CN102732955A - Semiconductor epitaxial wafer gripper used for electron beam evaporation - Google Patents
Semiconductor epitaxial wafer gripper used for electron beam evaporation Download PDFInfo
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- CN102732955A CN102732955A CN2012102116145A CN201210211614A CN102732955A CN 102732955 A CN102732955 A CN 102732955A CN 2012102116145 A CN2012102116145 A CN 2012102116145A CN 201210211614 A CN201210211614 A CN 201210211614A CN 102732955 A CN102732955 A CN 102732955A
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- electron beam
- beam evaporation
- specimen holder
- semiconductor epitaxial
- metal needle
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Abstract
The invention discloses a semiconductor epitaxial wafer gripper used for electron beam evaporation, which comprises a support plate (11), four metal needle sample clamps (12), an auxiliary sample clamps metal plate (13), two auxiliary sample clamps metal plate fixing screws(14); four metal needle clamp sample fixing screws(15); and four metal needle sample clamps circular arc-shaped chutes(16). The semiconductor epitaxial wafer gripper can be used for electron beam evaporation, the steps are simple and easy to operate without any restrictions on the sample sizes and shapes, the thermal conductivity is good and no covering is found on the samples.
Description
Technical field
The present invention relates to the electron beam evaporation technique field, relate in particular to a kind of semiconductor epitaxial plate clamp of realizing being used for electron beam evaporation through the elastic mechanism of particular design.
Background technology
Electron beam evaporation equipment is one of the most frequently used semiconductor devices, especially in the electrode manufacture craft of semiconductor device technology, is widely used especially.The sample clamp of electron beam evaporation equipment also need have the substrate heating and not have the function that evaporation is blocked except needs are accomplished common sample clamping.Common electron beam evaporation sample clamp structure adopts bigger tinsel sample to be pressed on the back up pad of sample clamp; The inevitable like this partial occlusion that causes when evaporation to sample; Cause the waste of sample, the clamping for erose sample simultaneously has difficulties.
Summary of the invention
The technical problem that (one) will solve
In order to overcome above-mentioned shortcoming, the object of the present invention is to provide a kind of semiconductor epitaxial plate clamp that is used for electron beam evaporation.
(2) technical scheme
For achieving the above object, the invention provides a kind of semiconductor epitaxial plate clamp that is used for electron beam evaporation, comprising: a back up pad 11; Four metal needle-like specimen holders 12; One auxiliary specimen holder metal sheet 13; Two auxiliary specimen holder metal sheet retaining screws 14; Four metal needle-like specimen holder retaining screws 15; And four metal needle-like specimen holder arc chutes 16.
In the such scheme, said back up pad 11 adopts aluminum alloy materials, and said back up pad 11 is circular, and diameter is less than 4 inches, and thickness is less than 3mm.
In the such scheme, said metal needle-like specimen holder 12 adopts thin tungsten filament material, and said four metal needle-like specimen holders 12 adopt thin tungsten filament material diameter less than 1mm.
In the such scheme, said auxiliary specimen holder metal sheet 13 adopts aluminum alloy materials, and said auxiliary specimen holder metal sheet 13 is for rectangle and have steep square edge.
In the such scheme; Said auxiliary specimen holder metal sheet retaining screw 14 models are the brass bolt of M4; Said metal needle-like specimen holder retaining screw 15 models are the brass bolt of M6, and said four metal needle-like specimen holder arc chutes 16 are the center of circle with the center separately of four metal needle-like specimen holder retaining screws 15.
(3) beneficial effect
These anchor clamps are simple; Said back up pad 11 adopts aluminum alloy plate materials to be processed into 4 inches disks of diameter and auxiliary sample clamping plate 13 by drawing; To assist sample clamping plate 13 to be fixed on back up pad 11 central positions with screw; And four metal needle-like specimen holders will sizing are screwed on the corresponding position, and four metal needle-like specimen holders can slide in arc chute 16 and not have restriction, good heat-transfer, sample not to have with the prints of fixing different sizes to sample size and shape to block.The clamping that is specially adapted to laboratory sample has bigger Practical significance to scientific effort.
Description of drawings
For further specifying content of the present invention and characteristics, below in conjunction with the width of cloth figure the present invention is done one and describe in detail, wherein:
Fig. 1 is a kind of exemplary front view that is used for the semiconductor epitaxial plate clamp of electron beam evaporation of the present invention;
Fig. 2 is a kind of exemplary rear view that is used for the semiconductor epitaxial plate clamp of electron beam evaporation of the present invention;
Fig. 3 is 4 inches standard chucks of electron beam evaporation system;
Fig. 4 is a kind of assembling that is used for semiconductor epitaxial plate clamp and 4 inches chucks of electron beam evaporation of the present invention, has shown a kind of band evaporation sample assembling embodiment simultaneously.
