CN102739221A - 过热保护三端双向可控硅开关及其保护方法 - Google Patents
过热保护三端双向可控硅开关及其保护方法 Download PDFInfo
- Publication number
- CN102739221A CN102739221A CN2012100883674A CN201210088367A CN102739221A CN 102739221 A CN102739221 A CN 102739221A CN 2012100883674 A CN2012100883674 A CN 2012100883674A CN 201210088367 A CN201210088367 A CN 201210088367A CN 102739221 A CN102739221 A CN 102739221A
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- CN
- China
- Prior art keywords
- thyristor
- triac
- circuit
- terminal
- grid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
- H03K17/72—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices having more than two PN junctions; having more than three electrodes; having more than one electrode connected to the same conductivity region
- H03K17/725—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices having more than two PN junctions; having more than three electrodes; having more than one electrode connected to the same conductivity region for ac voltages or currents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/061—Disposition
- H01L2224/0618—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/06181—On opposite sides of the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/4901—Structure
- H01L2224/4903—Connectors having different sizes, e.g. different diameters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
Landscapes
- Thyristors (AREA)
- Power Conversion In General (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11160706.5A EP2506435B1 (en) | 2011-03-31 | 2011-03-31 | Over-temperature protected triac and protection method |
EP11160706.5 | 2011-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102739221A true CN102739221A (zh) | 2012-10-17 |
CN102739221B CN102739221B (zh) | 2015-02-04 |
Family
ID=44072749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210088367.4A Active CN102739221B (zh) | 2011-03-31 | 2012-03-28 | 过热保护三端双向可控硅开关及其保护方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8630074B2 (zh) |
EP (1) | EP2506435B1 (zh) |
CN (1) | CN102739221B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105841831A (zh) * | 2015-02-03 | 2016-08-10 | 精工半导体有限公司 | 过热检测电路及电源装置 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013209696A1 (de) * | 2013-05-24 | 2014-11-27 | Robert Bosch Gmbh | Phasenanschnittsteuerung und Verfahren zur Phasenanschnittsteuerung |
FR3049768B1 (fr) | 2016-03-31 | 2018-07-27 | Stmicroelectronics (Tours) Sas | Composant de puissance protege contre les surchauffes |
CN106960809B (zh) * | 2017-04-28 | 2023-09-29 | 珠海市声驰电器有限公司 | 一种三极管的自动成型机 |
JP6885862B2 (ja) * | 2017-12-28 | 2021-06-16 | ルネサスエレクトロニクス株式会社 | 電力変換装置 |
CN110745118B (zh) * | 2018-07-23 | 2021-04-20 | 比亚迪股份有限公司 | 电子驻车开关和车辆 |
CN110932240B (zh) * | 2019-12-19 | 2021-11-12 | 苏州美思迪赛半导体技术有限公司 | 用于同步整流开关电源的开路检测保护系统 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4087848A (en) * | 1976-09-20 | 1978-05-02 | Cutler-Hammer, Inc. | Thermally self-protected power switching semiconductor device |
CN201054572Y (zh) * | 2007-05-30 | 2008-04-30 | 张辉 | 一种本质安全型电器控制开关 |
US7872428B1 (en) * | 2008-01-14 | 2011-01-18 | Papanicolaou Elias S | Line or low voltage AC dimmer circuits with compensation for temperature related changes |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3792324A (en) * | 1972-10-30 | 1974-02-12 | Reliance Electric Co | Single phase motor starting circuit |
US3920955A (en) * | 1973-09-20 | 1975-11-18 | Mitsubishi Electric Corp | Electronic thermally sensitive switch device |
US3946252A (en) * | 1974-09-23 | 1976-03-23 | Gca Corporation | Integral cycle power controller |
US3971056A (en) * | 1975-02-18 | 1976-07-20 | Cutler-Hammer, Inc. | Semiconductor temperature switches |
JPS5272183A (en) * | 1975-12-12 | 1977-06-16 | Mitsubishi Electric Corp | Semiconductor device with protecting device |
-
2011
- 2011-03-31 EP EP11160706.5A patent/EP2506435B1/en active Active
-
2012
- 2012-03-28 CN CN201210088367.4A patent/CN102739221B/zh active Active
- 2012-03-29 US US13/433,582 patent/US8630074B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4087848A (en) * | 1976-09-20 | 1978-05-02 | Cutler-Hammer, Inc. | Thermally self-protected power switching semiconductor device |
CN201054572Y (zh) * | 2007-05-30 | 2008-04-30 | 张辉 | 一种本质安全型电器控制开关 |
US7872428B1 (en) * | 2008-01-14 | 2011-01-18 | Papanicolaou Elias S | Line or low voltage AC dimmer circuits with compensation for temperature related changes |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105841831A (zh) * | 2015-02-03 | 2016-08-10 | 精工半导体有限公司 | 过热检测电路及电源装置 |
Also Published As
Publication number | Publication date |
---|---|
EP2506435B1 (en) | 2016-05-18 |
EP2506435A1 (en) | 2012-10-03 |
US8630074B2 (en) | 2014-01-14 |
CN102739221B (zh) | 2015-02-04 |
US20120250200A1 (en) | 2012-10-04 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160421 Address after: 330200 Jiangxi city of Nanchang Province, Nanchang County Blue Road Economic Development Zone No. 266 Building 2 Patentee after: Supportan Semiconductor Co. Ltd. Address before: Holland Ian Deho Finn Patentee before: Koninkl Philips Electronics NV |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 330052 No. 266 Huiren Avenue, Xiaolan Economic Development Zone, Nanchang County, Jiangxi Province Patentee after: Ruineng Semiconductor Technology Co., Ltd. Address before: 330200 Jiangxi city of Nanchang Province, Nanchang County Blue Road Economic Development Zone No. 266 Building 2 Patentee before: Supportan Semiconductor Co. Ltd. |