CN102768224B - Testing method for testing solid-solid contact thermal resistance by using forward and reverse bidirectional heat flux method - Google Patents

Abstract

The invention provides a testing method for testing solid-solid contact thermal resistance by using a forward and reverse bidirectional heat flux method on the basis of American national standards ASTME (American society of tool and manufacturing engineers) 1225 and ASTM (American society for testing and materials) D5470. The testing method includes that a vertical bidirectional heat flux symmetric testing structure is adopted, accordingly, uncertain temperature measurement errors caused by different contact conditions of a plurality of temperature sensors and a tested specimen can be basically eliminated, the temperature sensors are arranged on the tested specimen, and testing precision is improved. In addition, a temperature-controllable anti-radiation screen resisting thermal radiation and assisting measures are combined to reduce transverse heat flux loss, one-dimensionality of temperature gradient of a tested material is guaranteed by optimized minimum testing heat flux, so that the purpose of precisely testing thermal property parameters of the tested specimen is achieved, and the method can be used for precisely measuring contact thermal resistance of interfaces of the same type of materials or contact thermal resistance of interfaces of different types of materials.

Description

Gu positive and negative two-way heat flow method is surveyed the method for testing of solid-thermal contact resistance

Technical field

The invention belongs to technical field of measurement and test, be specifically related to admittedly a kind of-affixed tactile thermo-resistance measurement method, be applicable to the test to the interface thermal contact resistance between common used material, Gu be particularly useful for the interface thermal contact resistance test to solid-material.

Background technology

Thermal contact resistance is a parameter that affected by the many factors such as material property, mechanical property, surface topography, contact, temperature, clearance material.Whether stable according to experiment hot-fluid, generally thermal contact resistance measuring method is divided into Transient Method and steady state method.Transient Method is also a kind of conventional thermal contact resistance experimental measurement method, it mainly comprises photothermal laser mensuration, thermal imaging method, " flash " flicker method, laser optoacoustic method etc., wherein photothermal laser mensuration comprises again modulation photo-thermal method and heat scan method, and modulation photo-thermal method has again dividing of photo-thermal amplitude method, photo-thermal phase method and impulse method.Though although various Transient Method is suitable for Quick Measurement and can measures the little film to nanometer scale, its measuring process is subject to various factors impact, and derivation of equation relative complex, measuring accuracy is also difficult to ensure card.Therefore, what interface thermal contact resistance measuring method was the most frequently used is steady state method: on two contact samples, maintain certain temperature difference, measure the temperature value of two samples on axially, thereby then by Fourier law, be extrapolated to contact interface place and obtain the temperature difference on interface; Heat flux can be measured or be calculated by thermal conductivity and the thermograde of specimen material by thermal flow meter, thus R=|T1-T2|/Q.It is similar with the testing standard equipment of American National Standard ASTMD5470-06 mostly stable state thermal contact resistance method of testing is, but have document to point out because thermometric uncertain error and thermal loss error are difficult to guarantee that interface thermal contact resistance is had to sufficiently high measuring accuracy more.

Summary of the invention

Thereby the present invention is in order to solve due to multiple temperature sensors of arranging on test test specimen and the thermometric uncertain error of the different generation of the situation that contacts of test test specimen, Gu provide a kind of positive and negative two-way heat flow method to survey the method for solid-thermal contact resistance.

The technical solution that realizes the object of the invention is: Gu a kind of positive and negative two-way heat flow method is surveyed the method for solid-thermal contact resistance, said method comprising the steps of:

The first step, the preparation of testing apparatus and test the choosing of test specimen test point:

Process two test specimens, test specimen is vertically arranged between two upper and lower symmetrically arranged refrigeration heating jackets, on two refrigeration heating jackets, is provided with stress loading device, on described test specimen, be provided with temperature sensor, temperature sensor is connected with data acquisition system (DAS), for testing the axial temperature of test specimen;

Position on test specimen between test point meets following relation: take the contact interface sectional position on two test specimen y directions as the plane of symmetry, test point position full symmetric on two test specimens, each test specimen all arranges n test point between from lower surface to upper surface, axial distance on each test specimen between adjacent two test points is equal, and the distance between test point is dx;

Second step, loads compressive stress, and forward heats test specimen:

One end heating wherein axial to two test specimens, the other end is cooling, and test specimen temperature starts collecting test temperature after reaching and stablizing; Described probe temperature comprises the measurement temperature T of n test point on each test specimen _i,j, i=1, n, n is test point number by plane of symmetry symmetry on each test specimen, j=1,2 represent respectively two different test specimens;

