CN102786028B - Manufacturing method of multi-needle point array used for large area friction induced micro/nano-processing - Google Patents
Manufacturing method of multi-needle point array used for large area friction induced micro/nano-processing Download PDFInfo
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- CN102786028B CN102786028B CN201210246472.6A CN201210246472A CN102786028B CN 102786028 B CN102786028 B CN 102786028B CN 201210246472 A CN201210246472 A CN 201210246472A CN 102786028 B CN102786028 B CN 102786028B
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Abstract
The invention relates to a manufacturing method of a multi-needle point array used for large area friction induced micro/nano-processing. The method comprises the steps of: (a) using the pressure head of a microhardness tester to conduct indenting on a wax sheet substrate surface for processing an indentation array; (b) placing microspheres on each indentation; (c) covering the microspheres with a flat and smooth pressing sheet, exerting a load on the pressing sheet to make each microsphere pressed into the wax sheet simultaneously, thus forming a microsphere array; (d) pressing a pouring frame on the wax sheet substrate, and making the microsphere array framed by the pouring frame; (e) pouring an inlay material solution into the pouring frame, and making the solution submerge the microsphere array; and (f) after solidification of the inlay material solution, conducting heating and melting to remove the wax sheet, then taking the inlay material out from the pouring frame, and polishing the microsphere-free back of the inlay material to a plane, thus obtaining the multi-needle point array used for large area friction induced micro/nano-processing. The method has the advantages of simple operation, cheap raw materials, no need for glue spraying, oxidation, photoetching, anisotropic etching and other complex and special treatments, thus having the obvious characteristics of low cost and high efficiency.
Description
Technical field
The present invention relates to a kind of preparation method of the Multi-tip array for the processing of large area friction induction micro-/ nano.
Background technology
Since 21 century, the microminiaturized revolution caused by semiconductor microelectronic technology enters new epoch, and Here it is the era of nanotechnology.Nanometer technology owing to running through every field, and brings the change of essence to old conventional art, be referred to as a upcoming technological revolution.Nowadays, nanometer technology (NT), biotechnology (BT) and information technology (IT) become the large field of scientific and technological circle's tool influential three.Wherein, nanometer technology occupies more and more consequence in modern science and industry.
Nanometer manufacture realizes the approach that nanosecond science and technology transform to manufacturing theory by the principle of work and power, is also to support the basis that nanosecond science and technology move towardss application.Common nanometer adds technology to be had: photoetching technique, nanometer embossing, dip in an art of printing, anisotropic corrosion technique of monocrystalline silicon etc.But current technology has some limitations: such as lithographic equipment becomes increasingly complex, the development cost exponentially level growth of etching system, causes the manufacturing cost of equipment to be close to out of control thus; The stamp fabrication of nanometer embossing is faced with the challenges such as high cost, poor efficiency, low precision.
Friction induction micro-/ nano process technology is a kind of brand-new nanofabrication technique, just can directly process nanometer convex structure at material surfaces such as monocrystalline silicon by mechanical scratching, carries out KOH corrosion, then can form darker recessed structure or higher male structure if continue to it.The method does not rely on additional mask plate and loaded down with trivial details work flow, does not need controlled humidity, the environmental factors such as vacuum in process.Obviously, this technology has that processing cost is low, technology is simple, be easy to the advantages such as popularization, is a kind of micro-/ nano processing method of great potential.At present, friction induction micro-/ nano process technology completes primarily of scanning probe microscopy, and this equipment generally can only at Single probe MODE of operation, and process velocity is slow, and efficiency is lower.And its range of work is generally no more than 100 microns, is difficult to reach mass production requirement, seriously hinders the application of friction induction micro-/ nano process technology.
Summary of the invention
The object of this invention is to provide a kind of Multi-tip preparation method for the processing of large area friction induction micro-/ nano.The method operation is simple and easy, and step is simple, and raw material are cheap, have obvious low cost, high efficiency method characteristic.
