CN102830134B - Up-and-down constant-temperature parameter identifying method for testing thermal interface material performance - Google Patents
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- CN102830134B CN102830134B CN201210278771.8A CN201210278771A CN102830134B CN 102830134 B CN102830134 B CN 102830134B CN 201210278771 A CN201210278771 A CN 201210278771A CN 102830134 B CN102830134 B CN 102830134B
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Abstract
The invention discloses an up-and-down constant-temperature parameter identifying method for testing the thermal interface material performance. The up-and-down constant-temperature parameter identifying method comprises the following steps: step one, preparing a standard material thermal flow meter; step two, placing a thermal interface material between contact interfaces of two thermal flow meters, loading pressure stress, and heating the thermal flow meters forward; step three, amending measuring temperature of a test point; step four, calculating a contact thermal resistance R; and step five, measuring the thickness L of the thermal interface material, and calculating the equivalent heat conducting coefficient of the thermal interface material. According to the invention, a symmetrical testing structure which is amended by up-and-down constant-temperature parameter identification is adopted for measuring, the inconsistent error of temperature measurement caused by different contact thermal resistance of each temperature sensor and the thermal flow meters or incomplete linearity of temperature and the like can be eliminated, and further the performance of the thermal interface material with high accuracy can be measured on the premise that the thermal flow rate is ensured.
Description
Technical field
The invention belongs to technical field of measurement and test, be specifically related to a kind of thermal contact resistance method of testing and equipment, be applicable to the test to the interface thermal contact resistance of common used material, be particularly useful for the performance test to thermal interfacial material.
Background technology
Thermal contact resistance is a parameter that affected by the many factors such as material property, mechanical property, surface topography, contact, temperature, clearance material.Whether stable according to experiment hot-fluid, generally thermal contact resistance measuring method is divided into Transient Method and steady state method.Transient Method is also a kind of conventional thermal contact resistance experimental measurement method, it mainly comprises photothermal laser mensuration, thermal imaging method, " flash " flicker method, laser optoacoustic method etc., wherein photothermal laser mensuration comprises again modulation photo-thermal method and heat scan method, and modulation photo-thermal method has again dividing of photo-thermal amplitude method, photo-thermal phase method and impulse method.Though although various Transient Method is suitable for Quick Measurement and can measures the little film to nanometer scale, its measuring process is subject to various factors impact, and derivation of equation relative complex, measuring accuracy is also difficult to ensure card.Therefore, what interface thermal contact resistance measuring method was the most frequently used is steady state method: on two contact samples, maintain certain temperature difference, measure the temperature value of two samples on axially, thereby then by Fourier law, be extrapolated to contact interface place and obtain the temperature difference on interface; Heat flux can be measured or be calculated by thermal conductivity and the thermograde of specimen material by thermal flow meter, thus R=|T1-T2|/Q.It is similar with the testing standard equipment of American National Standard ASTMD5470-06 mostly stable state thermal contact resistance method of testing is, but have document to point out because thermometric uncertain error and thermal loss error are difficult to guarantee that interface thermal contact resistance is had to sufficiently high measuring accuracy more.
Summary of the invention
The object of the present invention is to provide a kind of upper and lower constant temperature parameter identification method calorimetric boundary material thermal contact resistance, the thermal contact resistance that records thermal interfacial material and equivalence unit coefficient of heat conductivity that can very high degree of precision under the prerequisite that guarantees heat flux precision.
The technical solution that realizes the object of the invention is: upper and lower constant temperature parameter identification method calorimetric boundary material performance, is characterized in that following steps:
The first step, the preparation of testing standard material thermal flow meter.