The 3rd step, the calculating of collecting test point temperature and forward thermal contact resistance R ':

Temperature in each test point on two test specimens is gathered and stored, and now on test specimen meter, the measurement temperature of n test point is T _i,j', i=1, n, j=1,2;

According to the position of n test point on each test specimen and measurement temperature T _i,j' temperature gradient relation, by numerical value extrapolation method, can obtain the extrapolation temperature T of two test specimens at contact interface place _s-1' and T _s-2', and then contact interface temperature difference T _s' be:

ΔT _s′=T _s-1′-T _s-2′

Now by known heat flux Q and then obtain forward thermal contact resistance

The 4th step, loads compressive stress, oppositely loads hot-fluid, collecting test point temperature:

Under similarity condition, load the compressive stress identical with second step, reverse operating, one end heating axial to two test specimens, one end is cooling, and test specimen temperature starts collecting test temperature after reaching and stablizing;

The 5th step, oppositely thermal contact resistance R " calculating:

Temperature in each test point on two test specimens is gathered and stored, and now on test specimen, the measurement temperature of n test point is T _i,j", i=1, n, j=1,2;

Equally, according to the position of n test point on each test specimen and measurement temperature T _i,j" temperature gradient relation, by numerical value extrapolation method, can obtain the extrapolation temperature T of two test specimens at contact interface place _s-1" and T _s-2", and then contact interface temperature difference T _s" be:

ΔT _s″=T _s-1″-T _s-2″

Now by known heat flux Q and then obtain reverse thermal contact resistance

The 6th step, the calculating of thermal contact resistance R:

When positive test, if the extrapolation temperature T of two test specimen contact interfaces _s-1' and T _s-2' be:

T _s-1′=a _s-1(T _s-1-T _ref)+E _s-1

T _s-2′=a _s-2(T _s-2-T _ref)+E _s-2

Wherein a _s-1and a _s-2for the coefficient of temperature sensor, T _s-1and T _s-2while being two test specimen positive tests in the actual temperature of contact interface, T _reffor the reference temperature of temperature sensor, E _s-1and E _s-2for the error term of temperature sensor;

Forward thermal contact resistance R ' is:

$R^{\text{'}}=\frac{\mathrm{\Δ}{T_s}^{\text{'}}}{Q}=\frac{a_{s-1}+a_{s-2}}{2}\·R+\frac{a_{s-1}-a_{s-2}}{2}\frac{(T_{s-1}+T_{s-2}-2T_{\mathrm{ref}})}{Q}+\frac{E_{s-1}-E_{s-2}}{Q}$

In like manner, the extrapolation temperature T of two test specimen contact interfaces during negative testing _s-1" and T _s-2" be:

${T_{s-1}}^{\text{'}\text{'}}=a_{s-1}({\stackrel{\←}{T}}_{s-1}-T_{\mathrm{ref}})+{\stackrel{\←}{E}}_{s-1}$

${T_{s-2}}^{\text{'}\text{'}}=a_{s-2}({\stackrel{\←}{T}}_{s-2}-T_{\mathrm{ref}})+{\stackrel{\←}{E}}_{s-2}$

Wherein,

with

while being two test specimen negative testings in the actual temperature of contact interface,

with

for the error term of temperature sensor;

In like manner reverse thermal contact resistance R " be:

$R^{\text{'}\text{'}}=\frac{\mathrm{\Δ}{T_s}^{\text{'}\text{'}}}{Q}=\frac{a_{s-1}+a_{s-2}}{2}\·R+\frac{a_{s-1}-a_{s-2}}{2}\frac{({\stackrel{\←}{T}}_{s-1}+{\stackrel{\←}{T}}_{s-2}-2T_{\mathrm{ref}})}{Q}-\frac{{\stackrel{\←}{E}}_{s-1}-{\stackrel{\←}{E}}_{s-2}}{Q}$

Because of the coefficient a of temperature sensor _s-1=a _s-2=1, thermal contact resistance R is:

$R=\frac{R^{\text{'}}+R^{\text{'}\text{'}}}{2}+\frac{(E_{s-1}-E_{s-2})-({\stackrel{\←}{E}}_{s-1}-{\stackrel{\←}{E}}_{s-2})}{Q}$

Now can make $(E_{s-1}-E_{s-2})\≈({\stackrel{\←}{E}}_{s-1}-{\stackrel{\←}{E}}_{s-2})\≈0,$ Thereby $R=\frac{R^{\text{'}}+R^{\text{'}\text{'}}}{2}.$

For guaranteeing the one dimension of thermograde, test specimen is right cylinder or rectangular parallelepiped.