The technical solution adopted for the present invention to solve the technical problems is: a kind of preparation method of the Multi-tip array for the processing of large area friction induction micro-/ nano, the steps include:
(a) wax disk(-sc) substrate is placed in microhardness instrument workbench on, make the pressure head of microhardness instrument carry out impression to wax disk(-sc) substrate surface, process impression array;
B equirotal microballoon is placed on each impression of impression array by () one by one;
C () adopts the compressing tablet of flat smooth to cover on the microballoon of wax disk(-sc) substrate, to compressing tablet imposed load, each microballoon is pressed in wax disk(-sc) simultaneously, compression distance is 0.7-1.0 times of microsphere radius, and the compression distance of each microballoon is consistent, and wax disk(-sc) substrate forms micro-sphere array;
D cast frame is pressed in wax disk(-sc) substrate by (), and make cast circle live micro-sphere array;
E (), toward cast setting material solution in cast frame, makes it flood micro-sphere array;
F (), after inlay solution solidifies, heat fused removes wax disk(-sc), then take out by inlay is in cast frame, and is plane by its polished backside without microballoon, namely obtains the Multi-tip array for the processing of large area friction induction micro-/ nano.
Compared with prior art, the invention has the beneficial effects as follows:
One, hardness tester is adopted in substrate, (to get) impression ready in advance, can accurately locate, can arrange arbitrarily the number, size, spacing, arrangement position etc. of microballoon probe on request, make the Multi-tip array processed have the feature of diversity, high reliability, the requirement of various Multi-contact friction induction processing can be met.
Two, hardness tester is adopted (to get) impression ready in substrate, can ensure that the degree of depth of each point is large to identical, suppress through smooth compressing tablet again, can ensure that the end face of all microballoons is all in same plane, again after solidifying bonding dewax, the needle point end face of the Multi-tip array that the bottom surface of each microballoon namely finally processes all is in same surface.Thus can ensure that each microballoon probe can both be identical with the contact operating mode of machined material in friction induction process.
Three, the needle point adopting the projection of microballoon to process as friction induction, microballoon can be steel ball, ceramic bead, silicon nitride bead etc. are commercially easily buied, cheap wear-resistance microspheres, thus greatly can reduce the manufacturing cost of Multi-tip array, and then reduce whole friction induction micro-/receive processing cost.
Four, the method does not need to carry out the complicated specially treateds such as any photoetching, anisotropic etch to machined material, significantly reduces operation easier and manufacturing cost.
The roughness of above-mentioned compressing tablet is at below 1nm.
Can ensure that summit and the end point of each microballoon are all in same plane like this, thus the uniformity processing request of micro-/ nano processing under can meeting Multi-contact pattern.
Above-mentioned inlay be any one can solidify at room temperature and fusing point after solidifying higher than the inlay of wax disk(-sc) fusing point.
So just make without the need to providing extra processing conditions for it in the process making Multi-tip array, and when adding heat abstraction wax disk(-sc), this inlay can not melt, guarantee is easy to process further, cost of manufacture is low.
Below in conjunction with accompanying drawing and concrete embodiment, the present invention is described in further detail.
Accompanying drawing explanation
Fig. 1 is the step schematic diagram of embodiment of the present invention method.Wherein (a), (b), (c), (d), (e), (f) component are respectively the schematic diagram of step (a), (b), (c), (d), (e), (f).The Multi-tip array processed in Fig. 1 is 3 × 3 arrays.
Detailed description of the invention
Embodiment
Fig. 1 illustrates, a kind of detailed description of the invention of the present invention is, a kind of preparation method of the Multi-tip array for the processing of large area friction induction micro-/ nano, the steps include:
(a) wax disk(-sc) substrate is placed in microhardness instrument workbench on, make the pressure head of microhardness instrument carry out impression to wax disk(-sc) substrate surface, process impression array (see a component);
B equirotal microballoon is placed in (see b component) on each impression of impression array by () one by one;
C () adopts the compressing tablet of flat smooth to cover on the microballoon of wax disk(-sc) substrate, to compressing tablet imposed load, each microballoon is pressed in wax disk(-sc) simultaneously, compression distance is 0.7-1.0 times of microsphere radius, and the compression distance of each microballoon is consistent, and wax disk(-sc) substrate is formed micro-sphere array (see c component);
D cast frame is pressed in wax disk(-sc) substrate by (), and make cast circle live micro-sphere array (see d component);
E (), toward cast setting material solution in cast frame, makes it flood micro-sphere array (see e component);
F () is after inlay solution solidifies, heat fused removes wax disk(-sc), take out by inlay is in cast frame again, and be plane by its polished backside without microballoon, namely the Multi-tip array (see f component, having facing up of microballoon in f component) for the processing of large area friction induction micro-/ nano is obtained.
