributing board substrate and splicing ear row, and said splicing ear row are formed on the face of said distributing board substrate, constitutes and be connected being listed as by splicing ear of substrate to connect; This distributing board is characterised in that; Said distributing board also has the splicing ear that is used for definite said distributing board and is listed as the mark that is connected the position that is listed as by splicing ear of substrate with respect to said, and said mark is arranged on the specific location on the said distributing board that the specific part that is listed as with said splicing ear is the benchmark setting, and said distributing board constitutes; Can observe this mark, and a said part that is connected substrate.
In the case, owing to can observe mark, and the ad-hoc location that is connected substrate, so can make the mark of distributing board consistent with the ad-hoc location that is connected substrate.Therefore; The position by between splicing ear row and the ad-hoc location being connected substrate concerns; Under the situation identical with the position relation between the mark with the splicing ear row of distributing board; Mark through making distributing board is consistent with the ad-hoc location that is connected substrate, thereby can splicing ear be listed as with respect to be listed as by splicing ear the configuration location with regulation.In addition; Owing to can observe the mark and the ad-hoc location that is connected substrate of distributing board; Even so, also can splicing ear be listed as with respect to being listed as the location by splicing ear at the splicing ear row that can't observe distributing board and under by the situation about being listed as of connection substrate by splicing ear.
(2) according to other example of the present invention, also can make said splicing ear row have a plurality of splicing ears, said mark is at least 1 splicing ear in said a plurality of splicing ear, the perhaps part of said at least 1 splicing ear.
In the case, because with splicing ear or its a part of mark, so need not utilize printing or laser beam marking etc. on distributing board, to form new mark as location usefulness.Therefore, the operation that forms mark can be omitted, therefore, the manufacturing process of distributing board can be simplified.In addition, owing to need not guarantee to form the space of mark, so can dwindle distributing board.
(3), said distributing board is had according to other example of the present invention: main part, it has a plurality of distributions that extend to said splicing ear row; And connecting portion, it has said splicing ear row, and said distributing board substrate has: 2 the 1st submounts, the said distribution of its clamping and constitute said main part; And the 2nd submounts, its back side to said splicing ear row is supported and is constituted said connecting portion, and said the 2nd submounts constitutes, and can have an X-rayed to observe through the 2nd submounts saidly to be connected substrate.
In the case, because the 2nd submounts is transparent, so can splicing ear be used as the mark that is used to locate.Owing to can with the acting splicing ear that serves as a mark be benchmark observe connected substrate by splicing ear; So, position thereby can the splicing ear of distributing board be listed as with respect to connected being listed as of substrate by splicing ear through making splicing ear and being connected the consistent of substrate by splicing ear.
(4) according to other example of the present invention, said distributing board substrate is constituted, can have an X-rayed through this distributing board substrate and observe the said substrate that connected.
In the case, because the substrate of distributing board is transparent, thus can regard mark as benchmark, and can observe the ad-hoc location that is connected substrate.Thus, can make this mark of distributing board and be connected the ad-hoc location of substrate consistent, the splicing ear of distributing board be listed as with respect to connected being listed as by splicing ear of substrate positioning.
(5) according to other example of the present invention, said mark also can be the through hole that runs through said distributing board substrate.
In the case, owing to be labeled as through hole, can observe the ad-hoc location that is connected substrate through this through hole.Thus, can make this mark of distributing board and be connected the ad-hoc location of substrate consistent, the splicing ear of distributing board be listed as with respect to connected being listed as by splicing ear of substrate positioning.
(6) according to other example of the present invention, said mark also can be arranged on the otch on the end of said distributing board substrate.
In the case, owing to be labeled as otch, can observe the ad-hoc location that is connected substrate through this otch.Thus, can make this mark of distributing board and be connected the ad-hoc location of substrate consistent, the splicing ear of distributing board be listed as with respect to connected being listed as by splicing ear of substrate positioning.
(7) according to other example of the present invention, said mark is constituted, confirm this mark and said by the permissible range of the alternate position spike between the ad-hoc location of connection substrate.
Whether the alternate position spike that in the case, can observe the mark of distributing board and connected between the substrate is in the permissible range.Thus, can easily judge the splicing ear row and the position relation that whether is in regulation by the splicing ear row that is connected substrate of distributing board.
In addition, under the situation that splicing ear is served as a mark, preferably this splicing ear is the size of same degree with what be connected substrate by splicing ear, but also can be made as more bigger than another with one.Splicing ear than little situation by splicing ear under, to connected substrate by splicing ear on during this splicing ear of configuration, can observation place alignment scope.On the contrary; This splicing ear than the big situation that is connected substrate by splicing ear under; To connected substrate by splicing ear on during this splicing ear of configuration; Be blocked if connect the integral body by splicing ear of substrate, the alternate position spike that then is judged to be between distributing board and the quilt connection substrate is in the permissible range.
(8), said splicing ear row are had: a plurality of splicing ears according to other example of the present invention; The conduction articulamentum, it is configured on the upper surface of said each splicing ear, and is formed by the electroconductive resin that comprises conductive particle; And insulating barrier, it is configured in the said splicing ear between 1 pair at least, and splicing ear is insulated from each other, and said insulating barrier is formed by insulating adhesive.
In the case, with the splicing ear of distributing board row with is connected substrate by the connection of splicing ear row the time, insulating barrier is with bonding in the part that is connected between being listed as by splicing ear of substrate.That is, the splicing ear of distributing board row with is connected the be listed as by splicing ear of substrate via the electrical connection of conduction articulamentum, and distributing board is connected substrate, and to pass through insulating adhesive bonding with quilt.Therefore, be connected substrate with distributing board with quilt and do not compared, can be increased the intensity that distributing board and quilt connect the coupling part between the substrate through the bonding situation of insulating adhesive.
(9) according to other example of the present invention, also can make said distributing board have stiffener, this stiffener is arranged on the connecting portion with said splicing ear row, and this connecting portion is strengthened, and said stiffener is provided with said mark.
In the case, utilize stiffener that the splicing ear row are strengthened.In addition, owing on this stiffener, be formed with mark, can improve the positional precision of mark with respect to the reference position of splicing ear row.
(10), also can make said stiffener on the position corresponding, have heating and use the hole with said splicing ear row according to other example of the present invention.
In the case,, stiffener uses the hole, so when the splicing ear row are heated, can the part that is provided with the splicing ear row not heated via stiffener because having heating.Therefore, the situation that is reinforced the plate covering with the part that is provided with the splicing ear row is compared, and can the splicing ear row promptly be heated to set point of temperature.
