CN102748595A - Light emitting diode (LED) light source device - Google Patents
Light emitting diode (LED) light source device Download PDFInfo
- Publication number
- CN102748595A CN102748595A CN2011100973411A CN201110097341A CN102748595A CN 102748595 A CN102748595 A CN 102748595A CN 2011100973411 A CN2011100973411 A CN 2011100973411A CN 201110097341 A CN201110097341 A CN 201110097341A CN 102748595 A CN102748595 A CN 102748595A
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- light source
- source device
- substrate
- emitting diode
- led light
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Abstract
The invention discloses a light emitting diode (LED) light source device which comprises a substrate, a reflecting cup arranged on the substrate and at least one LED chip which is accommodated in the reflecting cup and is arranged on the substrate. A plurality of groups of sliding chutes are respectively formed in the inner surface of the reflecting cup; and the LED light source device further comprises a fluorescent layer which is selectively inserted into one of groups of the sliding chutes and shields the light emergent direction of the LED chip so as to change the relative distance between the LED chip and the fluorescent layer and further change the emergent light color temperature. According to the LED light source device disclosed by the invention, the sliding chutes are formed in the inner surface of the accommodating cup; and the fluorescent layer is inserted into different sliding chutes, so the distance between the fluorescent layer and the LED chip is changed, the excited efficiency of fluorescent powder in the fluorescent layer is further changed and the adjustment on the emergency light color temperature of the LEDD light source is realized.
Description
Technical field
The present invention relates to a kind of lighting device, especially a kind of LED light source device.
Background technology
Light emitting diode is a kind of energy-saving and environmental protection, long-life solid light source, and therefore very active always to the research of led technology in recent ten years, light emitting diode also has the trend of conventional light source such as replacing fluorescent lamp, incandescent lamp gradually.In the prior art, LED light source device generally is that light emitting diode is arranged on the circuit board, utilizes this light emitting diode of packing colloid encapsulation that mixes fluorescent material then, and the optical excitation fluorescent material that said light emitting diode sends injects to the light source outside.But, because the phosphor powder layer position after the encapsulation is changeless,, can't adjust so the colour temperature of the light that LED source sends also is changeless, can not satisfy actual needs.
Summary of the invention
In view of this, be necessary to provide a kind of phosphor powder layer adjustable LED light source device.
A kind of LED light source device, it comprises substrate, be arranged on the reflector on the substrate and be contained in the reflector and be arranged at least one light-emitting diode chip for backlight unit on the substrate.Said reflector inner surface offers many group chutes respectively.Said LED light source device also comprises a fluorescence coating; Said fluorescence coating selectivity is plugged in a group in many group chutes and blocks the light direction at light-emitting diode chip for backlight unit, changes the bright dipping colour temperature to change fluorescence coating with respect to the distance of light-emitting diode chip for backlight unit.
Above-mentioned LED light source device is offered many group chutes on the inner surface of ccontaining cup; Through fluorescence coating being inserted into different chutes; Change the distance between fluorescence coating and the light-emitting diode chip for backlight unit; And then the efficient that is excited of fluorescent material in the change fluorescence coating, realize adjustment to the bright dipping colour temperature of LED source.
Description of drawings
Fig. 1 is inserted into the overall structure sketch map in the LED light source device process for fluorescence coating in the embodiment of the present invention.
Fig. 2 is the profile along the II-II direction of the LED light source device shown in Fig. 1.
Fig. 3 is the profile along the III-III direction of the LED light source device shown in Fig. 1.
The main element symbol description
| LED light source device | 10 |
| |
100 |
| Reflector | 200 |
| Light-emitting diode chip for |
300 |
| |
400 |
| |
500 |
| Electrode | 110 |
| Antetheca | 210 |
| |
220 |
| |
230 |
| Socket | 211 |
| |
231 |
| |
232 |
| The |
233 |
The following specific embodiment will combine above-mentioned accompanying drawing to further specify the present invention.
The specific embodiment
To combine accompanying drawing below, the present invention will be done further detailed description.
See also Fig. 1, Fig. 2 and Fig. 3, a kind of LED light source device 10 that the present invention's one preferred embodiments provides comprises substrate 100, be arranged on reflector 200 on the substrate 100, be contained in the reflector 200 and be arranged on a plurality of light-emitting diode chip for backlight unit 300 and the fluorescence coating 400 on the substrate 100.