When positive and negative two-way test to contact interface temperature T _s-1', T _s-1" and T _s-2', T _s-2" calculating also can adopt least square method to carry out that linear fit solves or Inverse Problem Method solves.

For the heat flux that calculates of degree of precision, at test test specimen two ends or arbitrarily one end axially adds the standard thermal flow meter of same sectional dimension.

Described temperature sensor adopts thermopair, thermal resistance, PT100 or PT25.

The invention has the beneficial effects as follows:

Thereby method of testing provided by the invention can be eliminated substantially due to multiple temperature sensors of arranging on test test specimen and the thermometric uncertain error of the different generation of the situation that contacts of test test specimen, thereby improves measuring accuracy.

Accompanying drawing explanation

Fig. 1 is the structural representation of the device of the inventive method employing.

Fig. 2 is system testing schematic diagram of the present invention.

Fig. 3 is that the temperature sensor of testing test specimen 1 in the present invention is arranged schematic diagram.

Fig. 4 adopts the inventive method when test pressure 2MPa, to test between a kind of Cu alloy material thermal contact resistance with the relation of heating power.

Embodiment

Therefore, for addressing the above problem, Gu the method for solid-thermal contact resistance that the present invention has proposed a kind of positive and negative two-way heat flow method survey on American National Standard ASTM E1225 and ASTM D5470 basis, described method of testing is the symmetrical structure test structure that adopts upper and lower two-way hot-fluid, thereby can substantially eliminate due to multiple temperature sensors of arranging on test test specimen and the thermometric uncertain error of the different generation of the situation that contacts of test test specimen, thereby improve measuring accuracy.In conjunction with controllable temperature heat radiation protective shield of radiation, come and ancillary method reduces lateral heat flow loss, and adopt the one dimension that guarantees the thermograde of test material once the minimum test heat flux of optimizing, reach the object of the thermal physical property parameter of high precision measurement test specimen, this method can high-precision measurement same material and the interface thermal contact resistance of storeroom of the same race not.

In Fig. 1, the invention discloses a kind of proving installation of high precision thermal interfacial material, this device is the symmetrical structure of upper and lower positive and negative two-way heat flux measurement, comprise control system, support 3, the first ball jacket 4-1, the second ball jacket 4-2, sliding screw 5, directed steel ball and pressure transducer 6, auxiliary heater 7, vacuum (-tight) housing 9, test specimen test section 10, stress loading device, vacuum extraction gas port 13, intake-outlet 14, data acquisition system (DAS), sealed chassis 16, back up pad 17, levelling lever 20 and heater strip 21, it is characterized in that: stress loading device is comprised of hydraulic cylinder 11 and pressure power source 12, and hydraulic cylinder 11 is positioned at the top of pressure power source 12, data acquisition system (DAS) is comprised of temperature sensor, sealing data connector 15, and temperature sensor is connected with sealing data connector 15 by wire, control system is comprised of controllable temperature protective shield of radiation 2, heating and cooling cover 1 and control protective shield of radiation heater strip R2, sample testing district 10 comprises test test specimen, wherein directed steel ball and pressure transducer 6, support 3, back up pad 17 and heating and cooling cover are symmetrical Shang Xia 1, directed steel ball and pressure transducer 6 are fixed on back up pad 17 centers, stress loading device also contacts with directed steel ball and pressure transducer 6 by support 3 location, for sample loading stress, it is fixing that the first ball jacket 4-1 is arranged on two ends up and down and the back up pad 17 of sliding screw 5, the second ball jacket 4-2 is arranged on the bottom of sliding screw 5 fixing with support 3, auxiliary heater 7 is between back up pad 17 and heating and cooling cover 1, sample testing district 10 is between laterally zygomorphic two heating and coolings cover 1, two controllable temperature protective shield of radiations 2 are positioned at the outside in sample testing district 10, vacuum (-tight) housing 9 is positioned at the external stability of whole device in sealed chassis 16, sliding screw 5 is fixed on the top of sealed chassis 16, vacuum extraction gas port 13, intake-outlet 14 and sealing data connector 15 are all arranged in sealed chassis 16, hydraulic cylinder 11 runs through sealed chassis 16 center, in sealed chassis, be provided with four groups of levelling levers 20.