(11), also can said being marked on the diverse location that the specific part that is listed as with said splicing ear is the benchmark setting be provided with 2 according to other example of the present invention.
In the case; Through making 2 marks consistent with pairing ad-hoc location respectively by the connection substrate; Thereby can make the terminal board column direction and the terminal board column direction unanimity that is listed as by splicing ear that is connected substrate of the splicing ear row of distributing board, both are positioned.
Description of drawings
Fig. 1 is the distributing board to execution mode of the present invention, and the oblique view of the part of connecting portion is shown.
Fig. 2 is the vertical view at the back side of the distributing board of expression execution mode of the present invention.
Fig. 3 is the distributing board of expression execution mode of the present invention and the sketch map that is connected the method for attachment between the substrate.
Fig. 4 is expression to the distributing board of execution mode of the present invention and is connected the vertical view of situation about confirming the position between the substrate.
Fig. 5 is the distributing board of expression execution mode of the present invention and the sketch map that is connected the adhering method between the substrate.
Fig. 6 is the 1st variation to execution mode of the present invention, and the vertical view of the situation that the position between this distributing board and the quilt connection substrate is confirmed is shown.
Fig. 7 is the 2nd variation to execution mode of the present invention, and the vertical view of the situation that the position between this distributing board and the quilt connection substrate is confirmed is shown.
Fig. 8 is the 3rd variation to execution mode of the present invention, and the vertical view of the situation that the position between this distributing board and the quilt connection substrate is confirmed is shown.
Fig. 9 is the 4th variation to execution mode of the present invention, and the oblique view of the part of connecting portion is shown.
Figure 10 is the distributing board to the 4th variation, and the figure that is in the product in the manufacture process is shown.
Figure 11 is the distributing board to the 4th variation, and the figure that is in the product in the manufacture process is shown.
Figure 12 is the oblique view of a variation of expression execution mode of the present invention.
Embodiment
With reference to Fig. 1～Fig. 5, the execution mode that distributing board of the present invention is specialized is described.
Like Fig. 1 and shown in Figure 2, the connecting portion 20 that distributing board 1 comprises main part 10 and is arranged on the leading section of main part 10.Connecting portion 20 be connected being connected of substrate 40 by connecting portion 50.
Distributing board substrate 11 is transparent.Specifically, the transparency of distributing board substrate 11 does, can have an X-rayed and observes and connected substrate 40.In addition, the bonding agent of formation bond layer 13 is transparent after sclerosis.Specifically, the transparency of bonding agent does, after adhesive hardens, can have an X-rayed and observes and connected substrate 40.That is, owing to have transparent distributing board substrate 11 and transparent bond layer 13, so distributing board 1 is transparent, and then distributing board 1 has when the one side side is observed, and can have an X-rayed and observes the structure of the parts that are disposed at the another side side.
As distributing board substrate 11, for example can enumerate thickness is the insulative resin thin plate of the PET of 12 μ m.Bond layer 13 applies the thickness of 30 μ m on distributing board substrate 11 polyesters bonding agent forms.As Wiring pattern 12, for example can enumerate thickness is the Copper Foil line of 35 μ m.
Connecting portion 20 comprises: the 20A of basic courses department; Splicing ear 22, it is configured in the upper surface of the 20A of basic courses department; Conduction articulamentum 23, it is formed on the upper surface of each splicing ear 22; Insulating barrier 24, it is configured between the adjacent splicing ear 22; And stiffener 26, it is strengthened this connecting portion 20.The 20A of basic courses department comprises part that forms through distributing board substrate 11 prolongations that make main part 10 and the part that forms through bond layer 13 prolongations that make main part 10.Below, the length direction note of splicing ear 22 is made distribution direction YA.To make terminal board column direction XA with distribution direction YA quadrature and along the direction note of the face of distributing board 1.
Splicing ear 22 forms through Wiring pattern 12 is prolonged.Splicing ear 22 is parallel and arrange with equal intervals, constitutes splicing ear row 21.The interval D A of the center line of adjacent splicing ear 22 is 0.5mm or 0.3～1.0mm.Distance between the side of adjacent splicing ear 22 (below be called " terminal pitch from DB ") is 0.2mm or 0.15～0.3mm.In addition, each splicing ear 22 is configured on the bond layer 13 that is laminated on the distributing board substrate 11.The bottom of splicing ear 22 is imbedded in the bond layer 13.
Insulating barrier 24 is configured on the bond layer 13.The height of the upper surface of insulating barrier 24 is a datum level 25 with the upper surface of distributing board substrate 11, is arranged on the higher position, position than the upper surface of conduction articulamentum 23.Step HA between insulating barrier 24 and the conduction articulamentum 23 is provided with than being connected the high by the height of splicing ear 52 of substrate 40.In addition, the end face distance WA between the insulating barrier 24 adjacent one another are is set to, and is identical or bigger than this length with the length by the Width of splicing ear 52 that is connected substrate 40.
As the insulating adhesive that forms insulating barrier 24, can enumerate for example polyesters hot-melt adhesive.The melt temperature of insulating barrier 24 for example is preferably 120 ℃～150 ℃.Be lower than in the melt temperature of insulating barrier 24 under 120 ℃ the situation, possibly make distributing board 1 and the adhesive strength that connected between the substrate 40 reduces.The melt temperature of insulating barrier 24 greater than 150 ℃ situation under, possibly make 11 distortion of distributing board substrate, or the bonding force between distributing board substrate 11 and the bond layer 13 is reduced.
In addition, shown in figure 12, distributing board 1 can not have main part yet and only has connecting portion 20.Arranged spaced Wiring pattern 12 to stipulate on distributing board substrate 11, and utilize bond layer 13 bonding.In the case, Wiring pattern 12 only is made up of splicing ear 22.The identical ground of mode with shown in Figure 1 is configured in insulating barrier 24 on the bond layer 13, and conduction articulamentum 23 is formed on the upper surface of splicing ear 22.Also can go up configuration stiffener 26, in addition, also can not be configured at the lower surface (face opposite) of distributing board substrate 11 with the face that disposes Wiring pattern 12.In the case, shown in figure 12, distributing board 1 can be connected as the flat cable 440 that is convex shape by the acting multiple conducting wires 452 of splicing ear.