Process the thermal flow meter of two standard materials, thermal flow meter is vertically coaxially installed between two heating and cooling covers, at two heating and coolings, put and be provided with stress loading device, on described thermal flow meter, be provided with temperature sensor, temperature sensor is connected with data acquisition system (DAS), for the axial temperature of test sample;
Position on thermal flow meter between test point meets following relation: the contact interface sectional position of take on two thermal flow meter axial directions is the plane of symmetry, test point position full symmetric on two thermal flow meters, axial distance between adjacent two test points on each thermal flow meter equates, each thermal flow meter arranges n test point between from lower surface to upper surface, and the distance between test point is dx;
Second step, places thermal interfacial material between two thermal flow meter contact interfaces, loads compressive stress, and forward heats thermal flow meter:
To two one end heating wherein that thermal flow meter is axial, the other end is cooling, and specimen temperature starts collecting test temperature after reaching and stablizing; Described probe temperature comprises the measurement temperature T of n test point on each thermal flow meter
i,j, i=1, n, n is test point number symmetrical by the plane of symmetry on thermal flow meter, j=1,2 represent respectively two different thermal flow meters;
The 3rd step, test point is measured the correction of temperature;
Carrying out under sufficient adiabatic condition, a steady temperature is set in the two ends of thermal flow meter simultaneously, specimen temperature starts collecting test temperature after reaching and stablizing; Described probe temperature comprises the measurement temperature of n test point on thermal flow meter
i=1, n, n is test point number on thermal flow meter;
To the temperature measurement range of the n gathering in a second step test point, according to precision, need to carry out the measurement temperature acquisition that above-mentioned many steady temperatures point repeats n test point on thermal flow meter, and the measurement temperature of each test point on thermal flow meter and the steady temperature setting are carried out to parameter identification analysis, carry out the synthetic related function of linear fit or multivariate quasi;
The 4th step, the calculating of thermal contact resistance R;
Related function in the 3rd step is solved the measurement temperature of each test point gathering in step 2, obtain a correction temperature
i=1, n, n is test point number on thermal flow meter;
And then ignoring hot-fluid loss in the situation that, the thermal contact resistance R that calculates thermal flow meter that can degree of precision;
The 5th step, thermal interfacial material thickness L measures, the calculating of the equivalent heat conductivity of thermal interfacial material;
Reference point locations by the in-situ measurement system in two thermal flow meter contact interface location arrangements changes the thickness L that records thermal interfacial material, calculates apparent thermal contact resistance R
afor: R
a=A * R, wherein A is contact area, thus equivalent effective thermal conductivity k
efffor:
For guaranteeing the one dimension of thermograde, thermal flow meter be right cylinder or rectangular parallelepiped.
When positive and negative two-way test to contact interface temperature T
s-1', T
s-1' ' and T
s-2', T
s-2' ' calculating also can adopt least square method to carry out that linear fit solves or Inverse Problem Method solves.
In-situ measurement system is equipped with in contact interface position at two thermal flow meters.
The present invention compared with prior art, a kind of method that adopts upper and lower constant temperature parameter identification method calorimetric boundary material of the present invention adopts the symmetrical test structure of upper and lower constant temperature parameter identification correction to measure cancellation substantially because the thermal contact resistance of each temperature sensor and thermal flow meter is different or temperature is not exclusively the thermometric inconsistency error that the reason such as linear causes, and then the thermal contact resistance that records thermal flow meter that can very high degree of precision under the prerequisite that guarantees heat flux precision.
Accompanying drawing explanation
Fig. 1 is the front view of proving installation of the present invention;
Fig. 2 is system testing schematic diagram of the present invention;
Fig. 3 is the front view of Plays thermal flow meter 1 of the present invention;
Fig. 4 is for adopting the inventive method temperature deviation on thermal flow meter 1 and 2 when upper and lower constant temperature is tested;
Parameter when Fig. 5 carries out related function matching for employing the inventive method to the temperature deviation on thermal flow meter 1 and 2;
Fig. 6 for adopt the inventive method when pressure 2MPa respectively on heating and the resulting thermal contact resistance of lower heating carry out the thermal contact resistance that obtains after thermostat temperature correction with the relation of heat flux;
Embodiment
The present invention has proposed a kind of performance that adopts upper and lower constant temperature parameter identification method calorimetric boundary material on American National Standard ASTM D5470 basis, described method of testing is to adopt the symmetrical test structure of constant temperature up and down, by test thermal flow meter being carried out to inconsistency error and the thermal loss error of upper and lower each temperature sensor of steady temperature parameter identification cancellation, in conjunction with controllable temperature heat radiation protective shield of radiation, come and ancillary method reduces hot-fluid loss, reach the object of the thermal physical property parameter of high precision measurement thermal interfacial material, this method can high-precision measurement be filled interface thermal contact resistance and the equivalence unit coefficient of heat conductivity after thermal interfacial material.