Fig. 2 is test philosophy schematic diagram of the present invention, carrying out in test process, according to the temperature sensor measurement temperature on thermal flow meter and test specimen, by the heating arrangement on control system regulation and control protective shield of radiation and thermal flow meter and the approximate thermograde of test specimen, with this, reduce thermal loss.In the position of the heating jacket that freezes up and down, also the corresponding auxiliary heater that is furnished with regulates and controls the temperature approximate with heating source and reduces thermal loss.

The first step, the choosing of the preparation of testing apparatus and test thermal flow meter and test specimen test point:

As depicted in figs. 1 and 2, can produce two standard materials (the present embodiment adopts 99.999% fine copper) thermal flow meter according to the coefficient of heat conductivity of known materials, process two Cu alloy material test specimens, test specimen is vertically arranged between two upper and lower symmetrically arranged refrigeration heating jackets, on two refrigeration heating jackets, be provided with stress loading device, on described test specimen, be provided with temperature sensor, temperature sensor is connected with data acquisition system (DAS), for testing the axial temperature of test specimen;

Position on test specimen between test point meets following relation: take the contact interface sectional position on two test specimen y directions as the plane of symmetry, test point position full symmetric on two test specimens, each test specimen all arranges 4 test points between from lower surface to upper surface, axial distance on each test specimen between adjacent two test points equates, distance between test point is dx=25mm, from the position of contact interface to test point, be 2mm, (T.x) of test specimen 1 as shown in Figure 2 ₈test point is 2mm to the distance of contact interface, and test specimen 2 is 2mm from the position of contact interface to test point equally.And by temperature sensor size equidistant probe mounting hole that processes temperature sensor on standard material thermal flow meter and test specimen, probe mounting hole≤the 0.5mm of described temperature sensor, in probe mounting hole, pass through the temperature sensor probe of welding or heat-conducting cream bonding≤0.5mm, temperature sensor is connected with data acquisition system (DAS) by the connector of chamber walls, and temperature sensor of the present invention adopts thermopair.

Second step, loads compressive stress (the present embodiment on-load pressure is 2MPa), and forward heats test specimen:

As shown in Figure 1 the test specimen that is furnished with 4 groups of temperature sensors is vertically installed in to upper and lower two ends and is arranged with thermal flow meter, refrigeration heating jacket, in the vacuum chamber of assisted heating device, for less thermal loss adds a controllable temperature protective shield of radiation that is embedded with heating arrangement at heat-insulation layer skin, after vacuumizing, carry out the forward heat flux measurement of heating bottom, top refrigeration, now controllable temperature protective shield of radiation simulates the thermograde of approximate test specimen, the auxiliary heater that top is arranged reduces the thermal loss of Y according to its temperature of temperature control of heating and cooling cover, while reaching stable state, carry out temperature data acquisition, now loading power can be by the heat flux that converts of the thermal flow meter that is arranged symmetrically with up and down,

The 3rd step, the calculating of collecting test point temperature and forward thermal contact resistance R ':

When adding forward heat flux measurement, as shown in Figure 2, according to (T.x) on test specimen 1 ₅, (T.x) ₆, (T.x) ₇with (T.x) ₈with the temperature gradient relation of 4 test point positions, and (T.x) on test specimen 2 ₉, (T.x) ₁₀, (T.x) ₁₁(T.x) ₁₂with the temperature gradient relation of 4 test point positions, by the extrapolate extrapolation interface temperature of the test specimen 1 that obtains of numerical method, be T _s-1', the extrapolation interface temperature of test specimen 2 is T _s-2'.

T _s-1′=a _s-1(T _s-1-T _ref)+E _s-1

T _s-2′=a _s-2(T _s-2-T _ref)+E _s-2

The interface temperature difference of two test specimens is: Δ T _s'=T _s-1'-T _s-2'

Wherein a _s-1and a _s-2for the coefficient of temperature sensor, T _s-1and T _s-2while being two test specimen positive tests in the actual temperature of contact interface, T _reffor the reference temperature of temperature sensor, E _s-1and E _s-2for the error term of temperature sensor.

Forward thermal contact resistance R ' is:

$R^{\text{'}}=\frac{\mathrm{\Δ}{T_s}^{\text{'}}}{Q}=\frac{a_{s-1}+a_{s-2}}{2}\·R+\frac{a_{s-1}-a_{s-2}}{2}\frac{(T_{s-1}+T_{s-2}-2T_{\mathrm{ref}})}{Q}+\frac{E_{s-1}-E_{s-2}}{Q}$

Wherein Q is heat flux.