The material of said substrate 100 is that materials such as sapphire, carborundum, silicon constitute, and is formed with electrode 110 on it.
Said reflector 200 is arranged on the substrate 100, and it is used to set the light field of LED light source device 10.Reflector 200 comprises antetheca 210, rear wall 220 and two sidewalls 230 that connect antetheca 210 and rear wall 220.Antetheca 210, rear wall 220 and two sidewalls 230 surround a ccontaining cup jointly.The inner surface of antetheca 210, rear wall 220 and sidewall 230 is respectively an inclined plane; This inclined plane is upwards outward-dipping from substrate 100; Be that these inclined planes are along tilting away from extending on substrate 100 directions; Make the inside of reflector 200 form a funnel shaped, and the inner surface of antetheca 210, rear wall 220 and sidewall 230 also is coated with reflectorized material respectively.Wherein, In the inner surface upper edge of two sidewalls 230 parallel substrate 100 directions respectively correspondence offer a pair of first chute 231, a pair of second chute 232 and a pair of the 3rd chute 233; This first chute 231, second chute 232 and the 3rd chute 233 are more and more far away apart from the distance of substrate 100, and connect the two ends of sidewall 230.Offer the socket 211 of corresponding first chute 231, second chute 232 and the 3rd chute 233 on the antetheca 210 of reflector 200 respectively.
What can expect is that the quantity of chute is not limited to three pairs of chutes in this embodiment, can confirm the quantity of chute according to actual needs.
Said a plurality of light-emitting diode chip for backlight unit 300 is arranged on the substrate 100, and is connected with electrode 110 on the substrate 100.This also coats one deck packaging body 500 above a plurality of light-emitting diode chip for backlight unit 300, and said packaging body 500 is a sealing resin, is used to protect influences such as light-emitting diode chip for backlight unit 300 dust, aqueous vapor.What can expect is that the quantity of said light-emitting diode chip for backlight unit 300 also can be one.
Said fluorescence coating 400 is a platy structure; It can optionally be plugged in respectively in first chute 231, second chute 232 and the 3rd chute 233 by the socket 211 on the antetheca 210 of reflector 200, thereby blocks on the bright dipping light path of light-emitting diode chip for backlight unit 300.Light that light-emitting diode chip for backlight unit 300 sends is through fluorescence coating 400, penetrates after exciting fluorescent material wherein.Fluorescence coating 400 is to have the sealing of fluorescent material resin to process by mixing, and said fluorescent material can be selected from one or more the combination in yttrium-aluminium-garnet, terbium yttrium-aluminium-garnet and the silicate.
Certainly, what can expect is, the quantity of said fluorescence coating 400 can be for a plurality of, and these a plurality of fluorescence coatings 400 optionally are plugged in respectively in the different chutes, thereby increases the alternative and the diversity of bright dipping colour temperature.
In use; When fluorescence coating 400 is inserted in first chute 231, second chute 232 and the 3rd chute 233 respectively; Its distance with respect to light-emitting diode chip for backlight unit 300 is different; Suffered light intensity is different, thereby the efficient that is excited of the fluorescent material in the fluorescence coating 400 also is different, and then makes that the colour temperature of the light that penetrates from fluorescence coating 400 is different.When fluorescence coating 400 near more apart from light-emitting diode chip for backlight unit 300; The light intensity that shines on the fluorescence coating 400 is strong more; The efficient that is excited of the fluorescent material in the fluorescence coating 400 is also just high more, otherwise, when fluorescence coating 400 far away more apart from light-emitting diode chip for backlight unit 300; Shine on the fluorescence coating 400 light intensity more a little less than, the efficient that is excited of the fluorescent material in the fluorescence coating 400 is also just low more.For example; Please consult 2 once more, when fluorescence coating 400 was inserted into first chute 231, it was H1 with respect to substrate 100 surface height; The area that light-emitting diode chip for backlight unit 300 shines fluorescence coating 400 is S1; When fluorescence coating 400 was inserted into second chute 232, it was H2 with respect to substrate 100 surface height, and the area that light-emitting diode chip for backlight unit 300 shines fluorescence coating 400 is S2.Since when fluorescence coating 400 is inserted into second chute 232 apart from the height H 1 of light-emitting diode chip for backlight unit 300 less than fluorescence coating 400 when being inserted into first chute 231 apart from the height H 2 of light-emitting diode chip for backlight unit 300; So the suffered intensity of illumination of fluorescence coating 400 is different; Thereby the efficient that is excited of the fluorescent material in it is also just different, thereby cause last bright dipping colour temperature different.Therefore through fluorescence coating 400 optionally being inserted in first chute 231, second chute 232 and the 3rd chute 233; Thereby adjustment fluorescence coating 400 is with respect to the height of substrate 100; Change the suffered intensity of illumination of fluorescence coating 400, can realize adjusting LED light source device 10 colour temperatures.
