CN102775927A - Heat-resistant double-faced adhesive tape for electronic industry - Google Patents
Heat-resistant double-faced adhesive tape for electronic industry Download PDFInfo
- Publication number
- CN102775927A CN102775927A CN2012102625573A CN201210262557A CN102775927A CN 102775927 A CN102775927 A CN 102775927A CN 2012102625573 A CN2012102625573 A CN 2012102625573A CN 201210262557 A CN201210262557 A CN 201210262557A CN 102775927 A CN102775927 A CN 102775927A
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- Prior art keywords
- heat
- resistant adhesive
- adhesive tape
- resistant
- faced adhesive
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Abstract
The invention discloses a heat-resistant double-faced adhesive tape for the electronic industry, comprising release paper and an adhesive layer body; both sides of the adhesive layer body are coated with a first heat-resistant binder and a second heat-resistant binder; the release paper is covered on the outer surfaces of the first heat-resistant binder and the second heat-resistant binder; and the material of the first heat-resistant binder and the material of second heat-resistant binder are polyimide. With the adoption of the mode, the double-faced adhesive tape has excellent heat resistance, is capable of reducing hypergolic occurrence rate, and is especially suitable for the electronic industry.
Description
Technical field
The present invention relates to a kind of double faced adhesive tape, particularly relate to the heat-resisting double faced adhesive tape of a kind of electronics, be particularly useful for electron trade.
Background technology
At present, more and more along with the development of industry-by-industry, and also increasingly high for the requirement of double faced adhesive tape for the demand of double faced adhesive tape, electron trade especially.
For on the component of electron trade because too high, the common problems such as the easy initiation fire of double faced adhesive tape of temperature, thereby cause serious consequence, can not be ignored.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of double faced adhesive tape, has good heat-stable effect, can prevent the incidence of spontaneous combustion, is particularly useful for electron trade.
For solving the problems of the technologies described above; The technical scheme that the present invention adopts is: provide a kind of electronics heat-resisting double faced adhesive tape; Comprise separate-type paper and glue-line body; The both sides of described glue-line body are coated with first heat-resistant adhesive and second heat-resistant adhesive, and described separate-type paper covers the outside surface of first heat-resistant adhesive and second heat-resistant adhesive, and the material of described first heat-resistant adhesive and second heat-resistant adhesive is polyimide.
In preferred embodiment of the present invention, the thickness of described glue-line body is 8-18um.
In preferred embodiment of the present invention, the thickness of described first heat-resistant adhesive and second heat-resistant adhesive is identical or inequality.
In preferred embodiment of the present invention, the thickness of described first heat-resistant adhesive and second heat-resistant adhesive is 35-65um.
In preferred embodiment of the present invention, the thickness of described separate-type paper is 85-125um.
The invention has the beneficial effects as follows: the heat-resisting double faced adhesive tape of electronics of the present invention; Be particularly useful for electron trade; The both sides of glue-line body are coated with first heat-resistant adhesive and second heat-resistant adhesive, and the material of described first heat-resistant adhesive and second heat-resistant adhesive is polyimide, have good heat-stable effect; Can prevent the incidence of spontaneous combustion, be particularly useful for electron trade.
Description of drawings
Fig. 1 is the perspective view of heat-resisting double faced adhesive tape one preferred embodiment of electronics of the present invention;
The mark of each parts is following in the accompanying drawing: 1, glue-line body, 2, first heat-resistant adhesive, 3, second heat-resistant adhesive, 4, separate-type paper.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is set forth in detail, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.
As shown in Figure 1, be the perspective view of heat-resisting double faced adhesive tape one preferred embodiment of electronics of the present invention.The heat-resisting double faced adhesive tape of this electronics comprises separate-type paper 4 and glue-line body 1.The both sides of the glue-line body 1 among the present invention are coated with first heat-resistant adhesive 2 and second heat-resistant adhesive 3, and described separate-type paper 4 covers the outside surface of first heat-resistant adhesive 2 and second heat-resistant adhesive 3 respectively.
First heat-resistant adhesive 2 among the present invention and the material of second heat-resistant adhesive 3 are polyimide.Polyimide is one of best organic polymer material of over-all properties, high temperature resistant reaching more than 400 ℃, life-time service TR-200～300 ℃; No sharp melting point, high insulating property, 103 hertz of following specific inductivity 4.0; Dielectric loss only 0.004～0.007 belongs to F to H class F insulating material F.
The thickness of the glue-line body 1 among the present invention is 8-18um; The thickness of separate-type paper 4 is 85-125um.
First heat-resistant adhesive 2 among the present invention and the thickness of second heat-resistant adhesive 3 can be identical, also can be inequality, and the thickness of first heat-resistant adhesive and second heat-resistant adhesive is 35-65um.The preferred 50um of thickness of first heat-resistant adhesive and second heat-resistant adhesive has reached best heat-resisting effect among the present invention.
The heat-resisting double faced adhesive tape of electronics that the present invention discloses; Be particularly useful for electron trade; The both sides of glue-line body are coated with first heat-resistant adhesive and second heat-resistant adhesive, and the material of described first heat-resistant adhesive and second heat-resistant adhesive is polyimide, have good heat-stable effect; Can prevent the incidence of spontaneous combustion, be particularly useful for electron trade.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification sheets of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (5)
1. heat-resisting double faced adhesive tape of electronics; Comprise separate-type paper and glue-line body; It is characterized in that; The both sides of described glue-line body are coated with first heat-resistant adhesive and second heat-resistant adhesive, and described separate-type paper covers the outside surface of first heat-resistant adhesive and second heat-resistant adhesive, and the material of described first heat-resistant adhesive and second heat-resistant adhesive is polyimide.
2. the heat-resisting double faced adhesive tape of electronics according to claim 1 is characterized in that the thickness of described glue-line body is 8-18um.
3. the heat-resisting double faced adhesive tape of electronics according to claim 1 is characterized in that, the thickness of described first heat-resistant adhesive and second heat-resistant adhesive is identical or inequality.
4. the heat-resisting double faced adhesive tape of electronics according to claim 1 is characterized in that the thickness of described first heat-resistant adhesive and second heat-resistant adhesive is 35-65um.
5. the heat-resisting double faced adhesive tape of electronics according to claim 1 is characterized in that the thickness of described separate-type paper is 85-125um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102625573A CN102775927A (en) | 2012-07-27 | 2012-07-27 | Heat-resistant double-faced adhesive tape for electronic industry |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102625573A CN102775927A (en) | 2012-07-27 | 2012-07-27 | Heat-resistant double-faced adhesive tape for electronic industry |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102775927A true CN102775927A (en) | 2012-11-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102625573A Pending CN102775927A (en) | 2012-07-27 | 2012-07-27 | Heat-resistant double-faced adhesive tape for electronic industry |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102775927A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113156548A (en) * | 2021-01-21 | 2021-07-23 | 泰锠科技(深圳)有限公司 | Antifogging optical lens and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101258212A (en) * | 2005-09-05 | 2008-09-03 | 株式会社钟化 | Heat resistant adhesive sheet |
-
2012
- 2012-07-27 CN CN2012102625573A patent/CN102775927A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101258212A (en) * | 2005-09-05 | 2008-09-03 | 株式会社钟化 | Heat resistant adhesive sheet |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113156548A (en) * | 2021-01-21 | 2021-07-23 | 泰锠科技(深圳)有限公司 | Antifogging optical lens and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121114 |