As shown in Figure 4, forward loads respectively the heat flux from 1W～9.5W, and test specimen temperature starts collecting test temperature after reaching and stablizing;

The 4th step, loads compressive stress, oppositely loads hot-fluid, collecting test point temperature:

Under similarity condition, maintain and load the compressive stress (2MPa) identical with second step, reverse operating, carry out the reverse heat flux measurement of refrigeration bottom, top heating, equally now controllable temperature protective shield of radiation simulates the thermograde of approximate test specimen, the auxiliary heater that bottom is arranged to reduce the thermal loss of Y, gathers this temperature data according to its temperature of temperature control of heating and cooling cover when reaching stable state again.

The 5th step, oppositely thermal contact resistance R " calculating:

Equally according to the temperature gradient relation of the position of 3 test points on test specimen 1 and test specimen 2 and measurement temperature, the extrapolation temperature T of the contact interface of test specimen 1 while extrapolating by numerical method the negative testing obtaining _s-1" and the extrapolation temperature T of the contact interface of test specimen 2 _s-2":

${T_{s-1}}^{\text{'}\text{'}}=a_{s-1}({\stackrel{\←}{T}}_{s-1}-T_{\mathrm{ref}})+{\stackrel{\←}{E}}_{s-1}$

${T_{s-2}}^{\text{'}\text{'}}=a_{s-2}({\stackrel{\←}{T}}_{s-2}-T_{\mathrm{ref}})+{\stackrel{\←}{E}}_{s-2}$

Wherein,

with

be respectively the actual temperature at contact interface while being two test specimen negative testings, with

for the error term of temperature sensor;

In like manner reverse thermal contact resistance R " be:

$R^{\text{'}\text{'}}=\frac{\mathrm{\Δ}{T_s}^{\text{'}\text{'}}}{Q}=\frac{a_{s-1}+a_{s-2}}{2}\·R+\frac{a_{s-1}-a_{s-2}}{2}\frac{({\stackrel{\←}{T}}_{s-1}+{\stackrel{\←}{T}}_{s-2}-2T_{\mathrm{ref}})}{Q}-\frac{{\stackrel{\←}{E}}_{s-1}-{\stackrel{\←}{E}}_{s-2}}{Q}$

As shown in Figure 4, oppositely load respectively the heat flux from 1W～9.5W, test specimen temperature starts collecting test temperature after reaching and stablizing;

The 6th step, the calculating of thermal contact resistance R:

Because of the coefficient a of temperature sensor _s-1=a _s-2=1, thermal contact resistance R is:

$R=\frac{R^{\text{'}}+R^{\text{'}\text{'}}}{2}+\frac{(E_{s-1}-E_{s-2})-({\stackrel{\←}{E}}_{s-1}-{\stackrel{\←}{E}}_{s-2})}{Q}$

Now can make $(E_{s-1}-E_{s-2})\≈({\stackrel{\←}{E}}_{s-1}-{\stackrel{\←}{E}}_{s-2})\≈0,$ Thereby $R=\frac{R^{\text{'}}+R^{\text{'}\text{'}}}{2}.$

Fig. 4 be under 2MPa pressure forward and reverse thermal contact resistance R ' and R during forward and reverse loading heat flux " with the relation that loads heat flux, as shown in Figure 4, because of when heating power is less than 2W, now because the poor thermal loss of one dimension in temperature field is also larger, and now the one dimension in temperature field is better when heat flux is greater than 2W, and thermal loss also≤0.3%, so data while accepting and believing heat flux 3～9.5W, during forward heating test, thermal contact resistance R ' is on average about 0.330 ± 0.003K/W, when oppositely heating is tested, thermal contact resistance R " is about 0.305 ± 0.005K/W, when thereby visible multiple temperature sensors owing to arranging on test test specimen cause positive dirction test with the thermometric uncertain error of the different generation of the situation that contacts of test test specimen, deviation reaches 7.8%, the visible error that it causes can not be left in the basket, then this method thinks that actual thermal contact resistance is

Claims (5)

1. Gu positive and negative two-way heat flow method is surveyed a method of testing for solid-thermal contact resistance, it is characterized in that said method comprising the steps of:

The first step, the preparation of testing apparatus and test the choosing of test specimen test point:

Process two test specimens, test specimen is vertically arranged between two upper and lower symmetrically arranged refrigeration heating jackets, on two refrigeration heating jackets, is provided with stress loading device, on described test specimen, be provided with temperature sensor, temperature sensor is connected with data acquisition system (DAS), for testing the axial temperature of test specimen;

Position on test specimen between test point meets following relation: take the contact interface sectional position on two test specimen y directions as the plane of symmetry, test point position full symmetric on two test specimens, each test specimen all arranges n test point between from lower surface to upper surface, axial distance on each test specimen between adjacent two test points is equal, and the distance between test point is dx;

Second step, loads compressive stress, and forward heats test specimen:

One end heating wherein axial to two test specimens, the other end is cooling, and test specimen temperature starts collecting test temperature after reaching and stablizing; Described probe temperature comprises the measurement temperature T of n test point on each test specimen _i,j, i=1, n, n is test point number by plane of symmetry symmetry on each test specimen, j=1,2 represent respectively two different test specimens;

The 3rd step, the calculating of collecting test point temperature and forward thermal contact resistance R ':

Temperature in each test point on two test specimens is gathered and stored, and now on test specimen, the measurement temperature of n test point is T _i,j', i=1, n, j=1,2;

According to the position of n test point on each test specimen and measurement temperature T _i,j' temperature gradient relation, by numerical value extrapolation method, can obtain the extrapolation temperature T of two test specimens at contact interface place _s-1' and T _s-2', and then contact interface temperature difference T _s' be:

ΔT _s′=T _s-1′-T _s-2′

Now by known heat flux Q and then obtain forward thermal contact resistance

The 4th step, loads compressive stress, oppositely loads hot-fluid, collecting test point temperature:

Under similarity condition, load the compressive stress identical with second step, reverse operating, one end heating axial to two test specimens, one end is cooling, and test specimen temperature starts collecting test temperature after reaching and stablizing;

The 5th step, oppositely thermal contact resistance R " calculating:

Temperature in each test point on two test specimens is gathered and stored, and now on test specimen, the measurement temperature of n test point is T _i,j", i=1, n, j=1,2;

Equally, according to the position of n test point on each test specimen and measurement temperature T _i,j" temperature gradient relation, by numerical value extrapolation method, can obtain the extrapolation temperature T of two test specimens at contact interface place _s-1" and T _s-2", and then contact interface temperature difference T _s" be:

ΔT _s″=T _s-1″-T _s-2″

Now by known heat flux Q and then obtain reverse thermal contact resistance

The 6th step, the calculating of thermal contact resistance R:

When positive test, if the extrapolation temperature T of two test specimen contact interfaces _s-1' and T _s-2' be:

T _s-1′=a _s-1(T _s-1-T _ref)+E _s-1

T _s-2′=a _s-2(T _s-2-T _ref)+E _s-2

Wherein a _s-1and a _s-2for the coefficient of temperature sensor, T _s-1and T _s-2while being two test specimen positive tests in the actual temperature of contact interface, T _reffor the reference temperature of temperature sensor, E _s-1and E _s-2for the error term of temperature sensor;

Forward thermal contact resistance R ' is:

In like manner, the extrapolation temperature T of two test specimen contact interfaces during negative testing _s-1" and T _s-2" be:

Wherein,

with while being two test specimen negative testings in the actual temperature of contact interface,

with

for the error term of temperature sensor;

In like manner reverse thermal contact resistance R " be:

Because of the coefficient a of temperature sensor _s-1=a _s-2=1, thermal contact resistance R is:

Now can make

thereby

2. Gu positive and negative two-way heat flow method according to claim 1 is surveyed the method for testing of solid-thermal contact resistance, it is characterized in that test specimen is right cylinder or rectangular parallelepiped.

3., Gu positive and negative two-way heat flow method according to claim 1 is surveyed the method for testing of solid-thermal contact resistance, it is characterized in that when positive and negative two-way test contact interface temperature T _s-1', T _s-1" and T _s-2', T _s-2" calculating adopt least square method to carry out that linear fit solves or Inverse Problem Method solves.

Positive and negative two-way heat flow method solid 4. according to claim 1 is surveyed the method for testing of solid-thermal contact resistance, it is characterized in that at test test specimen two ends or any one end axially adds the standard thermal flow meter of same sectional dimension.

5., Gu positive and negative two-way heat flow method according to claim 1 is surveyed the method for testing of solid-thermal contact resistance, it is characterized in that described temperature sensor adopts thermopair, PT100 or PT25.

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