In addition, as shown in Figure 2, on the position corresponding of stiffener 26, be formed with heating with hole 30 with splicing ear row 21.Heating uses hole 30 to be general square shape.Heating is extended with the direction of the length direction quadrature of splicing ear 22 with the upper limb 31 and lower edge 32 edges in hole 30.Heat the left side that is configured in splicing ear row 21 with the left border 33 in hole 30, extend along distribution direction YA.Heat the right side that is configured in splicing ear row 21 with the right border 34 in hole 30, extend along distribution direction YA.
In addition, right-hand member and the left end at connecting portion 20 is provided with the 1st mark 27 and the 2nd mark 28.The 1st mark 27 and the 2nd mark 28 with the splicing ear row 21 of distributing board 1 when being connected being connected of substrate 40 by splicing ear row 51, make splicing ear 22 and used as being used to by the benchmark of the aligned in position between the splicing ear row 51.The 1st mark 27 and the 2nd mark 28 are provided with through laser-marking device or ink jet printing, punching press printing, punch mark shaping etc.
Below, in Fig. 3, with the intersection point between the front-end edge of right side ora terminalis that is configured in rightmost splicing ear 22 and distributing board 1, note acts on initial point (reference position) KA of the position of regulation the 1st mark 27.In addition, will make the X axle, will make the Y axle through initial point KA and along the axis note that distribution direction Y extends through this initial point KA and along the axis note that terminal board column direction X extends.To be configured in rightmost splicing ear 22 notes and make reference terminal 22K.
In Fig. 2, the 1st mark 27 is set in place and in splicing ear row 21, is configured in rightmost splicing ear 22 right sides and has on the part of stiffener 26.The 1st mark 27 is a cross.The central point of the 1st mark 27 be configured in coordinate (X1, Y1) on.
In Fig. 2, the 2nd mark 28 is set in place and in splicing ear row 21, is configured in leftmost splicing ear 22 left sides and has on the part of stiffener 26.The 2nd mark 28 is a cross.The central point of the 2nd mark 28 be configured in coordinate (X2, Y1) on.
With reference to Fig. 3, the substrate 40 that connected that is connected with distributing board 1 is described.
Being connected substrate 40 comprises: base plate 41, and it is by the glass epoxy resin manufacturing; And by connecting portion 50, it is configured on the face of base plate 41.
By connecting portion 50 have by a plurality of by splicing ear 52 constitute by splicing ear row 51.Adjacent identical with the interval of adjacent splicing ear 22 by the interval of splicing ear 52.Below, will be made distribution direction YB by the length direction of splicing ear 52 note.In addition, will make terminal board column direction XB with distribution direction YB quadrature and along the direction note of the face of base plate 41.
Be provided with the 3rd mark 53 and the 4th mark 54 by the right-hand member of connecting portion 50 and left end.The 3rd mark 53 and the 4th mark 54 use as being used to make by the benchmark of the aligned in position between splicing ear row 51 and the splicing ear 22 in the time will being connected being connected with the splicing ear row 21 of distributing board 1 by splicing ear row 51 of substrate 40.
In Fig. 3, will be connected with reference terminal 22K by the upper right summit of splicing ear (below be called " benchmark is by splicing ear 52K "), note acts on initial point (reference position) KB of the position of regulation the 3rd mark 53.In addition, will make the X axle, will make the Y axle through initial point KB and along the axis note that distribution direction YB extends through this initial point KB and along the axis note that terminal board column direction XB extends.
In Fig. 3, the 3rd mark 53 be arranged on be disposed in the splicing ear row 51 rightmost by the right of splicing ear 52.The 3rd mark 53 is a cross.The central point of the 3rd mark 53 be configured in coordinate (X1, Y1) on.
In Fig. 3, the 4th mark 54 be arranged on be disposed in the splicing ear row 51 leftmost by the left side of splicing ear 52.The 4th mark 54 is a cross.The central point of the 4th mark 54 be configured in coordinate (X2, Y1) on.
With reference to Fig. 3 and Fig. 4, describe to distributing board 1 with by the localization method between the connection substrate 40.
At first, what will be connected substrate 40 has by the face of splicing ear 52 towards the top, will be connected substrate 40 and be fixed on the base 61.Connected substrate 40 with distributing board 1 is connected substrate 40 connections with quilt after, can easily be fixed from the state of base 61 dismountings.For example, it is temporary fixed to utilize splicing tape that base 61 and quilt are connected substrate 40.Perhaps also can use magnet to be connected substrate 40 and be fixed on the base 61 with ferromagnetism bodies such as iron as base 61.
Then, with distributing board 1 have facing downwards of splicing ear 22, confirm distributing board 1 with respect to the position that is connected substrate 40.Specifically, at first, with the connecting portion 20 of distributing board 1 be connected being overlapped of substrate 40 by connecting portion 50.Then, make the center of the 1st mark 27 consistent, and make the center of the 2nd mark 28 consistent, thereby confirm distributing board 1 with respect to the position that is connected substrate 40 with the center of the 4th mark 54 with the center of the 3rd mark 53.The preferred orientation operation uses microscope to carry out, so that the alternate position spike between the center of the center of alternate position spike between the center of the center of the 1st mark 27 and the 3rd mark 53 and the 2nd mark 28 and the 4th mark 54 is in the prescribed limit (below be called " permissible range ").For example, be under the situation of 0.2mm in terminal pitch from DB, the permissible range of alternate position spike is set at ± 0.05mm.
The 1st mark 27 and the 2nd mark 28 are arranged on the position of regulation coordinate that ad-hoc location with reference terminal 22K is initial point KA.It is on the position of regulation coordinate of initial point KB by the ad-hoc location of splicing ear 52K that the 3rd mark 53 and the 4th mark 54 are arranged on benchmark.In addition, the coordinate of the 1st mark 27 is identical with the coordinate of the 3rd mark 53, and the coordinate of the 2nd mark 28 is identical with the coordinate of the 4th mark 54.Utilize this relation, with the splicing ear row 21 of distributing board 1 be connected substrate 40 by splicing ear row 51 location accurately each other.
At distributing board 1 when being connected substrate 40 and being overlapped, the conduction articulamentum 23 of splicing ear 22 and with these splicing ear 22 corresponding being contacted with each other by splicing ear row 51, and insulating barrier 24 embeddings are by between the splicing ear 52.
With reference to Fig. 5, describe to distributing board 1 with by the adhering method between the connection substrate 40.
