CN102744176B - Cleaning agent coating bracket in encapsulation of electronic elements - Google Patents
Cleaning agent coating bracket in encapsulation of electronic elements Download PDFInfo
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- CN102744176B CN102744176B CN201210234582.0A CN201210234582A CN102744176B CN 102744176 B CN102744176 B CN 102744176B CN 201210234582 A CN201210234582 A CN 201210234582A CN 102744176 B CN102744176 B CN 102744176B
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- cleaning agent
- coating
- support
- application member
- electronic elements
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Abstract
The invention discloses a cleaning agent coating bracket in encapsulation of electronic elements. The cleaning agent coating bracket is characterized by comprising a bottom plate, wherein coating components capable of adsorbing cleaning agent and transuding the cleaning agent when being pressed are arranged on the bottom plate. Operating personnel do not need to paint by holding a brush with hands when the cleaning agent coating bracket is used, so that the labor intensity is low and the efficiency is high. During coating, the cleaning agent can be coated on the lower surfaces of pins without turning over a die and the electronic elements again, so that the labor intensity is further reduced, and the work efficiency is further improved. Support columns are arranged on the bottom plate, and clamps are arranged on and supported by the support columns in a coating process, so that the labor intensity can be reduced, the clamps can be precisely located, and the pins are prevented from being bent when being subjected to overlarge pressure. Limiting columns are arranged on the bottom plate, and the clamps can be precisely arranged in positions to be coated, so that the coating work is simpler and more convenient. By virtue of the cleaning agent coating bracket, the time required for coating the electronic elements in a pair of clamps is just 1/10 of that of the original coating method, and thus the efficiency can be improved by over ten times.
Description
Technical field
The present invention relates to the cleaning agent coating support in electronic package.
Background technology
It is illustrated in figure 1 a kind of electronic component structure schematic diagram.Fig. 2 is the structure chart after electronic package.Such as Fig. 1,
Shown in Fig. 2, when electronic component 30 is encapsulated, two pins 33 are welded as a whole with chip 31 by the weld tabs 32 of end respectively, so
Recycle resin material that chip 31 and weld tabs 32 are encapsulated in resin material 34 afterwards.The electronic component envelope encapsulated using resin material
In dress operation, realized using encapsulating mould.Electronic component to be packaged is positioned in encapsulating mould, injection envelope after resin material fusing
In die-filling tool, 32 solidify afterwards of chip 31 and weld tabs are wrapped up, after depanning, complete encapsulation.
The usage quantity of electronic component is huge, is required to using many electronic components in each integrated circuit.Therefore, electronics
The production scale of element is very big.This can be while encapsulate multiple electronic components in requiring every procedure.It is illustrated in figure 3 one
View when planting multiple electronic packages, 5 electronic components arrangements are neatly respectively put into an Encapsulation Moulds intracavity, resin
Material flows into each Encapsulation Moulds intracavity encapsulation successively.As each electronic component is independently encapsulated, so needing to arrange a tree
The total runner of fat material circulation, through total runner, resin material is injected separately into each Encapsulation Moulds intracavity.Due to arranging total runner, envelope
After the completion of dress, the resin material solidification being retained in total runner.As shown in figure 3, as total runner needs to be arranged at least one
A cull bar 35 is formed after resin material solidification in the lower section of pin 33, therefore total runner, and the cull bar 35 is sticked to
On one row's electronic component pin 33.
In order to easily remove cull bar 35, needs are easily adhered the position of cull bar 35 on pin 33 and coat cleaning
Agent.Cleaning agent can prevent cull bar from sticking on pin 33, even if which is sticked on pin 33, it is also possible to easily go
Remove.In prior art, the brushing working procedure of cleaning agent is loaded down with trivial details, needs operator to dip in cleaning agent in pin 33 with hand-held brush
Upper brushing, high labor intensive.As cull bar is sticked to below pin 33, it is therefore desirable to which the electronic component for arranging is turned over
Brush after turning, turned back after the completion of brushing again, so that cleaning agent is located at the lower surface of pin 33.The normal turning over electronic components of Jing increased
Labor intensity, extend the operating time.Especially electronic component is, and encapsulates in placing into mould.Folder
Tool is made using stainless steel and other metal materials, heavier-weight.Can only be by turnover fixture come turning over electronic components, labor intensity is non-
Chang great.When being brushed using brush, as 30 small volume of electronic component, 33 length of pin are shorter, therefore can be easy to will be clear
Clean dose is brushed on weld tabs even chip, affects packaging effect, and operation difficulty is big.
The content of the invention
First purpose of the present invention is to overcome deficiency of the prior art, there is provided convenient on electronic component pin
Cleaning agent coating support in the electronic package of brushing cleaning agent.
To realize object above, the present invention is achieved through the following technical solutions：
Cleaning agent coating support in electronic package, it is characterised in that including base plate, the base plate is provided with can
Adsorb cleaning agent and the application member of cleaning agent is oozed out when pressurized.