Below in conjunction with accompanying drawing, the present invention is described in further detail.
In conjunction with Fig. 1, the invention discloses a kind of device that adopts upper and lower constant temperature parameter identification method calorimetric boundary material, the symmetrical structure that this device is upper and lower positive and negative two-way heat flux measurement, comprise control system, support 3, the first ball jacket 4-1, the second ball jacket 4-2, sliding screw 5, directed steel ball and pressure transducer 6, auxiliary heater 7, vacuum (-tight) housing 9, test specimen test section 10, stress loading device, vacuum extraction gas port 13, intake-outlet 14, data acquisition system (DAS), sealed chassis 16, back up pad 17, levelling lever 20 and heater strip 21, it is characterized in that: stress loading device is comprised of hydraulic cylinder 11 and pressure power source 12, and hydraulic cylinder 11 is positioned at the top of pressure power source 12, data acquisition system (DAS) is comprised of temperature sensor, sealing data connector 15, and temperature sensor is connected with sealing data connector 15 by wire, control system is comprised of controllable temperature protective shield of radiation 2, heating and cooling cover 1 and control protective shield of radiation heater strip R2, sample testing district 10 comprises test test specimen, wherein directed steel ball and pressure transducer 6, support 3, back up pad 17 and heating and cooling cover are symmetrical Shang Xia 1, directed steel ball and pressure transducer 6 are fixed on back up pad 17 centers, stress loading device also contacts with directed steel ball and pressure transducer 6 by support 3 location, for sample loading stress, it is fixing that the first ball jacket 4-1 is arranged on two ends up and down and the back up pad 17 of sliding screw 5, the second ball jacket 4-2 is arranged on the bottom of sliding screw 5 and fixes with support 3, auxiliary heater 7 is between back up pad 17 and heating and cooling cover 1, sample testing district 10 is between laterally zygomorphic two heating and coolings cover 1, two controllable temperature protective shield of radiations 2 are positioned at the outside in sample testing district 10, vacuum (-tight) housing 9 is positioned at the external stability of whole device in sealed chassis 16, sliding screw 5 is fixed on the top of sealed chassis 16, vacuum extraction gas port 13, intake-outlet 14 and sealing data connector 15 are all arranged in sealed chassis 16, hydraulic cylinder 11 runs through sealed chassis 16 center, in sealed chassis, be provided with four groups of levelling levers 20.
Fig. 2 is test philosophy schematic diagram of the present invention, in carrying out test process, regulates and controls heating arrangement on protective shield of radiation make it reach the thermograde approximate with thermal flow meter to reduce hot-fluid loss with this according to the measurement temperature of the temperature sensor on thermal flow meter.In the position of upper and lower heating and cooling cover, also the corresponding auxiliary heater that is furnished with regulates and controls the temperature approximate with heating source and reduces thermal loss.
In Fig. 3, in the present invention, be fitted with the front view of the standard thermal flow meter 1 of temperature sensor, on this thermal flow meter, be fitted with 3 groups of temperature sensors that the upper and lower symmetry in position has strict demand.Standard thermal flow meter can be processed into right cylinder or rectangular parallelepiped, the plug-in opening of temperature sensor has strict positional precision and form accuracy requirement, and ensure enough symmetries up and down, before plug-in mounting temperature sensor, to standard thermal flow meter, (what present case selected is Elkonite copper-tungsten alloy30W3 material, coefficient of heat conductivity is 216 ± 2W/m K, and hardness is 276HV) carry out alcohol, acetone, isopropyl acetone and Ultrasonic Cleaning.Temperature sensor is symmetrical equidistant arrangement, and the probe of temperature sensor is by welding or heat-conducting cream bonding plug-in opening.The temperature sensor that the present embodiment adopts is thermal resistance.