At distributing board 1 with after being connected position between the substrate 40 and confirming, with the heating part 71 of heater 70 be pressed in the heating of stiffener 26 with on the corresponding part in hole 30, the splicing ear row 21 of distributing board 1 are heated.At this moment, through making a part of fusion of insulating barrier 24, thereby with the insulating barrier 24 of distributing board 1 be positioned at by the part of 52 of splicing ears bonding.
According to this execution mode, has following effect.
(1) in this execution mode, be on the preferred coordinates set of benchmark at ad-hoc location (initial point KA) with reference terminal 22K, be provided with the 1st mark 27.The splicing ear row 21 that the 1st mark 27 is used for confirming distributing board 1 with respect to connected substrate 40 by the position of splicing ear row 51.Be arranged on the 3rd mark 53 on the ad-hoc location that is connected substrate 40, can see through distributing board substrate 11 and be observed with the 1st mark 27.
According to this structure; Owing to regard the 1st mark as benchmark; And can see through distributing board substrate 11 and observe the 3rd mark 53 that is connected substrate 40; So can be so that the mode of the 1st mark 27 of distributing board 1 and the position consistency of the 3rd mark 53 that is connected substrate 40, configuration distributing board 1 and be connected substrate 40.
In addition, in this structure, the 3rd mark 53 is with respect to being connected being concerned by the position of splicing ear row 51 of substrate 40, and is identical with respect to the position relation of the splicing ear row 21 of distributing board 1 with the 1st mark 27.Therefore, through the position consistency of the 1st mark 27 that makes distributing board 1 and the 3rd mark 53 that is connected substrate 40, thereby configuration that can be according to the rules confirms that splicing ear row 21 are with respect to by the position of splicing ear row 51.
In addition; Owing to can observe the 1st mark 27 and the 3rd mark 53 that is connected substrate 40 of distributing board 1; Even so the splicing ear row 21 that can't observe distributing board 1 and connected substrate 40 by the situation of splicing ear row 51 under, can confirm that also splicing ear row 21 are with respect to by the position of splicing ear row 51.
(2) in this execution mode, distributing board substrate 11 is transparent, can have an X-rayed and observes the 1st mark 27 and be connected substrate 40.According to this structure, can see through the substrate 11 of distributing board 1, be labeled as benchmark, the 3rd mark 53 of observation quilt connection substrate 40 with the 1st.Thus, can make the position consistency of the 1st mark 27 with the 3rd mark 53 that is connected substrate 40 of distributing board 1, thereby the splicing ear row 21 of confirming distributing board 1 are with respect to by the position of splicing ear row 51.
(3) in this execution mode, on the upper surface of each splicing ear 22 that constitutes splicing ear row 21, be provided with the conduction articulamentum 23 that forms by the silver paste that contains silver powder.In addition, between splicing ear 22, be provided with the insulating barrier 24 that splicing ear 22 is insulated from each other.Insulating barrier 24 is formed by hot-melt adhesive.
According to this structure, with the splicing ear row 21 of distributing board 1 when being connected being connected of substrate 40 by splicing ear row 51, insulating barrier 24 is with bonding in the part by between the splicing ear 52 by splicing ear row 51 that is connected substrate 40.That is, the splicing ear row 21 of distributing board 1 be connected being electrically connected via conduction articulamentum 23 of substrate 40 by splicing ear row 51.In addition, distributing board 1 with utilized hot-melt adhesive bonding by being connected substrate 40.Through utilizing hot-melt adhesive, thereby can increase distributing board 1 and by the intensity of the connecting portion between the connection substrate 40 with distributing board 1 with by to be connected substrate 40 bonding.
(4) in this execution mode, on the connecting portion with splicing ear row 21 20, be provided with the stiffener 26 that connecting portion 20 is strengthened.In addition, connecting portion 20 is provided with the 1st mark 27.
According to this structure, utilize 26 pairs of splicing ear row 21 of stiffener to strengthen.In addition, because this stiffener 26 is provided with the 1st mark 27, so can improve the positional precision of the 1st mark 27 with respect to the reference position (initial point KA) of splicing ear row 21.
(5) in this execution mode, heat with hole 30 being provided with of stiffener 26 with splicing ear row 21 corresponding part places.According to this structure, when splicing ear row 21 are heated, can the part with splicing ear row 21 not heated via stiffener 26.Therefore, the situation that is reinforced plate 26 coverings with the part with splicing ear row 21 is compared, and can splicing ear row 21 be heated to set point of temperature rapidly.
(6) in this execution mode, the 1st mark 27 and the 2nd mark 28 are benchmark with the specific part of splicing ear row 21, are arranged on the different positions.According to this structure; Through making the 1st mark 27 consistent with the 3rd mark 53 that is connected substrate 40; And make the 2nd mark 28 consistent with the 4th mark 54 that is connected substrate 40; Thereby can with the terminal board column direction XA of the splicing ear row 21 of distributing board 1 with by the consistent mode of terminal board column direction XB of splicing ear row 51, confirm splicing ear row 21 and by the position between the splicing ear row 51.
< the 1st variation >
With reference to Fig. 6, the variation of distributing board 1 with respect to the locating structure that is connected substrate 40 described.
The distributing board 1 of the 1st variation structure with above-mentioned execution mode in the following areas is different.That is, in the above-described embodiment, so that the center of the 1st mark 27 is consistent with the center of the 3rd mark 53, the mode that the center of the 2nd mark 28 is consistent with the center of the 4th mark 54 is confirmed distributing board 1 and the position that is connected substrate 40.Relative therewith, in the 1st variation, the 1st mark 127 has makes the 3rd mark 153 get into its inboard shape.The relation of the 2nd mark and the 4th mark is identical with the relation of the 1st mark 127 and the 3rd mark 153.Below, the detailed change with respect to the structure of above-mentioned execution mode in the 1st variation is described.For with the general structure of above-mentioned execution mode, mark identical label, omit its explanation.
In Fig. 6, the 1st mark 127 of distributing board 1 is formed on splicing ear 22 right sides of the right-hand member that is positioned at splicing ear row 21 and has on the part of stiffener 26.The 1st mark 127 is for having the ring-type of regulation internal diameter.
On the other hand, the 3rd mark 153 is circular, and this circular diameter is littler than the internal diameter of the 1st mark 127.For example, the difference between the diameter of the internal diameter of the 1st mark 127 and the 3rd mark 153 is set at 0.1mm.That is, when in the 1st mark 127, having the 3rd mark 153, the alternate position spike between the center of the center of the 1st mark 127 and the 3rd mark 153 is in ± 0.05mm in.