Embodiment
For making the object of the invention, technical scheme and advantage clearer, below in conjunction with specific embodiment, and with reference to accompanying drawing, to further explain of the present invention.
The invention provides a kind of semiconductor epitaxial plate clamp that is used for electron beam evaporation, comprising: a back up pad 11; Four metal needle-like specimen holders 12; One auxiliary specimen holder metal sheet 13; Two auxiliary specimen holder metal sheet retaining screws 14; Four metal needle-like specimen holder retaining screws 15; And four metal needle-like specimen holder arc chutes 16.The brass bolt 14 of auxiliary specimen holder metal sheet 13 usefulness M4 is fixed on back up pad 11 central positions in order to barrier semiconductor material on one side; Four metal needle-like specimen holders are fixed on the corresponding position with the brass bolt 15 of M6; Specimen holder can slide in arc chute 16, to clamp the print of different sizes.
Wherein, said back up pad 11 adopts aluminum alloy materials, and said back up pad 11 is circular, and diameter is less than 4 inches, and thickness is less than 3mm.Said metal needle-like specimen holder 12 adopts thin tungsten filament material, and said four metal needle-like specimen holders 12 adopt thin tungsten filament material diameter less than 1mm.Said auxiliary specimen holder metal sheet 13 adopts aluminum alloy materials, and said auxiliary specimen holder metal sheet 13 is for rectangle and have steep square edge.Said auxiliary specimen holder metal sheet retaining screw 14 models are the brass bolt of M4; Said metal needle-like specimen holder retaining screw 15 models are the brass bolt of M6, and said four metal needle-like specimen holder arc chutes 16 are the center of circle with the center separately of four metal needle-like specimen holder retaining screws 15.
Fig. 1 has shown front view of the present invention, and Fig. 2 has shown rear view of the present invention.Fig. 3 is 4 inches standard chucks of electron beam evaporation system, and Fig. 4 is assembling embodiment of the present invention.Under sample situation, adopt the stainless steel plate of 4 inches of about diameters, thickness 3mm to make back up pad 11, utilize the bolt 14 of two M4 will assist sample clamping plate 13 to be fixed on the center of back up pad 11.On back up pad, be the four metal needle-like specimen holder retaining screws 15 of evenly arranging on the about 3 inches circle of the center of circle, radius with the back up pad center, retaining screw 15 has identical angle with auxiliary sample clamping plate 13.With four metal needle-like specimen holder retaining screws 15 separately the center be that the center of circle makes four circular-arc metal needle-like specimen holder chutes 16, through in chute, moving the samples can make the different sizes of metal needle-like specimen holder clamping.Four metal needle-like specimen holder 12 1 ends that adopt the tungsten filament material to process are fixed on the retaining screw 15, and the other end can slide in circular-arc metal needle-like specimen holder chute 16.Semiconductor samples passes through the flexible fastening of metal needle-like specimen holder between metal needle-like specimen holder and auxiliary specimen holder metal sheet.Install the present invention behind the sample and be used for semiconductor epitaxial plate clamp 4 inches standard chucks that are fixed on the electron beam evaporation system as shown in Figure 4 of electron beam evaporation, in the electron beam evaporation system of packing into then.
Above-described specific embodiment; The object of the invention, technical scheme and beneficial effect have been carried out further explain, and institute it should be understood that the above is merely specific embodiment of the present invention; Be not limited to the present invention; All within spirit of the present invention and principle, any modification of being made, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a semiconductor epitaxial plate clamp that is used for electron beam evaporation is characterized in that, comprising:
One back up pad (11);
Four metal needle-like specimen holders (12);
One auxiliary specimen holder metal sheet (13);
Two auxiliary specimen holder metal sheet retaining screws (14);
Four metal needle-like specimen holder retaining screws (15); And
Four metal needle-like specimen holder arc chutes (16).
2. the semiconductor epitaxial plate clamp that is used for electron beam evaporation according to claim 1 is characterized in that, said back up pad (11) adopts aluminum alloy materials.
3. the semiconductor epitaxial plate clamp that is used for electron beam evaporation according to claim 2 is characterized in that, said back up pad (11) is circular, and diameter is less than 4 inches, and thickness is less than 3mm.
4. the semiconductor epitaxial plate clamp that is used for electron beam evaporation according to claim 1 is characterized in that, said metal needle-like specimen holder (12) adopts thin tungsten filament material.