The invention discloses a kind of upper and lower constant temperature parameter identification method and measure the method for the thermal contact resistance of Graphite pad thermal interfacial material, its testing procedure is as follows:
The first step, the preparation of testing standard material thermal flow meter.
As depicted in figs. 1 and 2, why upper and lower thermal flow meter selects 30W3 tungsten-copper alloy to consider following reason: because the good heat conductivility of copper and the high strength of tungsten make it to reach good balance between material hardness and heat conductivility, so can reduce to destroy the possibility of contact end face surface topography in use procedure for a long time.Produce two standard materials (Elkonite copper-tungsten alloy30W3 material) thermal flow meter, process two tungsten-copper alloy material thermal flow meters, thermal flow meter is vertically arranged between two upper and lower symmetrically arranged heating and cooling covers, at two heating and coolings, put and be provided with stress loading device, on described thermal flow meter, be provided with temperature sensor, temperature sensor is connected with data acquisition system (DAS), for testing the axial temperature of thermal flow meter, if the temperature sensor adopting is thermopair, 1-4 the thermopair being evenly arranged according to this thermal flow meter axial cross section on average tried to achieve the temperature of this axial point, if the temperature sensor adopting is thermal resistance, 1-4 the thermal resistance that thermal flow meter axial cross section is evenly arranged to thermometric adopts 4 line connection processed, the exciting current of the 1-4 that this is evenly arranged thermal resistance is identical, and the lead-in wire of the 1-4 that this is evenly arranged a thermal resistance signal acquisition end can adopt parallel connection method on average to try to achieve the temperature of this axial point and reduce the hot-fluid loss that the lead-in wire because of thermal resistance causes.
Position on thermal flow meter between test point meets following relation: the contact interface sectional position of take on two thermal flow meter y directions is the plane of symmetry, test point position full symmetric on two thermal flow meters, each thermal flow meter all arranges 4 test points between from lower surface to upper surface, axial distance on each thermal flow meter between adjacent two test points equates, distance between test point is dx=25mm, from the position of contact interface to test point, be 2mm, (T.x) of thermal flow meter 1 as shown in Figure 2
3test point is 2mm to the distance of contact interface, and thermal flow meter 2 is 2mm from the position of contact interface to test point equally.And by temperature sensor size equidistant probe mounting hole that processes temperature sensor on standard material thermal flow meter and thermal flow meter, probe mounting hole≤the 0.5mm of described temperature sensor, in probe mounting hole, pass through the temperature sensor probe of welding or heat-conducting cream bonding≤0.5mm, temperature sensor is connected with data acquisition system (DAS) by the connector of chamber walls, and temperature sensor of the present invention adopts four-wire system thermal resistance.
Second step, places thermal interfacial material between two thermal flow meter contact interfaces, loads compressive stress, and forward heats thermal flow meter:
As depicted in figs. 1 and 2 by be furnished with 3 groups of temperature sensors thermal flow meter 1 and 2 be vertically installed in two ends and have thermal flow meter, heating and cooling cover, in the vacuum chamber of assisted heating device, for reducing thermal loss, at heat-insulation layer skin, add a controllable temperature protective shield of radiation that is embedded with heating arrangement, after vacuumizing, carry out the forward heat flux measurement of heating bottom, top refrigeration, now controllable temperature protective shield of radiation simulates the thermograde of approximate thermal flow meter, the auxiliary heater that top is arranged is controlled its temperature to reduce the thermal loss of Y according to the temperature of heating and cooling cover, while reaching stable state, carry out temperature data acquisition, now loading power can be by the heat flux that converts of the thermal flow meter that is arranged symmetrically with up and down.
For example, at pressure 2MPa, when heat flux is 3.5W, record (T.x) on thermal flow meter 1
1=25.053, (T.x)
2=24.658, (T.x)
3=24.257, (T.x) on thermal flow meter 2
4=23.038, (T.x)
5=22.64 and (T.x)
6=22.243.