The splicing ear row 21 of confirming distributing board 1 and connected substrate 40 by the position between the splicing ear row 51 time so that the mode that the 3rd mark 153 gets into the inboard of the 1st mark 127, and confirm distributing board 1 and connected the position between the substrate 40.Whether the alternate position spike that can easily observe between the 1st mark 127 and the 3rd mark 153 thus, is in the permissible range.
According to the 1st variation, except the effect of above-mentioned (1)～(6), can realize the following action effect.
(7) in the 1st variation, the 1st mark 127 constitutes, and confirms the 1st mark 127 of distributing board 1 and is connected the permissible range of the alternate position spike between the 3rd mark 153 of substrate 40.According to this structure, can observe the 1st mark 127 of distributing board 1 and whether the alternate position spike that connected between the 3rd mark 153 of substrate 40 is in the permissible range.Thus, can easily judge with the position relation that whether is had regulation by splicing ear row 51 that is connected substrate 40 the splicing ear row 21 of distributing board 1.
< the 2nd variation >
With reference to Fig. 7, explain that distributing board 1 connects the variation of the locating structure of substrate 40 with respect to quilt.
The distributing board 1 of the 2nd variation structure with above-mentioned execution mode in the following areas is different.That is, in the above-described embodiment, so that the mode that the center of the 1st mark 27 is consistent with the center of the 3rd mark 53 and the center of the 2nd mark 28 is consistent with the center of the 4th mark 54 is confirmed distributing board 1 and the position that is connected substrate 40.Relative therewith, in the 2nd variation, the 1st mark 227 has makes the 3rd mark 253 get into its inboard shape.The relation of the 2nd mark and the 4th mark is identical with the relation of the 1st mark 227 and the 3rd mark 253.Below, the detailed change with respect to the structure of above-mentioned execution mode in the 2nd variation is described.For with the general structure of above-mentioned execution mode, mark identical label, omit its explanation.
In Fig. 7, the 1st mark 227 of distributing board 1 is formed on splicing ear 22 right sides of the right-hand member that is positioned at splicing ear row 21 and has on the part of stiffener 26.The 1st mark 227 is for having the through hole of regulation internal diameter.
On the other hand, the 3rd mark 253 is circular, and this circular diameter is littler than the internal diameter of the 1st mark 227.For example, the difference between the diameter of the diameter of the 1st mark 227 and the 3rd mark 253 is set at 0.1mm.That is, when in the 1st mark 227, having the 3rd mark 253, the alternate position spike between the center of the center of the 1st mark 227 and the 3rd mark 253 is in ± 0.05mm in.
The splicing ear row 21 of confirming distributing board 1 and connected substrate 40 by the position between the splicing ear row 51 time; Identical ground with the 1st variation; So that the mode that the 3rd mark 253 gets into the inboard of the 1st mark 227 is confirmed distributing board 1 and is connected the position between the substrate 40.Whether the alternate position spike that can easily observe between the 1st mark 227 and the 3rd mark 253 thus, is in the permissible range.
According to the 2nd variation, the 1st mark 227 forms as through hole.Therefore, need not make distributing board substrate 11 and bond layer 13 for transparent.Therefore, distributing board substrate 11 and bond layer 13 can be by coloured material manufacture.
According to the 2nd variation, except the effect of above-mentioned (1)～(7), can realize the following action effect.
(8) in the 2nd variation, the 1st mark 227 forms as running through the through hole of distributing board substrate 11.According to this structure, can observe the 3rd mark 253 that is connected substrate 40 through through hole.Thus, can make the position consistency of the 1st mark 227 with the 3rd mark 253 that is connected substrate 40 of distributing board 1, thus the splicing ear row 21 of confirming distributing board 1 with respect to connected substrate 40 by the position of splicing ear row 51.
< the 3rd variation >
With reference to Fig. 8, explain that distributing board 1 connects the variation of the locating structure of substrate 40 with respect to quilt.
The distributing board 1 of the 3rd variation structure with the 2nd variation in the following areas is different.That is, in the 2nd variation, the 1st mark 227 forms as through hole.Relative therewith, in the 3rd variation, the 1st mark 327 forms as otch.The relation of the 2nd mark and the 4th mark is identical with the relation of the 1st mark 327 and the 3rd mark 353.Below, the detailed change with respect to the structure of above-mentioned execution mode in the 3rd variation is described.For with the general structure of above-mentioned execution mode, mark identical label, omit its explanation.
In Fig. 8, the 1st mark 327 of distributing board 1 is to cut through the part with the right-hand member of connecting portion 20 to form.The 1st mark 327 be shaped as rectangle.Utilize diel and form as the otch of the 1st mark 327.
On the other hand, the 3rd mark 353 is a rectangle, and is littler than the 1st mark 327.For example, the 1st mark 327 is 0.1mm along the length of terminal board column direction XA and the difference along between the length of terminal board column direction XB of the 3rd mark 353.In addition, the 1st mark 327 is 0.1mm along the length of distribution direction YA and the difference along between the length of distribution direction YB of the 3rd mark 353.That is, when in the 1st mark 327, having the 3rd mark 353, the alternate position spike between the center of the center of the 1st mark 327 (intersection of diagonal) and the 3rd mark 353 is in ± 0.05mm in.
The splicing ear row 21 of confirming distributing board 1 and connected substrate 40 by the position between the splicing ear row 51 time; Identical ground with the 1st variation; So that the mode that the 3rd mark 353 gets into the inboard of the 1st mark 327 is confirmed distributing board 1 and is connected the position between the substrate 40.Whether the alternate position spike that can easily observe between the 1st mark 327 and the 3rd mark 353 thus, is in the permissible range.
According to the 3rd variation, the 1st mark 327 forms as otch.Therefore, need not make distributing board substrate 11 and bond layer 13 for transparent.Therefore, distributing board substrate 11 and bond layer 13 can be by coloured material manufacture.
According to the 3rd variation, except the effect of above-mentioned (1)～(7), can realize the following action effect.
(9) in the 3rd variation, the 1st mark 327 forms as the otch of the end that is arranged on distributing board substrate 11.According to this structure, can observe the 3rd mark 353 that is connected substrate 40 through otch.Thus, can make the position consistency of the 1st mark 327 with the 3rd mark 353 that is connected substrate 40 of distributing board 1, thus the splicing ear row 21 of confirming distributing board 1 with respect to connected substrate 40 by the position of splicing ear row 51.