Compared to prior art; LED light source device of the present invention is offered many group chutes on the inner surface of ccontaining cup; Through fluorescence coating being inserted into different chutes; Change the distance between fluorescence coating and the light-emitting diode chip for backlight unit, and then change the efficient that the fluorescent material in the fluorescence coating is excited, realize adjustment the bright dipping colour temperature of LED source.
It is understandable that, for the person of ordinary skill of the art, can make change and the distortion that other various pictures are answered by technical conceive according to the present invention, and all these change the protection domain that all should belong to claim of the present invention with distortion.
Claims (7)
1. LED light source device; It comprises substrate, be arranged on the reflector on the substrate and be contained in the reflector and be arranged at least one light-emitting diode chip for backlight unit on the substrate; It is characterized in that; Said reflector inner surface offers many group chutes respectively; Said LED light source device also comprises a fluorescence coating, and said fluorescence coating selectivity is plugged in a group in many group chutes and blocks the light direction at light-emitting diode chip for backlight unit, changes the bright dipping colour temperature to change fluorescence coating with respect to the distance of light-emitting diode chip for backlight unit.
2. LED light source device as claimed in claim 1 is characterized in that: said reflector comprises antetheca, rear wall and two sidewalls that connect antetheca and rear wall, and said antetheca, rear wall and inside surface of side wall are coated with reflectorized material respectively.
3. LED light source device as claimed in claim 2 is characterized in that: said antetheca, rear wall and inside surface of side wall are respectively an inclined plane, and this inclined plane is upwards outward-dipping from substrate.
4. LED light source device as claimed in claim 2; It is characterized in that: said many group chutes correspondence respectively are formed on the said sidewall; Offer the socket of the said chute of a plurality of correspondences on the antetheca of said reflector, said fluorescence coating can be inserted into respectively in a plurality of chutes by these a plurality of sockets.
5. LED light source device as claimed in claim 1 is characterized in that: said many group chutes are parallel said substrate and more and more far away apart from the distance of said substrate respectively.
6. LED light source device as claimed in claim 1 is characterized in that: also coat one deck packaging body on the said light-emitting diode chip for backlight unit, said packaging body is a sealing resin.