The 3rd step, test point is measured the correction of temperature:
Carrying out under sufficient adiabatic condition, to (T.x) on the thermal flow meter 1 gathering in step 2
1, (T.x)
2(T.x)
3and (T.x) on thermal flow meter 2
4, (T.x)
5(T.x)
6totally 6 test points to the heating and cooling cover being arranged symmetrically with up and down the stable state image data of carrying out 7 steady temperature points from 22～28 ℃.As shown in Figure 4, set steady temperature the record (T.x) of heating and cooling cover
1, (T.x)
2, (T.x)
3, (T.x)
4, (T.x)
5(T.x)
6the measurement temperature of test point
with
deviation with this steady temperature.Present case is by carrying out y=A0 * x
3+ A1 * x
2the equation with many unknowns function of+A2 * x+A3 carries out data fitting to this temperature deviation and steady temperature, and parameter A 0, A1, A2 and the A3 of matching are as shown in Figure 5.
The 4th step, the calculating of thermal contact resistance R:
As shown in Figure 6, for example, when heat flux is 3.5W, (T.x)
1=25.053, (T.x)
2=24.658, (T.x)
3=24.257 and (T.x)
4=23.038, (T.x)
5=22.64 and (T.x)
6in the matching related function of totally 6 test points of=22.243 temperature value substitution the 3rd step, obtain temperature deviation value, thereby obtain
When adding forward heat flux measurement, when heat flux is 3.5W, revised according to (T.x) on thermal flow meter 1
1, (T.x)
2(T.x)
3with the revised temperature gradient relation of 3 test point positions, and (T.x) on thermal flow meter 2
4, (T.x)
5(T.x)
6with the revised temperature gradient relation of 3 test point positions, by the extrapolate extrapolation interface temperature of the thermal flow meter 1 that obtains of numerical method, be
the extrapolation interface temperature of thermal flow meter 2 is
The interface temperature difference of two thermal flow meters is:
Then thermal contact resistance
for:
Wherein Q is heat flux.
As shown in Figure 6, at pressure 2MPa, heat flux is when 3.5W, and upper heating is by the temperature (T.x) that does not have on thermal flow meter 1 and thermal flow meter 2 to revise
5=25.053, (T.x)
6=24.658, (T.x)
7=24.257, (T.x)
9=23.038, (T.x)
10=22.64 and (T.x)
11=22.243 thermal contact resistance values that calculate are 0.33K/W, and adopt revised temperature
With
The thermal contact resistance value calculating is 0.307 K/W.In like manner, the thermal contact resistance that the upper and lower different direction of heat flow of employing shown in Fig. 6 are calculated is worth measured temperature value to be revised, and obtains the different direction of heat flow up and down shown in Fig. 6 the thermal contact resistance value calculating and the relation that adopts the same loading of the thermal contact resistance value hot-fluid obtaining after the correction of this method temperature.
The 5th step, thermal interfacial material thickness L measures, the calculating of the equivalent heat conductivity of thermal interfacial material;
Reference point locations by the in-situ measurement system in two thermal flow meter contact interface location arrangements changes the thickness L=0.2mm that records thermal interfacial material, calculates apparent thermal contact resistance R
afor: R
a=A * R=150.698mm
2k/W, wherein contact area is A=490.874mm
2thereby, equivalent effective thermal conductivity k
efffor:
The above is the detailed description of preferred embodiment of the present invention and schemes attached; not be used for limiting the present invention; all scopes of the present invention should be as the criterion with patent right book scope required for protection; the embodiment of design philosophy all and of the present invention and similar variation thereof, approximate construction, all should be contained among scope of patent protection of the present invention.