< the 4th variation >
With reference to Fig. 9, explain that distributing board 1 connects the variation of the locating structure of substrate 40 with respect to quilt.
In the distributing board 1 of execution mode shown in Figure 3, on connecting portion 20, be formed with the 1st mark 27 and the 2nd mark 28.Relative therewith, in the 4th variation shown in Figure 9, with 2 splicing ears 22 as the 1st mark and the 2nd mark and use.In the case, as the 3rd mark that is consistent with the 1st mark, promptly connected substrate 40 by the mark on the connecting portion 50, use be connected with splicing ear 22 as the 1st mark by splicing ear 52.Identical ground, as the 4th mark that is consistent with the 2nd mark, promptly connected substrate 40 by the mark of connecting portion 50 sides, use be connected with splicing ear 22 as the 2nd mark by splicing ear 52.Below, the detailed change with respect to the structure of above-mentioned execution mode in the 4th variation is described.For with the general structure of above-mentioned execution mode, mark identical label, omit its explanation.
As the 1st submounts 111, for example can enumerating, thickness is the insulative resin thin plate of the PET of 12 μ m.In the above-mentioned execution mode of enumerating at first, used transparent distributing board substrate 11, but in this variation, can use opaque substrate as the 1st submounts 111.
End on the extending direction of Wiring pattern 12 of 111 pairs of the 1st submounts, the part that promptly constitutes the part of connecting portion 20 cover.The 2nd submounts 120 directly sticks on the connecting portion 20.
The 2nd submounts 120 has: the 2nd submounts main body 121, and it has rigidity; And bond layer 122, it is bonded on the splicing ear 22.Bond layer 122 is coated on the face of the 2nd submounts main body 121.Bond layer 122 is transparent, even and be heated and also keep transparent state.The 2nd submounts main body 121 also is transparent, is formed by the insulative resin thin plate of the PET of the thickness with 50～150 μ m.
The 2nd submounts 120 is bonded on the splicing ear row 21 via bond layer 122.The 2nd submounts 120 works as the stiffener that suppresses splicing ear 22 distortion.The 1st submounts 111 is equivalent to the distributing board substrate 11 of above-mentioned execution mode.The 2nd submounts 120 is equivalent to the stiffener 26 of above-mentioned execution mode.
The shape of the 2nd submounts 120 is constrained not.In the 4th variation, make the front end of splicing ear 22 consistent with the ora terminalis of the 2nd submounts 120.Also can replace,, form the 2nd submounts 120 so that the ora terminalis of the 2nd submounts 120 is positioned at the mode on the extended line of front end of splicing ear 22.
The structure of connecting portion 20 is identical with the structure of the connecting portion 20 of initial execution mode.That is, on the upper surface of splicing ear 22, be formed with conduction articulamentum 23.Between adjacent splicing ear 22, be formed with insulating barrier 24.
The splicing ear row 21 of distributing board 1 be connected being confirmed in the following manner of substrate 40 by the position of splicing ear row 51.
The splicing ear 22 at the two ends of splicing ear row 21 is respectively as the 1st mark and the 2nd mark and use.To being confirmed as the splicing ear 22 of the 1st mark and an end that is connected substrate 40 by splicing ear 52 (the 3rd mark); Make this splicing ear 22 and by the position consistency of splicing ear 52; And to as being confirmed of the splicing ear 22 of the 2nd mark and the other end that is connected substrate 40, make this splicing ear 22 and by the position consistency of splicing ear 52 by splicing ear 52 (the 4th mark).At this moment, also can be from distributing board 1 to being connected substrate 40 irradiates lights, be clear that connected substrate 40 by splicing ear row 51.
In addition, make splicing ear 22 and during by the position consistency of splicing ear 52, also can as shown in following with the ora terminalis of splicing ear 22 as benchmark.About this location, describe with reference to Fig. 3.Though distributing board 1 shown in Figure 3 is different with the distributing board 1 of this 4th variation, the array structure of the splicing ear 22 of the distributing board 1 of the array structure of splicing ear 22 and the 4th variation is identical.Therefore, make splicing ear 22 and the explanation of location during by splicing ear 52 position consistency in, use Fig. 3.
Align to splicing ear row 21 with by the position of splicing ear row 51 so that from as the ora terminalis 22A (with reference to Fig. 3) of the splicing ear 22 of the 1st mark to as the 3rd mark by the distance till the ora terminalis 52A (with reference to Fig. 3) of splicing ear 52, with extremely equate from ora terminalis 22B as the distance by till the ora terminalis 52B of splicing ear 52 of the 4th mark as the splicing ear 22 of the 2nd mark.Also can replace, in the case,, replace the ora terminalis of splicing ear 22 and the bight of using splicing ear 22 as the mark that is used for aligned in position.
With reference to Figure 10 and Figure 11, the manufacturing approach of above-mentioned distributing board 1 is described.
Shown in figure 10, through many Copper Foil lines are arranged side by side, form Wiring pattern 12 thus.Bonding the 1st thin plate 200 on a face of above-mentioned Wiring pattern 12, then, with the mode of aliging, from bonding the 2nd thin plate 200 of another face with the 1st thin plate 200.
The 1st thin plate 200 is made up of the mother metal thin plate with the 1st submounts 111 same materials.On a face of this mother metal thin plate, be coated with the bonding agent that forms bond layer 112 through heating.
The 1st thin plate 200 is along the long thin plate of a direction, has the window 201 of rectangle, and this window 201 has the length of regulation along extending direction.Along the length of the window 201 of extending direction about 2 times of length of connecting portion 20.The width of window 201 is bigger than the width of splicing ear row 21.The distance along between the adjacent window 201 of extending direction of the 1st thin plate 200 is consistent with the length of distributing board 1.That is, window 201 is formed on the part corresponding with splicing ear row 21.And, thin plate 200 being sticked on 12 last times of Wiring pattern, the window 201 of 2 thin plates is roughly consistent, does not cover connecting portion 20.
Shown in Figure 10 and Figure 11 (a), cut off line CA, the 2nd cut-out line CB and the 3rd cut-out line CC along the 1st thin plate is cut off.Thus, cut out distributing board 1.Then, shown in Figure 11 (b), bonding the 2nd submounts 120 at the both ends of distributing board 1.The part of the 2nd submounts 120 and thin plate 200 (that is the 1st submounts 111) are overlapping.
Then, prepare transfer printing thin plate 130, it is used on connecting portion 20, forming conduction articulamentum 23 and insulating barrier 24.