The roughness of the compressing tablet of this example is at below 1nm.
Compressing tablet of the present invention can be made up of materials such as silicon, glass, quartz, resins; Inlay be any one can solidify at room temperature and fusing point after solidifying higher than the inlay of wax disk(-sc) fusing point, as common artificial tooth base resin inlay, various metallic phase mounting panels etc.Microballoon then can adopt diameter to be the steel ball, ceramic bead, silicon nitride bead etc. of micron or nanometer scale.
Claims (3)
1., for a preparation method for the Multi-tip array of large area friction induction micro-/ nano processing, the steps include:
(a) wax disk(-sc) substrate is placed in microhardness instrument workbench on, make the pressure head of microhardness instrument carry out impression to wax disk(-sc) substrate surface, process impression array;
B equirotal microballoon is placed on each impression of impression array by () one by one;
C () adopts the compressing tablet of flat smooth to cover on the microballoon of wax disk(-sc) substrate, to compressing tablet imposed load, each microballoon is pressed in wax disk(-sc) simultaneously, compression distance is 0.7-1.0 times of microsphere radius, and the compression distance of each microballoon is consistent, and wax disk(-sc) substrate forms micro-sphere array;
D cast frame is pressed in wax disk(-sc) substrate by (), and make cast circle live micro-sphere array;
E (), toward cast setting material solution in cast frame, makes it flood micro-sphere array;
F (), after inlay solution solidifies, heat fused removes wax disk(-sc), then take out by inlay is in cast frame, and is plane by its polished backside without microballoon, namely obtains the Multi-tip array for the processing of large area friction induction micro-/ nano.
2. the preparation method of a kind of Multi-tip array for the processing of large area friction induction micro-/ nano according to claim 1, is characterized in that: the roughness of described compressing tablet is at below 1nm.
3. a kind of preparation method of Multi-tip array for the processing of large area friction induction micro-/ nano according to claim 1, is characterized in that: described inlay be any one can solidify at room temperature and fusing point after solidifying higher than the inlay of wax disk(-sc) fusing point.
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CN103803484B (en) * | 2013-12-27 | 2016-02-03 | 西南交通大学 | Based on the silicon nitride film/silicon micro-nano processing method of friction induction selective etch |
CN104108680B (en) * | 2014-06-19 | 2016-02-03 | 北京大学深圳研究生院 | A kind of preparation method of micro-sphere array needle point |
CN105858595B (en) * | 2016-04-06 | 2018-01-23 | 西南交通大学 | Flatness self-compensating large area micro Process Multi-tip array preparation method |
CN106567131B (en) * | 2016-11-08 | 2020-11-24 | 西南交通大学 | Method for processing monocrystalline silicon surface needle point based on indentation-induced selective etching |
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CN1654311A (en) * | 2005-03-09 | 2005-08-17 | 吉林大学 | Method for constructing non-close packing colloid balls ordered arrangement using soft-graving technology |
CN1986011A (en) * | 2006-12-08 | 2007-06-27 | 中国科学院上海微系统与信息技术研究所 | Miniature needle array for medicine transmission and its making process |
EP1810743A1 (en) * | 2004-10-18 | 2007-07-25 | National Agriculture and Food Research Organization | Process for producing microsphere with use of metal substrate having through-hole |
CN101015048A (en) * | 2004-09-22 | 2007-08-08 | 飞而康公司 | Manufacture method of vertical-type electric contactor and vertical-type electric contactor thereof |
CN101901788A (en) * | 2009-02-06 | 2010-12-01 | 精工电子有限公司 | Resin molded semiconductor device and manufacture method thereof |
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WO2005087305A1 (en) * | 2004-03-12 | 2005-09-22 | Agency For Science, Technology And Research | Methods and moulds for use in fabricating side-ported microneedles |
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CN101015048A (en) * | 2004-09-22 | 2007-08-08 | 飞而康公司 | Manufacture method of vertical-type electric contactor and vertical-type electric contactor thereof |
EP1810743A1 (en) * | 2004-10-18 | 2007-07-25 | National Agriculture and Food Research Organization | Process for producing microsphere with use of metal substrate having through-hole |
CN1654311A (en) * | 2005-03-09 | 2005-08-17 | 吉林大学 | Method for constructing non-close packing colloid balls ordered arrangement using soft-graving technology |
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