Claims (3)
1. adopt a method for upper and lower constant temperature parameter identification method calorimetric boundary material performance, it is characterized in that following steps:
The first step, the preparation of testing standard material thermal flow meter;
Process the thermal flow meter of two standard materials, thermal flow meter is vertically coaxially installed between two heating and cooling covers, at two heating and coolings, put and be provided with stress loading device, on described thermal flow meter, be provided with temperature sensor, temperature sensor is connected with data acquisition system (DAS), for the axial temperature of test sample;
Position on thermal flow meter between test point meets following relation: the contact interface sectional position of take on two thermal flow meter axial directions is the plane of symmetry, test point position full symmetric on two thermal flow meters, axial distance between adjacent two test points on each thermal flow meter equates, each thermal flow meter arranges n test point between from lower surface to upper surface, and the distance between test point is dx;
Second step, places thermal interfacial material between two thermal flow meter contact interfaces, loads compressive stress, and forward heats thermal flow meter:
To two one end heating wherein that thermal flow meter is axial, the other end is cooling, and specimen temperature starts collecting test temperature after reaching and stablizing; Described probe temperature comprises the measurement temperature T of n test point on each thermal flow meter
i,j, i=1, n, n is test point number symmetrical by the plane of symmetry on thermal flow meter, j=1,2 represent respectively two different thermal flow meters;
The 3rd step, test point is measured the correction of temperature;
Carrying out under sufficient adiabatic condition, a steady temperature is set in the two ends of thermal flow meter simultaneously, specimen temperature starts collecting test temperature after reaching and stablizing; Described probe temperature comprises the measurement temperature of n test point on thermal flow meter
i=1, n, n is test point number on thermal flow meter; J=1,2 represent respectively two different thermal flow meters;
To the temperature measurement range of the n gathering in a second step test point, according to precision, need to carry out the measurement temperature acquisition that above-mentioned many steady temperatures point repeats n test point on thermal flow meter, and the measurement temperature of each test point on thermal flow meter and the steady temperature setting are carried out to parameter identification analysis, carry out the synthetic related function of linear fit or multivariate quasi;
The 4th step, the calculating of thermal contact resistance R;
Related function in the 3rd step is solved the measurement temperature of each test point gathering in step 2, obtain a correction temperature
i=1, n, n is test point number on thermal flow meter; J=1,2 represent respectively two different thermal flow meters;
And then ignoring hot-fluid loss in the situation that, the thermal contact resistance R that calculates thermal flow meter that can degree of precision;
The 5th step, thermal interfacial material thickness L measures, the calculating of the equivalent heat conductivity of thermal interfacial material;
Reference point locations by the in-situ measurement system in two thermal flow meter contact interface location arrangements changes the thickness L that records thermal interfacial material, calculates apparent thermal contact resistance R
afor: R
a=A * R, wherein A is contact area, thus equivalent effective thermal conductivity k
efffor:
2. the method for the upper and lower constant temperature parameter identification of employing according to claim 1 method calorimetric boundary material performance, is characterized in that: thermal flow meter is right cylinder or rectangular parallelepiped.
3. the method for the upper and lower constant temperature parameter identification of employing according to claim 1 method calorimetric boundary material performance, is characterized in that: when positive and negative two-way test to contact interface temperature T
s-1', T
s-1" and T
s-2', T
s-2" calculating adopt least square method to carry out that linear fit solves or Inverse Problem Method solves.
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| CN104215661B (en) * | 2014-09-02 | 2017-02-22 | 兰州大学 | Solid interface contact thermal resistance test device based on super-magnetostrictive intelligent material |
| CN105388184A (en) * | 2015-12-17 | 2016-03-09 | 北京航空航天大学 | Specimen installation fixture used for contact thermal resistance testing |
| CN106093108B (en) * | 2016-05-19 | 2018-10-16 | 南京航空航天大学 | Unidirectional fibre toughening composition Equivalent Thermal Conductivities predictor method based on interstitial defect identification |
| CN109839406B (en) * | 2019-03-27 | 2022-08-09 | 桂林电子科技大学 | High-precision testing method for interface contact thermal resistance |
| CN110411397A (en) * | 2019-07-10 | 2019-11-05 | 南京航空航天大学 | A kind of on-Line Monitor Device and method of horizontal flue bottom dust stratification thickness |
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