Shown in Figure 11 (c), transfer printing thin plate 130 is to peel off on the thin plate 131, alternately applies the electric conducting material 133 corresponding with conduction articulamentum 23 and the formation with insulating barrier 24 corresponding insulating material 132.
On the surface of peeling off thin plate 131, for example be formed with layer of silicone.This way be for, after sticking on electric conducting material 133 and insulating material 132 on the connecting portion 20, in the time of will peeling off thin plate 131 and peel off, prevent to adhere to electric conducting material 133 and insulating material 132 on the thin plate 131 peeling off.
Through utilizing silk screen printing to the regulation zone of peeling off thin plate 131, promptly apply silver paste with splicing ear 22 corresponding zones, carry out drying then and harden, thus formation electric conducting material 133.
Insulating material 132 is for example formed by the polyesters hot-melt adhesive.Utilize silk screen printing to the regulation zone of peeling off thin plate 131, the zone between the promptly adjacent splicing ear 22 applies hot-melt adhesive, and makes hot-melt adhesive dry.Form transfer printing thin plate 130 according to the method described above.
Shown in Figure 11 (d), transfer printing thin plate 130 is sticked on the connecting portion 20 of distributing board 1, and utilize pressing plate etc. that electric conducting material 133 is pushed to splicing ear 22, insulating material 132 is pushed to the 2nd submounts 120.Utilizing pressing plate etc. when the 2nd submounts 120 is pushed electric conducting material 133 and insulating material 132, heat with 120～200 ℃.Then, remove and peel off thin plate 131.Form distributing board 1 through above operation.
In Figure 10 and Figure 11, the thin plate cutting is distributing board 1 after, bonding the 2nd submounts 120 has carried out transfer printing to electric conducting material 133 and insulating material 132.Also can replace,, thin plate cut off behind bonding the 2nd submounts 120 on the part corresponding with connecting portion 20.In addition, also can be on the part corresponding with connecting portion 20 bonding the 2nd submounts 120, and after with respect to the 2nd submounts 120 electric conducting material 133 and insulating material 132 being carried out transfer printing, thin plate is cut off.
According to the 4th variation, except the effect of above-mentioned (1)～(6), realize following effect.
(10) in the 4th variation, connect the position of substrate 40 in order to confirm splicing ear row 21 with respect to quilt, and splicing ear 22 is used as the 1st mark and the 2nd mark.Thus, can regard splicing ear 22 as benchmark as the 1st mark, and observe conduct the 3rd mark that connected substrate 40 by splicing ear 52.In addition, can observe as the splicing ear 22 of the 2nd mark and conduct the 4th mark that is connected substrate 40 by splicing ear 52.Thus, can make splicing ear 22 be connected substrate 40 by the position consistency of splicing ear 52, thereby the splicing ear row 21 of confirming distributing board 1 with respect to connected substrate 40 by the position of splicing ear row 51.
(other execution modes)
Example of the present invention is not limited to the form shown in above-mentioned execution mode and the variation.For example, example of the present invention also can be as changing shown in following and is implemented.In addition, each following variation is not to be only applicable to above-mentioned each embodiment, can combination with one another between the different variation be implemented yet.
In the above-described embodiment, position in order to connect substrate 40, and distributing board 1 is provided with 2 marks, but 1 mark also can be set with respect to quilt.In the case; Make distributing board 1 with respect to being connected substrate 40 rotations; So that the 1st mark 27 of distributing board 1 and the position consistency that connected the 3rd mark 53 of substrate 40, thereby the terminal board column direction XA that makes splicing ear row 21 is with consistent by the terminal board column direction XB of splicing ear row 51.
In the above-described embodiment, used one deck stiffener 26, but also can use stiffener 26 more than or equal to 2 layers.In the case, also can form heating with the mode that runs through 2 layers with hole 30.In addition, also can only on 1 layer of the outside, form heating with hole 30.
In the above-described embodiment, the stiffener 26 of distributing board 1 has heating with hole 30, but also can not have heating with hole 30.In the case, heat via 26 pairs of connecting portions 20 of stiffener.
In the above-described embodiment, the periphery that the stiffener 26 of distributing board 1 surrounds connecting portion 20, but stiffener 26 is not limited to this mode.For example, stiffener 26 also can only cover the leading section of distributing board 1.In addition, stiffener 26 also can cover the leading section and the both ends of distributing board 1.
In the above-described embodiment, on stiffener 26, be formed with the 1st mark 27 and the 2nd mark 28, but on the position that mark 27,28 can be formed on except the part with stiffener 26.
In the above-described embodiment, the back side of distributing board 1 has stiffener 26, but also can not have stiffener 26.
In the above-described embodiment, insulating barrier 24 forms 2 layers, but the structure of insulating barrier 24 is not limited thereto.For example, insulating barrier 24 can form 1 layer.In addition, insulating barrier 24 can form more than or equal to 3 layers.In addition, conduction articulamentum 23 is formed with 1 layer, but also can be formed with more than or equal to 2 layers.
In the above-described embodiment, conduction articulamentum 23 is formed by silver paste, but can replace, and is formed by the anisotropy resin.In the case, in the operation after applying the anisotropy resin,, form conduction articulamentum 23 with the compression of anisotropy resin.
In the above-described embodiment, form the high insulating barrier 24 in position of the upper surface of ratio conduction articulamentum 23.As the method that forms this insulating barrier 24, exist: utilize silk screen printing to form the method for 2 layer insulatings 24, insulating barrier 24 and conduction articulamentum 23 are being formed the method conduction articulamentum 23 compressed the back etc. with equal height.
In the above-described embodiment, also can make the upper surface of conduction articulamentum 23 and the upper surface of insulating barrier 24 is roughly the same height.
In the above-described embodiment, also can make the upper surface of conduction articulamentum 23 higher than the upper surface of insulating barrier 24.
In the above-described embodiment, for conduction articulamentum 23 and insulating barrier 24, also can replace transfer printing and directly print.
In the above-described embodiment, insulating barrier 24 is formed between each splicing ear 22.Also can replace, only the outside of the splicing ear 22 of the outside of the splicing ear 22 of an end and the other end forms insulating barrier 24 in splicing ear row 21.In addition, also can perhaps form insulating barrier 24 in any 1 place between each splicing ear 22 more than or equal to 2 places.