Preferably, the base plate is provided with support member, and the application member is arranged on support member, and protrudes from support
The upper surface of part.
Preferably, the support member is boss.
Preferably, the boss is provided with storage tank, and the application member is arranged in storage tank and protrudes from support
Part upper surface.
Preferably, the cell wall of the storage tank is provided with the fix bar through the storage tank and application member.
Preferably, the boss is shaped as cuboid.
Preferably, also including limited post, the limited post is arranged around the application member.
Preferably, also including pillar, the pillar is arranged on base plate and arranges around the application member.
Preferably, the application member is sponge, Cotton Gossypii, fiber or filter paper.
Cleaning agent coating support in electronic package in the present invention, the adsorbable cleaning agent of application member of setting,
When needing to coat cleaning agent, electronic component is placed on above application member makes pin oppress application member, application member absorption
Cleaning agent ooze out and stick on pin, complete coating work.When therefore, using the present invention, without the need for being used by operator again
Hand-held brush brushing, labor intensity are low, efficiency high.During brushing, directly electronic component is placed on application member, need not
Cleaning agent can be coated in pin lower surface by turnover fixture and electronic component again, and labor intensity is further reduced, labor efficiency
Further improve.Pillar is provided with base plate, fixture is placed on pillar during coating, by pillar support fixture, can both be dropped
Low labor intensity, can also be accurately positioned, it is to avoid pin pressure is excessive and bending.Limited post is set, fixture can be made accurately to put
Put at paintable position, coating work is easier.Using the cleaning agent coating support in the electronic package in the present invention,
It is only 1/10th of former brushing method the time required to coating the electronic component in sub-folder tool, efficiency can improve more than ten times.
Description of the drawings
Fig. 1 is a kind of electronic component structure schematic diagram.
Fig. 2 is the structural representation after electronic package.
Fig. 3 is the view after multiple electronic packages.
Fig. 4 is 1 front view of the embodiment of the present invention.
Upward views of the Fig. 5 for Fig. 4.
Fig. 6 is a kind of clamp structure schematic diagram.
Fig. 7 is the using method schematic diagram of the present invention.
Fig. 8 is the supporting structure schematic diagram in the embodiment of the present invention 2.
Specific embodiment
The present invention is described in detail with reference to embodiment and accompanying drawing：
Embodiment 1
As shown in Figure 4, Figure 5, the cleaning agent coating support in electronic package, including base plate 10,10 upper surface of base plate
It is evenly distributed with 10 sponge strips 11.Sponge strip 11 is used to adsorb cleaning agent, and cleaning agent can be oozed out when pressurized.Sponge strip 11
Protrude from the upper surface of base plate 10.Sponge strip 11 is provided with four pillars 12 and six limited posts 13.
As shown in fig. 6,30 points of electronic component is clamped on fixture 20 for 10 rows, often arranging has multiple.Arrange on fixture 20
There is handle 21.
The present invention using method be：As shown in fig. 7, clamping multiple electronic components 30 using fixture 20.Hand-held handle 21
Electronic component 30 can easily be carried.Fixture 20 is placed on pillar 12, four pillars 12 can support fixture 20.Pillar 12
Height can be determined according to the height of the thickness of fixture 20 and sponge strip 11, when fixture 20 is placed on pillar 12, it can be ensured that electricity
The pin of subcomponent 30 can oppress sponge strip 11, and make sponge strip 11 ooze out cleaning agent.The effect of limited post 13 is, limited post 13
Arrange around sponge strip 11, when fixture 20 is placed on pillar 12, limited post 13 limits the position of 20 horizontal direction of fixture, really
Protecting 10 row's electronic components 30 needs the position for coating cleaning agent to be located exactly at 11 location of sponge strip.
Using sponge strip, first adsorb cleaning agent before the use, then cleaning agent when pressurized, can be oozed out so that coating cleaning agent
Become easy.Using pillar 12 and limited post 13, when cleaning agent is coated, fixture 20 is placed on pillar 12 i.e. by operator
Can, pillar 12 can support fixture 20, reduce the labor intensity of operator.It is spacing using limited post 13, it is more prone to make electricity
The pin of subcomponent 30 needs the position alignment sponge strip 11 for coating cleaning agent, more convenient operation.Pin is directed at sponge strip 11, can
Prevent from cleaning agent is coated on weld tabs or chip, packaging effect is good, easy to operate.
Each fixture clamps 10 row's electronic components 30, when coating using existing method, per row brush once, has brushed a row again
Cleaning agent coating next row is dipped in brush.10 row's electronic components 30 on sub-folder tool 20, at least ten times coating behaviour have been brushed often
Make, the operation for dipping in cleaning agent ten times.Using the support in the present invention, the pin of electronic component 30 is placed on sea by Handheld clamp 20
On continuous bar 11,10 row's electronic components 30 on every sub-folder tool 20 can be once coated, required time is only existing painting method
It is 1/10th even less；Efficiency is than more than high ten times of existing method.
