CN102738297A - 用于局部电接触半导体结构的金属结构的制造方法 - Google Patents

用于局部电接触半导体结构的金属结构的制造方法 Download PDF

Info

Publication number
CN102738297A
CN102738297A CN2012101118425A CN201210111842A CN102738297A CN 102738297 A CN102738297 A CN 102738297A CN 2012101118425 A CN2012101118425 A CN 2012101118425A CN 201210111842 A CN201210111842 A CN 201210111842A CN 102738297 A CN102738297 A CN 102738297A
Authority
CN
China
Prior art keywords
layer
separating layer
semiconductor
semiconductor layer
partial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101118425A
Other languages
English (en)
Chinese (zh)
Inventor
S·克劳斯卡
F·格拉内克
A·费尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Publication of CN102738297A publication Critical patent/CN102738297A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0224Electrodes
    • H01L31/022408Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/268Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • H01L21/743Making of internal connections, substrate contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/068Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Sustainable Energy (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Photovoltaic Devices (AREA)
CN2012101118425A 2011-04-15 2012-04-16 用于局部电接触半导体结构的金属结构的制造方法 Pending CN102738297A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011017292A DE102011017292A1 (de) 2011-04-15 2011-04-15 Vefahren zur Erzeugung einer Metallstruktur zur lokalen elektrischen Kontaktierung einer Halbleiterstruktur
DE102011017292.0 2011-04-15

Publications (1)

Publication Number Publication Date
CN102738297A true CN102738297A (zh) 2012-10-17

Family

ID=46935584

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012101118425A Pending CN102738297A (zh) 2011-04-15 2012-04-16 用于局部电接触半导体结构的金属结构的制造方法

Country Status (2)

Country Link
CN (1) CN102738297A (de)
DE (1) DE102011017292A1 (de)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4694115A (en) * 1986-11-04 1987-09-15 Spectrolab, Inc. Solar cell having improved front surface metallization
DE19915666A1 (de) * 1999-04-07 2000-10-19 Fraunhofer Ges Forschung Verfahren und Vorrichtung zur selektiven Kontaktierung von Solarzellen
DE102005022139B4 (de) * 2005-05-12 2011-01-27 Universität Konstanz Verfahren zur Herstellung von versenkten Kontaktstrukturen in einem Siliciumwafer für Solarzellen
WO2007085452A1 (de) * 2006-01-25 2007-08-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und vorrichtung zur präzisionsbearbeitung von substraten mittels eines in einen flüssigkeitsstrahl eingekoppelten laser und dessen verwendung

Also Published As

Publication number Publication date
DE102011017292A1 (de) 2012-10-18

Similar Documents

Publication Publication Date Title
US6846984B2 (en) Solar cell and method for making a solar cell
CN101160668B (zh) 背接触式太阳能电池及其制造方法
Mondon et al. Microstructure analysis of the interface situation and adhesion of thermally formed nickel silicide for plated nickel–copper contacts on silicon solar cells
CN100524832C (zh) 太阳能电池背接触上的导电层的接触隔离方法和相应的太阳能电池
CN101361168B (zh) 选择性蚀刻绝缘层的方法
US20150017747A1 (en) Method for forming a solar cell with a selective emitter
CN102725867A (zh) 背面接触太阳能电池的制造方法
JP2011512661A (ja) 単結晶n型シリコン太陽電池の製造方法並びに当該方法に従って製造された太陽電池
EP2071632B1 (de) Dünnfilmsolarzelle und Verfahren zu ihrer Herstellung
US20110197965A1 (en) Solar cells and method of manufacturing thereof
JP2005123447A (ja) 太陽電池及びその製造方法
Mondon et al. Plated nickel-copper contacts on c-Si: from microelectronic processing to cost effective silicon solar cell production
CN103560168A (zh) Perc太阳能电池的制备工艺
CN103779473B (zh) Led芯片及其制作方法、led发光器件
CN108807579B (zh) 薄膜封装方法和器件、薄膜封装系统、太阳能电池
CN105552122A (zh) 一种带有深阱终端环结构的平面可控硅芯片及其制造方法
CN108183147A (zh) 一种mwt硅太阳能电池的制备方法
CN102738297A (zh) 用于局部电接触半导体结构的金属结构的制造方法
US20160087577A1 (en) Flexible solar cells comprising thick and thin absorber regions
KR20100004193A (ko) 기판형 태양전지의 제조방법
CN116598321A (zh) 碲化镉/晶硅叠层太阳能电池组件及其制备方法
CN105742375B (zh) 一种背接触晶硅电池及其制备方法
TW201212266A (en) Method for the fabrication of a rear side contacted solar cell
CN105932143A (zh) 一种倒装led芯片的制造方法
CN103066158A (zh) 一种背电场区域接触晶体硅太阳电池的制备方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20121017