In above-mentioned the 4th variation, as shown in Figure 9, on a face of splicing ear row 21, directly paste the 2nd submounts 120.Also can replace, the 1st submounts 111 that makes at least one side makes this 1st transparent submounts 111 extend to connecting portion 20 for transparent, on the 1st submounts 111, pastes the 2nd submounts 120.The 1st submounts 111 and the 2nd submounts 120 have the transparency of following degree, that is, after pasting the 1st submounts 111 and the 2nd submounts 120, can have an X-rayed and observe and connected substrate 40.Promptly; According to this structure; Because it is transparent that the 1st submounts 111 and the 2nd submounts 120 are pasted the composite plate of back formation; So ground identical with the 4th variation, can make splicing ear 22 with is connected substrate 40 by the position consistency of splicing ear 52, the splicing ear row 21 of confirming distributing board 1 with respect to quilt connection substrate 40 by the position of splicing ear row 51.
Claims (11)
1. distributing board, it has distributing board substrate and splicing ear row, said splicing ear row are formed on the face of said distributing board substrate, constitute be connected substrate be listed as connection by splicing ear,
This distributing board is characterised in that,
Said distributing board also has the splicing ear that is used for definite said distributing board and is listed as the mark that is connected the position that is listed as by splicing ear of substrate with respect to said; Said mark is arranged on the specific location on the said distributing board that the specific part that is listed as with said splicing ear is the benchmark setting; Said distributing board constitutes; Can observe this mark, and a said part that is connected substrate.
2. distributing board according to claim 1 is characterized in that,
Said splicing ear row have a plurality of splicing ears,
Said mark is at least 1 splicing ear in said a plurality of splicing ear, the perhaps part of said at least 1 splicing ear.
3. distributing board according to claim 2 is characterized in that,
Said distributing board has: main part, and it has a plurality of distributions that extend to said splicing ear row; And connecting portion, it has said splicing ear row,
Said distributing board substrate has: 2 the 1st submounts, the said distribution of its clamping and constitute said main part; And the 2nd submounts, its back side to said splicing ear row is supported and is constituted said connecting portion, and said the 2nd submounts constitutes, and can have an X-rayed to observe through the 2nd submounts saidly to be connected substrate.
4. distributing board according to claim 1 and 2 is characterized in that,
Said distributing board substrate constitutes, and can have an X-rayed through this distributing board substrate and observe the said substrate that connected.
5. distributing board according to claim 1 is characterized in that,
Said mark is the through hole that runs through said distributing board substrate.
6. distributing board according to claim 1 is characterized in that,
Said mark is arranged on the otch on the end of said distributing board substrate.
7. distributing board according to claim 1 and 2 is characterized in that,
Said mark constitutes, and confirms this mark and said by the permissible range of the alternate position spike between the ad-hoc location of connection substrate.
8. distributing board according to claim 1 and 2 is characterized in that,
Said splicing ear row have:
A plurality of splicing ears;
The conduction articulamentum, it is configured on the upper surface of said each splicing ear, and is formed by the electroconductive resin that comprises conductive particle; And
Insulating barrier, it is configured in the said splicing ear between 1 pair at least, and splicing ear is insulated from each other, and said insulating barrier is formed by insulating adhesive.
9. distributing board according to claim 1 and 2 is characterized in that,
Said distributing board has stiffener, and this stiffener is arranged on the connecting portion with said splicing ear row, and this connecting portion is strengthened,
Said stiffener is provided with said mark.
10. distributing board according to claim 9 is characterized in that,
Said stiffener has heating and uses the hole on the position corresponding with said splicing ear row.
11. distributing board according to claim 1 and 2 is characterized in that,
Said being marked on the diverse location that the specific part that is listed as with said splicing ear is the benchmark setting is provided with 2.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-115033 | 2011-05-23 | ||
| JP2011115033A JP5760687B2 (en) | 2010-06-23 | 2011-05-23 | Wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102801004A true CN102801004A (en) | 2012-11-28 |
| CN102801004B CN102801004B (en) | 2014-10-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110435851.5A Active CN102801004B (en) | 2011-05-23 | 2011-12-22 | Distributing board |
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| Country | Link |
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| KR (2) | KR101297904B1 (en) |
| CN (1) | CN102801004B (en) |
| TW (1) | TWI426835B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6985211B2 (en) * | 2018-05-31 | 2021-12-22 | 日東電工株式会社 | Wiring circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05304348A (en) * | 1992-04-27 | 1993-11-16 | Fujitsu Ltd | Installation structure of flexible printed board |
| JPH07176838A (en) * | 1993-12-20 | 1995-07-14 | Sharp Corp | Wiring substrate, its connecting structure and its method, and packaging structure of display panel |
| JPH11121894A (en) * | 1997-08-12 | 1999-04-30 | Optrex Corp | Connection structure of circuit board |
| JP2011077125A (en) * | 2009-09-29 | 2011-04-14 | Sumitomo Electric Ind Ltd | Wiring board, manufacturing method of wiring board, connection structure of wiring board, and connection method of wiring board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3833425B2 (en) * | 1999-10-27 | 2006-10-11 | 富士通株式会社 | Method for connecting printed wiring boards and printed circuit board |
| TWM401950U (en) * | 2010-10-18 | 2011-04-11 | Ko Ja (Cayman) Co Ltd Taiwan Branch | Transparent films type of printed circuit board |
-
2011
- 2011-12-19 TW TW100147019A patent/TWI426835B/en active
- 2011-12-19 KR KR1020110137434A patent/KR101297904B1/en active IP Right Grant
- 2011-12-22 CN CN201110435851.5A patent/CN102801004B/en active Active
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05304348A (en) * | 1992-04-27 | 1993-11-16 | Fujitsu Ltd | Installation structure of flexible printed board |
| JPH07176838A (en) * | 1993-12-20 | 1995-07-14 | Sharp Corp | Wiring substrate, its connecting structure and its method, and packaging structure of display panel |
| JPH11121894A (en) * | 1997-08-12 | 1999-04-30 | Optrex Corp | Connection structure of circuit board |
| JP2011077125A (en) * | 2009-09-29 | 2011-04-14 | Sumitomo Electric Ind Ltd | Wiring board, manufacturing method of wiring board, connection structure of wiring board, and connection method of wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201249269A (en) | 2012-12-01 |
| KR20120130679A (en) | 2012-12-03 |
| TWI426835B (en) | 2014-02-11 |
| KR20130059375A (en) | 2013-06-05 |
| CN102801004B (en) | 2014-10-01 |
| KR101396668B1 (en) | 2014-05-16 |
| KR101297904B1 (en) | 2013-08-22 |
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