Embodiment 2
As shown in figure 8, on the basis of embodiment 1,10 upper surface of base plate is provided with the boss 14 of 10 cuboids, it is convex
Platform 14 is provided with storage tank (not shown).Sponge strip 11 is placed in storage tank, and protrudes from the upper surface of boss 14.Its
Remaining structure and using method are same as Example 1.
Increase boss 14, it is possible to use boss 14 bears the weight of fixture 20 and electronic component 30.Sponge strip 11 only needs to hold
By the partial pressure of the pin of electronic component 30, as long as the pressure energy oozes out cleaning agent.Increase boss 14, sea can be prevented
Continuous bar 11 be stressed it is excessive, prevent long-time use rear generation stress fatigue, it is impossible to recover elasticity or compressive deformation and reach not
To use requirement.Increase boss 14, the service life of the present invention can be extended.
The present embodiment can also arrange fix bar, and fix bar passes through the sponge strip in storage tank and storage tank, by sponge strip
It is fixedly attached in storage tank.
Sponge strip 11 in the present invention using Cotton Gossypii, cloth, fiber or other adsorbable liquid and can also can received
During pressure, the material of liquid body exudate is made applicable shape and is replaced.
Embodiment in the present invention is only used for that the present invention will be described, does not constitute the restriction to right,
Other replacements being substantially equal to that those skilled in that art are contemplated that, in the scope of the present invention.
Claims (4)
1. the cleaning agent in electronic package coats support, it is characterised in that including base plate, the base plate is provided with can be inhaled
Attached cleaning agent simultaneously oozes out the application member of cleaning agent when pressurized；Also include limited post, the limited post surrounds the painting part
Part is arranged；Also include pillar, the pillar is arranged on base plate and arranges around the application member；The application member number
For two or more, it is spaced；The base plate is provided with support member, and the application member is arranged on support member, and is protruded from
The upper surface of support member；
The support member is boss；
The boss is provided with storage tank, and the application member is arranged in storage tank and protrudes from support member upper surface.
2. the cleaning agent in electronic package according to claim 1 coats support, it is characterised in that the storage tank
Cell wall be provided with the fix bar through the storage tank and application member.
3. the cleaning agent in electronic package according to claim 1 coats support, it is characterised in that the boss
It is shaped as cuboid.
4. the cleaning agent in the electronic package according to claims 1 to 3 any claim coats support, its feature
It is that the application member is sponge or fiber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210234582.0A CN102744176B (en) | 2012-07-07 | 2012-07-07 | Cleaning agent coating bracket in encapsulation of electronic elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210234582.0A CN102744176B (en) | 2012-07-07 | 2012-07-07 | Cleaning agent coating bracket in encapsulation of electronic elements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102744176A CN102744176A (en) | 2012-10-24 |
| CN102744176B true CN102744176B (en) | 2017-04-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210234582.0A Active CN102744176B (en) | 2012-07-07 | 2012-07-07 | Cleaning agent coating bracket in encapsulation of electronic elements |
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| CN (1) | CN102744176B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107856920B (en) * | 2017-11-07 | 2019-12-24 | 何翔鹤 | Automobile wire harness electronic clip packaging equipment |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0738051A (en) * | 1993-07-19 | 1995-02-07 | Hitachi Ltd | Resin mold electric device and its manufacture |
| US6197614B1 (en) * | 1999-12-20 | 2001-03-06 | Thin Film Module, Inc. | Quick turn around fabrication process for packaging substrates and high density cards |
| EP1315605B1 (en) * | 2000-09-08 | 2004-03-31 | ASM Technology Singapore Pte Ltd. | Mold and method for encapsulating an electronic device |
| CN100446873C (en) * | 2006-05-30 | 2008-12-31 | 深圳顺络电子股份有限公司 | Surface coating device and soaking paint method for chip elements |
| JP5160824B2 (en) * | 2007-07-17 | 2013-03-13 | 矢崎総業株式会社 | Electric wire coating apparatus and electric wire coating method |
| JP2009032906A (en) * | 2007-07-27 | 2009-02-12 | Seiko Instruments Inc | Semiconductor device package |
| KR20100001690A (en) * | 2008-06-27 | 2010-01-06 | (주)티.에스정밀 | Molding apparatus for manufacturing semi-conductor package |
| US20100164083A1 (en) * | 2008-12-29 | 2010-07-01 | Numonyx B.V. | Protective thin film coating in chip packaging |
| CN202752175U (en) * | 2012-07-07 | 2013-02-27 | 上海鼎虹电子有限公司 | Cleanser coating support in electronic element encapsulation |
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2012
- 2012-07-07 CN CN201210234582.0A patent/CN102744176B/en active Active
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| Publication number | Publication date |
|---|---|
| CN102744176A (en) | 2012-10-24 |
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