7. LED light source device as claimed in claim 1 is characterized in that: said fluorescence coating has the sealing of fluorescent material resin to process by mixing, and said fluorescent material is selected from one or more the combination in yttrium-aluminium-garnet, terbium yttrium-aluminium-garnet and the silicate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110097341.1A CN102748595B (en) | 2011-04-19 | 2011-04-19 | Light emitting diode (LED) light source device |
| TW100113970A TWI409414B (en) | 2011-04-19 | 2011-04-22 | Light emitting diode lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110097341.1A CN102748595B (en) | 2011-04-19 | 2011-04-19 | Light emitting diode (LED) light source device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102748595A true CN102748595A (en) | 2012-10-24 |
| CN102748595B CN102748595B (en) | 2015-03-11 |
Family
ID=47028995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110097341.1A Expired - Fee Related CN102748595B (en) | 2011-04-19 | 2011-04-19 | Light emitting diode (LED) light source device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102748595B (en) |
| TW (1) | TWI409414B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103032742A (en) * | 2012-12-27 | 2013-04-10 | 杭州纳晶照明技术有限公司 | Light source module |
| CN104456207A (en) * | 2014-12-02 | 2015-03-25 | 京东方科技集团股份有限公司 | Light source, backlight module and display device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070063201A1 (en) * | 2005-09-22 | 2007-03-22 | Cheng-Chung Kuo | Optical module having a lens formed without contacting a reflector and method of making the same |
| CN101104802A (en) * | 2007-01-08 | 2008-01-16 | 罗维鸿 | Luminescent diode and phosphor thereof |
| CN201126162Y (en) * | 2007-09-24 | 2008-10-01 | 东贝光电科技股份有限公司 | LED with improved structure |
| CN101452985A (en) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | Encapsulation structure and method for white light emitting diode device |
| CN101551067A (en) * | 2009-01-22 | 2009-10-07 | 深圳市成光兴实业发展有限公司 | White light LED light source module adopting COB technology and array interconnecting |
| US20090274188A1 (en) * | 2008-05-01 | 2009-11-05 | Samsung Electronics Co., Ltd. | Light emitting device and fabrication method thereof |
| CN101899301A (en) * | 2010-06-25 | 2010-12-01 | 海洋王照明科技股份有限公司 | LED light-emitting material, LED light-emitting device and manufacturing method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100818162B1 (en) * | 2007-05-14 | 2008-03-31 | 루미마이크로 주식회사 | White led device capable of adjusting correlated color temperature |
| CN101821544B (en) * | 2007-10-10 | 2012-11-28 | 科锐公司 | Lighting device and method of making |
| CN101514803B (en) * | 2008-02-20 | 2011-06-22 | 富士迈半导体精密工业（上海）有限公司 | Illuminating apparatus |
| US9425172B2 (en) * | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
| TW201031014A (en) * | 2009-02-03 | 2010-08-16 | Everlight Electronics Co Ltd | Light emitting device and fabrication method thereof |
| TWM383202U (en) * | 2009-12-31 | 2010-06-21 | Advanced Optoelectronic Tech | Light-emitting apparatus |
| TWM396925U (en) * | 2010-06-14 | 2011-01-21 | Soogug Technology Co Ltd | Light color changeable LED lamp |
-
2011
- 2011-04-19 CN CN201110097341.1A patent/CN102748595B/en not_active Expired - Fee Related
- 2011-04-22 TW TW100113970A patent/TWI409414B/en not_active IP Right Cessation
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070063201A1 (en) * | 2005-09-22 | 2007-03-22 | Cheng-Chung Kuo | Optical module having a lens formed without contacting a reflector and method of making the same |
| CN101104802A (en) * | 2007-01-08 | 2008-01-16 | 罗维鸿 | Luminescent diode and phosphor thereof |
| CN201126162Y (en) * | 2007-09-24 | 2008-10-01 | 东贝光电科技股份有限公司 | LED with improved structure |
| US20090274188A1 (en) * | 2008-05-01 | 2009-11-05 | Samsung Electronics Co., Ltd. | Light emitting device and fabrication method thereof |
| CN101452985A (en) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | Encapsulation structure and method for white light emitting diode device |
| CN101551067A (en) * | 2009-01-22 | 2009-10-07 | 深圳市成光兴实业发展有限公司 | White light LED light source module adopting COB technology and array interconnecting |
| CN101899301A (en) * | 2010-06-25 | 2010-12-01 | 海洋王照明科技股份有限公司 | LED light-emitting material, LED light-emitting device and manufacturing method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103032742A (en) * | 2012-12-27 | 2013-04-10 | 杭州纳晶照明技术有限公司 | Light source module |
| CN103032742B (en) * | 2012-12-27 | 2014-11-26 | 纳晶科技股份有限公司 | Light source module |
| CN104456207A (en) * | 2014-12-02 | 2015-03-25 | 京东方科技集团股份有限公司 | Light source, backlight module and display device |
| WO2016086596A1 (en) * | 2014-12-02 | 2016-06-09 | 京东方科技集团股份有限公司 | Light source, backlight module and display device |
| US9995867B2 (en) | 2014-12-02 | 2018-06-12 | Boe Technology Group Co., Ltd. | Light source, backlight module and display apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201243241A (en) | 2012-11-01 |
| CN102748595B (en) | 2015-03-11 |
| TWI409414B (en) | 2013-09-21 |
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| C10 | Entry into substantive examination | ||
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150311 Termination date: 20160419 |