5. the semiconductor epitaxial plate clamp that is used for electron beam evaporation according to claim 4 is characterized in that, said four metal needle-like specimen holders (12) adopt thin tungsten filament material diameter less than 1mm.
6. the semiconductor epitaxial plate clamp that is used for electron beam evaporation according to claim 1 is characterized in that, said auxiliary specimen holder metal sheet (13) adopts aluminum alloy materials.
7. the semiconductor epitaxial plate clamp that is used for electron beam evaporation according to claim 1 is characterized in that, said auxiliary specimen holder metal sheet (13) is for rectangle and have steep square edge.
8. the semiconductor epitaxial plate clamp that is used for electron beam evaporation according to claim 1 is characterized in that, said auxiliary specimen holder metal sheet retaining screw (14) model is the brass bolt of M4.
9. the semiconductor epitaxial plate clamp that is used for electron beam evaporation according to claim 1 is characterized in that, said metal needle-like specimen holder retaining screw (15) model is the brass bolt of M6.
10. the semiconductor epitaxial plate clamp that is used for electron beam evaporation according to claim 1 is characterized in that, said four metal needle-like specimen holder arc chutes (16) are the center of circle with the center separately of four metal needle-like specimen holder retaining screws (15).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210211614.5A CN102732955B (en) | 2012-06-21 | 2012-06-21 | Semiconductor epitaxial wafer gripper used for electron beam evaporation |
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CN201210211614.5A CN102732955B (en) | 2012-06-21 | 2012-06-21 | Semiconductor epitaxial wafer gripper used for electron beam evaporation |
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CN102732955A true CN102732955A (en) | 2012-10-17 |
CN102732955B CN102732955B (en) | 2015-04-01 |
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CN201210211614.5A Active CN102732955B (en) | 2012-06-21 | 2012-06-21 | Semiconductor epitaxial wafer gripper used for electron beam evaporation |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104711670A (en) * | 2015-04-02 | 2015-06-17 | 中国科学院上海微系统与信息技术研究所 | Sample support for molecular beam epitaxial growth and angle resolved photoelectron spectroscope testing |
Citations (7)
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US4681773A (en) * | 1981-03-27 | 1987-07-21 | American Telephone And Telegraph Company At&T Bell Laboratories | Apparatus for simultaneous molecular beam deposition on a plurality of substrates |
WO2000043567A1 (en) * | 1999-01-19 | 2000-07-27 | Tokyo Electron Limited | Film forming device |
CN1609644A (en) * | 2003-10-20 | 2005-04-27 | 中国科学院半导体研究所 | Clamping apparatus used for coaxle encapsulated semiconductor laser coupling with automatic identification device |
CN1969376A (en) * | 2004-06-21 | 2007-05-23 | 株式会社上睦可 | Heat treatment jig for silicon semiconductor substrate |
US20080308036A1 (en) * | 2007-06-15 | 2008-12-18 | Hideki Ito | Vapor-phase growth apparatus and vapor-phase growth method |
CN201256139Y (en) * | 2008-08-01 | 2009-06-10 | 攀钢集团研究院有限公司 | Special fixture for scanning electronic microscope |
CN101748368A (en) * | 2008-12-17 | 2010-06-23 | 中国科学院半导体研究所 | Sample clamp for electron beam evaporation film |
-
2012
- 2012-06-21 CN CN201210211614.5A patent/CN102732955B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4681773A (en) * | 1981-03-27 | 1987-07-21 | American Telephone And Telegraph Company At&T Bell Laboratories | Apparatus for simultaneous molecular beam deposition on a plurality of substrates |
WO2000043567A1 (en) * | 1999-01-19 | 2000-07-27 | Tokyo Electron Limited | Film forming device |
CN1609644A (en) * | 2003-10-20 | 2005-04-27 | 中国科学院半导体研究所 | Clamping apparatus used for coaxle encapsulated semiconductor laser coupling with automatic identification device |
CN1969376A (en) * | 2004-06-21 | 2007-05-23 | 株式会社上睦可 | Heat treatment jig for silicon semiconductor substrate |
US20080308036A1 (en) * | 2007-06-15 | 2008-12-18 | Hideki Ito | Vapor-phase growth apparatus and vapor-phase growth method |
CN201256139Y (en) * | 2008-08-01 | 2009-06-10 | 攀钢集团研究院有限公司 | Special fixture for scanning electronic microscope |
CN101748368A (en) * | 2008-12-17 | 2010-06-23 | 中国科学院半导体研究所 | Sample clamp for electron beam evaporation film |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104711670A (en) * | 2015-04-02 | 2015-06-17 | 中国科学院上海微系统与信息技术研究所 | Sample support for molecular beam epitaxial growth and angle resolved photoelectron spectroscope testing |
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